AMCC IBM25NPE405L

AMCC NPe405L
PowerNP
Data Sheet
Document Issue 1.00
September 2004
PowerNP NPe405L Data Sheet
COVER
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Copyright © 2004 Applied Micro Circuits Corporation.
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Features
• PowerNP technology using an IBM PowerPC
405 32-bit RISC processor core operating up to
266 MHz
• HDLC interface with 32 channels through two
ports at up to 4.096 Mbps each or 8.192 Mbps
for a single port
• PC-133 synchronous DRAM (SDRAM) interface
• Programmable interrupt controller
- 32-bit interface for non-ECC applications
- Seven external and 29 internal
- 40-bit interface serves 32 bits of data plus 8
check bits for ECC applications
- Edge triggered or level-sensitive
• External bus for peripheral devices
- Positive or negative active
- Flash and ROM interface
- Non-critical or critical interrupt to processor
core
- Direct support for 8-, or 16-bit SRAM and
external peripherals
- Programmable critical interrupt priority
ordering
- Up to 4 devices
- Programmable critical interrupt vector
• DMA support for external peripherals, internal
UARTs and memory
- Scatter-gather chaining supported
- Four channels
• Two 10/100 Ethernet MACs supporting up to
two external PHYs via MII, RMII, or SMII
interfaces
• Programmable timers
• Two serial ports (16550 compatible UART)
• One IIC interface
• General Purpose I/O (GPIO) available
• Supports JTAG for board level testing
• Internal processor local bus (PLB) runs at
SDRAM interface frequency
Description
Designed specifically to address embedded
applications, the NPe405L provides a highperformance, low-power solution that interfaces to a
wide range of peripherals by incorporating on-chip
power management features and lower power
dissipation requirements.
This chip contains a high-performance RISC
processor core, SDRAM controller, Ethernet
EMACs, HDLC controller, external bus controller for
ROM, Flash, and peripherals, DMA with scattergather support, serial ports, IIC interface, and
general purpose I/O.
Technology: IBM CMOS SA-12E 0.25 µm
(0.18 µm Leff)
Package: 23mm, 324-ball enhanced plastic ball grid
array (E-PBGA)
Power (typical): 1.3W at 133MHz, 1.7W at
200MHz, 1.8W at 266MHz
While the information contained herein is believed to be accurate, such information is preliminary, and should not be
relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made.
1
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Contents
Ordering, PVR, and JTAG Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Address Map Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
SDRAM Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
External Bus Controller (EBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
IIC Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
HDLCEX Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
General Purpose IO (GPIO) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Universal Interrupt Controller (UIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
10/100 Mbps Ethernet MAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Signal Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Spread Spectrum Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
2
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Tables
System Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
DCR Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Signals Listed Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Signal Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Input Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Clocking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Peripheral Interface Clock Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
I/O Specifications—All . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
I/O Specifications—133 and 200MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
I/O Specifications—266MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figures
NPe405L Embedded Controller Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
23mm, 324-Ball E-PBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Input Setup and Hold Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Output Delay and Float Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Ordering, PVR, and JTAG Information
Product Name
Order Part Number1
Processor
Frequency
Rev
Level
Package
PVR Value
JTAG ID
NPe405L
IBM25NPe405L-3FA133C
133MHz
23mm, 324 E-PBGA
A
0x416100C0
0x04247409
NPe405L
IBM25NPe405L-3FA133CZ
133MHz
23mm, 324 E-PBGA
A
0x416100C0
0x04247409
NPe405L
IBM25NPe405L-3FA200C
200MHz
23mm, 324 E-PBGA
A
0x416100C0
0x04247409
NPe405L
IBM25NPe405L-3FA200CZ
200MHz
23mm, 324 E-PBGA
A
0x416100C0
0x04247409
NPe405L
IBM25NPe405L-3FA266C
266MHz
23mm, 324 E-PBGA
A
0x416100C0
0x04247409
NPe405L
IBM25NPe405L-3FA266CZ
266MHz
23mm, 324 E-PBGA
A
0x416100C0
0x04247409
Note 1: Z at the end of the Order Part Number indicates a tape and reel shipping package. Otherwise, the chips are shipped in a tray.
This section provides the part numbering nomenclature for the NPe405L. For availability, contact your local
IBM sales office.
The part number contains a part modifier. This modifier provides for identification of future enhancements (for
example, higher performance).
Each part number also contains a revision code. This refers to the die mask revision number and is specified
in the part numbering scheme for identification purposes only.
The PVR (Processor Version Register) is software accessible and contains additional information about the
revision level of the part. Refer to the NPe405L User’s Manual for details on the register content.
IBM Part Number Key
IBM25NPe405L-3FA200Cx
Shipping Package
Blank = Tray
Z
= Tape and reel
IBM Part Number
Grade 3 Reliability
Package (E-PBGA)
4
Operational Case Temperature Range
(-40°C to +85°C)
Processor Speed
133MHz
200MHz
266MHz
Revision Level
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
NPe405L Embedded Controller Functional Block Diagram
Universal
Interrupt
Controller
x2
Clock
Control
Reset
Power
Mgmt
See Peripheral Interface
Clock Timing table
DCRs
Timers
MMU
PPC405
Processor Core
8KB
D-Cache
JTAG
Trace
DCU
ICU
GPIO
DCR Bus
16KB
I-Cache
UART
x2
IIC
On-chip Peripheral Bus (OPB)
Arb
DMA
Controller
(4-Channel)
OPB
Bridge
Processor Local Bus (PLB)
Ethernet
x2
MAL0
MAL1
SDRAM
Controller
13-bit addr
32-bit data
HDLCEX
External
Bus
Controller
28-bit addr
16-bit data
ZMII
Two
32-channel
ports
MII,
RMII,
SMII
The NPe405L is designed using the IBM Microelectronics Blue Logic methodology in which major functional
blocks are integrated to create an application-specific ASIC product. This approach provides a consistent way
to generate complex ASICs using IBM CoreConnect Bus Architecture.
Address Map Support
The NPe405L incorporates two separate address maps. The first is a fixed processor address map that
serves the PowerPC family of processors. This address map defines the possible contents of various address
regions which the processor can access. The second address map is for Device Configuration Registers
(DCRs). The DCRs are accessed by software running on the NPe405L processor through the use of mtdcr
and mfdcr commands.
5
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
System Address Map 4GB Total System Memory
Function
General use
Boot-up
Internal peripherals
Subfunction
SDRAM, External peripherals
Note: Any of the address ranges listed at
right may be use for any of the above
functions.
Start Address
End Address
Size
0x00000000
0xE7FFFFFF
3712MB
0xE8010000
0xE87FFFFF
8MB
44MB
0xEC000000
0xEEBFFFFF
0xEEE00000
0xEF3FFFFF
6MB
0xEF500000
0xEF5FFFFF
1MB
0xEF900000
0xFFFFFFFF
263MB
External peripheral bus boot 1
0xFFE00000
0xFFFFFFFF
2MB
UART0
0xEF600300
0xEF600307
8B
UART1
0xEF600400
0xEF600407
8B
IIC0
0xEF600500
0xEF60051F
32B
OPB Arbiter
0xEF600600
0xEF60063F
64B
GPIO0 controller registers
0xEF600700
0xEF60077F
128B
GPIO1 controller registers
0xEF600780
0xEF6007FF
128B
Ethernet MAC 0 registers
0xEF600800
0xEF6008FF
256B
Ethernet MAC 1 registers
0xEF600900
0xEF6009FF
256B
ZMII control registers
0xEF600C10
0xEF600C1F
16B
HDLCEX
0xEF610000
0xEF61FFFF
64KB
Notes:
1. When external peripheral bus boot is selected, peripheral bank 0 is automatically configured at reset to the address range listed
above.
2. After the boot process, software may reassign the boot memory regions for other uses.
3. All address ranges not listed above are reserved.
6
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
DCR Address Map 4KB Device Configuration Register
Function
Start
End
Size
0x000
0x3FF
1KW (4KB)1
Reserved
0x000
0x00F
16W
Memory controller registers
0x010
0x011
2W
External bus controller registers
0x012
0x013
2W
Reserved
0x014
0x07F
108W
DCR address space
1
PLB registers
0x080
0x08F
16W
Reserved
0x090
0x09F
16W
OPB bridge-out registers
0x0A0
0x0A7
8W
Reserved
0x0A8
0x0AF
8W
Clock, control and reset
0x0B0
0x0B7
8W
Power management
0x0B8
0x0BF
8W
Interrupt controller 0
0x0C0
0x0CF
16W
Interrupt controller 1
0x0D0
0x0DF
16W
Reserved
0x0E0
0x0EF
16W
Miscellaneous
0x0F0
0x0FF
16W
DMA controller registers
0x100
0x13F
64W
Reserved
0x140
0x17F
64W
MAL0 registers (Ethernet)
0x180
0x1FF
128W
MAL1 registers (HDLCEX)
0x200
0x27F
128W
Reserved
0x280
0x3FF
384W
Notes:
1. DCR address space is addressable with up to 10 bits (1024 or 1K unique addresses). Each unique address represents a single
32-bit (word) register, or 1 kiloword (KW) (which equals 4 KB).
7
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
SDRAM Memory Controller
The NPe405L Memory Controller provides a low latency access path to SDRAM memory. The memory
controller supports four logical banks. Up to 256MB per bank are supported, for a maximum of 1GB total.
Memory access and refresh timing, address and bank sizes, and memory addressing modes are
programmable.
Features include:
• 11x8 to 13x11 row-column address modes (2- and 4-bank devices supported)
• Memory bus operates at same frequency as PLB
• 32-bit memory interface support
• Programmable address range for each bank of memory
- 4GB address space
• Industry standard 168-pin DIMMS are supported (some configurations)
• 200 MHz NPe405H supports up to 100 MHz memory with PC100 support
• 266 MHz NPe405H supports up to 133 MHz memory with PC133 support
• 4MB to 256MB per bank
• Programmable timing
• Auto refresh
• Page Mode Accesses with up to 4 open pages
• Power Management (self-refresh)
• Error Checking and Correction (ECC) support
- Standard single error correct, double error detect coverage
- Aligned nibble error detect
- Address error logging
External Bus Controller (EBC)
• Supports four ROM, EPROM, SRAM, Flash, and Slave Peripheral I/O banks supported
• Up to 66.66MHz operation
• Burst and non-burst devices
• 8-, 16-bit byte-addressable data bus width support
• Latch data on Ready, Synchronous or Asynchronous
• Programmable 2K clock-cycle time-out counter with disable for Ready
8
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
• Programmable access timing per device
- 0–255 wait states for non-bursting devices
- 0 –31 Burst Wait States for first access and up to 7 Wait States for subsequent accesses
- Programmable chip select assertion/negation relative to driving address bus
- Programmable output and write-enable assertion/negation relative to assertion of chip select
• Programmable address mapping
• Peripheral device wait via “Ready”
DMA Controller
• Supports the following transfers:
- Memory-to-memory transfers
- Buffered peripheral to memory transfers
- Buffered memory to peripheral transfers
• Four channels
• Scatter/Gather capability for programming multiple DMA operations
• 8-, 16-, 32-bit peripheral support (OPB and external bus attached)
• 32-bit addressing
• Address increment or decrement
• Internal 32-byte data buffering capability
• Supports internal and external peripherals
• Support for memory mapped peripherals
• Support for peripherals running on slower frequency buses
Serial Interface
• Two 8-pin UART interfaces provided
• Selectable internal or external serial clock to allow wide range of baud rates
• Register compatibility with NS16550 register set
• Complete status reporting capability
• Transmitter and receiver are each buffered with 16-byte FIFOs when in FIFO mode
• Fully programmable serial-interface characteristics
• Supports DMA using internal DMA engine
9
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
IIC Bus Interface
• Compliant with Phillips® Semiconductors I2C Specification, dated 1995
• Operation at 100kHz or 400kHz
• 8-bit data
• 10- or 7-bit address
• Slave transmitter and receiver
• Master transmitter and receiver
• Multiple bus masters
• Supports fixed VDD IIC interface
• Two independent 4 x 1 byte data buffers
• One programmable interrupt request signal
• Provides full management of all IIC bus protocol
• Programmable error recovery
HDLCEX Interface
• 32-channel HDLC controller
• Two full-duplex Pulse Code Modulation (PCM) Highway ports at speeds up to 4.096 Mbps per port or
8.192 Mbps when using a single port
• Supports HDLC protocol as well as a Transparent mode
• For a single channel per port, autonomous management of I-Frames and S-Frames of the Normal
Response mode (NRM) protocol on one channel per port. U-frames are handled by software.
• Supports software emulation of NRM on all channels
General Purpose IO (GPIO) Controller
• Most GPIOs are pin-shared with other functions. Configuration registers are provided to determine
whether a particular pin that has GPIO capabilities acts as a GPIO or is used for another purpose. The
GPIO function has 32 I/Os.
• Each GPIO output is separately programmable to emulate an open-drain driver (drives to zero, threestated if output bit is 1)
Universal Interrupt Controller (UIC)
Two cascaded Universal Interrupt Controllers (UICs) provide the control, status, and communications
necessary for the interrupt sources and the PowerPC processor.
Features include:
10
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
• Seven external and 29 internal interrupts
• Edge triggered or level-sensitive
• Positive or negative active
• Selectable non-critical or critical interrupt requests to the PPC405 processor core
• Programmable critical interrupt priority ordering
• Programmable critical interrupt vector generation for reduced latency interrupt handling
10/100 Mbps Ethernet MAC
• Two units capable of full- and half-duplex, 10 Mbps or 100 Mbps operation
• Integrated ZMII Bridge supports use of MII, SMII or RMII connections to external PHYs (PHYs not
included on chip)
- Reduced Media Independent Interface (RMII) or Serial Media Independent Interface (SMII) for one to
two PHY applications
- Media Independent Interface (MII) for single or dual PHY applications
• Dedicated media access layer (MAL) provides DMA support
JTAG
• IEEE 1149.1 Test Access Port
• Debugger support
• JTAG boundary scan support (BSDL file available)
11
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
23mm, 324-Ball E-PBGA Package
Top View
Gold gate release
corresponds to
A01 ball location
Note: All dimensions are in mm.
Bottom View
0.60 nom
0.30 nom
23.0
1.0
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1.0
Thermal balls
23.0
01 03 05 07 09 11 13 15 17 19 21
02 04 06 08 10 12 14 16 18 20 22
0.60 Solder Ball
12
2.65 max
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Lists
The following table lists all the external signals in alphabetical order and shows the ball number on which the
signal appears. Multiplexed signals are shown with the default signal (following reset) not in brackets and the
alternate signal or signals in brackets. Multiplexed signals appear alphabetically multiple times in the list—
once for each signal name on the ball. The page number listed gives the page in “Signal Functional
Description” on page 32 where the signals in the indicated interface group begin.
Signals Listed Alphabetically
Signal Name
(Part 1 of 11)
Ball
AVDD
H21
BA0
AB15
BA1
Y14
BankSel0
Interface Group
Page
Power
37
SDRAM
33
SDRAM
33
SDRAM
33
SDRAM
33
External Peripheral Bus
34
External Peripheral Bus
34
SDRAM
33
SDRAM
33
SDRAM
33
AA07
BankSel1
Y08
BankSel2
AB06
BankSel3
AA06
CAS
AA12
ClkEn0
Y13
ClkEn1
AA13
[DMAAck0]GPIO13
U22
[DMAAck1]GPIO14
U21
[DMAAck2]GPIO15
T20
[DMAAck3]GPIO16
D17
[DMAReq0]GPIO09
P19
[DMAReq1]GPIO10
T22
[[DMAReq2]GPIO11
T21
[DMAReq3]GPIO12
R20
DQM0
U03
DQM1
U01
DQM2
R02
DQM3
L01
DQMCB
AA04
ECC0
AA05
ECC1
Y06
ECC2
AB04
ECC3
AA03
ECC4
Y05
ECC5
AB03
ECC6
Y04
ECC7
W06
EMC0MDClk
AB16
Ethernet
32
EMC0MDIO
AA16
Ethernet
32
[EMC0Sync]EMC0TxEn[EMC0Tx0En]
AB21
Ethernet
32
13
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
EMC0TxD0[EMC0Tx0D0][EMC0Tx0D]
(Part 2 of 11)
Ball
Interface Group
Page
AA22
EMC0TxD1[EMC0Tx0D1][EMC0Tx1D]
U19
EMC0TxD2[EMC0Tx1D0]
W20
EMC0TxD3[EMC0Tx1D1]
Y22
Ethernet
32
EMC0TxEn[EMC0Tx0En][EMC0Sync]
AB21
Ethernet
32
EMC0TxErr[EMC0Tx1En]
AB20
Ethernet
32
Ethernet
32
External Peripheral Bus
34
Power
Note: J09-J14, K09-K14, L09-L14, M09-M14, N09N14, and P09-P14 are also thermal balls.
37
[EMC0Tx0En]EMC0TxEn[EMC0Sync]
AB21
[EMC0Tx1En]EMC0TxErr
AB20
[EOT0/TC0]GPIO24
B19
[EOT1/TC1]GPIO25
B18
[EOT2/TC2]GPIO26
C16
[EOT3/TC3]GPIO27
B17
GND
A01
GND
A05
GND
A09
GND
A14
GND
A18
GND
A22
GND
B02
GND
B21
GND
C03
GND
C20
GND
D04
GND
D08
GND
D11
GND
D12
GND
D15
GND
D19
GND
E01
GND
E22
GND
H04
GND
H19
GND
J01
GND
J09-J14
GND
J22
GND
K09-K14
GND
L04
GND
L09-L14
GND
L19
14
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
(Part 3 of 11)
Ball
GND
M04
GND
M09-M14
GND
M19
GND
N09-N14
GND
P01
GND
P09-P14
GND
P22
GND
R04
GND
R19
GND
V01
GND
V22
GND
W04
GND
W08
GND
W11
GND
W12
GND
W15
GND
W19
GND
Y03
GND
Y20
GND
AA02
GND
AA21
GND
AB01
GND
AB05
GND
AB09
GND
AB14
GND
AB18
GND
AB22
Interface Group
Page
Power
Note: J09-J14, K09-K14, L09-L14, M09-M14, N09N14, and P09-P14 are also thermal balls.
37
15
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
(Part 4 of 11)
Ball
GPIO00[TrcClk]
B20
GPIO01[TS1E]GPIO08[TS6]
C18
GPIO02[TS2E]
A20
GPIO03[TS1O]
N20
GPIO04[TS2O]
N22
GPIO05[TS3]
P21
GPIO06[TS4]
P20
GPIO07[TS5]
R22
GPIO08[TS6]
R21
GPIO09[DMAReq0]
P19
GPIO10[DMAReq1]
T22
GPIO11[DMAReq2]
T21
GPIO12[DMAReq3]
R20
GPIO13[DMAAck0]
U22
GPIO14[DMAAck1]
U21
GPIO15[DMAAck2]
T20
GPIO16[DMAAck3]
D17
GPIO17[IRQ0]
F20
GPIO18[IRQ1]
J20
GPIO19[IRQ2]
L21
GPIO20[IRQ3]
M21
GPIO21[IRQ4]
AA17
GPIO22[IRQ5]
AB17
GPIO23[IRQ6]
W14
GPIO24[EOT0/TC0]
B19
GPIO25[EOT1/TC1]
B18
GPIO26[EOT2/TC2]
C16
GPIO27[EOT3/TC3]
B17
GPIO28[UART1_DCD][HDLCEXTxEnA]
GPIO29[UART1_RI][HDLCEXTxEnB]
Interface Group
Page
System
37
AA15
T01
GPIO30
T03
GPIO31[PerWE]
A13
Halt
F22
System
37
HDLCEXRxClk
L20
HDLC 32-Channel
32
HDLCEXRxDataA
M22
HDLCEXRxDataB
N21
HDLC 32-Channel
32
HDLCEXRxFS
M20
HDLC 32-Channel
32
HDLCEXTxClk
K20
HDLC 32-Channel
32
HDLCEXTxDataA
K21
HDLCEXTxDataB
L22
HDLC 32-Channel
32
HDLC 32-Channel
32
HDLC 32-Channel
32
[HDLCEXTxEnA]GPIO28[UART1_DCD]
AA15
[HDLCEXTxEnB]GPIO29[UART1_RI]
T01
HDLCEXTxFS
K22
16
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
(Part 5 of 11)
Ball
IICSCL[IECSCL]
C17
IICSDA[IECSDA]
A19
[IRQ0]GPIO17
F20
[IRQ1]GPIO18
J20
[IRQ2]GPIO19
L21
[IRQ3[GPIO20
M21
[IRQ4[GPIO21
AA17
[IRQ5]GPIO22
AB17
[IRQ6[GPIO23
W14
MemAddr00
Y12
MemAddr01
Y11
MemAddr02
AB11
MemAddr03
AA11
MemAddr04
AA10
MemAddr05
Y10
MemAddr06
AB10
MemAddr07
AA09
MemAddr08
Y09
MemAddr09
AB08
MemAddr10
AA08
MemAddr11
W09
MemAddr12
AB07
MemClkOut0
AA14
MemClkOut1
AB13
Interface Group
Page
Internal Peripheral
35
Interrupts
36
SDRAM
Note: During a CAS cycle MemAddr00 is the least
significant bit (lsb) on this bus.
