CHR3663-QEG RoHS COMPLIANT 17-24GHz Integrated Down Converter GaAs Monolithic Microwave IC in SMD package Description The CHR3663-QEG is a multifunction part, which integrates a balanced cold FET mixer, a multiplier by two, and a RF LNA including gain control. It is designed for a wide range of applications, typically commercial communication systems. The circuit is manufactured with a pHEMT process, 0.25µm gate length. It is available in lead-free SMD package. Main Features UMS R3663 YYWW LO I ■ Broadband RF performance 17-24GHz ■ 11dB conversion gain ■ 15 dBc Image Rejection ■ 3 dBm Input IP3 ■ 15dB Gain control ■ 24LQFN4x5 ■ ESD protected VD X2 Q VGM VDL VGL GC2 GC3 Main Characteristics RF Tamb = +25°C, Vd= 4.5V Symbol Parameter Min Typ Max Unit FRF RF frequency range 17 24.0 GHz FLO LO frequency range 7 14.0 GHz FIF IF frequency range DC 3.5 GHz Gc Conversion gain 11 dB ESD Protections: Electrostatic discharge sensitive device observe handling precautions! Ref. : DSCHR3663-QEG8317 - 12 Nov 08 1/16 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 17–24 GHz Down Converter CHR3663-QEG Electrical Characteristics Tamb = +25°C, VD=VDL= 4.5V Symbol Parameter Min Typ Max Unit FRF RF frequency range 17 24.0 GHz FLO LO frequency range 7 14.0 GHz FIF IF frequency range DC 3.5 GHz Gc Conversion gain@ min. attenuation (1) 11 dB ∆G Gain control range 15 dB NF Noise Figure@ min. attenuation 3.5 dB Image rejection (1) 15 dBc PLO LO Input power 0 dBm IIP3 Input IP3@ all gain range (∆G) 3 dBm Im_rej 2LO/RF 2LO leakage at RF port @ max. gain -40 dBm VD, VDL DC drain voltage 4.5 V Drain current 380 mA LNA DC gate voltage -0.4 V Id VGL GC2, GC3 VGM Gain control DC voltage -2 Mixer DC gate voltage +0,6 V -0.7 V These values are representative of onboard measurements as defined on the drawing at page 15 (paragprah “Evaluation mother board”). (1) An external combiner 90° is required on I / Q. Note : Id not affected by GC2, GC3. Absolute Maximum Ratings (1) Tamb = +25°C Symbol Parameter Values Unit Vd Maximum drain bias voltage 5 V Id Maximum drain bias current 450 mA VGL LNA DC gate voltage -2.0 to +0.4 V VGM Mixer DC gate voltage -2.0 to +0.4 V Gain control voltage -2.5 to + 0.8 V GC1, GC2 P_RF Maximum peak input power overdrive 10 dBm P_LO Maximum LO input power 10 dBm Tch Maximum channel temperature (1) 175 °C Ta Operating temperature range -40 to +85 °C Storage temperature range -55 to +125 °C Tstg (1) Operation of this device above anyone of these paramaters may cause permanent damage. Ref. : DSCHR3663-QEG8317 - 12 Nov 08 2/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature can not be maintained below than the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). DEVICE THERMAL SPECIFICATION : CHR3663-QEG Recommanded max. junction temperature (Tj max) : 143 °C Junction temperature absolute maximum rating : 175 °C Max. continuous dissipated power @ Tcase= 85 °C : 1,71 W (1) 85 °C : 29 mW /°C => Pdiss derating above Tcase = (2 ) Junction-Case thermal resistance (Rth J-C) : <34 °C/W (3) Min. package back side operating temperature : -40 °C (3) Max. package back side operating temperature : 85 °C Min. storage temperature : -55 °C Max. storage temperature : 125 °C (1) Derating at junction temperature constant = Tj max (2) Rth J-C is calculated for a worst case where the hotter junction of the MMIC is considered. (3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below). Tcase 1,8 1,6 1,4 1 0,8 0,6 0,4 Pdiss. Max. (W) 0,2 Pdiss. Max. (W) 1,2 Example of QFN 16L 3x3 back-side view, temperature reference point (Tcase) location. 0 -50 -25 0 25 50 75 100 125 Tcase (°C) 5.6 Ref. : DSCHR3663-QEG8317 - 12 Nov 08 3/16 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Typical Measured Performances Tamb = +25°C, VD = VDL = 4.5V, VGL=-0.4V, VGM = -0. 