CHR3352-QEG RoHS COMPLIANT 12-16GHz Integrated Down Converter GaAs Monolithic Microwave IC in SMD leadless package Description The CHR3352-QEG is a multifunction monolithic circuit, which integrates a balanced cold FET mixer, a LO buffer and a RF LNA including gain control. It is designed for a wide range of applications, typically ISM and commercial communication systems. The circuit is manufactured with a pHEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in RoHS compliant SMD package. Main Features Gain versus attenuation 15 14 ■ Broadband RF performance 12-16GHz ■ 13dB conversion gain ■ 2dBm Input IP3 ■ 9dB Gain Control ■ 15dBc Image Rejection ■ 24LQFN4x5 – MSL1 ■ ESD protected 13 Conversion Gain (dB) 12 11 10 9 8 7 6 5 4 3 2 1 -1,5 0 10 11 -0,7 12 -0,6 13 -0,5 14 -0,3 15 0,0 16 17 18 RF Frequency (GHz) Main Characteristics Tamb.= +25°C Symbol Parameter FRF RF Frequency range FLO LO Frequency range FIF IF Frequency range Gc Conversion gain Ref. : DSCHR3352-QEG1192 - 11 Jul 11 Min 12 8.5 DC Typ 13 1/16 Max 16 19.5 3.5 Unit GHz GHz GHz dBm Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHR3352-QEG 12-16GHz Integrated Down Converter Main Characteristics Tamb.= +25°C Symbol Parameter FRF RF frequency range FLO LO frequency range FIF IF frequency range CG Conversion gain@ min. attenuation (1) ∆G Gain control range NF Noise Figure@ min. attenuation, IF>0.1GHz Im_rej Image rejection (1) PLO LO Input power IIP3 Input IP3@ at Gc max. LO RL LO Return Loss RF RL RF Return Loss VD, VDL DC drain voltage IDL LNA current ID LO Buffer current VG2, 3 LNA DC gate voltage B LO Buffer DC gate voltage IB LO Buffer DC gate current GC Gain control DC voltage Min 12 8.5 DC Typ Max 16 19.5 3.5 12 9 2.7 15 0 2 -12 -12 4.0 120 130 -0.5 -3 -7 -1.5 0 Unit GHz GHz GHz dB dB dB dBc dBm dBm dB dB V mA mA V V mA V (1) An external combiner 90° is required on I / Q These values are representative of on-board measurements. Note: Id is not affected by GC. Electrostatic discharge sensitive device, observe handling precautions! Ref. : DSCHR3352-QEG1192 - 11 Jul 11 2/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Absolute Maximum Ratings (1) Tamb.= +25°C Symbol Parameter VD, VDL Maximum drain bias voltage Id_total Maximum drain bias current VGL LNA DC gate voltage B Buffer, Mixer DC gate voltage GC Gain control voltage P_RF Maximum peak input power overdrive P_LO Maximum LO input power Tch Maximum channel temperature Ta Operating temperature range Tstg Storage temperature range Values 4.5 420 -2.0 to +0.4 -4 -2.5 to + 0.8 10 5 175 -40 to +85 -55 to +150 Unit V mA V V V dBm dBm °C °C °C (1) Operation of this device above anyone of these parameters may cause permanent damage. Typical Bias Conditions Tamb.= +25°C Symbol Pad No VDL, VD 10, 11 IDL 10 VG2, 3 8, 9 B 12 GC 7 Parameter DC drain voltages LNA current controlled with VG2, 3 LNA DC gate voltage Buffer DC gate voltage Gain control DC voltage Ref. : DSCHR3352-QEG1192 - 11 Jul 11 3/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Values 4 120 -0.5 -3 -1.5 to 0 Unit V mA V V V Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature can not be maintained below than the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). DEVICE THERMAL SPECIFICATION : CHR3352-QEG Recommended max. junction temperature (Tj max) : 174 Junction temperature absolute maximum rating : 175 Max. continuous dissipated power (Pdiss. Max.) : 1.0 => Pdiss. Max. derating above Tcase(1)= 85 °C : 11 (2) Junction-Case thermal resistance (Rth J-C) : <89 Minimum Tcase operating temperature(3) : -40 Maximum Tcase operating temperature(3) : 85 Minimum storage temperature : -55 Maximum storage temperature : 150 °C °C W mW/°C °C/W °C °C °C °C (1) Derating at junctio n temperature co nstant = Tj max. (2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the M M IC and all the devices biased. (3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 1.2 0.8 0.6 0.4 0.2 Pdiss. Max. @Tj <Tj max (W) 0 -50 -25 0 25 50 75 100 125 150 175 Pdiss. Max. @Tj <Tj max (W) 1 Tcase Example: QFN 16L 3x3 Location of temeprature reference point (Tcase) on package's bottom side Tcase (°C) 6.0 Ref. : DSCHR3352-QEG1192 - 11 Jul 11 4/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Typical Measured Performances (1) Tamb = +25°C, VD=VDL= 4V, VG2=VG3= -0.5V, VGM = -0.7V, P_LO = 0dBm Board losses de-embedded (result given on package access planes) Conversion Gain versus RF & IF Frequencies RF = LO+ IF, GC = -1.5V & 0V 18 17 16 15 Conversion Gain (dB) 14 13 12 11 10 9 8 Atten min @2GHz Atten max @2GHz 7 6 Atten min @3,5GHz Atten max @3,5GHz 5 4 3 2 1 0 10 11 12 13 14 15 16 17 18 RF Frequency (GHz) (1) If no specific mention, the following values are representative of onboard measurements (on connector access planes) as defined on the drawing at paragraph Evaluation mother board. The board losses are estimated from 0.8 to 1.2dB in the frequency range. Ref. : DSCHR3352-QEG1192 - 11 Jul 11 5/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Typical Measured Performances Tamb = +25°C, VD=VDL= 4V, VG2=VG3= -0.5V, VGM = -0.7V, P_LO = 0dBm Board losses de-embedded (result given on package access planes) Conversion Gain in Supradyne Mode versus RF Frequency & GC RF = LO+ IF, IF = 2GHz 15 14 13 12 Conversion Gain (dB) 11 10 9 8 7 6 5 4 3 2 1 Gc=-1,5V Gc=-0,7V Gc=-0,6V Gc=-0,5V Gc=-0,3V Gc=-0V 0 10 11 12 13 14 15 16 17 18 RF Frequency (GHz) Conversion Gain in infradyne Mode versus RF Frequency & GC RF = LO- IF, IF = 2GHz 15 14 13 Conversion Gain (dB) 12 11 10 9 8 7 6 5 4 3 2 1 Gc=-1,5V Gc=-0,7V Gc=-0,6V Gc=-0,5V Gc=-0,3V Gc=-0V 0 10 11 12 13 14 15 16 17 18 RF Frequency (GHz) Ref. : DSCHR3352-QEG1192 - 11 Jul 11 6/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Typical Measured Performances Tamb = +25°C, VD=VDL= 4V, VG2=VG3= -0.5V, VGM = -0.7V, P_LO = 0dBm Board losses de-embedded (result given on package access planes) Noise Figure versus Frequency RF = LO+/- IF, IF = 2GHz, GC = -1.5 & 0V 8 7 Noise Figure (dB) 6 5 NF_I Atten min NF_I Atten max 4 NF_Q Atten min NF_Q Atten max 3 2 1 10 11 12 13 14 15 16 17 18 RF Frequency (GHz) Return loss versus Frequency GC = -1.5V 0 Return loss (dB) -5 -10 -15 -20 -25 RF return loss LO return loss -30 0 5 10 15 20 Frequency (GHz) Ref. : DSCHR3352-QEG1192 - 11 Jul 11 7/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Typical Measured Performances Tamb = +25°C, VD=VDL= 4V, VG2=VG3= -0.5V, VGM = -0.7V, P_LO = 0dBm Board losses de-embedded (result given on package access planes) Image Rejection versus frequency RF = LO+/- IF, IF = 2GHz, GC = -1.5V 40 Image rejection (dB) 35 30 25 20 15 10 Channel I FI=2GHz Channel Q FI=2GHz 5 10 11 12 13 14 15 16 17 18 RF Frequency (GHz) Image Rejection versus Frequency RF = LO+/- IF, IF = 3.5GHz, GC = -1.5V 40 Image rejection (dB) 35 30 25 20 15 10 Channel I FI=3,5GHz Channel Q FI=3,5GHz 5 10 11 12 13 14 15 16 17 18 RF Frequency (GHz) Ref. : DSCHR3352-QEG1192 - 11 Jul 11 8/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Typical Measured Performances Tamb = +25°C, VD=VDL= 4V, VG2=VG3= -0.5V, VGM = -0.7V, P_LO = 0dBm Board losses de-embedded (result given on package access planes) Input IP3 versus Freq. at GC = -1.5V IMD3 versus Freq. at GC = -1.5V 16 80 14 75 12 70 65 60 8 IMD3 (dBc) Input IP3 (dBm) 10 6 4 55 50 45 2 40 0 35 -2 30 13GHz -4 13GHz -6 20 -30 -28 -26 -24 -22 -20 -18 -16 -30 -28 -26 Input Power DCL (dBm) -24 -22 -20 -18 -16 Input Power DCL (dBm) Input IP3 versus GC at 16GHz Input IP3 vs temperature at 13GHz 16 6 14 5 12 4 10 3 8 Input IP3 (dBm) Input IP3 (dBm) 16GHz 25 16GHz 6 4 2 2 1 0 -1 -2 0 -3 -2 -4 -4 -1.5V -0.7V -0.6V -0.5V -0.3V -5 0V -6 -30 -28 -26 -24 -22 -20 -18 -16 85°C;-1.5V 85°C;-0.6V -6 -30 Input Power DCL (dBm) Ref. : DSCHR3352-QEG1192 - 11 Jul 11 -28 -26 -24 25°C;-1.5V 25°C;-0.6V -22 -40°C;-1.5V -40°C;-0.6V -20 -18 -16 Input Power DCL (dBm) 9/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Typical Measured Performances Tamb = +25°C, Tcold = -40°C, Thot = +85°C VD=VDL= 4V, VG2=VG3= -0.5V, VGM = -0.7V, P_LO = 0dBm Board