SS8026 1.8V 1A Positive Voltage Regulator Features General Description Output current in excess of 1A Output voltage accuracy +2.5%/-2% Quiescent current typically 480µA Internal short-circuit current-limit Internal over-temperature protection The SS8026 positive 1.8V voltage regulator features the ability to source 1A of output current. The typical quiescent current is 0.48mA. Familiar regulator features such as over-temperature and over-current protection circuits are provided to prevent it from being damaged by abnormal operating conditions. Applications PC motherboard ADSL/Cable Modem Set -Top Box LAN switch/Hub Broadband/Router Ordering Information SS8026XXXXX Packing Type Pin Option Package Type PACKAGE TYPE PIN OPTION T2 : SOT-89 T3 : TO 220 T4 : TO 252 T5 : TO-263 T6 : SOT-223 1 1 : V OUT 2 : V OUT 3 : GND 4 : GND 5 : V IN 6 : V IN Typical Application PACKING 2 GND V IN V OUT V IN GND V OUT 3 V IN GND V IN V OUT V OUT GND TR : Tape & Reel TB : Tubes Pin Configuration [Note 4] : Type of COUT IO VIN SS8026 C1 1µ F IQ VOUT C OUT 10µF Top View 1 2 1 3 TO-220 Rev.2.02 12/06/2003 Top View 2 3 TO-252 and TO-263 www.SiliconStandard.com Top View 1 2 3 SOT-223 and SOT-89 1 of 12 SS8026 Absolute Maximum Ratings (Note 1) Input Voltage………………...................................................................……………………..…..…7V Power Dissipation Internally Limited….................................................................... (Note 2) Maximum Junction Temperature….......................................................……………............…..150°C Storage Temperature Rang…........................................................................................-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering SOT 223 Package……………….…….......................................................................………..260°C, 4s Continuous Power Dissipation (TA = +25°C) SOT 89 (1) ……………………......................................................................………………..….…0.5W SOT 223(1) ……………...................................................................………...……………….…....0.8W TO 252(1) ……………………….................................................................................................................………………………………………………….1.0W Note (1): See Recommended Minimum Footprint Operating Conditions (Note 1) Input Voltage……………………........................................................................……………..2.7V~6.5V Temperature Range…………..........................................................................................…0°C ≤ T J ≤125°C Electrical Characteristics VIN =3.3V, IO = 1A, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER CONDITIONS MIN TYP MAX Output Voltage Line Regulation Load Regulation Output Impedance Quiescent Current Ripple Rejection 10mA < IO < 1A 3V < V IN < 6.5V, IO = 10mA 10mA < IO < 1A 200mA DC and 100mA AC, fo = 120Hz V IN = 3.3V f i = 120Hz,V ripple =1V P-P , Io = 100mA Dropout Voltage IO = 0A IO = 100mA IO = 500mA IO = 1A V IN = 3V(SOT 223) Output Current Continuous Test, TA = 25°C, TJ 150°C, V OUT within ±2% V IN = 3.3V(SOT 223) V IN = 3.3V(SOT 89) 1.764 Minimum footprint (0.0625 square inch) Mounted on 0.53 square inch pcb area Mounted on 0.16 square inch pcb area Short Circuit Current Over Temperature 1.800 3 30 80 480 53 880 895 950 1160 1.845 30 50 UNITS V mV