AVAGO ADJD-MJ60

ADJD-MJ50 / ADJD-MJ51 and ADJD-MJ60 / ADJD-MJ61
High Performance RGB LED Light Source
Data Sheet
Description
Features
Avago RGB LED Light Source is a high performance device
which can be operated at high driving current. It comes
with a plug-and-play electrical connector.
• High flux output
The built-in heat sink and the mechanical mounting
features simplify the thermal management of a lighting
solution. This enables effective heat transfer and maintain
LED junction below maximum allowed temperature.
The footprint of the top emitting package is 100mm
x 18mm x 3.6mm with aperture of 96mm x 6mm. The
footprint of side emitting package is 100mm x 18mm x
8mm with aperture of 96mm x 4.6mm.
The reflector cavity design maximized the light extraction
as well as maximized the color mixing to produce the
required color. Together with closely pitched LED dice, the
color mixing is best of its class.
• Choice of top emitting or side emitting
• Compact footprint for ease of stacking horizontally and
vertically.
• Integrated heatsink to simplify thermal management
• Red, Green & Blue color premix in the reflector cavity to
produce required color
• Silicone encapsulation for extra long product life
• Plug and play mechanical mounting and electrical
connection (connector interface)
• Fully serviceable due to ease of mounting and
demounting.
Applications
• Decorative lighting
• Architectural lighting
• Specialty lighting
CAUTION: ADJD-MJ50/51 & ADJD-MJ60/61 are Class 1 ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details
Package Dimensions
ADJD-MJ50 and ADJD-MJ51 (Top Emitting)
18.00
7.29
97.00
12.00
LED die position 50
100.00
(4.41)
LED die position 1
3D VIEW
17.15
14.00
19.00
TOP VIEW
34.00
Connector Connector
Pin 1
Pin 8
19.00
14.00
15.00
18.00
3.60
2.00
96.00
Dr & Tap For
M3 Screw (4X)
BOTTOM VIEW
2.00
SIDE VIEW
ADJD-MJ60 and ADJD-MJ61 (Side Emitting)
Connector
Pin 1
Connector
Pin 8
14.00
19.00
34.00
19.00
14.00
Dr & Tap For
M3 Screw (4X)
TOP VIEW
LED die position 50
3D VIEW
LED die position 1
4.67
6.00
8.00
100.00
98.00
46.65
2.00
0.70
2.00
15.00
1.00
FRONT VIEW
2.00
96.00
BOTTOM VIEW
Notes:
1. All Dimensions are in millimeters.
2. Tolerance = ±0.20 mm unless otherwise specified.
18.00
12.00
16.15
2.00
Color Configuration
Electrical Configuration
Pin 1
G1 +
Pin 2
R+
Male Connector
Pin 3
B+
Pin 4
G2 +
Connector and Pin Configuration
G1 Pin 5
RPin 6
BPin 7
G2 Pin 8
Recommended female connector: Molex 51146-0800
*Note: This cable is only applicable for ADJD-MJ51 and ADJD-MJ61
Pin Number
Configuration
1
G1 +
2
R+
3
B+
4
G2 +
5
G1 -
6
R-
7
B-
8
G2 -
Table 1. Absolute Maximum Ratings (Tj = 25°C)
Parameter
Red
Green & Blue
Unit
DC forward current [1] [2] [3]
300
150
mA
Power dissipation
10.5
6.75
W
Maximum junction temperature Tj max
120
°C
Operating board temperature, TB range [4]
- 40 to + 85
°C
Storage temperature range
- 40 to + 85
°C
Note:
1. Per individual string.
2. Derate linearly as shown in Figure 6.
3. Operation at current below 20 mA is not recommended.
4. Board temperature, TB = temperature of the metal core PCB at the bottom of the LED.
Table 2. Electrical Characteristics (Tj = 25°C)
Forward Voltage, VF (V) [1] [2]
Min.
Typ.
Max.
Testing Current,
IF (mA) [1]
Dynamic Resistance,
RD (W) [3] [4]
AlInGaP Red
25
29
35
300
26
InGaN Green G1
30
35
45
150
31
InGaN Green G2
30
35
45
150
31
InGaN Blue
30
35
45
150
31
Color
Note:
1. Per individual string.
2. VF tolerance is ±1.0V.
3. Measured at Tj = 25ºC, applicable from IF = 50mA onwards.
4. Dynamic resistance is the inverse slope of the forward current vs. forward voltage characteristic as in Figure 3.
Table 3. Luminous Flux
Luminous Flux fv (lm) [1] [2]
@ Tj = 25°C
Min.
Typ.
White fv at 9000K
color temperature,
TB = 70°C [3] [4] [5] Typ.
AlInGaP Red
300
130
200
310
InGaN Green G1
150
75
125
InGaN Green G2
150
75
125
InGaN Blue
150
12
30
Color
Testing Current,
IF (mA)
Note:
1. fV is the total luminous flux output as measured with an integrating sphere per individual string.
2. fV tolerance ± 15%.
3. White point at 9000K color temperature according to CIE 1931: (0.285, 0.300).
4. When the LEDs are tuned to 9000K color temperature at TB = 70°C, not all LED strings will be driven at its maximum forward current.
5. Board temperature, TB = temperature of the metal core PCB at the bottom of the LED.
Table 4. Optical Characteristics (Tj = 25°C)
Chromaticity
Coordinates [1]
Typ.
Dominant Wavelength, ld (nm) [1]
Peak
Wavelength, lp
(nm)
Spectral Width
at Half Max,
Dl1/2 (nm) [2]
x
y
Min.
Typ.
Max.
Typ.
Typ.
Color
Testing
Current,
IF (mA)
AlInGaP Red
300
0.684
0.315
615
617
625
626
20
InGaN Green G1
150
0.191
0.715
520
530
535
523
35
InGaN Green G2
150
0.191
0.715
520
530
535
523
35
InGaN Blue
150
0.153
0.033
450
457
460
451
24
Notes:
1. The chromaticity coordinates and dominant wavelength are derived from the CIE Chromaticity Diagram and represent the perceived color of the
device.
2. The total spectral width at 1/2 of the peak intensity.
Table 5. Thermal Characteristics
Temperature Coefficients
Color
of Dominant Wavelength
Dldom/DTj (nm/°C)
Typ.
of Forward Voltage
DVF/DTj (mV/°C)
Typ.
AlInGaP Red
0.08
-24
InGaN Green G1
0.01
-33
InGaN GreenG2
0.01
-33
InGaN Blue
0.03
-29
Table 6. Thermal Resistance (From Junction to Board)
Part Number
Thermal Resistance,
Junction to Board,
RqJ-B [1] (°C/W) Typ.
ADJD-MJ50/51 and ADJD-MJ60/61
2.0
Notes:
1. Thermal resistance is defined as the increase of junction temperature
with reference to TB per 1W of total electrical power that is applied to
the entire unit.
2. TB = temperature of the metal core PCB at the bottom of the LED.
Intensity Bins
ADJD-MJ50 / 51
ADJD-MJ60 / 61
Luminous Flux fv (lm) [1]
Bin ID
Min.
Max.
A
400
B
520
Luminous Flux fv (lm) [1]
Bin ID
Min.
Max.
520
Z
310
400
670
A
400
520
Notes:
1. The luminous flux used for intensity binning is by lighting up all R, G1, G2 & B channels together at maximum rated current.
2. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative
for information on current available bins.
Figure 1. Color bins1
Note:
1. The chromaticity coordinate used for binning the product is obtained
when all R, G1, G2 & B channels are lighted up together at maximum
rated current.
2. Bin categories are established for classification of products. Products
may not be available in all categories. Please contact your Avago
representative for information on current available bins.
Figure 2. Relative intensity vs. wavelength
Figure 3. Forward current vs. forward voltage
Figure 4. Relative luminous flux vs. forward current @ Tj=25°C
Figure 5. Relative light output vs junction temperature
Figure 6. Maximum forward current vs board temperature TB
Note:
Board temperature, TB = temperature of the metal core PCB at the
bottom of the LED.
Packing Information
ADJD-MJ50/51 and ADJD-MJ60/61 are supplied in plastic
tray made of ESD safe material. Each tray contains 25
units.
Handling Cautions
1. The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone
is a soft material, please do not press on the silicone
or poke a sharp object onto the silicone. These might
damage the product and cause premature failure.
During assembly or handling, the unit should be held
on the metal reflector or metal body.
2. When attaching the product to the heat sink, a thermally
conductive compound is necessary as the interface
between the metal core PCB of the product and the
heat sink to ensure sufficient heat dissipation.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0448EN
AV02-0280EN - May 16, 2007