33
SDRAM
33
17
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
(Part 6 of 11)
Ball
MemData00
AB02
MemData01
AA01
MemData02
U04
MemData03
W03
MemData04
Y01
MemData05
V03
MemData06
Y02
MemDatar07
W01
MemData08
W02
MemData09
V02
MemData10
U02
MemData11
R03
MemData12
T02
MemData13
P04
MemData14
R01
MemData15
P03
MemData16
P02
MemData17
N01
MemData18
N03
MemData19
N02
MemData20
M02
MemData21
M01
MemData22
M03
MemData23
L03
MemData24
L02
MemData25
K02
MemData26
K03
MemData27
K01
MemData28
J02
MemData29
J03
MemData30
H01
MemData31
H02
18
Interface Group
SDRAM
Notes:
1. MemData00 is the most significant bit (msb).
2. MemData31 is the least significant bit (lsb)
Page
33
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
(Part 7 of 11)
Ball
OVDD
D05
OVDD
D07
OVDD
D16
OVDD
D18
OVDD
E04
OVDD
E19
OVDD
G04
OVDD
G19
OVDD
T19
OVDD
T04
OVDD
V04
OVDD
V19
OVDD
W05
OVDD
W07
OVDD
W16
OVDD
W18
Interface Group
Power
Page
37
19
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
(Part 8 of 11)
Ball
PerAddr04
D06
PerAddr05
C04
PerAddr06
A03
PerAddr07
C05
PerAddr08
B03
PerAddr09
A04
PerAddr10
C06
PerAddr11
B04
PerAddr12
B05
PerAddr13
C07
PerAddr14
B06
PerAddr15
C08
PerAddr16
B07
PerAddr17
A07
PerAddr18
D09
PerAddr19
B08
PerAddr20
A08
PerAddr21
C09
PerAddr22
B09
PerAddr23
A10
PerAddr24
C10
PerAddr25
B10
PerAddr26
B11
Interface Group
Page
External Peripheral Bus
34
PerAddr27
A11
PerAddr28
C11
PerAddr29
C12
PerAddr30
A12
PerAddr31
B12
PerBLast
C15
External Peripheral Bus
34
PerClk
A17
External Peripheral Bus
34
External Peripheral Bus
34
PerCS0
B14
PerCS1
C14
PerCS2
A15
PerCS3
B15
20
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
(Part 9 of 11)
Ball
PerData00
J04
PerData01
G01
PerData02
G02
PerData03
H03
PerData04
F01
PerData05
F02
PerData06
G03
PerData07
E02
PerData08
D02
PerData09
F03
PerData10
D01
PerData11
C02
PerData12
E03
PerData13
C01
PerData14
D03
PerData15
F04
Interface Group
External Peripheral Bus
Note: PerData00 is the most significant bit (msb)
on this bus.
Page
34
PerErr
J21
External Peripheral Bus
34
PerOE
D14
External Peripheral Bus
34
PerPar0
B01
PerPar1
A02
External Peripheral Bus
34
PerR/W
A16
External Peripheral Bus
34
PerReady
B16
External Peripheral Bus
34
External Peripheral Bus
34
34
PerWBE0
B13
PerWBE1
C13
[PerWE]GPIO31
A13
External Peripheral Bus
PHY0Col[PHY0Rx1Er]
W17
Ethernet
32
PHY0CrS[PHY0CrS0DV]
Y18
Ethernet
32
[PHY0CrS1DV]PHY0RxDV
Y17
Ethernet
32
AB19
Ethernet
32
[PHY0RefClk]PHY0TxClk
Y19
Ethernet
32
PHY0RxD0[PHY0Rx0D0][PHY0Rx0D]
Y15
PHY0RxD1[PHY0Rx0D1][PHY0Rx1D]
Y16
Ethernet
32
Ethernet
32
32
PHY0RxClk
PHY0RxD2[PHY0Rx1D0]
AA18
PHY0RxD3[PHY0Rx1D1]
AA19
PHY0RxDV[PHY0CrS1DV]
Y17
PHY0RxErr[PHY0Rx0Er]
AA20
Ethernet
[PHY0Rx0Er]PHY0RxErr
AA20
Ethernet
32
PHY0TxClk[PHY0RefClk]
Y19
Ethernet
32
RAS
AB12
SDRAM
33
SysClk
G22
System
37
SysErr
C21
System
37
SysReset
A21
System
37
TCK
J19
JTAG
36
21
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
[TC0/EOT0]GPIO24
(Part 10 of 11)
Ball
Interface Group
Page
B19
[TC1/EOT1]GPIO25
B18
[[TC2/EOT2]GPIO26
C16
[TC3/EOT3]GPIO27
B17
TDI
G21
JTAG
36
TDO
F21
JTAG
36
TestEn
H20
System
37
TmrClk
D20
System
37
TMS
E21
JTAG
36
[TrcClk]GPIO00
B20
Trace
37
TRST
H22
JTAG
36
[TS1E]GPIO01
C18
[TS2E]GPIO02
A20
Trace
37
[TS1O]GPIO03
N20
[TS2O]GPIO04
N22
Trace
37
[TS3]GPIO05
P21
[TS4]GPIO06
P20
[TS5]GPIO07
R22
Trace
37
[TS6]GPIO08
R21
UART0_CTS
B22
Internal Peripheral
35
Internal Peripheral
35
UART0_DCD
C19
UART0_DSR
A06
UART0_DTR
G20
UART0_RI
D22
UART0_RTS
D21
UART0_Rx
C22
UART0_Tx
F19
UART1_CTS
W22
[UART1_DCD]GPIO28[HDLCEXTxEnA]
AA15
UART1_DSR
W21
UART1_DTR
U20
[UART1_RI]GPIO29[HDLCEXTxEnB]
T01
UART1_RTS
V21
UART1_Rx
V20
UART1_Tx
Y21
UARTSerClk
E20
22
External Peripheral Bus
34
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed Alphabetically
Signal Name
(Part 11 of 11)
Ball
VDD
D10
VDD
D13
VDD
K19
VDD
K04
VDD
N19
VDD
N04
VDD
W10
VDD
W13
WE
Y07
Interface Group
Page
Power
37
SDRAM
33
23
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment
Ball
24
Signal Name
Ball
(Part 1 of 6)
Signal Name
Ball
Signal Name
Ball
Signal Name
A01
GND
B01
PerPar0
C01
PerData13
D01
PerData10
A02
PerPar1
B02
GND
C02
PerData11
D02
PerData08
A03
PerAddr06
B03
PerAddr08
C03
GND
D03
PerData14
A04
PerAddr09
B04
PerAddr11
C04
PerAddr05
D04
GND
A05
GND
B05
PerAddr12
C05
PerAdd7
D05
OVDD
A06
UART0_DSR
B06
PerAddr14
C06
PerAddr10
D06
PerAddr04
D07
OVDD
A07
PerAddr17
B07
PerAddr16
C07
PerAddr13
A08
PerAddr20
B08
PerAddr19
C08
PerAddr15
D08
GND
A09
GND
B09
PerAddr22
C09
PerAddr21
D09
PerAddr18
A10
PerAddr23
B10
PerAddr25
C10
PerAddr24
D10
VDD
A11
PerAddr27
B11
PerAddr26
C11
PerAddr28
D11
GND
A12
PerAddr30
B12
PerAddr31
C12
PerAddr29
D12
GND
VDD
A13
GPIO31[PerWE]
B13
PerWBE0
C13
PerWBE1
D13
A14
GND
B14
PerCS0
C14
PerCS1
D14
PerOE
A15
PerCS2
B15
PerCS3
C15
PerBLast
D15
GND
A16
PerR/W
B16
PerReady
C16
GPIO26[EOT2/TC2]
D16
OVDD
A17
PerClk
B17
GPIO27[EOT3/TC3]
C17
IICSCL[IECSCL]
D17
GPIO16[DMAAck3]
A18
GND
B18
GPIO25[EOT1/TC1]
C18
GPIO01[TS1E]
D18
OVDD
A19
IICSDA[IECSDA]
B19
GPIO24[EOT0/TC0]
C19
UART0_DCD
D19
GND
A20
GPIO02[TS2E]
B20
GPIO00[TrcClk]
C20
GND
D20
TmrClk
A21
SysReset
B21
GND
C21
SysErr
D21
UART0_RTS
A22
GND
B22
UART0_CTS
C22
UART0_Rx
D22
UART0_RI
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment
Ball
Signal Name
Ball
(Part 2 of 6)
Signal Name
Ball
Signal Name
Ball
Signal Name
E01
GND
F01
PerData04
G01
PerData01
H01
MemData30
E02
PerData07
F02
PerData05
G02
PerData02
H02
MemData31
E03
PerData12
F03
PerData09
G03
PerData06
H03
PerData03
E04
OVDD
F04
PerData15
G04
OVDD
H04
GND
E05
No ball
F05
No ball
G05
No ball
H05
No ball
E06
No ball
F06
No ball
G06
No ball
H06
No ball
E07
No ball
F07
No ball
G07
No ball
H07
No ball
E08
No ball
F08
No ball
G08
No ball
H08
No ball
E09
No ball
F09
No ball
G09
No ball
H09
No ball
E10
No ball
F10
No ball
G10
No ball
H10
No ball
E11
No ball
F11
No ball
G11
No ball
H11
No ball
E12
No ball
F12
No ball
G12
No ball
H12
No ball
E13
No ball
F13
No ball
G13
No ball
H13
No ball
E14
No ball
F14
No ball
G14
No ball
H14
No ball
E15
No ball
F15
No ball
G15
No ball
H15
No ball
E16
No ball
F16
No ball
G16
No ball
H16
No ball
E17
No ball
F17
No ball
G17
No ball
H17
No ball
E18
No ball
F18
No ball
G18
No ball
H18
No ball
E19
OVDD
F19
UART0_Tx
G19
OVDD
H19
GND
E20
UARTSerClk
F20
GPIO17[IRQ0]
G20
UART0_DTR
H20
TestEn
E21
TMS
F21
TDO
G21
TDI
H21
AVDD
E22
GND
F22
Halt
G22
SysClk
H22
TRST
25
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment
Ball
26
Signal Name
Ball
(Part 3 of 6)
Signal Name
Ball
Signal Name
Ball
Signal Name
J01
GND
K01
MemData27
L01
DQM3
M01
MemData21
J02
MemData28
K02
MemData25
L02
MemData24
M02
MemData20
J03
MemData29
K03
MemData26
L03
MemData23
M03
MemData22
J04
PerData00
K04
VDD
L04
GND
M04
GND
J05
No ball
K05
No ball
L05
No ball
M05
No ball
J06
No ball
K06
No ball
L06
No ball
M06
No ball
J07
No ball
K07
No ball
L07
No ball
M07
No ball
J08
No ball
K08
No ball
L08
No ball
M08
No ball
J09
GND
K09
GND
L09
GND
M09
GND
J10
GND
K10
GND
L10
GND
M10
GND
J11
GND
K11
GND
L11
GND
M11
GND
J12
GND
K12
GND
L12
GND
M12
GND
J13
GND
K13
GND
L13
GND
M13
GND
J14
GND
K14
GND
L14
GND
M14
GND
J15
No ball
K15
No ball
L15
No ball
M15
No ball
J16
No ball
K16
No ball
L16
No ball
M16
No ball
J17
No ball
K17
No ball
L17
No ball
M17
No ball
J18
No ball
K18
No ball
L18
No ball
M18
No ball
J19
TCK
K19
VDD
L19
GND
M19
GND
J20
GPIO18[IRQ1]
K20
HDLCEXTxClk
L20
HDLCEXRxClk
M20
HDLCEXRxFS
J21
PerErr
K21
HDLCEXTxDataA
L21
GPIO19[IRQ2]
M21
GPIO20[IRQ3]
J22
GND
K22
HDLCEXTxFS
L22
HDLCEXTxDataB
M22
HDLCEXRxDataA
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment
Ball
Signal Name
Ball
(Part 4 of 6)
Signal Name
Ball
Signal Name
Ball
Signal Name
N01
MemData17
P01
