ANAREN RFP-250375N4Z50-2

25 Watts, 50 Ω
General Specifications
Resistive Element:
Substrate:
Terminals:
Thick film
Aluminum nitride ceramic
Tin/Lead, 90/10 over nickel
Electrical Specifications
Resistance Value:
Frequency Range:
Power:
V.S.W.R.:
Features
• DC – 3.0 GHz
• 25 Watts
Aluminum Nitride SMD Terminations
Model RFP-250375N4Z50-2
Aluminum Nitride Terminations
50 ohms, ±2%
DC - 3.0 GHz
25 Watts
1.25:1
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +125°C (see chart). Designed to meet or exceed
applicable portions of MIL-E-5400. All dimensions are in inches.
Specifications subject to change without notice.
• Aluminum Nitride (AlN) Ceramic
• Surface Mountable
• Non-Nichrome Resistive
Element
• Low VSWR
• 100% Tested
Outline Drawing
.250
RFP
250375
N4ZXXX
.040
DENOTES LOCATION OF
RF PAD ON
BACKSIDE OF CHIP
Note: XXX denotes value.
BACK VIEW
TOP VIEW
SIDE VIEW
.375
.060
.060
.058
.135
.058
HATCHED AREA INDICATES
LOCATION OF PROTECTIVE COATING
.135
VER. 12/5/01
Available on Tape and Reel for Pick and Place Manufacturing.
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
1
Aluminum Nitride SMD Terminations
Model RFP-250375N4Z50-2
Typical Performance
Suggested Mounting Procedures
Power Derating
SCREW
(2 PLS.)
% OF RATED POWER
100
SOLDER
PASTE
75
50
PC BOARD
HEATSINK
SOLDER
FILLED VIA
25
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700°F).
0
25
50
75
100
125
P.C.B. SOLDER INTERFACE TEMPERATURE — °C
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
Available on Tape and Reel for Pick and Place Manufacturing.
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369