AMIS-710600-A8: 600dpi CIS Module Data Sheet 1.0 General Description The AMIS-710600-A8 (PI600MC-A8) is a contact image sensor (CIS) module. It is a short version within a family of contact image sensor modules. It consists of image sensor chips, AMIS-720639 (PI3039), which are also a product of AMIS. This AMIS-720639 sensor chip is a linear array image sensor chip with a 600 elements per inch resolution. Fabricated with AMI Semiconductor’s proprietary CMOS image sensing technology, these sensors are bonded on a printed circuit board (PCB) to produce the AMIS-710600A8 CIS modules. Using the chip-on-board technology, seven sensor chips are bonded to the PCB, forming a linear array module of 57mm, with a total of 1344 pixel elements. This 57mm active read length lends itself to scanning A8 size documents with 23.62 dots per millimeter (dpm) resolution. This short array length module was especially designed for applications in card scanners but it is not limited to this specific application. It can be used in various mark readers and other automation equipment requiring narrow scanning modules. 2.0 Key Features • • • • • • • • • Light source, lens and sensor are integrated into a single module 23.62dpm resolution, 57mm scanning length Up to 390µsec/line scanning speed, with 3.5MHz pixel rate Wide dynamic range Analog output Yellow-Green LED light source Compact size ≅ 12mm x 15mm x 70mm Low power Light weight 3.0 Functional Description As described in the previous section, the AMIS-710600-A8 imaging array consists of seven image sensors. Each solid-state sensor contains an integrated array of photo-detectors with their associated multiplex switches and a digital shift register, to sequentially readout each video pixel from its photo-detector. Seven of these integrated array sensors are bonded on the PCB and sequentially cascaded to form a CIS line array of 1344 pixel elements. Since each sensor has I/O pads for the shift register start pulse ( SP) and the end-of-scan pulse (EOS); each preceding sensor’s EOS in the sequence loads into the following sensor’s SP, providing for a continuously scanning array each time the first sensor’s SP in the sequence is loaded. These sequential video pixels from each sensor are summed on to a common video line, which terminates into a common buffer amplifier. The output of the amplifier produces the output video pixels from the module (see Figure 1). The PCB is enclosed in the module housing along with its associated electro-optical components, to form a self-contained imaging system. Its array sensors are optically aligned and mounted along with a one-to-one graded indexed micro lens array, which focuses the image from the scanned documents onto the sensing plane of its array. Its light source is specially fabricated and aligned with the micro lens and its document to form a completely integral CIS imaging system. The enclosed module has a cover glass with its surface near or on the focal point for the object being scanned, while it serves to protect the imaging sensors, the micro lens assembly and the LED light source from contaminants in the environment, such as dust. The I/O to the module is a 10-pin connector located on one end of the module. Figure 2 shows a cross section of the AMIS-710600-A8. AMI Semiconductor – July. 06, M-20597-001 www.amis.com 1 AMIS-710600-A8: 600dpi CIS Module Data Sheet Figure 1: Block Diagram of the AMIS-710600-A8 Module Figure 2: AMIS-710600-A8 Cross Section Although the connector location is not seen in the cross section sketch (Figure 2), it is shown in the mechanical drawing (Figure 4). Table 1 shows the pin outs and their definitions. AMI Semiconductor – July. 06, M-20597-001 www.amis.com 2 AMIS-710600-A8: 600dpi CIS Module Table 1: Pin Configuration Pin Number 1 2 3 4 5 6 7 8 9 10 Symbol VOUT GRD Vdd (+5V) VN (-5V) GND CP GND SP GLED VLED Data Sheet Names and Functions Analog video output Ground; 0V Positive power supply Negative power supply Ground; 0V Clock pulse Ground; 0V Shift register start pulse Ground for the light source; 0V Supply for the light source 4.0 Operational Environment Conceptually, the overview of the module operation can be understood from the functional description (Section 3.0) and the module pin out description. All that the module requires are the power supplies, VDD, VGLED and VSS, with two control clock pulses, CP and SP. The timing diagram (Figure 3) provides the clock timing and its relationship to the output video pixels. When the power supplies and the clocks are connected, the module will start its line scanning process, hence the module is ready to produce video signal as soon as it is placed on the image document. 