losses de-embedded (result given on package access planes) Conversion Gain vs Temperature IF = 2GHz, GC = -1.5V & 0V Conversion Gain vs Temperature IF = 3.5GHz, GC = -1.5V & 0V 18 17 16 15 13 Conversion Gain (dB) Conversion Gain (dB) 14 12 11 10 Gain max Ta=-40°C Gain min Ta=-40°C 8 Gain max Ta=+25°C Gain min Ta=+25°C 7 Gain max Ta=+85°C Gain min Ta=+85°C 9 6 5 4 3 2 1 0 10 11 12 13 14 15 16 17 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 -1 -2 -3 18 10 11 Gain max Ta=-40°C Gain min Ta=-40°C Gain max Ta=+25°C Gain min Ta=+25°C Gain max Ta=+85°C Gain min Ta=+85°C 12 13 RF Frequency (GHz) 14 15 16 Noise figure vs Temperature Supradyne, IF = 2GHz, GC = -1.5V 18 Noise figure vs Temperature Infradyne, IF = 2GHz, GC = -1.5V 8 8 7 7 -40°C 6 -40°C 6 +25°C Noise Figure (dB) Noise Figure (dB) 17 RF Frequency (GHz) +85°C 5 4 3 +25°C +85°C 5 4 3 2 2 1 10 11 12 13 14 15 16 17 1 18 10 11 12 RF Frequency (GHz) mRF 0 1 2 3 4 13 14 15 16 17 18 RF Frequency (GHz) Spurious on IF outputs P_RF = -20dBm / P_LO = 0dBm @12GHz nLO 0 1 2 3 Xx 12 9 22 26 24 >40 32 39 >40 37 >40 33 >40 >40 >40 >40 >40 >40 >40 4 >40 >40 >40 >40 >40 All values in dBc below IF power level (IF = 1GHz). Data measured without external hybrid coupler. Ref. : DSCHR3352-QEG1192 - 11 Jul 11 10/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 12-16GHz Integrated Down Converter CHR3352-QEG Package outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678- Nc Nc Nc Gnd(2) RF in Nc GC VG2 910111213141516- VG3 VDL VD B Nc Nc LO in Gnd(2) 1718192021222324- Nc Nc Nc IF_I Gnd(2) IF_Q Nc Nc (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0017 (http://www.ums-gaas.com) for exact package dimensions. (2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package. Ref. : DSCHR3352-QEG1192 - 11 Jul 11 11/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter 16 15 NC NC LO IN 17 GND NC 19 18 NC NC Due to ESD protection circuits on RF input and output, an external capacitance might be requested to isolate the product from external voltage that could be present on the RF accesses. 14 13 IF_I 20 12 B GND 21 11 VD IF_Q 22 10 VDL NC 23 9 VG3 NC 24 8 VG2 NC 5 6 7 GC NC 4 NC 3 RF IN 2 GND 1 NC NC ESD protections are also implemented on gate and control accesses. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling (10nF) on the PC board, as close as possible to the package. Ref. : DSCHR3352-QEG1192 - 11 Jul 11 12/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter DC Schematic LO Amplifier and Mixer: 4V, 130mA; -3V, 7mA VD 6 25 1.8 k x5 1.5 k IF I 50 mA 30 mA LO 365 855 7 mA 1425 300 5 300 390 IF Q 1425 1.5 k B 50 mA LO amplifier Mixer LNA: 4V, 120mA VDL 1615 RF 40 8 2214mA mA 66 mA 47 2 44mA 9261mA mA 280 300 280 200 x2 2 k x4 x2 800 800 800 GC VG3 VG2 Ref. : DSCHR3352-QEG1192 - 11 Jul 11 13/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Evaluation mother board ■ Compatible with the proposed footprint. ■ Based on typically Ro4003 / 8mils or equivalent. ■ Using a micro-strip to coplanar transition to access the package. ■ Recommended for the implementation of this product on a module board. ■ Decoupling capacitors of 10nF ±10% are recommended for all DC accesses. ■ See application note AN0017 for details. ■ Hybrid coupler 90° ; 2- 4GHz Q I RF LO GC VG2 VG3 VDL VD B Ref. : DSCHR3352-QEG1192 - 11 Jul 11 14/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 12-16GHz Integrated Down Converter CHR3352-QEG Notes Ref. : DSCHR3352-QEG1192 - 11 Jul 11 15/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3352-QEG 12-16GHz Integrated Down Converter Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management Refer to the application note AN0019 available at http://www.ums-gaas.com for environmental data on UMS package products. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products. Ordering Information QFN 4x5 RoHS compliant package: CHR3352-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR3352-QEG1192 - 11 Jul 11 16/16 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice