PHILIPS ISP1103DH

ISP1103
Universal Serial Bus transceiver
Rev. 01 — 4 October 1999
Preliminary specification
1. General description
The ISP1103 is a single-chip generic Universal Serial Bus (USB) transceiver that is
fully compliant with the Universal Serial Bus Specification Rev. 1.1. It allows 3.3 V
USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) to
interface with the physical layer of the Universal Serial Bus. It supports transmitting
and receiving serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s)
data rates. It also supports the low-power single-ended input receiver interface in
‘suspend’ mode operation. The ISP1103 operates on a 3.3 V supply voltage.
The pin configuration conforms to the ‘Serial Interface Engine’ from the Universal
Serial Bus Implementers Forum (USB-IF). The ISP1103 allows for both the ‘USB-IF
Standard Data Interface’ and the ‘Philips Encoded Data Interface’. The ISP1103 is
fully pin compatible with the industry-standard Philips Semiconductors USB
transceiver PDIUSBP11A.
2. Features
c
c
■
■
■
■
■
■
■
■
■
■
■
■
■
■
Complies with Universal Serial Bus Specification Rev. 1.1
Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates
Slew-rate controlled differential data driver
Differential input receiver with wide common-mode range and very high data input
sensitivity
Stable RCV output during SE0 condition
Two single-ended receivers with hysteresis
Supports ‘Philips Encoded Data Interface’ and ‘USB-IF Standard Data Interface’
Low-power operation in ‘suspend’ mode
Operates on a 3.3 V supply voltage
Fully backward compatible with PDIUSBP11A
Compatible with VHDL ‘Serial Interface Engine’ from USB Implementers Forum
Higher than 8 kV ESD protection
Full industrial operating temperature range −40 to +85 °C
Available in SO14, SSOP14 and TSSOP14 packages.
ISP1103
Philips Semiconductors
USB transceiver
3. Ordering information
Table 1:
Ordering information
Type number
Package
Name
Description
Version
ISP1103D
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
ISP1103DB
SSOP14
plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
ISP1103DH
TSSOP14
plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
4. Functional diagram
handbook, halfpage
n.c.
MODE
OE
SPEED
VMO/FSE0
VPO/VO
SUSPND
RCV
VP
VM
8
14
1
2
10
VCC(3.3)
D−
9
13
11
12
D+
6
3
4
5
7
ISP1103x
GND
MBL094
Fig 1. Functional diagram.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
2 of 17
ISP1103
Philips Semiconductors
USB transceiver
5. Pinning information
5.1 Pinning
fpage
fpage
MODE
1
14 VCC(3.3)
OE
2
13 VMO/FSE0
RCV
3
12 VPO/VO
VP
4
VM
fpage
MODE
1
14 VCC(3.3)
OE
2
13 VMO/FSE0
RCV
3
12 VPO/VO
ISP1103D 11 D+
VP
4
5
10 D−
VM
SUSPND
6
9
GND
7
8 n.c.
SPEED
MODE
1
14 VCC(3.3)
OE
2
13 VMO/FSE0
RCV
3
12 VPO/VO
ISP1103DB 11 D+
VP
4
ISP1103DH 11 D+
5
10 D−
VM
5
10 D−
SUSPND
6
9
SUSPND
6
9
GND
7
8 n.c.
GND
7
8 n.c.
MBL091
SPEED
MBL092
Fig 2. Pinning diagram SO14.
Fig 3. Pinning diagram SSOP14.
SPEED
MBL093
Fig 4. Pinning diagram TSSOP14.
5.2 Pin description
Table 2:
Pin description
Symbol
Pin
Type
Description
MODE
1
I
driver interface selection input (Schmitt trigger):
LOW: Philips Encoded Data Interface (pins VO, FSE0)
HIGH: USB-IF Standard Data Interface (pins VPO, VMO);
pulled HIGH by an internal pull-up transistor, if left floating
OE
2
I
output enable input (Schmitt trigger, active LOW); enables the
transceiver to transmit data on the bus
RCV
3
O
differential data receiver output (CMOS level); driven HIGH
when input SUSPND is HIGH; the output state of RCV is
preserved and stable during an SE0 condition
VP
4
O
single-ended D+ receiver output (CMOS level); used for
external detection of single-ended zero (SE0), error
conditions, speed of connected device
VM
5
O
single-ended D− receiver output (CMOS level); used for
external detection of single-ended zero (SE0), error
conditions, speed of connected device
SUSPND
6
I
suspend input (Schmitt trigger); a HIGH level enables
low-power state while the USB bus is inactive and drives
output RCV to a HIGH level
GND
7
-
ground supply
n.c.
8
-
not connected
SPEED
9
I
speed selection input (Schmitt trigger); adjusts the slew rate
of differential data outputs D+ and D− according to the
transmission speed:
LOW: low-speed (1.5 Mbit/s)
HIGH: full-speed (12 Mbit/s)
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
3 of 17
ISP1103
Philips Semiconductors
USB transceiver
Table 2:
Pin description…continued
Symbol
Pin
Type
Description
D−
10
AI/O
negative USB data bus connection (analog, differential); for
low-speed mode connect to pin VCC(3.3) via a 1.5 kΩ resistor
D+
11
AI/O
positive USB data bus connection (analog, differential); for
full-speed mode connect to pin VCC(3.3) via a 1.5 kΩ resistor
VPO/VO
12
I
differential driver data input (Schmitt trigger); see Table 4
VMO/FSE0
13
I
differential driver data input (Schmitt trigger); see Table 4
VCC(3.3)
14
-
supply voltage (3.0 to 3.6 V)
6. Functional description
6.1 Function selection
Table 3:
Function table
SUSPND
OE
D+/D−
RCV
VP/VM
Function
L
L
driving
active
active
normal driving
(differential receiver active)
L
H
receiving [1]
active
active
receiving
active
driving during ‘suspend’
(differential receiver inactive)
active
low-power state
[1]
[2]
H
L
driving
inactive [2]
H
H
high-Z [1]
inactive [2]
Signal levels on D+/D− are determined by other USB devices and external pull-up/down resistors.
In ‘suspend’ mode (SUSPND = H) the differential receiver is inactive and output RCV is always HIGH.
Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM.
6.2 Operating functions
Table 4:
MODE
L
H
Table 5:
[1]
Driving function (OE = L)
Interface type
VPO/VO
VMO/FSE0
Data
L
L
differential logic 0
Philips Encoded
Data Interface
USB-IF Standard
Data Interface
H
SE0
L
differential logic 1
H
H
SE0
L
L
SE0
L
H
differential logic 0
H
L
differential logic 1
H
H
illegal data
Receiving function (OE = H)
D+/D−
RCV
VP
VM
differential logic 0
L
L
H
differential logic 1
H
H
L
SE0
RCV*
L
L
RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is kept stable
during the SE0 period.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
L
H
Rev. 01 — 4 October 1999
4 of 17
ISP1103
Philips Semiconductors
USB transceiver
7. Limiting values
Table 6: Absolute maximum ratings
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VCC(3.3)
supply voltage
VI
input voltage
Ilatchup
latchup current
VI < 0 or VI > VCC
Vesd
electrostatic discharge voltage
ILI < 1 µA
Tstg
Ptot
[1]
Conditions
Min
Max
Unit
−0.5
+6.0
V
−0.5
VCC + 0.5
V
-
200
mA
-
±8000
V
storage temperature
−60
+150
°C
total power dissipation
-
<tbf>
W
Min
Max
Unit
[1]
Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).
Table 7:
Recommended operating conditions
Symbol
Parameter
Conditions
VCC(3.3)
supply voltage
3.0
3.6
V
VI
input voltage
0
5.5
V
VI(AI/O)
input voltage on analog I/O pins
(D+/D−)
0
3.6
V
Tamb
operating ambient temperature
−40
+85
°C
8. Static characteristics
Table 8: Static characteristics: supply pins
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
ICC
ICC(susp)
Conditions
Min
Typ
Max
Unit
operating supply current
-
<tbf>
-
mA
suspend supply current
-
-
10
µA
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
5 of 17
ISP1103
Philips Semiconductors
USB transceiver
Table 9: Static characteristics: digital pins
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Schmitt trigger input levels
Vth(LH)
positive-going threshold
voltage
1.4
-
1.9
V
Vth(HL)
negative-going threshold
voltage
0.9
-
1.5
V
Vhys
hysteresis voltage
0.4
-
0.7
V
IOL = 3 mA
-
-
0.4
V
IOL = 20 µA
-
-
0.1
V
IOL = 3 mA
2.4
-
-
V
IOL = 20 µA
VCC(3.3) −
0.1
-
-
V
-
-
±1
µA
Output levels
LOW-level output voltage
VOL
VOH
HIGH-level output voltage
Leakage current
ILI
input leakage current
Table 10: Static characteristics: analog I/O pins (D+, D−) [1]
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDI
differential input sensitivity
|VI(D+) − VI(D−)|
0.2
-
-
V
VCM
differential common mode
voltage
includes VDI range
0.8
-
2.5
V
Input levels
VIL
LOW-level input voltage
-
-
0.8
V
VIH
HIGH-level input voltage
2.0
-
-
V
Vhys
hysteresis voltage
0.4
-
0.7
V
Output levels
VOL
LOW-level output voltage
RL = 1.5 kΩ to VCC(3.3)
-
-
0.3
V
VOH
HIGH-level output voltage
RL = 15 kΩ to GND
2.8
-
VCC(3.3)
V
-
-
±10
µA
Leakage current
OFF-state leakage current
ILZ
Capacitance
transceiver capacitance
pin to GND
-
-
20
pF
ZDRV
driver output impedance [2]
steady-state drive
28
-
44
Ω
ZINP
input impedance
10
-
-
MΩ
termination voltage [3] for
upstream port pull-up (RPU)
3.0 [4]
-
3.6
V
CIN
Resistance
Termination
VTERM
[1]
[2]
[3]
[4]
D+ is the USB positive data pin; D− is the USB negative data pin.
