ISP1103 Universal Serial Bus transceiver Rev. 01 — 4 October 1999 Preliminary specification 1. General description The ISP1103 is a single-chip generic Universal Serial Bus (USB) transceiver that is fully compliant with the Universal Serial Bus Specification Rev. 1.1. It allows 3.3 V USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) to interface with the physical layer of the Universal Serial Bus. It supports transmitting and receiving serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates. It also supports the low-power single-ended input receiver interface in ‘suspend’ mode operation. The ISP1103 operates on a 3.3 V supply voltage. The pin configuration conforms to the ‘Serial Interface Engine’ from the Universal Serial Bus Implementers Forum (USB-IF). The ISP1103 allows for both the ‘USB-IF Standard Data Interface’ and the ‘Philips Encoded Data Interface’. The ISP1103 is fully pin compatible with the industry-standard Philips Semiconductors USB transceiver PDIUSBP11A. 2. Features c c ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Complies with Universal Serial Bus Specification Rev. 1.1 Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates Slew-rate controlled differential data driver Differential input receiver with wide common-mode range and very high data input sensitivity Stable RCV output during SE0 condition Two single-ended receivers with hysteresis Supports ‘Philips Encoded Data Interface’ and ‘USB-IF Standard Data Interface’ Low-power operation in ‘suspend’ mode Operates on a 3.3 V supply voltage Fully backward compatible with PDIUSBP11A Compatible with VHDL ‘Serial Interface Engine’ from USB Implementers Forum Higher than 8 kV ESD protection Full industrial operating temperature range −40 to +85 °C Available in SO14, SSOP14 and TSSOP14 packages. ISP1103 Philips Semiconductors USB transceiver 3. Ordering information Table 1: Ordering information Type number Package Name Description Version ISP1103D SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 ISP1103DB SSOP14 plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1 ISP1103DH TSSOP14 plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 4. Functional diagram handbook, halfpage n.c. MODE OE SPEED VMO/FSE0 VPO/VO SUSPND RCV VP VM 8 14 1 2 10 VCC(3.3) D− 9 13 11 12 D+ 6 3 4 5 7 ISP1103x GND MBL094 Fig 1. Functional diagram. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 2 of 17 ISP1103 Philips Semiconductors USB transceiver 5. Pinning information 5.1 Pinning fpage fpage MODE 1 14 VCC(3.3) OE 2 13 VMO/FSE0 RCV 3 12 VPO/VO VP 4 VM fpage MODE 1 14 VCC(3.3) OE 2 13 VMO/FSE0 RCV 3 12 VPO/VO ISP1103D 11 D+ VP 4 5 10 D− VM SUSPND 6 9 GND 7 8 n.c. SPEED MODE 1 14 VCC(3.3) OE 2 13 VMO/FSE0 RCV 3 12 VPO/VO ISP1103DB 11 D+ VP 4 ISP1103DH 11 D+ 5 10 D− VM 5 10 D− SUSPND 6 9 SUSPND 6 9 GND 7 8 n.c. GND 7 8 n.c. MBL091 SPEED MBL092 Fig 2. Pinning diagram SO14. Fig 3. Pinning diagram SSOP14. SPEED MBL093 Fig 4. Pinning diagram TSSOP14. 5.2 Pin description Table 2: Pin description Symbol Pin Type Description MODE 1 I driver interface selection input (Schmitt trigger): LOW: Philips Encoded Data Interface (pins VO, FSE0) HIGH: USB-IF Standard Data Interface (pins VPO, VMO); pulled HIGH by an internal pull-up transistor, if left floating OE 2 I output enable input (Schmitt trigger, active LOW); enables the transceiver to transmit data on the bus RCV 3 O differential data receiver output (CMOS level); driven HIGH when input SUSPND is HIGH; the output state of RCV is preserved and stable during an SE0 condition VP 4 O single-ended D+ receiver output (CMOS level); used for external detection of single-ended zero (SE0), error conditions, speed of connected device VM 5 O single-ended D− receiver output (CMOS level); used for external detection of single-ended zero (SE0), error conditions, speed of connected device SUSPND 6 I suspend input (Schmitt trigger); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a HIGH level GND 7 - ground supply n.c. 8 - not connected SPEED 9 I speed selection input (Schmitt trigger); adjusts the slew rate of differential data outputs D+ and D− according to the transmission speed: LOW: low-speed (1.5 Mbit/s) HIGH: full-speed (12 Mbit/s) © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 3 of 17 ISP1103 Philips Semiconductors USB transceiver Table 2: Pin description…continued Symbol Pin Type Description D− 10 AI/O negative USB data bus connection (analog, differential); for low-speed mode connect to pin VCC(3.3) via a 1.5 kΩ resistor D+ 11 AI/O positive USB data bus