CXG1131ER High Power 3 × 5 Antenna Switch MMIC with Integrated Control Logic Description The CXG1131ER is a high power antenna switch MMIC for PDC full packet 1.5GHz handsets. This IC is suited to connect Tx/Rx/duplexer to one of 4 antennas. The CXG1131ER has on-chip logic circuit for operation with 4 CMOS inputs. The Sony's GaAs J-FET process is used for low insertion loss and low voltage operation. 24 pin VQFN (Plastic) Features • Low insertion loss: 1.0dB @1.5GHz • High linearity: Harmonic < – 65dBc • CMOS compatible input control • Small package: 24-pin VQFN (4.0mm × 4.0mm) Applications 3 × 5 antenna switch for digital cellular such as PDC handsets Structure GaAs J-FET MMIC Absolute Maximum Ratings (Ta = 25°C) • Bias voltage VDD • Control voltage • Operating temperature • Storage temperature Vctl Topr Tstg 7 5 –35 to +85 –65 to +150 V V °C °C GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E02110-PS CXG1131ER Block Diagram F13 F1 Ext Tx F15 Dup_In F14 F2 F9 F16 GND3 F3 Ant Dup_Out F4 F17 F10 F5 GND4 F6 GND1 F7 D_Ant Rx F11 F8 GND2 D_Ext F12 –2– CXG1131ER Dup_In 10 9 Ant CRF (100pF) GND 11 Z1 GND 12 GND CRF (100pF) GND1 Tx Pin Configuration/Recommended Circuit 8 7 13 GND3 GND4 CRF (100pF) Z3 14 5 GND 15 4 GND 16 3 Z4 17 2 18 1 Dup_Out Ext 6 CRF (100pF) CRF (100pF) GND D_Ext GND Z2 D_Ant CRF (100pF) Cbypass (100pF) VDD CTLD CTLC 24 Cbypass (100pF) 23 Cbypass (100pF) 22 CTLB Cbypass (100pF) CTLA Rx 21 Cbypass (100pF) 20 CRF (100pF) 19 When using this IC, the following external components should be used: CRF: This capacitor is used for RF de-coupling and must be used for all applications. 100pF is recommended. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. Z1 to Z4: It is recommended that these pins be directly grounded. –3– GND2 CXG1131ER Truth Table A: Rx/Tx B: Main/diversity C: External/antenna D: TDMA/28.8k State On Pass A B C D F1 F2 F3 F4 F5 F6 F7 F8 F9 F10 F11 F12 F13 F14 F15 F16 F17 1 Tx – Ext H — L L H L L L L L L L L H H H H L L H H 2 Tx – Ant H — H L L H L L L L L L H L H H H L L H H 3 Rx – Ext L L L L L L L L H L L L L H H H L H L H H 4 Rx – Ant L L H L L L L L L H L L H L H H L H L H H 5 Rx – D_Ext L H L L L L L L L L L H H H H L L H L H H 6 Rx – D_Ant L H H L L L L L L L H L H H L H L H L H H — L H H L L L H L H L L H L H H L H H L L — H H H L L L H L L H L H L L H L H H L L — L L H L L H L H L L L L H H H L H H L L — H L H L L H L L L L H L H H L L H H L L 7 Dup_Out – Ant Rx – Ant 8 Dup_Out – Ant Rx – D_Ant 9 Dup_Out – Ext Rx – Ext 10 Dup_Out – Ext Rx – D_Ext DC Bias Condition Item (Ta = 25°C) Min. Typ. Max. Unit VDD 2.7 3.0 3.3 V Vctl (H) 2.0 3.0 3.6 V Vctl (L) 0 0.4 V –4– CXG1131ER Electrical Characteristics Item Insertion loss Isolation (Ta = 25°C) Symbol IL ISO. Port Condition Min. Typ. Max. Unit Tx – Ext ∗1 — 1.0 1.3 dB Tx – Ant ∗1 — 1.0 1.3 