4.1 Absolute Maximum Rating Table 2 shows the absolute maximum rating of inputs to the module. Table 2: Absolute Maximum Rating Parameter Power supply inputs Input clocks high Input clocks low Symbols VDD IDD VLED ILED Vih Vil Maximum Rating 10 50 5.5 150 Vdd – 0.5V -0.6 Units V mA V mA V V Maximum Rating 0 to 50 10 to 85 -25 to +75 5 to 95 Units ° C % ° C % 4.2 Operating Environment Table 3 shows the environmental specification for the module. Table 3: Environmental Specifications Parameter Operating temperature Operating humidity Storage temperature Storage humidity AMI Semiconductor – July. 06, M-20597-001 www.amis.com Symbols Top Hop Tstg Hstg 3 AMIS-710600-A8: 600dpi CIS Module Data Sheet 4.3 Electro-Optical Characteristics (25°C) ° Table 4 lists the typical operational parameters at 25 C, which characterizes the module's operations. ° Table 4: Electro-Optical Characteristics at 25 C Parameter Number of photo detectors Pixel-to-pixel spacing Line scanning rate Symbol Tint (2) Clock frequency (3) Bright output voltage (4) Bright output non-uniformity (5) Adjacent pixel non-uniformity (6) Dark non-uniformity (7) Dark output voltage (8) Modulation transfer function (1) f Vpavg Up Uadj Ud Vd MTF Parameter 1344 42.3 680 Units Elements µm µsec 2.0 1.0 <+/-30 <15 <200 <0.1 >30 MHz V % % mV V % Note @ 2.0MHz clock frequency (see Note 1) See Note 7 Notes: (1) Tint: line scanning rate or the integration time. Tint is determined by the interval of two SPs. The minimum tint of 390us is available with a 3.5MHz clock. However, the Vpavg is directly proportional to the integration time. For example, if tint is increased two times, Vpavg increases by two. Alternately, if tint is decreased by two then Vpavg decreases by two. The Vpavg of this module is adjusted to 1.0V with an integration time of 680µsec with a CP = 2.0MHz, hence if the SP is increased or decreased, the output will also increase or decrease. Note that changing the clock frequency will also change the tint if the SP rate is divided down from the CP. (2) f: main clock frequency (3) The video output is 1.0V with an integration time of 680µs. The video output is calculated based on Vpavg = ∑ Vp(n)/1344 (4) Up = [(Vpmax - Vpavg) / Vpavg] x 100% or [(Vpavg - Vpmin) / Vpavg] x 100% Where Vpmax = the maximum video pixel value and Vpmin = the minimum video pixel value in the line scan. (5) Upadj = MAX[ | (Vp(n) - Vp(n+l) | / Vp(n)) x 100% Where Vp(n) is the nthpixel in the scan. Upadj is the non-uniformity percentage pixel to pixel (6) Ud = Vdmax – Vdmin Vdmin is the minimum output on a black document(O.D.=0.8)(9) Vdmax: maximum output voltage of a black document (O.D.= 0.8) (7) Vd is adjustable, it can be set to ground, (0V). The factory adjust is close to 0V. (8) (8) MTF = [(Vmax - Vmin) / (Vmax + Vmin)] x 100 [%] Vmax: maximum output voltage on a 11.8lp/mm(10) bar target (300dpi)(11) Vmin: minimum output voltage on a 11.8lp/mm (300dpi) bar target. (9) O.D. = optical density (10) lp / mm: line pair per mm (11) DPI = dots per inch 4.4 Recommended Operating Conditions (25°C) Table 5 lists the recommended operating conditions of the module. ° Table 5: Recommended Operating Conditions (25 C) Item Symbol Power supply VDD VLED IDD ILED Input voltage at digital high Vih Input voltage at digital low Vil Clock frequency f Clock pulse high duty cycle Clock pulse high duration Integration time Tint Operating temperature Top Notes: (1) (2) Min. 4.5 4.5 20 85 Vdd-1.0 0 Mean 5.0 5 25 115 Vdd-.5 25 (1) 71 (2) 390 50 Max. 5.5 5.5 30 150 Vdd 0.8 3.5 75 25 10000 50 This is with a maximum clock frequency of 3.5MHz and a duty cycle