connection (analog, differential); for full-speed mode connect to pin VCC(3.3) via a 1.5 kΩ resistor VPO/VO 12 I differential driver data input (Schmitt trigger); see Table 4 VMO/FSE0 13 I differential driver data input (Schmitt trigger); see Table 4 VCC(3.3) 14 - supply voltage (3.0 to 3.6 V) 6. Functional description 6.1 Function selection Table 3: Function table SUSPND OE D+/D− RCV VP/VM Function L L driving active active normal driving (differential receiver active) L H receiving [1] active active receiving active driving during ‘suspend’ (differential receiver inactive) active low-power state [1] [2] H L driving inactive [2] H H high-Z [1] inactive [2] Signal levels on D+/D− are determined by other USB devices and external pull-up/down resistors. In ‘suspend’ mode (SUSPND = H) the differential receiver is inactive and output RCV is always HIGH. Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM. 6.2 Operating functions Table 4: MODE L H Table 5: [1] Driving function (OE = L) Interface type VPO/VO VMO/FSE0 Data L L differential logic 0 Philips Encoded Data Interface USB-IF Standard Data Interface H SE0 L differential logic 1 H H SE0 L L SE0 L H differential logic 0 H L differential logic 1 H H illegal data Receiving function (OE = H) D+/D− RCV VP VM differential logic 0 L L H differential logic 1 H H L SE0 RCV* L L RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is kept stable during the SE0 period. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification L H Rev. 01 — 4 October 1999 4 of 17 ISP1103 Philips Semiconductors USB transceiver 7. Limiting values Table 6: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC(3.3) supply voltage VI input voltage Ilatchup latchup current VI < 0 or VI > VCC Vesd electrostatic discharge voltage ILI < 1 µA Tstg Ptot [1] Conditions Min Max Unit −0.5 +6.0 V −0.5 VCC + 0.5 V - 200 mA - ±8000 V storage temperature −60 +150 °C total power dissipation - <tbf> W Min Max Unit [1] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model). Table 7: Recommended operating conditions Symbol Parameter Conditions VCC(3.3) supply voltage 3.0 3.6 V VI input voltage 0 5.5 V VI(AI/O) input voltage on analog I/O pins (D+/D−) 0 3.6 V Tamb operating ambient temperature −40 +85 °C 8. Static characteristics Table 8: Static characteristics: supply pins VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter ICC ICC(susp) Conditions Min Typ Max Unit operating supply current - <tbf> - mA suspend supply current - - 10 µA © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 5 of 17 ISP1103 Philips Semiconductors USB transceiver Table 9: Static characteristics: digital pins VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Schmitt trigger input levels Vth(LH) positive-going threshold voltage 1.4 - 1.9 V Vth(HL) negative-going threshold voltage 0.9 - 1.5 V Vhys hysteresis voltage 0.4 - 0.7 V IOL = 3 mA - - 0.4 V IOL = 20 µA - - 0.1 V IOL = 3 mA 2.4 - - V IOL = 20 µA VCC(3.3) − 0.1 - - V - - ±1 µA Output levels LOW-level output voltage VOL VOH HIGH-level output voltage Leakage current ILI input leakage current Table 10: Static characteristics: analog I/O pins (D+, D−) [1] VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VDI differential input sensitivity |VI(D+) − VI(D−)| 0.2 - - V VCM differential common mode voltage includes VDI range 0.8 - 2.5 V Input levels VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V Vhys hysteresis voltage 0.4 - 0.7 V Output levels VOL LOW-level output voltage RL = 1.5 kΩ to VCC(3.3) - - 0.3 V VOH HIGH-level output voltage RL = 15 kΩ to GND 2.8 - VCC(3.3) V - - ±10 µA Leakage current OFF-state leakage current ILZ Capacitance transceiver capacitance pin to GND - - 20 pF ZDRV driver output impedance [2] steady-state drive 28 - 44 Ω ZINP input impedance 10 - - MΩ termination voltage [3] for upstream port pull-up (RPU) 3.0 [4] - 3.6 V CIN Resistance Termination VTERM [1] [2] [3] [4] D+ is the USB positive data pin; D− is the USB negative data pin. Includes external resistors of 22 Ω ±1% or 24 Ω ±1% on both D+ and D−. This voltage is available at pin VCC(3.3). In ‘suspend’ mode the minimum voltage is 2.9 V. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 6 of 17 ISP1103 Philips Semiconductors USB transceiver 9. Dynamic characteristics Table 11: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode [1] VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D+ to VTERM.; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics tFR rise time CL = 50 pF; 10 to 90% of |VOH − VOL|; see Figure 5 4 - 20 ns tFF fall time CL = 50 pF; 90 to 10% of |VOH − VOL|; see Figure 5 4 - 20 ns FRFM differential rise/fall time matching (tFR/tFF) 90 - 111.1 % VCRS output signal crossover voltage 1.3 - 2.0 V [2] [2] [3] Driver timing tPLH tPHL tPHZ tPLZ tPZH tPZL propagation delay (VPO,VMO/FSE0 to D+,D−) LOW-to-HIGH; see Figure 8 - - 14 ns HIGH-to-LOW; see Figure 8 - - 14 ns 3-state output disable time (OE to D+,D−) HIGH-to-OFF; see Figure 6 - - 6 ns LOW-to-OFF; see Figure 6 - - 5 ns 3-state output enable time (OE to D+,D−) OFF-to-HIGH; see Figure 6 - - 14 ns OFF-to-LOW; see Figure 6 - - 15 ns LOW-to-HIGH; see Figure 7 Receiver timing Differential receiver propagation delay (D+,D− to RCV) tPLH tPHL - - 8 ns HIGH-to-LOW; see Figure 7 - - 8 ns LOW-to-HIGH; see Figure 7 - - 5 ns HIGH-to-LOW; see Figure 7 - - 8 ns Single-ended receiver propagation delay (D+,D− to VP,VM) tPLH tPHL [1] [2] [3] Test circuit: see Figure 11. Excluding the first transition from Idle state. Characterized only, not tested. Limits guaranteed by design. Table 12: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode [1] VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM.; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics tLR rise time CL = 200 to 600 pF; 10 to 90% of |VOH − VOL|; see Figure 5 75 - 300 ns tLF fall time CL = 200 to 600 pF; 90 to 10% of |VOH − VOL|; see Figure 5 75 - 300 ns LRFM differential rise/fall time matching (tLR/tLF) 85 - 118 % VCRS output signal crossover voltage 1.3 - 2.0 V [2] [2] [3] © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 7 of 17 ISP1103 Philips Semiconductors USB transceiver Table 12: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode [1]…continued VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM.; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit propagation delay (VPO/VO, VMO/FSE0 to D+,D−) LOW-to-HIGH; see Figure 8 - - 165 ns HIGH-to-LOW; see Figure 8 - - 145 ns HIGH-to-OFF; see Figure 6 - - 6 ns LOW-to-OFF; see Figure 6 - - 5 ns OFF-to-HIGH; see Figure 6 - - 100 ns OFF-to-LOW; see Figure 6 - - 100 ns LOW-to-HIGH; see Figure 7 - - 9 ns HIGH-to-LOW; see Figure 7 - - 10 ns LOW-to-HIGH; see Figure 7 - - 5 ns HIGH-to-LOW; see Figure 7 - - 8 ns Driver timing tPLH tPHL 3-state output disable time (OE to D+,D−) tPHZ tPLZ tPZH 3-state output enable time (OE to D+,D−) tPZL Receiver timing Differential receiver propagation delay (D+,D− to RCV) tPLH tPHL Single-ended receiver propagation delay (D+,D− to VP,VM) tPLH tPHL [1] [2] [3] Test circuit: see Figure 11. Excluding the first transition from Idle state. Characterized only, not tested. Limits guaranteed by design. +3.0 to +5.5 V 1/2VCC(3.3) logic input 0V t FR, t LR VOH t FF, t LF 90% 10% t PZH t PZL t PHZ t PLZ +3.3 V 90% differential data lines 10% VOL VOH − 0.3 V VCRS VOL + 0.3 V 0V MGS255 MGS257 Fig 5. Rise and fall times. Fig 6. +3.3 V Timing of OE to D+, D-. +3.0 to +5.5 V differential data lines VCRS 1/2VCC(3.3) logic input 0V 0V t PLH t PHL t PLH logic output 0V Fig 7. Timing of D+, D- to RCV, VP, VM. 1/2VCC(3.3) MGS256 differential data lines VCRS 0V MGS254 Fig 8. Timing of VPO/VO, VMO/FSE0 to D+, D-. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification t PHL +3.3 V VOH Rev. 01 — 4 October 1999 8 of 17 ISP1103 Philips Semiconductors USB transceiver 10. Test information test point handbook, halfpage 22 or 24 Ω 500 Ω D.U.T. 50 pF V MGS258 V = 0 V for tPZH, tPHZ V = VCC(3.3) for tPZL, tPLZ Fig 9. Load for enable and disable times. test point handbook, halfpage D.U.T. 25 pF MGS259 Fig 10. Load for VM, VP and RCV. handbook, halfpage VCC(3.3) test point RPU 22 or 24 Ω S1 1.5 kΩ D.U.T. 15 kΩ CL test S1 D−/LS closed D+/LS open D−/FS open D+/FS closed MGS260 Load capacitance: CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing) CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing). Speed selection: full-speed mode (FS): 1.5 kΩ pull-up resistor on D+ low-speed mode (LS): 1.5 kΩ pull-up resistor on D−. Fig 11. Load for D+, D-. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 9 of 17 ISP1103 Philips Semiconductors USB transceiver 11. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.244 0.039 0.050 0.041 0.228 0.016 0.010 0.057 inches 0.069 0.004 0.049 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ o 8 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06S MS-012AB EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-23 97-05-22 Fig 12. SO14 package outline. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 10 of 17 ISP1103 Philips Semiconductors USB transceiver SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm D SOT337-1 E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp L 7 1 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.0 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 7.9 7.6 1.25 1.03 0.63 0.9 0.7 0.2 0.13 0.1 1.4 0.9 8 0o o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC SOT337-1 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 96-01-18 MO-150AB Fig 13. SSOP14 package outline. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 11 of 17 ISP1103 Philips Semiconductors USB transceiver TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 7 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.72 0.38 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC SOT402-1 JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 94-07-12 95-04-04 MO-153 Fig 14. TSSOP14 package outline. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 12 of 17 ISP1103 Philips Semiconductors USB transceiver 12. Soldering 12.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 12.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 230 °C. 12.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 13 of 17 ISP1103 Philips Semiconductors USB transceiver Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 12.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 12.5 Package related soldering information Table 13: Suitability of surface mount IC packages for wave and reflow soldering methods Package Soldering method BGA, LFBGA, SQFP, TFBGA Wave Reflow [1] not suitable suitable suitable [2] HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not PLCC [3], SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO [1] [2] [3] [4] [5] suitable suitable not recommended [3] [4] suitable not recommended [5] suitable All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 13. Revision history Table 14: Revision history Rev Date 01 CPCN 19991004 Description Preliminary specification; initial version. © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 14 of 17 ISP1103 Philips Semiconductors USB transceiver 14. Data sheet status Datasheet status Product status Definition [1] Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued data sheet before initiating or completing a design. 15. Definitions 16. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. © Philips Electronics N.V. 1999 All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 15 of 17 ISP1103 Philips Semiconductors USB transceiver Philips Semiconductors - a worldwide company Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102 Canada: Tel. +1 800 234 7381 China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044 Finland: Tel. +358 961 5800, Fax. +358 96 158 0920 France: Tel. +33 14 099 6161, Fax. +33 14 099 6427 Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300 Hungary: see Austria India: Tel. +91 22 493 8541, Fax. +91 22 493 8722 Indonesia: see Singapore Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200 Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007 Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057 Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415 Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880 Mexico: Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399 New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811 Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474 Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107 Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745 Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730 Taiwan: Tel. +886 22 134 2865, Fax. +886 22 134 2874 Thailand: Tel. +66 27 45 4090, Fax. +66 23 98 0793 Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: Tel. +381 11 62 5344, Fax. +381 11 63 5777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825 Internet: http://www.semiconductors.philips.com (SCA68) © Philips Electronics N.V. 1999. All rights reserved. 9397 750 06329 Preliminary specification Rev. 01 — 4 October 1999 16 of 17 ISP1103 Philips Semiconductors USB transceiver Contents 1 2 3 4 5 5.1 5.2 6 6.1 6.2 7 8 9 10 11 12 12.1 12.2 12.3 12.4 12.5 13 14 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Function selection. . . . . . . . . . . . . . . . . . . . . . . 4 Operating functions. . . . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 Package related soldering information . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 © Philips Electronics N.V. 1999. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 4 October 1999 Document order number: 9397 750 06329