7V, P_LO = 0 dBm These values are representative of onboard measurements (on connector access planes) as defined on the drawing 97625 page 16. The board losses are estimated from 1.5 to 2dB in the frequency range. 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_SUP@2GHz Gcmax_SUP@3,5GHz -14 Gcmin_SUP@2GHz Gcmin_SUP@3,5GHZ -16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Figure 1 : Conversion Gain in Supradyne Mode versus Frequency F_RF=2xF_LO+F_IF, F_IF=2 & 3.5GHz, GC2=GC3=-1.5 & 0.5V 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_INF@2GHz Gcmax_INF@3,5GHz -14 Gcmin_INF@2GHz Gcmin_INF@3,5GHz -16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Figure 2 : Conversion Gain in Infradyne Mode versus Frequency F_RF=2xF_LO-F_IF, F_IF=2 & 3.5GHz, GC2=GC3=-1.5 & 0.5V Ref. : DSCHR3663-QEG8317 - 12 Nov 08 4/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG 30 28 26 24 Dynamic Range (dB) 22 20 18 16 14 12 10 8 6 DynamicRange_SUP@2GHz 4 DynamicRange_INF@2GHz 2 0 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Figure 3 : Dynamic Range (Gcmax – Gcmin) versus Frequency F_RF=2xF_LO-F_IF & F_RF=2xF_LO+F_IF, F_IF=2GHz 300 280 260 Drain Current (dB) 240 220 200 IDL@P_RF=-20dBm ID@P_LO=0dBm 180 160 140 120 100 16 17 18 19 20 21 22 23 24 25 26 Frequency (GHz) Figure 4 : Drain Currents versus Frequency F_RF=2xF_LO-F_IF, Freq_IF=2GHz, GC2=GC3=-1.5V Ref. : DSCHR3663-QEG8317 - 12 Nov 08 5/16 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG 15 F_RF=16GHz F_RF=22GHz 14 F_RF=18GHz F_RF=24GHz F_RF=20GHz F_RF=26GHz Conversion Gain (dB) 13 12 11 10 9 8 7 6 5 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 2 4 6 Input Power (dBm) Figure 5 : Conversion Gain versus RF Power F_RF=2xF_LO+F_IF, F_IF=2 GHz, GC2=GC3=-1.5V 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 GCx=-1,5V Gcx=-0,1V -14 Gcx=-0,5V GCx=+0,5V" Gcx=-0,3V -16 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 Input Power (dBm) Figure 6: : Conversion Gain versus RF Power F_RF=2xF_LO+F_IF, F_RF=20 GHz, F_IF=2 GHz Ref. : DSCHR3663-QEG8317 - 12 Nov 08 6/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice Input IP3 (dBm) 17–24 GHz Down Converter 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 F_RF=17,5GHz CHR3663-QEG F_RF=20,5GHz -20 F_RF=23,5GHz -15 -10 Input Power (dBm) Input IP3 (dBm) Figure 7 : Input IP3 versus RF Frequency & RF Power (Double Carrier) F_RF=2xF_LO-F_IF, F_IF=3.5 GHz, GC2=GC3=-1.5V 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 GCx=-1,5V GCx=-0,5V -20 GCx=-0,3V -15 -10 Input Power (dBm) Figure 8 : Input IP3 versus Gain Control & RF Power (Double Carrier) F_RF=2xF_LO-F_IF, F_RF=20.5 GHz, F_IF=3.5 GHz Ref. : DSCHR3663-QEG8317 - 12 Nov 08 7/16 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Temperature Measurements T = [-40, +25, 85] °C, VD = VDL = 4.5V, VGL=-0.4V, VGM = -0.7V, P_LO = 0 dBm 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_SUP@-40°C Gcmax_SUP@25°C Gcmax_SUP@85°C -14 Gcmin_SUP@-40°C Gcmin_SUP@25°C Gcmin_SUP@85°C -16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Figure 9: Conversion Gain in Supradyne Mode versus Temperature & Frequency F_RF=2xF_LO+F_IF, F_IF=2GHz, GC2=GC3=-1.5 & 0.5V 16 14 12 10 Conversion Gain (dB) 8 6 4 2 0 -2 -4 -6 -8 -10 -12 Gcmax_INF@-40°C Gcmax_INF@25°C Gcmax_INF@85°C -14 -16 17 18 19 20 21 Gcmin_INF@-40°C Gcmin_INF@25°C Gcmin_INF@85°C 22 23 24 25 26 RF Frequency (GHz) Figure 10 : Conversion Gain in Infradyne Mode versus Temperature & Frequency F_RF=2xF_LO-F_IF, F_IF=2GHz, GC2=GC3=-1.5 & 0.5V Ref. : DSCHR3663-QEG8317 - 12 Nov 08 8/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG 40 35 Image Rejection (dBc) 30 25 20 15 10 5 IM_REJ_I@-40°C IM_REJ_I@25°C IM_REJ_I@85°C 0 7 8 9 10 11 12 13 14 LO Frequency (GHz) Figure 11 : Image Rejection on Output I F_IF=2GHz, GC2=GC3=-1.5V 40 35 Image Rejection (dBc) 30 25 20 15 10 5 IM_REJ_Q@-40°C IM_REJ_Q@25°C IM_REJ_Q@85°C 