dB Tx – Dup_In ∗1 — 0.35 0.65 dB Rx – Ext ∗2 — 0.85 1.15 dB Rx – Ant ∗2 — 0.85 1.15 dB Rx – D_Ext ∗2 — 0.7 1.0 dB Rx – D_Ant ∗2 — 0.7 1.0 dB Dup_Out – Ext ∗1 , ∗4 — 1.2 1.5 dB Rx – Ext ∗2 , ∗5 — 1.2 1.5 dB Dup_Out – Ant ∗1 , ∗4 — 1.3 1.6 dB Rx – Ant ∗2 , ∗5 — 1.3 1.6 dB Dup_Out – Ext ∗1 , ∗4 — 0.75 1.05 dB Rx – D_Ext ∗2 , ∗5 — 0.75 1.05 dB Dup_Out – Ant ∗1 , ∗4 — 0.75 1.05 dB Rx – D_Ant ∗2 , ∗5 — 0.75 1.05 dB Tx – Ext ∗1 30 33 — dB Tx – Ant ∗1 30 33 — dB Tx – Dup_In ∗1 26 29 — dB Rx – Ext ∗2 35 38 — dB Rx – Ant ∗2 35 38 — dB Rx – D_Ext ∗2 30 33 — dB Rx – D_Ant ∗2 27 30 — dB Dup_Out – Ext ∗1 , ∗4 30 33 — dB Rx – Ext ∗2 , ∗5 35 38 — dB Dup_Out – Ant ∗1 , ∗4 27 30 — dB Rx – Ant ∗2 , ∗5 35 38 — dB Dup_Out – Ext ∗1 , ∗4 30 33 — dB Rx – D_Ext ∗2 , ∗5 30 33 — dB Dup_Out – Ant ∗1 , ∗4 30 33 — dB Rx – D_Ant ∗2 , ∗5 27 30 — dB Tx – Rx (Full packet) ∗1 47 50 — dB Tx – Rx (TDMA) ∗1 14 17 — dB –5– CXG1131ER Item Symbol 2fo Harmonics 3fo ±50kHz ACP ±100kHz P1dB P1dB Port Condition Min. Typ. Max. Unit Tx – Ext ∗3 — –75 –60 dBc Tx – Ant ∗3 — –75 –60 dBc Tx – Dup_In ∗3 — –80 –60 dBc Dup_Out – Ext ∗3 , ∗4 — –75 –60 dBc Dup_Out – Ant ∗3 , ∗4 — –75 –60 dBc Tx – Ext ∗3 — –67 –60 dBc Tx – Ant ∗3 — –67 –60 dBc Tx – Dup_In ∗3 — –75 –60 dBc Dup_Out – Ext ∗3 , ∗4 — –67 –60 dBc Dup_Out – Ant ∗3 , ∗4 — –67 –60 dBc Tx – Ext ∗3 — –65 –57 dBc Tx – Ant ∗3 — –65 –57 dBc Tx – Dup_In ∗3 — –65 –57 dBc Dup_Out – Ext ∗3 , ∗4 — –65 –57 dBc Dup_Out – Ant ∗3 , ∗4 — –65 –57 dBc Tx – Ext ∗3 — –73 –65 dBc Tx – Ant ∗3 — –73 –65 dBc Tx – Dup_In ∗3 — –73 –65 dBc Dup_Out – Ext ∗3 , ∗4 — –73 –65 dBc Dup_Out – Ant ∗3 , ∗4 — –73 –65 dBc Tx – Ext VDD = 3V 33 34 — dBm Tx – Ant VDD = 3V 33 34 — dBm Tx – Dup_In VDD = 3V 33 34 — dBm Dup_Out – Ext VDD = 3V 33 34 — dBm Dup_Out – Ant VDD = 3V 33 34 — dBm — 2 — µs Switching speed TSW — Bias current IDD — VDD = 3V — 350 500 µA Control current Ictl — Vctl (H) = 3V — 35 75 µA ∗1 Pin = 29.5dBm, 0/3V control, VDD = 2.8V to 3.6V, 1,429MHz to 1,453MHz ∗2 Pin = 10dBm, 0/3V control, VDD = 2.8V to 3.6V, 1,477MHz to 1,501MHz ∗3 π/4-shifted DQPSK, Pin = 29.5dBm, 0/3V control, VDD = 3.0V, 1,429MHz to 1,453MHz, ACP (±50kHz) < – 70dBc, ACP (±100kHz) < – 75dBc, 2nd harmonics < – 75dBc, 3rd harmonics < – 75dBc ∗4 Rx is open. ∗5 Dup_Out is open. –6– CXG1131ER Package Outline Unit: mm 24PIN VQFN(PLASTIC) 0.9 ± 0.1 4.0 0.6 ± 0.1 3.6 18 A 19 0.05 S 0.7 C 13 12 B 9) .3 (0 78 4. PIN 1 INDEX 24 ˚ 45 5) S x4 1.0 0.2 S A-B C (0 0.4 .1 6 C 1 0. 6 7 x4 0.2 ± 0.01 0.03 ± 0.03 (∗1) (Stand Off) 0.05 M S A-B C 0.225 ± 0.03 0.2 S A-B C Solder Plating 0.13 ± 0.025 + 0.09 0.14 – 0.03 TERMINAL SECTION PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.04g VQFN-24P-03 SONY CODE LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SPEC. COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18µm –7– Sony Corporation