GND
R01
MemData14
T01
GPIO29[UART1_RI]
[HDLCEXTxEnB]
N02
MemData19
P02
MemData16
R02
DQM2
T02
MemData12
N03
MemData18
P03
MemData15
R03
MemData11
T03
GPIO30
N04
VDD
P04
MemData13
R04
GND
T04
OVDD
N05
No ball
P05
No ball
R05
No ball
T05
No ball
N06
No ball
P06
No ball
R06
No ball
T06
No ball
N07
No ball
P07
No ball
R07
No ball
T07
No ball
N08
No ball
P08
No ball
R08
No ball
T08
No ball
N09
GND
P09
GND
R09
No ball
T09
No ball
N10
GND
P10
GND
R10
No ball
T10
No ball
N11
GND
P11
GND
R11
No ball
T11
No ball
N12
GND
P12
GND
R12
No ball
T12
No ball
N13
GND
P13
GND
R13
No ball
T13
No ball
N14
GND
P14
GND
R14
No ball
T14
No ball
N15
No ball
P15
No ball
R15
No ball
T15
No ball
N16
No ball
P16
No ball
R16
No ball
T16
No ball
N17
No ball
P17
No ball
R17
No ball
T17
No ball
N18
No ball
P18
No ball
R18
No ball
T18
No ball
N19
VDD
P19
GPIO09[DMAReq0]
R19
GND
T19
OVDD
N20
GPIO3[TS1O]
P20
GPIO06[TS4]
R20
GPIO12[DMAReq3]
T20
GPIO15[DMAAck2]
N21
HDLCEXRxDataB
P21
GPIO05[TS3]
R21
GPIO08[TS6]
T21
GPIO11[DMAReq2]
N22
GPIO4[TS2O]
P22
GND
R22
GPIO07[TS5]
T22
GPIO10[DMAReq1]
27
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment
Ball
U01
Signal Name
Ball
(Part 5 of 6)
Signal Name
GND
Ball
W01
Signal Name
MemData07
Ball
Y01
Signal Name
DQM1
V01
MemData04
U02
MemData10
V02
MemData09
W02
MemData08
Y02
MemData06
U03
DQM0
V03
MemData05
W03
MemData03
Y03
GND
U04
MemData02
V04
OVDD
W04
GND
Y04
ECC6
U05
No ball
V05
No ball
W05
OVDD
Y05
ECC4
U06
No ball
V06
No ball
W06
ECC7
Y06
ECC1
U07
No ball
V07
No ball
W07
OVDD
Y07
WE
U08
No ball
V08
No ball
W08
GND
Y08
BankSel1
U09
No ball
V09
No ball
W09
MemAddr11
Y09
MemAddr08
U10
No ball
V10
No ball
W10
VDD
Y10
MemAddr05
U11
No ball
V11
No ball
W11
GND
Y11
MemAddr01
U12
No ball
V12
No ball
W12
GND
Y12
MemAddr00
U13
No ball
V13
No ball
W13
VDD
Y13
ClkEn0
U14
No ball
V14
No ball
W14
GPIO23[IRQ6]
Y14
BA1
U15
No ball
V15
No ball
W15
GND
Y15
PHY0RxD0
[PHY0Rx0D0]
[PHY0Rx0D]
U16
No ball
V16
No ball
W16
OVDD
Y16
PHYRxD1
[PHY0Rx0D1]
[PHY0Rx1D]
U17
No ball
V17
No ball
W17
PHY0Col[PHY0Rx1Er]
Y17
PHY0RxDV
[PHY0CrS1DV]
U18
No ball
V18
No ball
W18
OVDD
Y18
PHY0CrS
[PHY0CrS0DV]
U19
EMC0TxD1
[EMC0Tx0D1]
[EMC0Tx1D]
V19
OVDD
W19
GND
Y19
PHY0TxClk
[PHY0RefClk]
U20
UART1_DTR
V20
UART1_Rx
W20
EMC0TxD2
[EMC0Tx1D0]
Y20
GND
U21
GPIO14[DMAAck1]
V21
UART1_RTS
W21
UART1_DSR
Y21
UART1_Tx
Y22
EMC0TxD3
[EMC0Tx1D1]
U22
28
GPIO13[DMAAck0]
V22
GND
W22
UART1_CTS
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signals Listed by Ball Assignment
Ball
Signal Name
Ball
(Part 6 of 6)
Signal Name
AA01
MemData01
AB01
AA02
GND
AB02
MemData00
AA03
ECC3
AB03
ECC5
Ball
Signal Name
Ball
Signal Name
GND
AA04
DQMCB
AB04
ECC2
AA05
ECC0
AB05
GND
AA06
BankSel3
AB06
BankSel2
AA07
BankSel0
AB07
MemAddr12
AA08
MemAddr10
AB08
MemAddr09
AA09
MemAddr07
AB09
GND
AA10
MemAddr04
AB10
MemAddr06
AA11
MemAddr03
AB11
MemAddr02
AA12
CAS
AB12
RAS
AA13
ClkEn1
AB13
MemClkOut1
AA14
MemClkOut0
AB14
GND
AA15
GPIO28[UART1_DCD]
[HDLCEXTxEnA]
AB15
BA0
AA16
EMC0MDIO
AB16
EMC0MDClk
AA17
GPIO21[IRQ4]
AB17
GPIO22[IRQ5]
AA18
PHY0RxD2
[PHY0Rx1D0]
AB18
GND
AA19
PHY0RxD3
[PHY0Rx1D1]
AB19
PHY0RxClk
AA20
PHY0RxErr
[PHY0Rx0Er]
AB20
EMC0TxErr
[EMC0Tx1En]
AA21
GND
AB21
EMC0TxEn
[EMC0Tx0En]
[EMC0Sync]
AA22
EMC0TxD0
[EMC0Tx0D0]
[EMC0Tx0D]
AB22
GND
29
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Description
The following table provides a summary of the number of package pins (balls) associated with each functional
interface group.
Pin Summary
Group
No. of Pins
Nonmultiplexed Signals
167
Multiplexed Signals
48
Total Signal Pins
215
AVDD
1
OVDD
16
VDD
8
Gnd
48
Gnd (and thermal)
36
Reserved
0
Total Pins
324
Multiplexed pins
In the table “Signal Functional Description” on page 32, each external signal is listed along with a short
description of the signal function. The signals are grouped together according to their function. Some signals
are multiplexed on the same package pin (ball) so that the pin can be used for different functions. In most
cases, the signal name is shown in this table unaccompanied by multiplexed signal names that may be
associated with it. In cases where multiplexed signals are in the same functional group, the names appear as
a default signal followed by secondary signals in square brackets (for example, EMC0TxErr[EMC0Tx1En]).
Active-low signals (for example, RAS) are marked with an overline. Any signal that is not the primary (default)
signal on a multiplexed pin is shown in square brackets.
The active signal on a multiplexed pin is controlled by programming. It is expected that in any single
application, a particular pin will always be programmed to serve the same function. The flexibility of
multiplexing allows a single chip to offer a richer pin selection than would otherwise be possible.
Initialization Strapping
One group of pins is used as strapped inputs during system reset. These pins function as strapped inputs
only during reset and are used for other functions during normal operation (see “Initialization” on page 51).
Note that the use of these pins for strapping is not considered multiplexing since the strapping function is not
programmable.
Pull-up and Pull-down Resistors
Pull-up and pull-down resistors are used for strapping during reset and to retain unused or undriven inputs in
an appropriate state. The recommended pull-up value of 3kΩ to +3.3V (10kΩ to +5V can be used on 5V
tolerant I/Os) and pull-down value of 1kΩ to GND, applies only to individually terminated signals. To prevent
possible damage to the device, I/Os capable of becoming outputs must never be tied together and terminated
through a common resistor.
If your system-level test methodology permits, input-only signals can be connected together and terminated
through either a common resistor or directly to +3.3V or GND. When a resistor is used, its value must ensure
30
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
that the grouped I/Os reach a valid logic zero or logic one state when accounting for the total input current into
the NPe405L.
Unused I/Os
Strapping of some pins may be necessary when they are unused. Although the NPe405L requires only the
pull-up and pull-down terminations as specified in the “Signal Functional Description” on page 32, good
design practice is to terminate all unused inputs or to configure I/Os such that they always drive. If unused,
the peripheral and SDRAM bus should be configured and terminated as follows:
• Peripheral interface—PerAddr00:31, PerData00:31, and all of the control signals are driven by default.
Terminate PerReady high and PerError low.
• SDRAM—Program SDRAM0_CFG[EMDULR]=1 and SDRAM0_CFG[DCE]=1. This causes the NPe405L
to actively drive all of the SDRAM address, data, and control signals.
External Peripheral Bus Control Signals
All external peripheral bus control signals (PerCS0:3, PerR/W, PerWBE0:1, PerOE, PerWE, PerBLast) are
set to the high-impedance state when ExtReset=0. In addition, as detailed in the PowerNP NPe405L
Embedded Processor User’s Manual, the peripheral bus controller can be programmed via EBC0_CFG to
float some of these control signals between transactions. As a result, a pull-up resistor should be added to
those control signals where an undriven state may affect any devices receiving that particular signal.
The following table lists all of the I/O signals provided by the NPe405L. Please see “Signals Listed
Alphabetically” on page 13 for the pin number to which each signal is assigned. In cases where a multiplexed
signal (indicated by the square brackets) is shown without the other signals that are assigned to that pin, you
can see what the other signals are by referring to the same table.
31
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description
(Part 1 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name
Description
I/O
Type
Notes
HDLCEX Interface
HDLCEXTxClk
Transmit Clock
I
3.3V LVTTL
HDLCEXTxFS
Transmit Frame Synchronization
I
3.3V LVTTL
HDLCEXTxDataA
Transmit Data port A
O
3.3V LVTTL
HDLCEXTxDataB
Transmit Data port B
O
3.3V LVTTL
HDLCEXRxClk
Receive Clock
I
3.3V LVTTL
HDLCEXRxFS
Receive Frame Synchronization
I
3.3V LVTTL
HDLCEXRxDataA
Receive Data port A
I
3.3V LVTTL
HDLCEXRxDataB
Receive Data port B
I
3.3V LVTTL
[HDLCEXTxEnA]
Transmit Enable port A
O
5V tolerant
3.3V LVTTL
[HDLCEXTxEnB]
Transmit Enable port B
O
5V tolerant
3.3V LVTTL
EMC0MDClk
Management Data Clock. The MDClk is sourced to the
PHY. Management information is transferred
synchronously with respect to this clock (MII, RMII, and
SMII).
O
3.3V LVTTL
EMC0MDIO
Management Data Input/Output is a bidirectional signal
between the Ethernet controller and the PHY. It is used to
transfer control and status information (MII, RMII, and
SMII).
I/O
5V tolerant
3.3V LVTTL
EMC0TxD0[EMC0Tx0D0][EMC0Tx0D]
Transmit Data. A nibble wide data bus towards the net.
EMC0TxD1[EMC0Tx0D1][EMC0Tx1D]
The data is synchronous with PHY0TxClk
EMC0TxD2[EMC0Tx1D0]
(MII 0[RMII 0, 1][SMII 0, 1]).
EMC0TxD3[EMC0Tx1D1]
O
3.3V LVTTL
Transmit Enable. This signal is driven by EMAC2 to the
PHY. Data is valid during the active state of this signal.
Deassertion of this signal indicates end of frame
EMC0TxEn[EMC0Tx0En][EMC0Sync] transmission. This signal is synchronous with PHYTxClk
(MII 0[RMII 0]).
or
SMII Sync.
O
3.3V LVTTL
O
3.3V LVTTL
Ethernet Interface
EMC0TxErr[EMC0Tx1En]
32
Transmit Error. This signal is generated by the Ethernet
controller, is connected to the PHY and is synchronous
with the PHY0TxClk. It informs the PHY that an error was
detected (MII 0).
or
Transmit Enable [RMII 1].
1, 4
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description
(Part 2 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name
Notes
I/O
Type
Collision [receive error] signal from the PHY. This is an
asynchronous signal (MII 0).
or
Receive Error ([RMII 1]).
I
5V tolerant
3.3V LVTTL
Carrier Sense signal from the PHY. This is an
asynchronous signal (MII 0).
or
Carrier sense data valid ([RMII 0]).
I
5V tolerant
3.3V LVTTL
1, 5
Receiver medium clock. This signal is generated by the
PHY (MII 0).
I
5V tolerant
3.3V LVTTL
1, 4
PHY0RxD0[PHY0Rx0D0][PHY0Rx0D]
Received Data. This is a nibble wide bus from the PHY.
PHY0RxD1[PHY0Rx0D1][PHY0Rx1D]
The data is synchronous with PHY0RxClk
PHY0RxD2[PHY0Rx1D0]
(MII 0[RMII 0, 1][SMII 0, 1]).
PHY0RxD3[PHY0Rx1D1]
I
5V tolerant
3.3V LVTTL
1, 4
Receive Data Valid. Data on the Data Bus is valid when
this signal is activated. Deassertion of this signal indicates
end of the frame reception (MII 0).
or
Carrier sense data valid ([RMII 1])
I
5V tolerant
3.3V LVTTL
1, 5
PHY0RxErr[PHY0Rx0Er]
Receive Error. This signal comes from the PHY and is
synchronous with PHY0RxClk (MII 0 [RMII 0]).
I
5V tolerant
3.3V LVTTL
1, 5
PHY0TxClk[PHY0RefClk]
Transmit medium clock. This signal is generated the PHY
([MII 0]).
or
Reference Clock [RMII and SMII].
I
5V tolerant
3.3V LVTTL
1, 4
MemAddr00:31
Memory Data bus
Notes:
1. MemAddr00 is the most significant bit (msb).
2. MemData31 is the least significant bit (lsb).
I/O
3.3V LVTTL
MemAddr12:00
Memory Address bus.
Notes:
1. MemAddr12 is the most significant bit (msb).
2. MemAddr00 is the least significant bit (lsb).
O
3.3V LVTTL
PHY0Col[PHY0Rx1Er]l
PHY0CrS[PHY0CrS0DV]
PHY0RxClk
PHY0RxDV[PHY0CrS1DV]
Description
SDRAM Interface
BA1:0
Bank Address supporting up to 4 internal banks
O
3.3V LVTTL
RAS
Row Address Strobe.
O
3.3V LVTTL
CAS
Column Address Strobe.
O
3.3V LVTTL
DQM0:3
DQM for byte lane 0 (MemAddr00:7),
1 (MemAddr08:15),
2 (MemData16:23), and
3 (MemData24:31)
O
3.3V LVTTL
DQMCB
DQM for ECC check bits.
O
3.3V LVTTL
33
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description
(Part 3 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name
ECC0:7
Description
I/O
Type
Notes
ECC check bits 0:7.
I/O
3.3V LVTTL
Select up to four external SDRAM banks.
O
3.3V LVTTL
Write Enable.
O
3.3V LVTTL
SDRAM Clock Enable.
O
3.3V LVTTL
Two copies of an SDRAM clock allows, in some cases,
glueless SDRAM attachment without requiring this signal
to be repowered by a PLL or zero-delay buffer.
O
3.3V LVTTL
PerData00:15
External peripheral data bus .
Note: PerData00 is the most significant bit (msb) on this
bus.
I/O
5V tolerant
3.3V LVTTL
PerAddr04:31
External peripheral address bus .
O
5V tolerant
3.3V LVTTL
External peripheral byte parity signals.
I/O
5V tolerant
3.3V LVTTL
1
PerWBE0:1
Peripheral write-bte enable. Byte-enables which are valid
for an entire cycle or write-byte-enables which are valid for
each byte on each data transfer, allowing partial word
transactions. Used by either external bus controller or DMA
controller depending upon the type of transfer involved.
O
5V tolerant
3.3V LVTTL
2, 7
[PerWE]
Peripheral write enable. Low when any of the two PerWBE
signals are low.
I/O
5V tolerant
3.3V LVTTL
7
Peripheral Chip Selects
O
5V tolerant
3.3V LVTTL
Peripheral output enable. Used by either the external bus
controller or the DMA controller depending upon the type
of transfer involved. When the NPe405L is the bus master,
it enables the peripherals to drive the bus.
O
5V tolerant
3.3V LVTTL
O
5V tolerant
3.3V LVTTL
BankSel0:3
WE
ClkEn0:1
MemClkOut0:1
External Peripheral Bus Interface
PerPar0:1
PerCS0:3
PerOE
PerR/W
34
Peripheral read/write. Used by either the external bus
controller or DMA controller depending upon the type of
transfer involved. High indicates a read from memory, low
indicates a write to memory.
1
7
PerReady
Indicates peripheral is ready to transfer data.
I
5V tolerant
3.3V LVTTL
1
PerBLast
Peripheral burst last. Used to indicate the last transfer of a
memory access.
O
5V tolerant
3.3V LVTTL
7
PerClk
Peripheral Clock. Used by synchronous peripherals.
O
5V tolerant
3.3V LVTTL
PerErr
Used to indicate errors from peripherals.
I
5V tolerant
3.3V LVTTL
1, 5
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description
(Part 4 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name
Description
I/O
Type
Notes
[DMAReq0:3]
DMA request. Used by peripherals to request a data
transfer. Following a system reset, the default mode of the
signals is active-low. They may be programmed to activehigh using the DMA0_POL register.
I
5V tolerant
3.3V LVTTL
1
[DMAAck0:3]
DMA acknowledge. Used to indicate to peripherals that
data transfer is complete. Following a system reset, the
default mode of the signals is active-low. They may be
programmed to active-high using the DMA0_POL register.
O
5V tolerant
3.3V LVTTL
[EOT0:3/TC0:3]
End Of Transfer/Terminal Count. Indication by peripherals
that all data has been transfered, or by DMA controller that
programmed amount of data has been transfered.
Following a system reset, the default mode of the signals is
active-low. They may be programmed to active-high using
the DMA0_POL register.
I/O
5V tolerant
3.3V LVTTL
1
Serial Clock used to provide an alternative clock to the
internally generated serial clock. Used in cases where the
allowable internally generated baud rates are not
satisfactory. This input can be individually connected to
either or both UART0 and UART1.
I
5V tolerant
3.3V LVTTL
1
UART0_Rx
UART0 Receive data.
I
5V tolerant
3.3V LVTTL
1
UART0_Tx
UART0 Transmit data.
O
5V tolerant
3.3V LVTTL
[UART0_DCD]
UART0 Data Carrier Detect.
I
5V tolerant
3.3V LVTTL
1
[UART0_DSR]
UART0 Data Set Ready.
I
5V tolerant
3.3V LVTTL
1
[UART0_CTS]
UART0 Clear To Send.
I
5V tolerant
3.3V LVTTL
1
[UART0_DTR]
UART0 Data Terminal Ready.
O
5V tolerant
3.3V LVTTL
[UART0_RTS]
UART0 Request To Send.
O
5V tolerant
3.3V LVTTL
UART0 Ring Indicator.
I
5V tolerant
3.3V LVTTL r
Internal Peripheral Interface
UARTSerClk
[UART0_RI]
1
35
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description
(Part 5 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name
Description
I/O
Type
Notes
UART1_Rx
UART1 Receive data.
I
5V tolerant
3.3V LVTTL
1
UART1_Tx
UART1 Transmit data.
O
5V tolerant
3.3V LVTTL
6
[UART1_DCD]
UART1 Data Carrier Detect.
I
5V tolerant
3.3V LVTTL
1, 4
[UART1_DSR]
UART1 Data Set Ready.
I
5V tolerant
3.3V LVTTL
1, 4
[UART1_CTS]
UART1 Clear To Send.
I
5V tolerant
3.3V LVTTL
1, 4
[UART1_DTR]
UART1 Data Terminal Ready.
O
5V tolerant
3.3V LVTTL
6
[UART1_RTS]
UART1 Request To Send.
O
5V tolerant
3.3V LVTTL
6
UART1 Ring Indicator.
I
5V tolerant
3.3V LVTTL
1, 4
[UART1_RI]
IICSCL
IIC Serial Clock.
I/O
5V tolerant
3.3V LVTTL
1, 2
IICSDA
IIC Serial Data.
I/O
5V tolerant
3.3V LVTTL
1, 2
Interrupt Requests.
I
5V tolerant
3.3V LVTTL
1
TDI
Test Data In.
I
5V tolerant
3.3V LVTTL
1, 4
TMS
Test Mode Select.
I
5V tolerant
3.3V LVTTL
1, 4
TDO
Test Data Out.
O
5V tolerant
3.3V LVTTL
TCK
Test Clock.
I
5V tolerant
3.3V LVTTL
1, 4
Test Reset. TRST must be low at power-on to reset the
JTAG boundary scan state machine.
I
5V tolerant
3.3V LVTTL
5
Interrupts Interface
[IRQ0:6]
JTAG Interface
TRST
36
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Signal Functional Description
(Part 6 of 6)
Notes:
1. Receiver input has hysteresis.
2. Must pull up. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
3. Must pull down. See “Pull-up and Pull-down Resistors” on page 30 for recommended termination values.
4. If not used, must pull up.
5. If not used, must pull down.
6. Strapping input during reset; pull up or pull down as required.
7. Pull-up may be required. See “External Peripheral Bus Control Signals” on page 31.
Signal Name
Description
Notes
I/O
Type
I
3.3V Analog
Wire w/ESD
Main System Reset.
I/O
5V tolerant
3.3V LVTTL
Set to 1 when a Machine Check is generated.
O
5V tolerant
3.3V LVTTL
Halt from external debugger.
I
5V tolerant
3.3V LVTTL
1
I/O
5V tolerant
3.3V LVTTL
1
System Interface
SysClk
SysReset
SysErr
Halt
GPIO00:31
Main System Clock input.
General Purpose I/O. To access this function, software
must toggle a DCR bit.
TestEn
Test Enable. Used only for manufacturing tests. Pull down
for normal operation.
I
3.3V LVTTL
Rcvr w/PD
TmrClk
This input must toggle at a rate of less than one half the
CPU core frequency (less than 100MHz in most cases). In
most cases this input toggles much slower (in the 1MHz to
10MHz range).
I
5V tolerant
3.3V LVTTL
[TS1E]
[TS2E]
Even Trace execution status.To access this function,
software must toggle a DCR bit.
O
5V tolerant
3.3V LVTTL
[TS1O]
[TS2O]
Odd Trace execution status. To access this function,
software must toggle a DCR bit.
O
5V tolerant
3.3V LVTTL
[TS3:6]
Trace Status. To access this function, software must toggle
a DCR bit.
O
5V tolerant
3.3V LVTTL
[TrcClk]
Trace interface clock. A toggling signal that is always half
of the CPU core frequency. To access this function,
software must toggle a DCR bit.
O
5V tolerant
3.3V LVTTL
GND
Ground
Note: J09-J14, K09-K14, L09-L14, M09-M14, N09-N14,
and P09-P14 are also thermal balls.
I
Hardwire
VDD
Logic voltage—2.5V
I
Hardwire
OVDD
Output driver voltage—3.3V
I
Hardwire
AVDD
Filtered PLL voltage—2.5V
I
3.3V DC
Wire w/ESD
n/a
n/a
1, 2
1
Trace Interface
1
Power Pins
Other Pins
Reserved
Do not connect signals, voltage, or ground to these pins.
37
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause
permanent damage to the device.
Characteristic
Symbol
Value
Unit
Supply Voltage (Internal Logic)
VDD
0 to +2.7
V
Supply Voltage (I/O Interface)
OVDD
0 to +3.6
V
PLL Supply Voltage 2
AVDD
0 to +2.7
V
Input Voltage (3.3V LVTTL receivers)
VIN
-0.6 to (OVDD + 0.6)
V
Input Voltage (5.0V LVTTL receivers)
VIN
-0.6 to (OVDD + 2.4)
V
Storage Temperature Range
TSTG
-55 to +150
°C
Case temperature under bias
TC
-40 to +120
°C
Notes:
1. All voltages are specified with respect to ground (GND).
2. AVDD should be derived from VDD using the following circuit:
AVDD
VDD
L1
C2
C1
L1 – 2.2 µH SMT inductor (equivalent to MuRata
LQH3C2R2M34) or SMT chip ferrite bead (equivalent
to MuRata BLM31A700S)
C1 – 3.3 µF SMT tantalum
C3
C2 – 0.1 µF SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
C3 – 0.01 µF SMT monolithic ceramic capacitor with X7R
dielectric or equivalent
Package Thermal Specifications
The NPe405L is designed to operate within a case temperature range of -40°C to 85°C. Thermal resistance values for the
E-PBGA packages in a convection environment are as follows:
Package—Thermal Resistance
Airflow
ft/min (m/sec)
Symbol
Unit
0 (0)
100 (0.51)
200 (1.02)
23mm, 324-balls—Junction-to-Case
θJC
2
2
2
°C/W
1
θCA
17
15
14
°C/W
23mm, 324-balls—Case-to-Ambient
Notes:
1. For a chip mounted on a JEDEC 2S2P card without a heat sink.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
a. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
b. TA = TC – P×θ CA, where TA is ambient temperature and P is power consumption.
c. TCMax = TJMax – P×θJC, where TJ Max is maximum junction temperature and P is power consumption.
38
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Recommended DC Operating Conditions
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
Parameter
Symbol
Minimum
Typical
Maximum
Unit
VDD
+2.3
+2.5
+2.7
V
I/O Supply Voltage
OVDD
+3.0
+3.3
+3.6
V
PLL Supply Voltage
AVDD
+2.3
+2.5
+2.7
V
Input Logic High (3.3V LVTTL
receivers)
VIH
+2.0
OVDD
V
Input Logic High (2.5V CMOS
receivers)
VIH
+1.7
VDD
V
Input Logic High (5.0V LVTTL
receivers)
VIH
+2.0
+5.5
V
Input Logic Low
VIL
0
+0.8
V
Output Logic High
VOH
+2.4
OVDD
V
Output Logic Low
VOL
0
+0.4
V
3.3V I/O input current (no pull-up or
pull-down)
IIL1
±10
µA
Input Current (with internal pulldown)
IIL2
±10 (@ 0V)
400 (@ 3.6V)
µA
Input Current (with internal pull-up)
IIL3
-250 (@ 0V)
±10 (@ 3.6V)
µA
Logic Supply Voltage
Input Max Allowable Overshoot
(2.5V CMOS receivers)
VIMAO25
VDD + 0.6
V
Input Max Allowable Overshoot
(3.3V LVTTL receivers)
VIMAO3
OVDD + 0.6
V
Input Max Allowable Overshoot
(5.0V LVTTL receivers)
VIMAO5
+5.5
V
Input Max Allowable Undershoot
(3.3V or 5.0V receivers)
VIMAU
Output Max Allowable Overshoot
(3.3V or 5.0V receivers)
VOMAO
Output Max Allowable Undershoot
(3.3V and 5.0V receivers)
VOMAU3
− 0.6
TC
− 40
Case Temperature
− 0.6
Notes
V
OVDD + 0.3
V
V
+85
°C
Notes:
1. See “5V-Tolerant I/O Input Current” on page 40
39
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
5V-Tolerant I/O Input Current
100
0
Input Current (µA)
-100
-200
-300
-400
-500
-600
-700
0.0
1.0
2.0
3.0
4.0
5.0
Input Voltage (V)
Input Capacitance
Parameter
Symbol
Maximum
Unit
3.3V LVTTL I/O)
CIN1
2.5
pF
5V tolerant LVTTL I/O
CIN2
3.5
pF
RX only pins
CIN4
0.75
pF
40
Notes
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
DC Electrical Characteristics
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Active Operating Current for VDD @ 133MHz
IDD
444
497
543
mA
Active Operating Current for VDD @ 200MHz
IDD
468
565
676
mA
Active Operating Current for VDD @ 266MHz
IDD
490
590
700
mA
Active Operating Current for OVDD @ 133MHz
IODD
17
23
36
mA
Active Operating Current for OVDD @ 200MHz
IODD
24
36
51
mA
Active Operating Current for OVDD @ 266MHz
IODD
27
44
61
mA
Active Operating Current for AVDD
IADD
5.5
6
6.5
mA
Active Operating Power @ 133MHz
PDD
1.1
1.3
1.61
W
Active Operating Power @ 200MHz
PDD
1.4
1.7
21
W
Active Operating Power @ 266MHz
PDD
1.5
1.8
2.11
W
Notes:
1. Maximum power is characterized at VDD=2.7V, OVDD=3.6V, TC=85 °C, across the silicon process (worse case to best case),
while running an application designed to maximize power consumption. The maximum power values are measured with the
following clock rate combinations:
a. CPU=133.33MHz, PLB=66.66MHz, OPB=66.66MHz, EBC=33.33MHz
b. CPU=200 MHz, PLB=100MHz, OPB=50MHz, EBC=50MHz
c. CPU=266.66MHz, PLB=66.66MHz, OPB=66.66MHz, EBC=33.33MHz
Test Conditions
Clock timing and switching characteristics are specified in accordance
with operating conditions shown in the table “Recommended DC
Operating Conditions.” AC specifications are characterized at
OVDD = 3.00V and TJ = 85°C with the 50pF test load shown in the
figure at right.
Output
Pin
50pF
41
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Clocking Specifications
Symbol
Parameter
Min
Max
Units
SysClk Input
FC
SysClk clock input frequency
25
66.66
MHz
TC
SysClk clock period
15
40
ns
0.15
ns
TCS
Clock edge stability (phase jitter, cycle to cycle)
TCH
Clock input high time
40% of nominal period 60% of nominal period
ns
TCL
Clock input low time
40% of nominal period 60% of nominal period
ns
Note: Input slew rate > 2V/ns
MemClkOut Output
FC
MemClkOut clock output frequency–133MHz
TC
MemClkOut clock period–133MHz
FC
MemClkOut clock output frequency–200MHz
TC
MemClkOut clock period–200MHz
FC
MemClkOut clock output frequency–266MHz
TC
MemClkOut clock period–266MHz
TCH
Clock output high time
45% of nominal period 55% of nominal period
ns
TCL
Clock output low time
45% of nominal period 55% of nominal period
ns
66.66
15
MHz
ns
100
10
MHz
ns
133.33
7.5
MHz
ns
Other Clocks
FC
VCO frequency
FC
PLB frequency–133MHz
FC
PLB frequency–200MHz
100
MHz
FC
PLB frequency–266MHz
133.33
MHz
FC
OPB frequency–133MHz
501
MHz
FC
OPB frequency–200MHz
50
MHz
OPB frequency–266MHz
501
MHz
FC
400
800
MHz
66.66
MHz
Notes:
1. If HDLCEX is not used, the maximum OPB frequency is 66.66MHz.
Clocking Waveform
2.0V
1.5V
0.8V
TCH
TCL
TC
42
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Spread Spectrum Clocking
Care must be taken when using a spread spectrum clock generator (SSCG) with the NPe405L. This
controller uses a PLL for clock generation inside the chip. The accuracy with which the PLL follows the SSCG
is referred to as tracking skew. The PLL bandwidth and phase angle determine how much tracking skew
there is between the SSCG and the PLL for a given frequency deviation and modulation frequency. When
using an SSCG with the NPe405L the following conditions must be met:
• The frequency deviation must not violate the minimum clock cycle time. Therefore, when operating the
NPe405L with one or more internal clocks at their maximum supported frequency, the SSCG can only
lower the frequency.
• The maximum frequency deviation cannot exceed −3%, and the modulation frequency cannot exceed
40kHz. In some cases, on-board NPe405L peripherals impose more stringent requirements (see Note 1).
• Use the peripheral bus clock (PerClk) for logic that is synchronous to the peripheral bus since this clock
tracks the modulation.
• Use the SDRAM MemClkOut since it also tracks the modulation.
Please refer to the application note Using a Spread Spectrum Clock Generator with the PowerPC 405GP for
additional details. This application note is available on the IBM Microelectronics web site at
http://www.chips.ibm.com.
Notes:
1. The serial port baud rates are synchronous to the modulated clock. The serial port has a tolerance of
approximately 1.5% on baud rate before framing errors begin to occur. The 1.5% tolerance assumes that
the connected device is running at precise baud rates. If an external serial clock is used the baud rate is
unaffected by the modulation
2. Ethernet operation is unaffected.
3. IIC operation is unaffected.
Caution: It is up to the system designer to ensure that any SSCG used with the NPe405L meets the above
requirements and does not adversely affect other aspects of the system.
43
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Peripheral Interface Clock Timings
Parameter
EMC0MDClk output frequency
Min
Max
Units
–
2.5
MHz
EMC0MDClk period
400
–
ns
EMC0MDClk output high time
160
–
ns
EMC0MDClk output low time
160
–
ns
PHY0TxClk input frequency
2.5
25
MHz
PHY0TxClk period
40
400
ns
PHY0TxClk input high time
35% of nominal period
–
ns
PHY0TxClk input low time
35% of nominal period
–
ns
PHY0RxClk input frequency
2.5
25
MHz
PHY0RxClk period
40
400
ns
PHY0RxClk input high time
35% of nominal period
–
ns
PHY0RxClk input low time
35% of nominal period
–
ns
PerClk output frequency–133MHz
–
33.33
MHz
PerClk period–133MHz
30
–
ns
PerClk output frequency–200MHz
–
50
MHz
PerClk period–200MHz
20
–
ns
PerClk output frequency–266MHz)
–
66.66
MHz
PerClk period–266MHz
15
–
ns
PerClk output high time
45% of nominal period
55% of nominal period
ns
PerClk output low time
45% of nominal period
55% of nominal period
ns
–
1000/(2TOPB + 2ns)
MHz
2TOPB + 2
–
ns
UARTSerClk input high time
TOPB + 1
–
ns
UARTSerClk input low time
UARTSerClk input frequency (Note 1)
UARTSerClk period
TOPB + 1
–
ns
TmrClk input frequency–133MHz
–
33.33
MHz
TmrClk period–133MHz
30
–
ns
TmrClk input frequency–200MHz
–
50
MHz
TmrClk period–200MHz
20
–
ns
TmrClk input frequency–266MHz
–
66.66
MHz
TmrClk period–266MHz
15
–
ns
TmrClk input high time
40% of nominal period
60% of nominal period
ns
TmrClk input low time
40% of nominal period
60% of nominal period
ns
0
8.192
MHz
HDLCEXTxClk, HDLCEXRxClk
Notes:
1. TOPB is the period in ns of the OPB clock. The maximum OPB clock frequency is 33.33 MHz for 133MHz parts, 50 MHz for
200MHz parts, and 66.66MHz for 266MHz parts.
44
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Input Setup and Hold Waveform
SysClk
1.5V
TIS
TIH
MIN
MIN
Inputs
1.5 V
Valid
Output Delay and Float Timing Waveform
SysClk
1.5V
TOH
MIN
TOV
MAX
Outputs
1.5V
Valid
TOF
Outputs
MAX
MIN
1.5V
45
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—All
Input (ns)
Signal
Output (ns)
Setup Time Hold Time Valid Delay
(TIS min)
TIH min)
(TOV max)
Hold Time
(TOH min)
Output Current (mA)
I/O H
I/O L
(maximum) (minimum)
Internal Peripheral Interface
IICSCL
async
async
async
async
17
IICSDA
async
async
async
async
17
11
UART0_CTS
async
async
n/a
n/a
n/a
n/a
UART0_DCD
async
async
n/a
n/a
n/a
n/a
UART0_DSR
async
async
n/a
n/a
n/a
n/a
UART0_DTR
n/a
n/a
async
async
12
8
async
async
n/a
n/a
n/a
n/a
n/a
n/a
async
async
12
8
async
async
n/a
n/a
n/a
n/a
UART0_RI
UART0_RTS
UART0_Rx
UART0_Tx
11
n/a
n/a
async
async
12
8
UART1_CTS
async
async
n/a
n/a
n/a
n/a
[UART1_DCD]
[async]
[async]
n/a
n/a
n/a
n/a
UART1_DSR
async
async
n/a
n/a
n/a
n/a
UART1_DTR
n/a
n/a
async
async
12
8
[UART1_RI]
[async]
[async]
n/a
n/a
n/a
n/a
n/a
n/a
async
async
12
8
async
async
n/a
n/a
n/a
n/a
UART1_RTS
UART1_Rx
UART1_Tx
n/a
n/a
async
async
12
8
async
async
n/a
n/a
n/a
n/a
async
async
n/a
n/a
n/a
n/a
TCK
async
async
n/a
n/a
n/a
n/a
TDI
async
async
n/a
n/a
n/a
n/a
UARTSerClk
Interrupts Interface
[IRQ0:6]
JTAG Interface
TDO
n/a
n/a
async
async
12
8
TMS
async
async
n/a
n/a
n/a
n/a
TRST
async
async
n/a
n/a
n/a
n/a
GPIO30
async
async
async
async
12
8
Halt
async
async
n/a
n/a
n/a
n/a
SysClk
n/a
n/a
n/a
n/a
n/a
n/a
SysErr
n/a
n/a
5.5
1.7
12
8
SysReset
n/a
n/a
n/a
n/a
12
8
System Interface
TestEn
dc
dc
n/a
n/a
n/a
n/a
TmrClk
n/a
n/a
async
async
n/a
n/a
46
Clock
Notes
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—133 and 200MHz
(Part 1 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the
command is used by SDRAM. Output times in table are in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hold times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and
reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns)
Signal
Output (ns)
Setup Time Hold Time Valid Delay
(TIS min)
TIH min)
(TOV max)
Hold Time
(TOH min)
Output Current (mA)
I/O H
I/O L
(maximum) (minimum)
Clock
Notes
Ethernet Interface
EMC0MDClk
n/a
n/a
7.4
1.5
12
8
EMC0MDIO
n/a
n/a
8.8
1.2
12
8
EMC0MDClk
1
3.0
[2.3]
[1.7]
12
8
PHYTX
1
12
8
PHYTX
1
PHYTX
1
EMC0TxD0:3
[EMC0Tx0:1D0:1]
[EMC0Tx0:1D]
n/a
n/a
10.5
[7.3]
[5.0]
EMC0TxEn
[EMC0Tx0En]
[EMC0Sync]
n/a
n/a
11.8
[7.2]
[5.6]
2.9
[2.3]
[1.7]
EMC0TxErr[EMC0Tx1En]
1, async
n/a
n/a
11.8[7.4]
2.9[2.4]
12
8
PHY0Col[PHY0Rx1Er]
async[0.2]
async[1.7]
n/a
n/a
n/a
n/a
1
PHY0CrS[PHY0CrS0DV]
async[0.1]
async[1.9]
n/a
n/a
n/a
n/a
1
1, async
PHY0RxClk
n/a
n/a
n/a
n/a
n/a
n/a
PHY0RxD0:3
[PHY0Rx0:1D0:1]
[PHY0Rx0:1D]
1.5
[0.8]
[0.9]
1.7
[1.7]
[0.3]
n/a
n/a
n/a
n/a
PHYRX
1
PHY0RxDV[PHY0CRS1DV]
1.3[0.7]
1.7[1.7]
n/a
n/a
n/a
n/a
PHYRX
1
PHY0RxErr[PHY0Rx0Er]
1.3[0.7]
1.8[1.9]
n/a
n/a
n/a
n/a
PHYRX
1
PHY0TxClk[PHY0RefClk]
n/a
n/a
n/a
n/a
n/a
n/a
1, async
HDLCEX Interface
HDLCEXRxClk
n/a
n/a
n/a
n/a
n/a
n/a
HDLCEXRxDataA:B
23.8
2.1
n/a
n/a
n/a
n/a
HDLCEXRxFS
24.2
1.1
n/a
n/a
n/a
n/a
HDLCEXTxClk
n/a
n/a
n/a
n/a
n/a
n/a
HDLCEXTxDataA:B
n/a
n/a
10.5
3.3
12
8
HDLCEXTxFS
20.3
1.0
n/a
n/a
n/a
n/a
[HDLCEXTxEnA]
n/a
n/a
11.3
3.5
12
8
[HDLCEXTxEnB]]
n/a
n/a
11.8
3.8
12
8
Trace Interface
[TrcClk]GPIO00
n/a
n/a
11.2
1.2
12
8
[TS1E]GPIO01
n/a
n/a
7.0
1.2
12
8
[TS2E]GPIO02
n/a
n/a
7.0
1.2
12
8
[TS1O]GPIO03
n/a
n/a
6.5
1.0
12
8
[TS2O]GPIO04
n/a
n/a
6.4
1.0
12
8
[TS3:6]GPIO05:08
n/a
n/a
6.4
1.0
12
8
47
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—133 and 200MHz
(Part 2 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the
command is used by SDRAM. Output times in table are in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hold times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and
reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns)
Signal
Output (ns)
Setup Time Hold Time Valid Delay
(TIS min)
TIH min)
(TOV max)
Hold Time
(TOH min)
Output Current (mA)
I/O H
I/O L
(maximum) (minimum)
Clock
Notes
2, 3
SDRAM Interface
BA1:0
n/a
n/a
7.2
1.5
19
12
SysClk
BankSel3:0
n/a
n/a
5.8
1.0
19
12
SysClk
3
CAS
n/a
n/a
7.0
1.4
19
12
SysClk
2, 3
ClkEn0:1
n/a
n/a
4.9
1.0
40
25
SysClk
3
DQM0:3
n/a
n/a
5.9
1.0
19
12
SysClk
3
DQMCB
n/a
n/a
5.9
1.0
19
12
SysClk
3
ECC0:7
2.0
0.3
5.7
1.0
19
12
SysClk
3
MemAddr12:00
n/a
n/a
7.2
1.4
19
12
SysClk
2, 3
3, 4
MemClkOut0:1
n/a
n/a
0.4
-1.2
19
12
SysClk
MemData00:31
2.0
0.3
5.6
1.0
19
12
SysClk
3
RAS
n/a
n/a
7.4
1.6
19
12
SysClk
2, 3
WE
n/a
n/a
7.1
1.4
19
12
SysClk
2, 3
External Peripheral Bus Interface
[DMAReq0:3]
[4.8]
[0.0]
[7.0]
[1.1]
n/a
n/a
PerClk
[DMAAck0:3]
n/a
n/a
[7.5]
[1.1]
12
8
PerClk
PerClk
[EOT0:3/TC0:3]
[4.3]
[-0.1]
[8.5]
[1.2]
12
8
PerAddr04:31
n/a
n/a
8.5
0.9
17
11
PerClk
PerBLast
n/a
n/a
7.4
1.4
12
8
PerClk
PerCS0:3
n/a
n/a
7.2
1.3
12
8
PerClk
PerData00:15
4.8
1.0
9.3
1.0
17
11
PerClk
PerOE
n/a
n/a
7.6
1.4
12
8
PerClk
PerPar0:1
3.1
0.0
8.3
0.9
17
11
PerClk
PerR/W
n/a
n/a
7.5
1.4
12
8
PerClk
PerReady
7.5
-0.5
n/a
n/a
n/a
n/a
PerClk
PerWBE0:1
n/a
n/a
7.5
1.3
12
8
PerClk
PerClk
n/a
n/a
0.5
-0.9
17
11
PLB Clk
PerErr
4.0
-0.6
n/a
n/a
n/a
n/a
PerClk
[PerWE]
n/a
n/a
[8.3]
[1.3]
12
8
48
5
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—266MHz
(Part 1 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the
command is used by SDRAM. Output times in table are in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hold times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and
reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns)
Signal
Setup Time Hold Time
(TIS min)
TIH min)
Output (ns)
Valid Delay
(TOV max)
Hold Time
(TOH min)
Output Current (mA)
I/O H
I/O L
(maximum) (minimum)
Clock
Notes
Ethernet Interface
EMC0MDClk
n/a
n/a
7.4
1.5
12
8
EMC0MDIO
n/a
n/a
6.7
1.2
12
8
EMC0MDClk
1
3
[2.3]
[1.7]
12
8
PHYTX
1
12
8
PHYTX
1
PHYTX
1
EMC0TxD0:3
[EMC0Tx0:1D0:1
[EMC0Tx0:1D]
n/a
n/a
7.7
[5.6]
[4.6]
EMC0TxEn
[EMC0Tx0En]
[EMC0Sync]
n/a
n/a
9.4
[5.5]
[4.2]
2.9
[2.3]
[1.7]
EMC0TxErr[EMC0Tx1En]
1, async
n/a
n/a
9.4[5.7]
2.9[2.4]
12
8
PHY0Col[PHY0Rx1Er]l
async[0.1]
async[1.4]
n/a
n/a
n/a
n/a
1
PHY0CrS[PHY0CrS0DV]
async[0.1]
async[1.5]
n/a
n/a
n/a
n/a
1
1, async
PHY0RxClk
n/a
n/a
n/a
n/a
n/a
n/a
PHY0RxD0:3
[PHY0Rx0:1D0:1]
[PHY0Rx0:1D]
1.5
[0.8]
[0.8]
1.4
[1.3]
[0.2]
n/a
n/a
n/a
n/a
PHYRX
1
PHY0RxDV[PHY0CRS1DV]
1.3[0.7]
1.3[1.3]
n/a
n/a
n/a
n/a
PHYRX
1
PHY0RxErr[PHY0Rx0Er]
1.3[0.7]
1.4[1.5]
n/a
n/a
n/a
n/a
PHYRX
1
PHY0TxClk[PHY0RefClk]
n/a
n/a
n/a
n/a
n/a
n/a
n/a
1, async
HDLCEX Interface
HDLCEXRxClk
n/a
n/a
n/a
n/a
n/a
HDLCEXRxDataA:B
23.9
1.6
n/a
n/a
n/a
n/a
HDLCEXRxFS
24.2
0.8
n/a
n/a
n/a
n/a
HDLCEXTxClk
n/a
n/a
n/a
n/a
n/a
n/a
HDLCEXTxDataA:B
n/a
n/a
7.6
3.3
12
8
HDLCEXTxFS
24.2
0.8
n/a
n/a
n/a
n/a
[HDLCEXTxEnA]
n/a
n/a
[8.5]
[3.5]
12
8
[HDLCEXTxEnB]
n/a
n/a
[8.9]
[3.8]
12
8
49
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
I/O Specifications—266MHz
(Part 2 of 2)
Notes:
1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard.
2. The SDRAM command interface is configurable through SDRAM0_TR[LDF] to provide a 2 to 4 cycle delay before the
command is used by SDRAM. Output times in table are in cycle 1.
3. SDRAM I/O timings are specified relative to a SysClk terminated in a lumped 10pF load.
4. SDRAM interface hold times are guaranteed at the NPe405L package pin. System designers must use the NPe405L
IBIS model (available from www.chips.ibm.com) to ensure their clock distribution topology minimizes loading and
reflections, and that the relative delays on clock wiring do not exceed the delays on other SDRAM signal wiring.
5. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 0.8ns.
Input (ns)
Signal
Output (ns)
Setup Time Hold Time
(TIS min)
TIH min)
Valid Delay
(TOV max)
Output Current (mA)
Hold Time
(TOH min)
I/O H
I/O L
(maximum) (minimum)
Clock
Notes
1, 2
Trace Interface
[TrcClk]
n/a
n/a
8.7
1.2
12
8
[TS1E]
n/a
n/a
5.8
1.2
12
8
[TS2E]
n/a
n/a
5.7
1.2
12
8
[TS1O]
n/a
n/a
5.3
1
12
8
[TS2O]
n/a
n/a
5.3
1
12
8
[TS3:6]
n/a
n/a
5.4
1
12
8
SDRAM Interface
BA1:0
n/a
n/a
5.5
1.5
19
12
SysClk
BankSe3:0
n/a
n/a
4.6
1
19
12
SysClk
2
CAS
n/a
n/a
5.3
1.4
19
12
SysClk
1, 2
ClkEn0:1
n/a
n/a
3.9
1
40
25
SysClk
2
DQM0:3
n/a
n/a
4.7
1
19
12
SysClk
2
DQMCB
n/a
n/a
4.7
1
19
12
SysClk
2
ECC0:7
1.8
0.3
4.5
1
19
12
SysClk
2
MemAddr12:00
n/a
n/a
5.5
1.4
19
12
SysClk
1, 2
2, 3
MemClkOut0:1
n/a
n/a
0.4
-1.2
19
12
SysClk
MemData00:31
1.8
0.3
4.4
1
19
12
SysClk
2
RAS
n/a
n/a
5.7
1.6
19
12
SysClk
1, 2
WE
n/a
n/a
5.4
1.4
19
12
SysClk
1, 2
PerClk
External Peripheral Bus Interface
[DMAReq0:3]
4.1
0
5.5
1.1
n/a
n/a
[DMAAck0:3]
n/a
n/a
5.9
1.1
12
8
PerClk
[EOT0:3/TC0:3]
3.7
-0.1
6.7
1.2
12
8
PerClk
PerAddr04:31
n/a
n/a
6.5
0.9
17
11
PerClk
PerBLast
n/a
n/a
5.6
1.4
12
8
PerClk
PerCS0:3
n/a
n/a
5.5
1.3
12
8
PerClk
PerData00:15
3.9
1
7.1
1
17
11
PerClk
PerOE
n/a
n/a
5.7
1.4
12
8
PerClk
PerPar0:1
2.7
0
6.4
0.9
17
11
PerClk
PerR/W
n/a
n/a
5.7
1.4
12
8
PerClk
PerReady
6.2
-0.5
n/a
n/a
n/a
n/a
PerClk
PerWBE0:1
n/a
n/a
5.7
1.3
12
8
PerClk
PerClk
n/a
n/a
0.5
-0.9
17
11
PLB Clk
PerErr
3.5
-0.6
n/a
n/a
n/a
n/a
PerClk
[PerWE]
n/a
n/a
7
1.3
12
8
50
4
Preliminary
PowerNP NPe405L Embedded Processor Data Sheet
Initialization
The following describes the method by which initial chip settings are established when a system reset occurs.
Strapping
While the SysReset input pin is low (system reset), the state of certain I/O pins is read to enable default initial
conditions prior to NPe405L start-up. The actual capture instant is the nearest SysClk edge before the
deassertion of reset. These pins must be strapped using external pull-up (logical 1) or pull-down (logical 0)
resistors to select the desired default conditions. The recommended pull-up is 3kΩ to +3.3V or 10kΩ to +5V,
the recommended pull-down is 1kΩ to GND.These pins are used for strap functions only during reset. They
are used for other signals during normal operation. The following table lists the strapping pins along with their
functions and strapping options.
Strapping Pin Assignments
Function
Option
EXT_BootW
Width of boot device on EBC data bus
Ball Strapping
Y21
(UART1_Tx)
8 bits
0
16 bits
1
ZMII_Mode
Ethernet ZMII mode
V21
U20
(UART1_RTS) (UART1_DTR)
MII mode
0
0
1
SMII mode
0
RMII 10 Mbps mode
1
0
RMII 100 Mbps mode
1
1
51
Preliminary

PowerNP NPe405L Embedded Processor Data Sheet
(c) Copyright International Business Machines Corporation 1999, 2002
All Rights Reserved
Printed in the United States of America, October 2, 2002
The following are trademarks of International Business Machines Corporation in
the United States, or other countries, or both:
Blue Logic
IBM
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CodePack
IBM Logo
CoreConnect
PowerNP
Other company, product, and service names may be trademarks or service marks
of others.
Preliminary Edition (October 2, 2002)
This document contains information on a new product under development by IBM.
IBM reserves the right to change or discontinue this product without notice.
This document is a preliminary edition of the PowerNP NPe405L data sheet. Make
sure you are using the correct edition for the level of the product.
While the information contained herein is believed to be accurate, such
information is preliminary, and should not be relied upon for accuracy or
completeness, and no representations or warranties of accuracy or completeness
are made.
All information contained in this document is subject to change without notice. The
products described in this document are NOT intended for use in applications
such as implantation, life support, or other hazardous uses where malfunction
could result in death, bodily injury, or catastrophic property damage. The
information contained in this document does not affect or change IBM product
specifications or warranties. Nothing in this document shall operate as an express
or implied license or indemnity under the intellectual property rights of IBM or third
parties. All information contained in this document was obtained in specific
environments, and is presented as an illustration. The results obtained in other
operating environments may vary.
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN
"AS IS" BASIS. In no event will IBM be liable for damages arising directly or
indirectly from any use of the information contained in this document.
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The IBM home page is www. ibm.com.
The IBM Microelectronics Division home is www.chips.ibm.com.
SA14-2558-10
52