AGILENT HSMX-C191

Agilent HSMx-C191
Low Profile ChipLED
Data Sheet
Description
This series of ChipLEDs is
designed with the smallest footprint to achieve high density of
components on board. The
HSMx-C191 has the industry
standard 1.6 mm x 0.8 mm footprint. Its low 0.6 mm profile and
wide viewing angle make this
LED exceptional for backlighting
applications. The available colors
in this surface mount series are
HER, orange, yellow, green, and
AS AlGaAs red.
This package is fully binned by
color and intensity, except for
red color. In order to facilitate
pick and place operation, these
ChipLEDs are shipped in tape
and reel, with 4000 units per
reel. These packages are compatible with IR soldering process.
Features
• Small size
1.6 mm x 0.8 mm x 0.6 mm
• Industry standard footprint
• Diffused optics
• Operating temperature range of
–30°C to 85°C
• Available in 5 colors
(HER, orange, yellow, green,
AS AlGaAs red)
• Compatible with IR solder reflow
• Available in 8 mm tape on
7" diameter reel
Applications
• Keypad backlighting
• Push button backlighting
• LCD backlighting
• Symbol indicator
• Front panel indicator
Package Dimensions
CATHODE
MARK
LED DIE
0.8 (0.031)
0.4 (0.016)
1.6
(0.063 )
1.0
(0.039)
POLARITY
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
0.6 (0.023)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C191
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C191 will be the opposite of what is shown on above drawing.
Device Selection Guide
Footprint
(mm)[1,2]
HER
Orange
Yellow
Green
AS AlGaAs
Red
Package
Description
1.6 x 0.8 x 0.6
HSMS-C191
HSMD-C191
HSMY-C191
HSMG-C191
HSMH-C191
Untinted,
Diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
2
Absolute Maximum Ratings
TA = 25°C
Parameter
HSMS/HSMD/HSMY/HSMG-C191
HSMH-C191
Units
DC Forward Current[1]
20
25
mA
Peak Pulsing Current[2]
100
100
mA
Power Dissipation
52
65
mW
Reverse Voltage (I R = 100 µA)
5
5
V
LED Junction Temperature
95
95
°C
Operating Temperature Range
–30 to +85
–30 to +85
°C
Storage Temperature Range
–40 to +85
–40 to +85
°C
Soldering Temperature
See IR soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4.
2. Pulse condition of 1/10 duty and 0.1 msec width.
Electrical Characteristics
TA = 25°C
Part Number
Color
Forward Voltage
VF (Volts)
@ IF = 20 mA
Typ.
Max.
Reverse Breakdown
VR (Volts)
@ IR = 100 µA
Min.
Capacitance C
(pF), VF = 0,
f = 1 MHz
Typ.
Thermal
Resistance
RθJ-PIN = (°C/W)
Typ.
HSMS-C191
HER
2.1
2.6
5
5
250
HSMD-C191
Orange
2.2
2.6
5
7
250
HSMY-C191
Yellow
2.1
2.6
5
6
250
HSMG-C191
Green
2.2
2.6
5
9
250
HSMH-C191
AlGaAs
1.8
2.6
5
18
300
Optical Characteristics
TA = 25°C
Part
Number
Color
Luminous
Intensity
Iv (mcd)
@ 20 mA[1]
Min.
Typ.
Peak
Wavelength
λpeak (nm)
Typ.
Color,
Dominant
Wavelength
λd[2] (nm)
Typ.
Viewing
Angle
2 θ1/2
Degrees [3]
Typ.
HSMS-C191
HER
2.50
10.0
630
626
170
HSMD-C191
Orange
2.50
8.0
605
604
170
HSMY-C191
Yellow
2.50
8.0
589
586
170
HSMG-C191
Green
4.00
15.0
570
572
170
HSMH-C191
AlGaAs
6.30
17.0
660
639
170
Notes:
1. The luminous intensity I v is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
3
Color Bin Limits [1]
Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
561.5
564.5
B
564.5
567.5
C
567.5
570.5
D
570.5
573.5
E
573.5
576.5
Yellow/Amber Color Bins[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
582.0
584.5
B
584.5
587.0
C
587.0
589.5
D
589.5
592.0
E
592.0
594.5
F
594.5
597.0
Tolerance: ± 0.5 nm
Tolerance: ± 0.5 nm
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID
Min.
Max.
A
597.0
600.0
B
600.0
603.0
C
603.0
606.0
D
606.0
609.0
E
609.0
612.0
F
612.0
615.0
Tolerance: ± 1 nm
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd)
Bin ID
Min.
Max.
A
0.11
0.18
B
0.18
0.29
C
0.29
0.45
D
0.45
0.72
E
0.72
1.10
F
1.10
1.80
G
1.80
2.80
H
2.80
4.50
J
4.50
7.20
K
7.20
11.20
L
11.20
18.00
M
18.00
28.50
Bin ID
N
P
Q
R
S
T
U
V
W
X
Y
Intensity (mcd)
Min.
Max.
28.50
45.00
45.00
71.50
71.50
112.50
112.50
180.00
180.00
285.00
285.00
450.00
450.00
715.00
715.00
1125.00
1125.00
1800.00
1800.00
2850.00
2850.00
4500.00
Tolerance: ± 15%
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
4
1.0
RELATIVE INTENSITY
GREEN
AlGaAs
YELLOW
0.5
ORANGE
0
500
HER
550
600
650
700
750
WAVELENGTH – nm
1.6
AlGaAs
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
100
HER
AlGaAs
GREEN
10
1
YELLOW
0.1
1.7
1.9
0.8
0.4
GaP
ORANGE
1.5
1.2
0
2.1
2.3
0
10
20
IF – FORWARD CURRENT – mA
VF – FORWARD VOLTAGE – V
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward
current.
1.00
RELATIVE INTENSITY
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C191.
5
30
40
IF MAX. – MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative intensity vs. wavelength.
30
AlGaAs RED
25
20
HER,
ORANGE,
YELLOW,
GREEN
15
10
600°C/W
800°C/W
5
0
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum forward current vs.
ambient temperature.
TEMPERATURE
10 SEC. MAX.
230°C MAX.
0.8 (0.031)
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
4°C/SEC.
MAX.
0.8
(0.031)
OVER 2 MIN.
0.8
(0.031)
0.7
(0.028)
TIME
Figure 6. Recommended reflow soldering profile.
Figure 7. Recommended Soldering Pattern for HSMx-C191.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 8. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
Figure 9. Reel dimensions.
Note: All dimensions in millimeters (inches).
6
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
COVER TAPE
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
HSMx-C191 SERIES
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
1.80 (0.071)
0.95 (0.037)
0.75 (0.030)
Figure 10. Tape dimensions.
END
START
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 11. Tape leader and trailer dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
Storage Condition: 5 to 30˚ C @ 60% RH max.
Baking is required under the condition:
a) the blue silica gel indicator becoming white/transparent color
b) the pack has been opened for more than 1 week
Baking recommended condition: 60 +/– 5˚C for 20 hours.
7
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Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-4831EN
April 16, 2002
5988-6172EN