SP4T Antenna Switch for CDMA/UMTS CXM3531XR Description The CXM3531XR is a high power SP4T antenna switch for CDMA/UMTS applications. The antenna port can be routed to either of the 4TRx ports. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. Built-in decoder reduces component count and simplifies PCB layout by allowing direct connection of the switch to digital base band control lines with the 1.8V CMOS logic levels. The Sony GaAs JPHEMT MMIC Process is used for low insertion loss and high linearity. (Applications: CDMA/UMTS handsets) Features Low insertion Loss (Tx): 0.28dB (Typ.) @27dBm (450MHz) 0.30dB (Typ.) @27dBm (Cellular) 0.36dB (Typ.) @27dBm (PCS) 0.38dB (Typ.) @27dBm (IMT2000) 0.45dB (Typ.) @27dBm (2.6GHz) High linearity: IIP3 = 70dBm No DC Blocking Capacitors required on RF ports. Lead-Free and RoHS Compliant Package Small package: 20pin XQFN (2.7mm × 2.7mm × 0.35mm Typ.) Structure GaAs JPHEMT MMIC This IC is ESD sensitive device. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E08909-PS CXM3531XR Absolute Maximum Ratings Bias voltage VDD Control voltage Vctl Input power Max. [Ant, RF1, RF2, RF3, RF4] Operating temperature Storage temperature Maximum power dissipation PD *1 25mm × 25mm × t:0.8mm 4V (Ta = 25°C) 4V (Ta = 25°C) 32dBm (410 to 2690MHz, Ta = 25°C) –35 to +85°C –65 to +150°C 500mW *1 Mounted on standard board (FR-4) -2- CXM3531XR Block Diagram Ant RF1 F1 F5 RF2 F2 F6 RF3 F3 F7 RF4 F4 F8 13 CTLB 14 GND 15 GND Ant GND RF1 6 XQFN-20P PKG (2.7mm × 2.7mm × 0.35mm Typ.) Top View 16 17 18 19 20 RF2 CTLA 7 GND 12 8 N/C GND 9 GND 11 10 GND VDD GND Pin Configuration -3- 5 GND 4 RF3 3 GND 2 RF4 1 GND CXM3531XR Truth Table ON Path CTLA CTLB F1 F2 F3 F4 F5 F6 F7 F8 ANT – RF1 L L ON OFF OFF OFF OFF ON ON ON ANT – RF2 H L OFF ON OFF OFF ON OFF ON ON ANT – RF3 L H OFF OFF ON OFF ON ON OFF ON ANT – RF4 H H OFF OFF OFF ON ON ON ON OFF DC Bias Condition (Ta = 25°C) Item Min. Typ. Max. Vctl (H) 1.3 1.8 3.2 Vctl (L) 0 — 0.3 2.5 2.8 3.2 VDD Unit V -4- CXM3531XR Electrical Characteristics Electrical Characteristics 1 (Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V) Item Symbol Path ANT-RF1 ANT-RF2 Insertion Loss IL ANT-RF3 ANT-RF4 Isolation ISO. ANT-RF1, 2, 3, 4 Condition Min. Typ. Max. *1 — 0.28 0.43 *2 — 0.30 0.45 *3 — 0.36 0.51 *4 — 0.38 0.53 *5 — 0.45 0.60 *1 — 0.28 0.43 *2 — 0.30 0.45 *3 — 0.36 0.51 *4 — 0.38 0.53 *5 — 0.46 0.61 *1 — 0.25 0.40 *2 — 0.27 0.42 *3 — 0.33 0.48 *4 — 0.35 0.50 *5 — 0.42 0.57 *1 — 0.25 0.40 *2 — 0.27 0.42 *3 — 0.33 0.48 *4 — 0.35 0.50 *5 — 0.42 0.57 *1 30 41 — *2 25 36 — *3 22 27 — *4 21 26 — *5 18 23 — Electrical Characteristics are measured with all RF ports terminated in 50Ω. *1 *2 *3 *4 *5 freq = 410 to 495MHz freq = 698 to 960MHz freq = 1710 to 1990MHz freq = 2110 to 2170MHz freq = 2500 to 2690MHz -5- Unit dB dB CXM3531XR Electrical Characteristics 2 (Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V) Item VSWR Symbol Path Condition VSWR 2fo Min. Typ. Max. 410 to 2170MHz — 1.1 1.4 2500 to 2690MHz — 1.3 1.7 — –68 –40 — –68 –40 — –66 –40 — –66 –40 — –66 –40 — –63 –40 — –66 –40 — –63 –40 — –62 –40 — –59 –40 *1, *2, *3, *4, *5 31 — — *6-*9, *17 — –110 –105 *10-*13, *17 — –110 –105 *14, *17 65 70 — *15, *17 65 70 — *16, *17 65 70 — *1 3fo 2fo *2 3fo Harmonics 2fo 3fo ANT-RF1, 2, 3, 4 2fo *3 *4 3fo 2fo *5 3fo P0.2dB compression input power Inter modulation product power in Rx band Input IP3 P0.2dB IMD2 IMD3 IIP3 ANT-RF1, 2, 3, 4 ANT-RF1, 2, 3, 4 ANT-RF1, 2, 3, 4 Unit — dBm dBm dBm dBm Control current Ictl Vctl = 1.8V — 0.005 10 μA Supply current IDD VDD = 2.8V — 0.2 0.4 mA Switching speed Swt 50% Ctl to 90% RF — 2 5 μs RF1, 2, 3, 4 Electrical Characteristics are measured with all RF ports terminated in 50Ω. *1 *2 *3 *4 *5 *6 *7 *8 *9 *10 *11 *12 *13 *14 *15 *16 *17 Pin = 27dBm, freq = 410 to 484MHz Pin = 27dBm, freq = 698 to 915MHz Pin = 27dBm, freq = 1710 to 1910MHz Pin = 27dBm, freq = 1920 to 1980MHz Pin = 27dBm, freq = 2500 to 2570MHz Pin on RF: 20dBm, 1950MHz, Pin on ANT: –15dBm, 190MHz Pin on RF: 20dBm, 1745MHz, Pin on ANT: –15dBm, 95MHz Pin on RF: 20dBm, 1880MHz, Pin on ANT: –15dBm, 80MHz Pin on RF: 20dBm, 835MHz, Pin on ANT: –15dBm, 45MHz Pin on RF: 20dBm, 1950MHz, Pin on ANT: –15dBm, 1760MHz Pin on RF: 20dBm, 1745MHz, Pin on ANT: –15dBm, 1650MHz Pin on RF: 20dBm, 1880MHz, Pin on ANT: –15dBm, 1800MHz Pin on RF: 20dBm, 835MHz, Pin on ANT: –15dBm, 790MHz Pin = 27 + 27dBm, 450 + 451MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss Pin = 27 + 27dBm, 835 + 836MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss Pin = 27 + 27dBm, 1950 + 1951MHz, IIP3 = (3 × Pout – IM3) / 2 + Loss Measured with the recommended circuit -6- CXM3531XR Electrical Characteristics 3 (Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V) Item Symbol Path Condition PTx at RF* Triple beat ratio Typ. Max. Pin [dBm] PTx1 [MHz] PTx2 [MHz] Jammer at Ant –30dBm [MHz] 21.5 835.5 836.5 881.5 881.5 ± 1 81 — — 21.5 1880 1881 1960 1960 ± 1 81 — — 13.5 1732 1733 2132 2132 ± 1 81 — — TBR ANTRF1, RF2, RF3, RF4 Triple beat product at RF* [MHz] Min. Unit dBc Electrical Characteristics are measured with all RF ports terminated in 50Ω. Measured with the recommended circuit Electrical Characteristics 4 (Ta = +25°C, VDD = 2.8V, Vctl = 0/1.8V) Item Input IP2 Symbol IIP2 Path AntRF1, RF2, RF3, RF4 Condition Min. Typ. Max. PTx at RF* 24dBm [MHz] Jammer at ANT –20dBm [MHz] IM2 product at RF* [MHz] 836.61 1718.61 881.61 113.5 — — 836.61 45 881.61 95.5 — — 1885 3850 1965 95.5 — — 1885 80 1965 95.5 — — 1732.5 3865 2132.5 95.5 — — 1732.5 400 2132.5 95.5 — — Electrical Characteristics are measured with all RF ports terminated in 50Ω. Measured with the recommended circuit -7- Unit dBm CXM3531XR Recommended Circuit GND Ant RF1 6 11 5 12 4 13 XQFN-20P PKG (2.7mm × 2.7mm × 0.35mm Typ.) 14 3 2 Top View 15 1 GND 16 17 18 19 GND RF3 GND RF4 GND 20 RF2 CTLB 7 GND CTLA 8 N/C GND 9 GND VDD GND GND 10 GND C1 L1 Note) 1. No DC blocking capacitors are required on all RF ports. 2. DC levels of all RF ports are GND. 3. L1 (27nH) and C1 (12pF) are recommended on Ant port for ESD protection. -8- CXM3531XR PCB Layout Template XQFN-20P-01 Macro (Reference) 2.7mm × t0.35mm Terminal pitch: 0.4mm Terminal length: 0.4mm Mask thickness: 0.11mm PKG size: : Land area : Mask open area (Solder printing area) : Board resist open area : Metal area in board (*1) This metal is for heat loss reduction in package and recommend to connect to GND. 3.1 2.7 (PKG Line) [Detail A] 1.3 (∗1) 0.3 Land line R0.05 0.05 0.2 0.4 0.6 R0.3 Resist line 0. 2 0. 1 1.3 (∗1) 3.1 2.7 (PKG Line) *1 Solder printing area 0.1 0.15 0.4 A -9- 0.21 0.26 ∗ R0.05: Mask corner CXM3531XR Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL - 10 - SPEC. COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm Sony Corporation