of 25 percent. The integration time is the minimum allowable time at a 3.5MHz clock rate. AMI Semiconductor – July. 06, M-20597-001 www.amis.com 4 Units V V ma ma V V MHz % ns µs ° C AMIS-710600-A8: 600dpi CIS Module Data Sheet 5.0 Timing Characteristics of the Module (25°C) The input control clocks and video pixel output relationships are depicted in Figure 3. As indicated, the internal shift register is loaded on the falling edges of the module's clock, CP and during this time the SP is high or true. To ensure that only one shift register pulse is loaded into the shift register during any one line scan, only one SP is allowed to go high for one CP cycle going low. After loading the shift register, the SP is to remain low throughout the remainder of the line scan; otherwise multiple start pulses will load into the shift register. To prevent this phenomenon, as the timing diagram shows, SP should occur only once in one CP cycle. When only one pulse is loaded in the register, a single pulse shifts down the register, accessing a single photo-site with each shift and sequentially reading it out onto the common video line where the video pixel is amplified and produced at the output I/O. Figure 3: Timing Diagram of SP Relative to First Pixel The call outs for the switching characteristics in Figure 3 are given in Table 6. This table defines the symbols used in the timing diagram and calls out their time durations. Table 6: Timing Definition and Specifications Item Symbol Clock cycle time to Clock pulse width tw Clock duty cycle Prohibit crossing time of SP tprh Data setup time tds Data hold time tdh Signal delay time tdl Signal sample and hold time tsh AMI Semiconductor – July. 06, M-20597-001 www.amis.com Min. 290 71 25 30 30 30 50 120 Typ. Max. 7440 75 5 Units ns ns % ns ns ns ns ns AMIS-710600-A8: 600dpi CIS Module Data Sheet 6.0 AMIS-710600-A8 Module and its Mechanical Dimensions The pictorial sketch depicted in Figure 4 illustrates the approximate dimensions of the AMIS-710600-A8 housing. It is not intended to be a reference for a detailed system design but provides the overall dimensions for estimating possible uses for this module in a given system. A detailed drawing can be made available upon request. Figure 4: AMIS-710600-A8 Module and its Mechanical Dimensions AMI Semiconductor – July. 06, M-20597-001 www.amis.com 6 AMIS-710600-A8: 600dpi CIS Module Data Sheet 7.0 Company or Product Inquiries For more information about AMI Semiconductor, our technology and our product, visit our Web site at: http://www.amis.com North America Tel: +1.208.233.4690 Fax: +1.208.234.6795 Europe Tel: +32 (0) 55.33.22.11 Fax: +32 (0) 55.31.81.12 Production Technical Data - The information contained in this document applies to a product in production. AMI Semiconductor and its subsidiaries (“AMIS”) have made every effort to ensure that the information is accurate and reliable. However, the characteristics and specifications of the product are subject to change without notice and the information is provided “AS IS” without warranty of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify that data being relied on is the most current and complete. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. Products sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no other warranty, express or implied, and disclaims the warranties of noninfringement, merchantability, or fitness for a particular purpose. AMI Semiconductor's products are intended for use in ordinary commercial applications. These products are not designed, authorized, or warranted to be suitable for use in life-support systems or other critical applications where malfunction may cause personal injury. Inclusion of AMIS products in such applications is understood to be fully at the customer’s risk. Applications requiring extended temperature range, operation in unusual environmental conditions, or high reliability, such as military or medical life-support, are specifically not recommended without additional processing by AMIS for such applications. Copyright © 2006 AMI Semiconductor, Inc. AMI Semiconductor – July. 06, M-20597-001 www.amis.com 7