mV mΩ µA dB mV 660 mA 1 A 0.5 A 1.6 150 A °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax , total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient te mperature is Tjmax-TA / θJA. If this dissipation is exceeded, tthe die temperature will rise above 150°C and the IC will go into thermal shutdown. For the SS8026 in SOT 89 package, θJA is 250°C/W. For the SS8026 in SOT 223 package, θJA is 156°C/W; in TO 252 package, θJA is 125°C/W. (See recommend minimum footprint). The safe operation in SOT 89, SOT 223, TO 252 package, can be seen in “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperatures as close to ambient as possible. Note4: The output capacitor should be a tantalum or aluminum type. Rev.2.02 12/06/2003 www.SiliconStandard.com 2 of 12 SS8026 Definitions Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Rev.2.02 12/06/2003 Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation under which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. www.SiliconStandard.com 3 of 12 SS8026 Typical Performance Characteristics (V IN= +3.3V, CIN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.) Output Voltage vs. Load Current Dropout Voltage vs. Load Current 1.900 1600 1.880 1400 Dropout Voltage (mV) Ootput Voltage (V) 1.860 1.840 1.820 1.800 1.780 1.760 1.740 1200 1000 800 600 400 200 1.720 1.700 0 100 200 300 400 500 600 700 800 900 1000 0 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Load Current (mA) Line Transient Ground Current vs. Load Current 2.00 1.80 Ground Current (mA) 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Line Transient Rev.2.02 12/06/2003 www.SiliconStandard.com 4 of 12 SS8026 Typical Performance Characteristics (continued) Load Transient Load Transient Load Transient Rev.2.02 12/06/2003 Load Transient www.SiliconStandard.com 5 of 12 SS8026 Safe Operating Area of SOT 223 Maximum Power Dissipation of SOT 223 1200 1.0 1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R£ c J A =156°C/W) 1100 T A =25°C,Still Air 0.9 1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R£ c J A =156°C/W) Power Dissipation (W) Output Current (mA) 1000 900 TA =25°C,Still Air 800 700 600 TA=25¢ J 500 TA=55¢ J 400 TA=85¢ J 300 0.8 0.7 0.6 0.5 0.4 0.3 0.2 200 0.1 100 0.0 0 25 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 35 45 55 65 75 85 95 105 115 125 Amibent Temperature TA (°C) Input-Output Voltage Differential VIN-VOUT (V) Note: V IN(max) <= 6.5V Safe Operating Area of SOT-89 [Power Dissipation Limit] Maximum Power Dissipation of SOT-89 700 0.7 Maximum recommended output current TA=25¢ J 600 0.6 TA=55¢ J TA=85¢ J Power Dissipation (W) Output Current (mA) 500 1oz Copper on SOT-89 Package Mounted on recommended mimimum footprint (R£ c J A =250 °C/W) 400 300 200 100 0 0.5 0.4 0.3 0.2 1oz Copper on SOT-89 Package Mounted on recommended mimimum footprint (R£ c J A =250 °C/W) 0.1 0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 25 35 45 Input-Output Voltage Differential VIN - VOUT (V) 55 65 75 85 95 105 115 125 Ambient Temperature ( °C) Note: V IN(max) <= 6.5V Safe Operating Area of SOT 223 1100 Mounted on 1 square inch, 1oz copper pcb area (R£ c J A =70°C/W) 1000 T A=25°C,Still Air Load Current (mA) 900 800 Mounted on 0.53 square inch, 1oz copper pcb area (R£ c J A =85°C/W) 700 600 500 400 300 200 Mounted on recommend minimum footprint, 1oz copper pcb area (See Recommend minimum footprint) (R£ cJA=156°C/W) 100 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4 4.2 4.4 4.6 Input-Output Voltage Differential (V) Rev.2.02 12/06/2003 www.SiliconStandard.com 6 of 12 SS8026 Safe Operating Area of TO 252 Maximum Power Dissipation of TO 252 1400 1.4 Maximum recommended output current TA=25 °C,Still Air Still Air 1oz Copper on TO-252 Package Mounted on recommend mimimum footprint (R £ c JA=125 °C/W) 1.2 1oz Copper on TO-252 Package Mounted on recommended mimimum footprint (R£ c JA=125°C/W) 1000 800 TA=25 ¢ J 600 TA=55 ¢ J TA=85 ¢ J 400 200 Power Dissipation (W) Output Current (mA) 1200 1.0 0.8 0.6 0.4 0.2 0.0 0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 Input-Output Voltaage Differential VIN-VOUT (V) 25 35 45 55 65 75 85 95 105 115 125 Amibent Temperature T A (¢ J ) Note: V IN(max) <= 6.5V Recommend Minimum Footprint Rev.2.02 12/06/2003 www.SiliconStandard.com 7 of 12 SS8026 Package Information D D1 POLISH E HE A1 e C MATTE FINISH A b b1 b POLISH SOT-89 (T2) Package SYMBOLS DIMENSIONS IN INCHES DIMENSIONS IN MILLIMETERS MIN NOM MAX MIN NOM MAX 0.063 A 1.40 1.50 1.60 0.055 0.059 A1 0.80 1.04 ----- 0.031 0.041 ----- b 0.36 0.42 0.48 0.014 0.016 0.048 b1 0.41 0.47 0.53 0.016 0.018 0.020 C 038 0.40 0.43 0.014 0.015 0.017 D 4.40 4.50 4.60 0.173 0.177 0.181 D1 1.40 1.60 1.75 0.055 0.062 0.069 HE ----- ----- 4.25 ----- ----- 0.167 E 2.40 2.50 2.60 0.094 0.098 0.102 e 2.90 3.00 3.10 0.114 0.118 0.122 Rev.2.02 12/06/2003 www.SiliconStandard.com 8 of 12 SS8026 E A E1 E1 R F d D D1 I L e C A1 b e1 b1 TO-220 (T3) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 4.318 4.826 0.170 0.190 A1 2.46 2.72 0.097 0.107 b 0.69 0.94 0.027 0.037 b1 1.143 1.397 0.045 0.055 C 0.304 0.460 0.012 0.018 D 3.429 3.683 0.135 0.145 D1 8.53 9.04 0.336 0.356 d 2.62 2.87 0.103 0.113 E 9.906 10.40 0.390 0.410 E1 2.84 5.13 0.112 0.202 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 F 1.143 1.397 0.045 0.055 I 3.454 3.962 0.136 0.156 L 13.589 14.351 0.535 0.565 Rev.2.02 12/06/2003 www.SiliconStandard.com 9 of 12 SS8026 E A F E1 L1 H D L2 A1 L3 θ b e C e1 TO-252 (T4) Package SYMBOL MILLIMETERS INCHES MIN. MAX. MIN. MAX. A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245 E 6.35 6.73 0.250 0.265 E1 5.21 5.46 0.205 e 2.26BSC 0.215 0.09BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4° Rev.2.02 12/06/2003 www.SiliconStandard.com 10 of 12 SS8026 A E A1 L3 D H C L1 e L L2 A2 e1 b b1 TO-263 (T5) Package SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.70 10.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 L3 Rev.2.02 12/06/2003 1.40MAX www.SiliconStandard.com 0.111 0.055MAX 11 of 12 SS8026 A D α B1 C 13°(4X ) H E L L2 e e1 13 °(4 X ) A1 B SOT-223 (T6) Package SYMBOLS MILLIMETERS MIN MAX INCHES MIN MAX A 1.55 1.80 0.061 0.071 A1 0.02 0.12 0.0008 0.0047 B 0.60 0.80 0.024 0.031 B1 2.90 3.10 0.114 0.122 C 0.24 0.32 0.009 0.013 D 6.30 6.70 0.248 0.264 E 3.30 3.70 0.130 e 2.30 BSC e1 H 4.60 BSC 6.70 0.146 0.090 BSC 0.181 BSC 7.30 0.264 0.287 L 0.90 MIN 0.036 MIN L2 0.06 BSC 0.0024 BSC a 0º 10º 0º 10º Package Orientation on tape Feed Direction TO-252, TO-263 Package Orientation Feed Direction SOT 89, SOT-223 Package Orientation Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. Rev.2.02 12/06/2003 www.SiliconStandard.com 12 of 12