0 7 8 9 10 11 12 13 14 LO Frequency (GHz) Figure 12 : Image Rejection on Output Q F_IF=2GHz, GC2=GC3=-1.5V Ref. : DSCHR3663-QEG8317 - 12 Nov 08 9/16 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter Input IP3 (dBm) CHR3663-QEG 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 T=-40°C T=25°C -20 T=75°C -15 -10 Input Power (dBm) Figure 13 : Input IP3 versus Temperature & RF Power (Double Carrier) F_RF=2xF_LO-F_IF, F_RF = 20.5 GHz, F_IF = 3.5 GHz, GC2=GC3=-1.5V Ref. : DSCHR3663-QEG8317 - 12 Nov 08 10/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Noise Figure (dB) The following values are representative of onboard measurements of the Noise Figure where board losses have been deembedded (result given on package access planes). 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 NF_SUP@-40°C 16 17 18 NF_SUP@25°C 19 20 21 NF_SUP@85°C 22 23 24 25 26 RF Frequency (GHz) Noise Figure (dB) Figure 14 : Noise Figure in Surpradyne Mode vs Temperature & Frequency F_RF=2xF_LO+F_IF, F_IF=2GHz, GC2=GC3=-1.5V 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 NF_INF@-40°C 16 17 18 19 NF_INF@25°C 20 21 22 NF_INF@85°C 23 24 25 26 RF Frequency (GHz) Figure 15 : Noise Figure in Infradyne Mode vs Temperature & Frequency F_RF=2xF_LO-F_IF, F_IF=2GHz, GC2=GC3=-1.5V Ref. : DSCHR3663-QEG8317 - 12 Nov 08 11/16 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Package outline (1) (1) The package outline drawing included to this data-sheet is given for indication. Refere to the application note AN0017 available at http://www.ums-gaas.com for exact package dimensions. (2) It is strongly recommended to ground on the PCB board all the pins referenced as GND. Ref. : DSCHR3663-QEG8317 - 12 Nov 08 12/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Definition of the Sij reference planes The reference planes used for Sij measurements given above are symmetrical from the symmetrical axis of the package (see drawing beside). The input and output reference planes are located at 3.18mm offset (input wise and output wise respectively) from this axis. Then, the given Sij parameters incorporate the land pattern of the evaluation motherboard recommended at the page 15. 3.18 3.18 Recommanded package footprint Refere to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommandations. SMD mounting procedure The SMD leadless package has been designed for high volume surface mount PCB assembly process. The dimensions and footprint required for the PCB (motherboard) are given in the drawings above. For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Ref. : DSCHR3663-QEG8317 - 12 Nov 08 13/16 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Notes Due to ESD protection circuits on RF and LO inputs, an external capacitance might be requested to isolate the product from external voltage that could be present on these accesses in the application. 15 LO 20 I VD X2 22 Q 12 VGM 11 VDL 10 VGL GC2 GC3 9 8 7 RF 5 ESD protections are also implemented on gate accesses. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling on the PC board, as close as possible to the package. Ref. : DSCHR3663-QEG8317 - 12 Nov 08 14/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Evaluation mother board Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. Decoupling capacitors of 10nF ±10% are recommended for all DC accesses. (See application note AN0017 for details). Decoupling Capacitors = 10nF Hybrid coupler Anaren 90° 2-4GHz Ref. : DSCHR3663-QEG8317 - 12 Nov 08 GC3 GC2 VGL VDL VGM VD 15/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 17–24 GHz Down Converter CHR3663-QEG Ordering Information QFN 4x5 RoHS compliant package : Stick: XY = 20 Tape & reel: XY = 21 CHR3663-QEG/XY Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR3663-QEG8317 - 12 Nov 08 16/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice