AGERE USS810M-D

Data Sheet, Rev. 6
March 2006
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
1 Features
„
Complies with Universal Serial Bus Specification
Rev. 2.0.
„
Can be used as a USB device transceiver or a
USB host transceiver.
„
Supports full-speed (12 Mbits/s) and low-speed
(1.5 Mbits/s) serial data rates.
„
Includes two single-ended receivers with hysteresis.
„
Low-power operation helps maximize battery life of
portable electronic devices.
„
Available in a small MLCC16 package measuring
3 mm x 3 mm. (A lead-free package is also available. See Ordering Information on page 14.)
„
Supports a digital I/O voltage range from 1.75 V to
3.3 V.
„
Supports the full industrial operating temperature
range, −40 °C to +85 °C.
2 Description
Agere’s USS810 is a Universal Serial Bus (USB)
transceiver that is fully compliant with the Universal
Serial Bus Specification Rev. 2.0. The USS810 can
transmit and receive serial data at full-speed
(12 Mbits/s) and low-speed (1.5 Mbits/s) data rates
and, therefore, can be used as either a USB device
transceiver or a USB host transceiver.
Since the USS810 operates at digital I/O voltages
between 1.75 V to 3.3 V, it is particularly suitable for
portable electronic devices such as mobile phones,
digital still cameras, personal digital assistants
(PDAs), and a variety of information appliances. This
transceiver provides an ideal interface to the physical
layer of the universal serial bus for application-specific ICs (ASICs) and programmable logic devices
(PLDs) with power supply voltages in the above
range.
The USB transceiver is currently available in an
MLCC16 package that supports single-ended input
data interface.
3 Suitable Applications
Portable electronic devices, such as the following:
„
Mobile phone
„
Digital still camera
„
Personal digital assistant (PDA)
„
Information appliances
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
Data Sheet, Rev. 6
March 2006
Table of Contents
Contents
Page
1
2
3
4
5
Features ...............................................................................................................................................................1
Description ............................................................................................................................................................1
Suitable Applications ............................................................................................................................................1
Functional Diagram ..............................................................................................................................................3
Pin Information .....................................................................................................................................................3
5.1 Pin Descriptions ............................................................................................................................................ 4
6 Functional Description ..........................................................................................................................................5
6.1 Function Selection ........................................................................................................................................ 5
6.1 Operating Functions...................................................................................................................................... 5
7 Limiting Values .....................................................................................................................................................6
7.1 Absolute Maximum Ratings .......................................................................................................................... 6
8 Static Characteristics ............................................................................................................................................6
9 Dynamic Characteristics .......................................................................................................................................8
10 Test Information ................................................................................................................................................ 11
11 Package Outline Diagrams ............................................................................................................................... 12
11.1 16-Pin MLCC, 3 mm x 3 mm..................................................................................................................... 12
12 USB Application Support Contact Information .................................................................................................. 14
13 Ordering Information ......................................................................................................................................... 14
Figure
Page
Figure 1. USS810 Functional Diagram ..................................................................................................................... 3
Figure 2. USS810 MLCC Pin Diagram (Top View) ................................................................................................... 3
Figure 3. Rise and Fall Times ................................................................................................................................... 9
Figure 4. Timing of OE to D+, D– ........................................................................................................................... 10
Figure 5. Timing of D+, D– to RCV, VP, VM .......................................................................................................... 10
Figure 6. Timing of VO, FSE0 to D+, D– ................................................................................................................ 10
Figure 7. Load for D+, D– ....................................................................................................................................... 11
Table
Page
Table 1. USS810 Pin Description ............................................................................................................................ 4
Table 2. Function Table........................................................................................................................................... 5
Table 3. Transmit Function Using Single-Ended Input Data Interface (OE = L)...................................................... 5
Table 4. Receive Function (OE = H) ....................................................................................................................... 5
Table 5. Absolute Maximum Ratings....................................................................................................................... 6
Table 6. Recommended Operating Conditions ....................................................................................................... 6
Table 7. Static Characteristics: Supply Pins............................................................................................................ 6
Table 8. Static Characteristics: Digital Pins............................................................................................................. 7
Table 9. Static Characteristics: Analog I/O Pins (D+, D–) ....................................................................................... 7
Table 10. Dynamic Characteristics: Analog I/O Pins (D+, D–)1 .............................................................................. 8
Table 11. Pitch Variation ....................................................................................................................................... 13
Table 12. Common Dimensions ............................................................................................................................ 13
2
Agere Systems Inc.
Data Sheet, Rev. 6
March 2006
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
4 Functional Diagram
VDD
VDD(I/O)
VPU(3.3)
SOFTCON
OE
SPEED
FSE0
D+
1.5 kΩ1
D–
24 Ω (1%)
VO
SUSPND
RCV
24 Ω (1%)
LEVEL
SHIFTER
+
–
VP
VM
GND
1. Connect pull-up to D– for low-speed operation.
Figure 1. USS810 Functional Diagram
5 Pin Information
SOFTCON
VPU(3.3)
NU
VDD
16
15
14
13
OE
1
12
FSE0
RCV
2
11
VO
VP
3
10
D+
VM
4
9
D–
USS810
MLCC
5
6
7
8
SUSPND
GND
VDD(I/O)
SPEED
Figure 2. USS810 MLCC Pin Diagram (Top View)
Agere Systems Inc.
3
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
Data Sheet, Rev. 6
March 2006
5 Pin Information (continued)
5.1 Pin Descriptions
Table 1. USS810 Pin Description
Symbol
MLCC
Pin
Type
Description
VPU(3.3)
15
—
Pull-Up Voltage Source. Connect this pin through an external 1.5 kΩ resistor to D+
(for full-speed operation) or D– (for low-speed operation). This pin’s function is
controlled by the SOFTCON input pin. To ensure zero pull-up current, set
SOFTCON = low to cause VPU(3.3) to float (high impedance); when
SOFTCON = high, VPU(3.3) = 3.3 V.
SOFTCON
16
I
Software-Controlled USB Connection. This pin allows USB connect/disconnect
signaling to be controlled by software. A high level on this pin applies 3.3 V to pin
VPU(3.3), which is connected to an external 1.5 kΩ pull-up resistor.
OE 1
1
I
Output Enable. This active-low pin enables the transceiver to transmit data on the
USB bus.
RCV
2
O
Differential Data Receiver. When the SUSPND input is high, this pin is driven low.
The state of RCV is unknown when FSE0 = 1.
VP
3
O
Single-Ended D+ Receiver. The VP pin is used for external detection of singleended zero (SE0), error conditions, and speed of connected device.
VM
4
O
Single-Ended D− Receiver. The VM pin is used for external detection of singleended zero (SE0), error conditions, and speed of connected device.
SUSPND
5
I
Suspend. When SUSPND is high, it enables a low-power state while the USB is
inactive and drives output RCV to a low level. No dc power is consumed when
SUSPND is high.
GND
6
P
Device Ground.
VDD(I/O)
7
P
Power Supply for Digital I/O. 1.75 V to 3.3 V.
SPEED
8
I
Speed Selection. This pin adjusts the slew rate of differential data outputs D+ and
D–. Tie this pin low to enable low-speed data transmission (1.5 Mbits/s) and high to
enable full-speed data transmission (12 Mbits/s).
D–
9
D+
10
Analog Negative USB Differential Data Bus. If this device is used in a USB peripheral
I/O
application, connect an external 24 Ω ± 1% resistor in series with this signal in
order to meet the USB Specification, Rev. 2.0 impedance requirement. Connect
this signal to pin VPU(3.3) via a 1.5 kΩ ± 5% resistor for low-speed USB peripheral
applications.
Analog Positive USB Differential Data Bus. If this device is used in a USB peripheral
I/O
application, connect an external 24 Ω ± 1% resistor in series with this signal in
order to meet the USB Specification Rev. 2.0 impedance requirement. Connect this
signal to pin VPU(3.3) via a 1.5 kΩ ± 5% resistor for full-speed USB peripheral applications.
VO
11
I
Single-Ended Data Input. Refer to Table 3..
FSE0
VDD
12
I
13
P
14
—
Single-Ended Zero Mode. Refer to Table 3..
3.3 V Power Supply. This voltage supply is used for the USB signals D+/D– and the
internal level shifter.
Not Usable. No external connections to this pin are allowed.
NU
1. Symbol names with an overscore (e.g., NAME) indicate active-low signals.
4
Agere Systems Inc.
Data Sheet, Rev. 6
March 2006
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
6 Functional Description
6.1 Function Selection
Table 2. Function Table
SUSPND
(D+, D–)
RCV
VP/VM
Active
Active
Normal transmit (differential receiver active)
Active
L2
Active
Active
L2
Active
Receiving
Transmitting during suspend (differential
receiver inactive)
Low-power state
L
OE
L
L
H
H
L
Transmitting
and Receiving
Receiving1
High-Z 3
H
H
High-Z 3
Function
1. Signal levels on (D+, D–) are determined by other USB devices and external pull-up/down resistors.
2. In suspend mode (SUSPND = high), the differential receiver is inactive and output RCV is always low. Out-of-suspend (K) signaling is
detected via the single-ended receivers VP and VM.
3. In suspend mode, the D+/D– output is tristated.
6.1 Operating Functions
Table 3. Transmit Function Using Single-Ended Input Data Interface (OE = L)
FSE0
VO
L
L
H
H
L
H
L
H
Data
Differential logic 0
Differential logic 1
SE0
SE0
Table 4. Receive Function (OE = H)
(D+, D–)
RCV
VP
VM
Differential Logic 0
Differential Logic 1
SE0
L
H
Unknown1
L
H
L
H
L
L
1. The state of RCV is unknown when FSE0 = 1.
Agere Systems Inc.
5
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
Data Sheet, Rev. 6
March 2006
7 Limiting Values
7.1 Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of
those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Table 5. Absolute Maximum Ratings
Symbol
VDD(I/O)
VDD(3.3)
VI
Tstg
Parameter
Conditions
Min
Max
Unit
—
—
—
—
1.7
3.0
–0.5
–40
3.3
3.6
VDD + 0.5
125
V
V
V
°C
I/O Supply Voltage
3.3 V Supply Voltage
dc Input Voltage
Storage Temperature
Table 6. Recommended Operating Conditions
Symbol
VDD(I/O)
VDD(3.3)
VI
VI(AI/O)
Tamb
Parameter
Conditions
I/O Supply Voltage
—
3.3 V Supply Voltage
3.3 V operation
Input Voltage
—
Input Voltage on Analog
—
I/O Pins (D+/D–)
Operating Ambient
—
Temperature
Min
Typical
Max
Unit
1.75
3.135
0
0
—
3.3
—
—
3.3
3.465
3.3
VDD(I/O)
V
V
V
V
–40
—
85
°C
8 Static Characteristics
Table 7. Static Characteristics: Supply Pins
VDD = 3.3 V; VDD(I/O) = 1.75 V to 3.3 V; VGND = 0 V; Tamb = –40 °C to +85 °C; unless otherwise specified.
Symbol
Conditions
Min
Typical
Max
Unit
IDD
Operating Supply Current
Full-speed transmit and
receive
—
5
8
mA
IDD(I/O)
Operating I/O Supply
Current
Suspend Supply Current
Full-speed transmit and
receive at 12 Mbits/s
SUSPND = high
—
—
100
µA
—
—
10
µA
IDD(susp)
6
Parameter
Agere Systems Inc.
Data Sheet, Rev. 6
March 2006
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
8 Static Characteristics (continued)
Table 8. Static Characteristics: Digital Pins
VDD(I/O) = 1.75 V to 3.3 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typical
Max
Unit
VDD(I/O) = 1.75 V to 3.3 V
Input Levels:
VIL
Low-level Input Voltage
High-level Input Voltage
VIH
Output Levels:
VOL
Low-level Output Voltage
High-level Output Voltage
VOH
—
—
—
1.7
—
—
0.7
—
V
V
IOL ≤ 6 mA
IOH ≤ 6 mA
—
VDD – 0.4
—
—
0.4
—
V
V
Table 9. Static Characteristics: Analog I/O Pins (D+, D–)
VDD = 3.3 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typical
Max
Unit
0.2
0
—
—
—
VDD
V
V
0.3
—
—
V
Input Levels
VDI
VCM
Differential Receiver
Differential Input Sensitivity
IVI(D+) – VI(D–)I
Differential Common-mode
Includes VDI range
Voltage
Single-Ended Receiver
Hysteresis Voltage
—
Vhys
Output Levels
VOL
Low-level Output Voltage
VOH
High-level Output Voltage
Leakage Current
ILZ
High-impedance Leakage
Current
Capacitance
CIN
Transceiver Capacitance
Agere Systems Inc.
RL = 1.5 kΩ to
3.6 V
RL = 15 kΩ to GND
—
—
0.3
V
2.8
—
3.6
V
OE = 1
–10
—
10
µA
Pin to GND
—
—
3
pF
7
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
Data Sheet, Rev. 6
March 2006
9 Dynamic Characteristics
Table 10. Dynamic Characteristics: Analog I/O Pins (D+, D–)1
VDD = 3.3 V; VDD(I/O) = 1.75 V to 3.3 V; VGND = 0 V; Tamb = –40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typical
Max
Unit
Driver Characteristics
Full-Speed Mode (Speed = 1)
tR
Rise Time
OE = 0, CL = 50 pF;
10% to 90% of |VOL − VOH|;
see Figure 3..
4
—
20
ns
tF
Fall Time
OE = 0, CL = 50 pF;
90% to 10% of |VOH − VOL|;
see Figure 3.
4
—
20
ns
Differential Rise/Fall Time Matching OE = 0, CL = 50 pF.
90
100
110
%
Output Signal Crossover Voltage
OE = 0, CL = 50 pF:
see Figures 4, 5, 6.
1.3
—
2.0
V
DRFM
VCRS
Low-Speed Mode (Speed = 0)
tR
Rise Time
OE = 0, CL = 50 pF or
350 pF; 10% to 90% of
|VOL − VOH|; see Figure 3.
75
—
300
ns
tF
Fall Time
OE = 0, CL = 50 pF or
350 pF; 90% to 10% of
|VOH − VOL|; see Figure 3.
75
—
300
ns
DRFM
Differential Rise/Fall Time Matching CL = 50 pF or 350 pF.
80
100
120
%
VCRS
Output Signal Crossover Voltage
1.3
—
2.0
V
—
—
18
ns
—
—
18
ns
—
—
2.5
ns
—
—
2.5
ns
—
—
20
ns
—
—
20
ns
CL = 50 pF or 350 pF;
see Figures 4, 5, 6.
Driver Timing
Full-Speed Mode (Speed = 1)
tPLH
tPHL
tPHZ
tPLZ
tPZH
tPZL
Driver Propagation Delay:
OE = 0, CL = 50 pF; see
Low-to-High (VO, FSE0 to D+, D–) Figure 6.
OE = 0, CL = 50 pF; see
Driver Propagation Delay:
High-to-Low (VO, FSE0 to D+, D–) Figure 6.
Tristate Output Disable: High-to-Off OE switching; see Figure 4.
(OE to D+, D−)
Tristate Output Disable: Low-to-Off OE switching; see Figure 4.
(OE to D+, D−)
Tristate Output Enable: Off-to-High OE switching; see Figure 4.
(OE to D+, D−)
Tristate Output Enable: Off-to-Low OE switching; see Figure 4.
(OE to D+, D−)
1. Test circuit: see Figure 7.
8
Agere Systems Inc.
Data Sheet, Rev. 6
March 2006
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
9 Dynamic Characteristics (continued)
Table 10. Dynamic Characteristics: Analog I/O Pins (D+, D–)1 (continued)
Symbol
Parameter
Conditions
Min
Typical
Max
Unit
—
250
ns
—
250
ns
—
4
ns
—
4
ns
—
400
ns
—
400
ns
—
5
ns
—
5
ns
—
3
ns
—
3
ns
Driver Timing (continued)
Low-Speed Mode (SPEED = 0)
tPLH
tPHL
tPHZ
tPLZ
tPZH
tPZL
tPLH(dif)
tPHL(dif)
tPLH(se)
tPHL(se)
—
Driver Propagation Delay:
OE = 0, CL = 50 pF; see
Low-to-High (VO, FSE0 to D+, D–) Figure 6.
—
OE = 0, CL = 50 pF; see
Driver Propagation Delay:
High-to-Low (VO, FSE0 to D+, D–) Figure 6.
Tristate Output Disable: High-to-Off OE switching; see Figure 4.
—
(OE to D+, D−)
—
Tristate Output Disable: Low-to-Off OE switching; see Figure 4.
(OE to D+, D−)
—
Tristate Output Enable: Off-to-High OE switching; see Figure 4.
(OE to D+, D−)
—
Tristate Output Enable: Off-to-Low OE switching; see Figure
(OE to D+, D−)
4..
Receiver Timing (Full-Speed and Low-Speed Mode)
Differential Receiver
See Figure 5..
—
Propagation Delay; Low-to-High
(D+, D− to RCV)
See Figure 5..
—
Propagation Delay; High-to-Low
(D+, D− to RCV)
Single-Ended Receiver
See Figure 5..
—
Propagation Delay; Low-to-High
(D+, D− to VP, VM)
See Figure 5..
—
Propagation Delay; High-to-Low
(D+, D− to VP, VM)
1. Test circuit: see Figure 7
.
t FFtF
, t LF
t FRtR
, t LR
VOH
90%
10%
VOL
90%
10%
MGS963
Figure 3. Rise and Fall Times
Agere Systems Inc.
9
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
Data Sheet, Rev. 6
March 2006
9 Dynamic Characteristics (continued)
1.65
1.75
V V
LOGIC
INPUT
logic
input
0.9 V
0.9 V
0V
t PZH
t PZL
VOH
t PHZ
t PLZ
VOH −0.3 V
differential
DIFFERENTIAL
data
lines
DATA
LINES
VCRS
VOL +0.3 V
VOL
MGS966
Figure 4. Timing of OE to D+, D–
2.0 V
DIFFERENTIAL
differential
DATAdata
LINES
lines
VCRS
VCRS
0.8 V
t PLH(rcv)
t PLH(se)
t PHL(rcv)
t PHL(se)
VOH
LOGIC
OUTPUT
logic output
0.9 V
0.9 V
VOL
MGS965
Figure 5. Timing of D+, D– to RCV, VP, VM
1.75 V
1.65
V
LOGIC
INPUT
logic
input
0.9 V
0.9 V
0V
t PLH(drv)
t PHL(drv)
VOH
DIFFERENTIAL
differential
DATA data
LINES
lines
VCRS
VOL
VCRS
MGS964
Figure 6. Timing of VO, FSE0 to D+, D–
10
Agere Systems Inc.
Data Sheet, Rev. 6
March 2006
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
10 Test Information
VPU(3.3)
1.5 kΩ1
DUT
TEST POINT
D+/D–
24 Ω2
CL
15 kΩ
Load Capacitance:
CL = 50 pF (full-speed mode).
CL = 50 pF or 350 pF (low-speed mode).
1. Full-speed mode: connected to D+, low-speed mode: connected to D–.
2. Complies with USB2.0.
Figure 7. Load for D+, D–
Agere Systems Inc.
11
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
Data Sheet, Rev. 6
March 2006
11 Package Outline Diagram
11.1 16-Pin MLCC, 3 mm x 3 mm
Dimensions are in millimeters.
4
2X
0.10 M C A B
0.05 M C
b
0.10 C A
A
SEE DETAIL A
FOR PIN #1 ID
AND TIE BAR
MARK OPTION
D2
D
D/2
D2/2
D1
D1/2
4X P
2X
N
PIN #1 ID
R0.20
N
0.10 C B
4X P
1
5
6
1
E/2
E1/2
0.45
2
E1
0.50 DIA
2
E
E2/2
E2 (Ne – 1) X e
REF.
(MIN. 0.35)
0.10 C B
(MIN. 0.35)
B
2X
e
TOP VIEW
0.10 C
(Nd – 1) X e
REF.
A
2X
BOTTOM VIEW
0.05 C
0.10 C
DATUM A OR B
A1
NX R
STANDARD
A2
A3
(L)
DETAIL A - PIN# ID AND
TIEBAR MARK FIGURES
4
b
10
e/2
e
FOR EVEN TERMINAL/SIDE
A1
GENERAL: NOMINAL EXPOSED PAD (D2/E2) DIMENSION =
NOMINAL DIE ATACHED PAD DIMENSION – 0.
SECTION C-C
SCALE: NONE
NOMINAL DIE ATTACH PAD DIMENSION
0.10
C
SEATING
PLANE
NOMINAL EXPOSED PAD (D2/E2) DIMENSION
0.10
<DIE ATTACH PAD X — SECTION VIEW>
SIDE VIEW
Notes (Refer also to Tables 11 and 12):
1. Die thickness allowable is 0.305 mm maximum (0.012 inches maximum).
2. Dimensioning and tolerances conform to ASME Y14.5M-1994.
3. N is the number of terminals. Nd is the number of terminals in X direction, and Ne is the number of terminals in the Y direction.
4. Dimension b applies to plated terminal and is measured between 0.2 mm and 0.25 mm from terminal tip.
5. The pin #1 identifier must be existed on the top surface of the package by using identification mark or other feature of package body.
6. Exact shape and size of this feature is optional.
7. All dimensions are in millimeters.
8. The shape shown on four corners is not actual I/O.
9. Bilateral coplanarity zone applies to the exposed pad as well as the terminals.
10. Applied only for terminals.
11. Q and R apply only for straight tie bar shapes.
12
Agere Systems Inc.
Data Sheet, Rev. 6
March 2006
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
11 Package Outline Diagram (continued)
Table 11. Pitch Variation
Symbol
e
N
Nd
Ne
L
b
D2
E2
Pitch Variation
Min
Nom
0.3
0.18
1.40
1.40
0.5 BSC
16
4
4
0.4
0.23
1.50
1.50
Notes
Max
—
3
3
3
—
4
—
—
0.5
0.3
1.60
1.60
Table 12. Common Dimensions
Symbol
A
A1
A2
A3
D
D1
E
E1
θ
P
R
Agere Systems Inc.
Common Dimensions
Notes
Min
Nom
Max
0.8
0.0
0.6
0.85
0.01
0.65
0.20 REF
3.0 BSC
2.75 BSC
3.0 BSC
2.75 BSC
—
0.42
0.17
0.9
0.05
0.70
0
0.24
0.13
12
0.6
0.23
—
11
—
—
—
—
—
—
—
—
12
13
USS810 USB 2.0
Full-Speed/Low-Speed Transceiver
Data Sheet, Rev. 6
March 2006
12 USB Application Support Contact Information
E-mail: [email protected]
13 Ordering Information
Device Code
USS810M-D
USS810M-DT
L-USS810M-D*†
L-USS810M-D*†
Description
USS810 in dry-packed tube
USS810 in dry-packed tape and reel
Lead-free USS810 in dry-packed tube
Lead-free USS810 in dry-packed tape and reel
Package
Comcode
MLCC16
MLCC16
MLCC16
MLCC16
700057479
700058082
700067200
700067201
* Lead-free: No intentional addition of lead, and less than 1000 ppm.
† Agere Systems lead-free devices are fully compliant with the Restriction of Hazardous Substances (RoHS) directive that restricts the content
of six hazardous substances in electronic equipment in the European Union. Beginning July 1, 2006, electronic equipment sold in the European Union must be manufactured in accordance with the standards set by the RoHS directive.
For additional information, contact your Agere Systems Account Manager or the following:
INTERNET:
Home: http://www.agere.com Sales: http://www.agere.com/sales
E-MAIL:
[email protected]
N. AMERICA: Agere Systems Inc., Lehigh Valley Central Campus, Room 10A-301C, 1110 American Parkway NE, Allentown, PA 18109-9138
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA:
CHINA: (86) 21-54614688 (Shanghai), (86) 755-25881122 (Shenzhen), (86) 10-65391096 (Beijing)
JAPAN: (81) 3-5421-1600 (Tokyo), KOREA: (82) 2-767-1850 (Seoul), SINGAPORE: (65) 6741-9855, TAIWAN: (886) 2-2725-5858 (Taipei)
EUROPE:
Tel. (44) 1344 296 400
Agere Systems Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
Agere, Agere Systems, and the Agere logo are registered trademarks of Agere Systems Inc.
Copyright © 2006 Agere Systems Inc.
All Rights Reserved
March 2006
DS05-035CMPR-6 (Replaces DS05-035CMPR-5)