Includes external resistors of 22 Ω ±1% or 24 Ω ±1% on both D+ and D−.
This voltage is available at pin VCC(3.3).
In ‘suspend’ mode the minimum voltage is 2.9 V.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
6 of 17
ISP1103
Philips Semiconductors
USB transceiver
9. Dynamic characteristics
Table 11: Dynamic characteristics: analog I/O pins (D+, D−); full-speed mode [1]
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D+ to VTERM.; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tFR
rise time
CL = 50 pF;
10 to 90% of |VOH − VOL|;
see Figure 5
4
-
20
ns
tFF
fall time
CL = 50 pF;
90 to 10% of |VOH − VOL|;
see Figure 5
4
-
20
ns
FRFM
differential rise/fall time
matching (tFR/tFF)
90
-
111.1
%
VCRS
output signal crossover voltage
1.3
-
2.0
V
[2]
[2] [3]
Driver timing
tPLH
tPHL
tPHZ
tPLZ
tPZH
tPZL
propagation delay
(VPO,VMO/FSE0 to D+,D−)
LOW-to-HIGH; see Figure 8
-
-
14
ns
HIGH-to-LOW; see Figure 8 -
-
14
ns
3-state output disable time
(OE to D+,D−)
HIGH-to-OFF; see Figure 6
-
-
6
ns
LOW-to-OFF; see Figure 6
-
-
5
ns
3-state output enable time
(OE to D+,D−)
OFF-to-HIGH; see Figure 6
-
-
14
ns
OFF-to-LOW; see Figure 6
-
-
15
ns
LOW-to-HIGH; see Figure 7
Receiver timing
Differential receiver
propagation delay
(D+,D− to RCV)
tPLH
tPHL
-
-
8
ns
HIGH-to-LOW; see Figure 7 -
-
8
ns
LOW-to-HIGH; see Figure 7
-
-
5
ns
HIGH-to-LOW; see Figure 7 -
-
8
ns
Single-ended receiver
propagation delay
(D+,D− to VP,VM)
tPLH
tPHL
[1]
[2]
[3]
Test circuit: see Figure 11.
Excluding the first transition from Idle state.
Characterized only, not tested. Limits guaranteed by design.
Table 12: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode [1]
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM.; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver characteristics
tLR
rise time
CL = 200 to 600 pF;
10 to 90% of |VOH − VOL|;
see Figure 5
75
-
300
ns
tLF
fall time
CL = 200 to 600 pF;
90 to 10% of |VOH − VOL|;
see Figure 5
75
-
300
ns
LRFM
differential rise/fall time
matching (tLR/tLF)
85
-
118
%
VCRS
output signal crossover voltage
1.3
-
2.0
V
[2]
[2] [3]
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
7 of 17
ISP1103
Philips Semiconductors
USB transceiver
Table 12: Dynamic characteristics: analog I/O pins (D+, D−); low-speed mode [1]…continued
VCC = VCC(3.3); VGND = 0 V; Tamb = −40 to +85 °C; CL = 50 pF; RPU = 1.5 kΩ on D− to VTERM.; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
propagation delay (VPO/VO,
VMO/FSE0 to D+,D−)
LOW-to-HIGH; see Figure 8
-
-
165
ns
HIGH-to-LOW; see Figure 8 -
-
145
ns
HIGH-to-OFF; see Figure 6
-
-
6
ns
LOW-to-OFF; see Figure 6
-
-
5
ns
OFF-to-HIGH; see Figure 6
-
-
100
ns
OFF-to-LOW; see Figure 6
-
-
100
ns
LOW-to-HIGH; see Figure 7
-
-
9
ns
HIGH-to-LOW; see Figure 7 -
-
10
ns
LOW-to-HIGH; see Figure 7
-
-
5
ns
HIGH-to-LOW; see Figure 7 -
-
8
ns
Driver timing
tPLH
tPHL
3-state output disable time
(OE to D+,D−)
tPHZ
tPLZ
tPZH
3-state output enable time
(OE to D+,D−)
tPZL
Receiver timing
Differential receiver
propagation delay
(D+,D− to RCV)
tPLH
tPHL
Single-ended receiver
propagation delay
(D+,D− to VP,VM)
tPLH
tPHL
[1]
[2]
[3]
Test circuit: see Figure 11.
Excluding the first transition from Idle state.
Characterized only, not tested. Limits guaranteed by design.
+3.0 to +5.5 V
1/2VCC(3.3)
logic input
0V
t FR, t LR
VOH
t FF, t LF
90%
10%
t PZH
t PZL
t PHZ
t PLZ
+3.3 V
90%
differential
data lines
10%
VOL
VOH − 0.3 V
VCRS
VOL + 0.3 V
0V
MGS255
MGS257
Fig 5. Rise and fall times.
Fig 6.
+3.3 V
Timing of OE to D+, D-.
+3.0 to +5.5 V
differential
data lines
VCRS
1/2VCC(3.3)
logic input
0V
0V
t PLH
t PHL
t PLH
logic output
0V
Fig 7. Timing of D+, D- to RCV, VP, VM.
1/2VCC(3.3)
MGS256
differential
data lines
VCRS
0V
MGS254
Fig 8. Timing of VPO/VO, VMO/FSE0 to D+, D-.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
t PHL
+3.3 V
VOH
Rev. 01 — 4 October 1999
8 of 17
ISP1103
Philips Semiconductors
USB transceiver
10. Test information
test point
handbook, halfpage
22 or 24 Ω
500 Ω
D.U.T.
50 pF
V
MGS258
V = 0 V for tPZH, tPHZ
V = VCC(3.3) for tPZL, tPLZ
Fig 9. Load for enable and disable times.
test point
handbook, halfpage
D.U.T.
25 pF
MGS259
Fig 10. Load for VM, VP and RCV.
handbook, halfpage
VCC(3.3)
test point
RPU
22 or 24 Ω
S1
1.5 kΩ
D.U.T.
15 kΩ
CL
test
S1
D−/LS closed
D+/LS open
D−/FS open
D+/FS closed
MGS260
Load capacitance:
CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing)
CL = 200 pF or 600 pF (low-speed mode, minimum or maximum timing).
Speed selection:
full-speed mode (FS): 1.5 kΩ pull-up resistor on D+
low-speed mode (LS): 1.5 kΩ pull-up resistor on D−.
Fig 11. Load for D+, D-.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
9 of 17
ISP1103
Philips Semiconductors
USB transceiver
11. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.039
0.050
0.041
0.228
0.016
0.010 0.057
inches 0.069
0.004 0.049
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
o
8
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06S
MS-012AB
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
Fig 12. SO14 package outline.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
10 of 17
ISP1103
Philips Semiconductors
USB transceiver
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
D
SOT337-1
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
7
1
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.0
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
1.4
0.9
8
0o
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
SOT337-1
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
96-01-18
MO-150AB
Fig 13. SSOP14 package outline.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
11 of 17
ISP1103
Philips Semiconductors
USB transceiver
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1.0
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8
0o
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
SOT402-1
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
94-07-12
95-04-04
MO-153
Fig 14. TSSOP14 package outline.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
12 of 17
ISP1103
Philips Semiconductors
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12. Soldering
12.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reflow soldering is often used.
12.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 230 °C.
12.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
• Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
13 of 17
ISP1103
Philips Semiconductors
USB transceiver
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
12.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.
12.5 Package related soldering information
Table 13: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
Soldering method
BGA, LFBGA, SQFP, TFBGA
Wave
Reflow [1]
not suitable
suitable
suitable [2]
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
SMS
not
PLCC [3], SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
[1]
[2]
[3]
[4]
[5]
suitable
suitable
not
recommended [3] [4]
suitable
not
recommended [5]
suitable
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
13. Revision history
Table 14: Revision history
Rev Date
01
CPCN
19991004
Description
Preliminary specification; initial version.
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
14 of 17
ISP1103
Philips Semiconductors
USB transceiver
14. Data sheet status
Datasheet status
Product status
Definition [1]
Objective specification
Development
This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
15. Definitions
16. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
© Philips Electronics N.V. 1999 All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
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Internet: http://www.semiconductors.philips.com
(SCA68)
© Philips Electronics N.V. 1999. All rights reserved.
9397 750 06329
Preliminary specification
Rev. 01 — 4 October 1999
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ISP1103
Philips Semiconductors
USB transceiver
Contents
1
2
3
4
5
5.1
5.2
6
6.1
6.2
7
8
9
10
11
12
12.1
12.2
12.3
12.4
12.5
13
14
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Function selection. . . . . . . . . . . . . . . . . . . . . . . 4
Operating functions. . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
Package related soldering information . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
© Philips Electronics N.V. 1999.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 4 October 1999
Document order number: 9397 750 06329