16 Watts, 50 Ω General Specifications Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver Surface Mount Terminations Model RFP-250250-6Z50-2 Surface Mount Terminations Electrical Specifications Resistance Value: Frequency Range: Power: V.S.W.R.: Features • DC - 3.0 GHz • 16 Watts 50 ohms, ±2% DC - 3.0 GHz 16 Watts 1.25:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +125°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. • BeO Ceramic • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Outline Drawing BOTTOM VIEW SIDE VIEW .060 TOP VIEW .250 GND RF PAD RFP Z 50 .250 .070 .030 .070 .120 .037 .175 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Surface Mount Terminations Model RFP-250250-6Z50-2 Typical Performance Suggested Mounting Procedures Power Derating SCREW (2 PLS.) % OF RATED POWER 100 SOLDER PASTE 75 SOLDER FILLED VIA 50 PC BOARD HEATSINK 25 1. Solder part in place using 60/40 type solder with controlled temperature iron (700°F). 0 25 50 75 100 P.C.B. SOLDER INTERFACE TEMPERATURE 125 °C 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws. Available on Tape and Reel for Pick and Place Manufacturing. 2 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369