HSMx - C660 Right Angle Surface Mount Chip LEDs Data Sheet Description Package Dimensions The HSMx-C660 series of chip-type LEDs are designed to illuminate at a right angle to the direction of mounting. When mounted on a PC board, these devices will emit light in a direction parallel to the board. CATHODE ANODE 3.0 1.0 The small 3.0 x 2.0 mm footprint of the HSMx-C660 is designed for applications where space is limited. These devices are available in four colors and use untinted, non-diffused optics. 0.3 The HSMx-C660 series of parts are compatible with IR reflow soldering process only. 2.0 2.0 Features • Right Angle Mounting • Compatible with IR Reflow Soldering Process • Available in a Wide Variety of Colors • Available in 8 mm Tape on 178 mm (7") Diameter Reels • LCD Backlighting • Keypad Side/Backlighting • Light Piping • Right Angle Indicator 1.0 0.25 0.25 0.88 CATHODE Applications Footprint (mm) 3.0 x 2.0 x 1.0 0.3 Parts per Reel 3000 ANODE POLARITYMARK R0.45 TOREINFORCESOLDERING� (NON-PINCONNECTION) DH AS AlGaAs HSMH-C660 High Efficiency Red HSMS-C660 HSMX-S660PkgDimensionC660 Yellow HSMY-C660 Green HSMG-C660 Absolute Maximum Ratings at TA = 25°C Parameter DC Forward Current[1] HSMx-C660 25 Units mA Power Dissipation 65 mW Reverse Voltage (IR = 100 µA) 5 V Operating Temperature Range –30 to +85 °C Storage Temperature Range[2] –40 to +100 °C Notes: 1. Derate linearly as shown on Figure 4. Optical Characteristics at TA = 25°C Part No. Color Luminous Intensity Iv (mcd) @ IF = 20 mA Min. Typ. Peak Wavelength λpeak (nm) Typ. Color Dominant Wavelength λd[1] (nm) Typ. Viewing Angle 2θ1/2 (degrees)[2] Typ. Luminous Efficacy ηv (lm/W) HSMH-C660 DH AlGaAs Red 6.3 650 639 155 80 HSMS-C660 High Efficiency 1.6 5.0 639 626 Red 155 145 HSMY-C660 Yellow 1.6 5.0 589 586 155 500 HSMG-C660 Green 4.0 9.0 570 572 155 595 16.0 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics at TA = 25°C Part No. Color Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF) VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN (°C/W) HSMH-C660 DH AlGaAs Red 1.8 2.2 5 4.5 300 HSMS-C660 High Efficiency Red 1.9 2.6 5 4.0 300 HSMY-C660 Yellow 2.1 2.6 5 3.0 300 HSMG-C660 Green 2.2 2.6 5 8.0 300 Light Intensity (Iv) Bin Limits [1] Color Bin Limits (Green) Bin ID Dominant Wavelength (nm) Minimum Maximum A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance : ± 1nm Color Bin Limits (Yellow) Bin ID Dominant Wavelength (nm) Bin ID Intensity (mcd) Minimum Maximum A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 Minimum Maximum K 7.20 11.20 A 582.0 584.5 L 11.20 18.00 B 584.5 587.0 M 18.00 28.50 C 587.0 589.5 N 28.50 45.00 D 589.5 592.0 P 45.00 71.50 E 592.0 594.5 Q 71.50 112.50 F 594.5 597.0 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 Tolerance : ± 1nm Color Bin Limits (AlGaAs Red) Bin ID - Dominant Wavelength (nm) Minimum Maximum 630.0 650.0 Tolerance : ± 1nm Color Bin Limits (High Efficiency Red) Bin ID Tolerance : ± 1nm Dominant Wavelength (nm) Minimum Maximum 615.0 630.0 Tolerance : ±15% Notes: 1. Bin categories are established for classifi-cation of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. RELATIVEINTENSITY 1.0 AlGaAsRED GREEN HIGHEFFICIENCYRED 0.5 YELLOW 0 500 550 600 650 700 750 WAVELENGTH–nm Figure 1. Relative Intensity vs. Wavelength. 1.6 AlGaAs� RED 20 15 HER GREEN 10 5 0 1.0 1.5 2.0 2.5 3.0 30 1.4 IF–FORWARDCURRENT–mA YELLOW 25 RELATIVELUMINOUSINTENSITY� (NORMALIZEDAT20mA) IE–FORWARDCURRENT–mA 30 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 Figure 2. Forward Current vs. Forward Voltage. Figure 3. Relative Luminous Intensity vs. DC Forward Current. HSMX-R661fig3 10 0 1.0 30 50 0.8 NORMALIZEDINTENSITY 40 0.6 60 70 80 90 0.4 0.2 10 20 30 40 50 60 70 80 90 100 ANGULARDISPLACEMENT–DEGREES Figure 5. HSMx-C660 Intensity vs. Angle, Vertical Axis. HSMX-S660fig5 25 IDC–DCFORWARDCURRENT–mA VF–FORWARDVOLTAGE–V 20 20 25 20 15 10 5 0 0 20 40 60 80 100 TA–AMBIENTTEMPERATURE–C Figure 4. Maximum DC Current vs. Ambient Temperature. HSMX-R§§&fig4 Figure 6. Recommended soldering land pattern. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. Figure 7. Recommended reflow soldering profile. USERFEEDDIRECTION CATHODESIDE PRINTEDLABEL Figure 9. Reeling Orientation for the HSMx-C660. HSMX-R661fig11 Figure 8. Recommended Pb-free reflow soldering profile. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Figure 10. Reel Dimensions. TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM.A ± 0.10 (0.004) DIM. B ± 0.10 (0.004) DIM. C ± 0.10 (0.004) HSMx-C660 3.35 (0.132) 2.30 (0.091) 1.20 (0.047) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. Figure 11. Tape Dimensions. END THERE SHALL BE A MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 150 mm-360 mm (5.9 - 14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 12. Tape Leader and Trailer Dimensions. Reflow Soldering: HSMX-R661 fig 14 For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5989-0165EN AV01-0118EN -April 24, 2006