30 Watts, 50 Ω Chip Terminations Model RFP-100200-4X50-2 Chip Terminations General Specifications Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver Electrical Specifications Resistance Value: Frequency Range: Power: V.S.W.R.: Features • DC - 3.0 GHz • 30 Watts 50 ohms, ±2% DC - 3.0 GHz 30 Watts 1.25:1 Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +150°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. • BeO Ceramic • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Outline Drawing SIDE VIEW TOP VIEW .100 .040 .030 .170 .200 HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Chip Terminations Model RFP-100200-4X50-2 Typical Performance Suggested Mounting Procedures Power Derating .025 MIN. (2 PLACES) % OF RATED POWER 100 75 BOARD LOWER THAN LEAD. 50 BOARD EVEN WITH LEAD. SUGGESTED STRESS RELIEF METHODS BOARD LOWER THAN LEAD. SCALE: 25 BOARD HIGHER THAN LEAD. NOT RECOMMENDED APPLICATION SCALE: 1. Make sure that the devices are mounted on flat surfaces (.001” under the device) to optimize the heat transfer. 0 25 50 75 100 125 150 P.C.B. SOLDER INTERFACE TEMPERATURE — °C 2. Position device on mounting surface and solder in place using an indalloy type or a 60/40 type solder. 3. Solder leads in place using a 60/40 type solder with a controlled temperature iron (700°F). Available on Tape and Reel for Pick and Place Manufacturing. 2 Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369