Agilent HSMx-C265 Surface Mount Chip LEDs Data Sheet Description The HSMx-C265 is a reverse mountable chip-type LED for lighting the non-component side of a PCB board. In this reverse mounting configuration, this LED is designed to emit light through a small cut-out hole in the PC board. The HSMx-C265 is available in four colors. The small size, narrow footprint, and low profile make this series of LEDs excellent for backlighting, status indication, and front panel illumination application. Features • Reverse mountable • Undiffused optics • Small 3.4 x 1.25 mm footprint • Operating temperature range of –30°C to +85°C • Compatible with IR solder reflow • Four colors available: red, orange, yellow, and green • Available in 8 mm tape on 7" (178 mm) diameter reels Applications • Keypad backlighting • Symbol backlighting • LCD backlighting • Status indication • Front panel indicator Device Selection Guide Part Number Color Parts Per Reel HSMS-C265 High Efficiency Red 3000 HSMD-C265 Orange 3000 HSMY-C265 Yellow 3000 HSMG-C265 Green 3000 HSMH-C265 AlGaAs Red 3000 Package Dimensions 3.4 (0.134) LED DIE CATHODE MARK (ETCHED) [ANODE MARK FOR HSMH-C265] 1.25 (0.049) 2 – 0.6 (0.028) (GREEN SOLDER MASK) [3] 1.2 (0.047) UNDIFFUSED EPOXY 1.1 (0.043) POLARITY 1.1 (0.043) PC BOARD 0.3 (0.012) CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 3. POLARITY OF HSMH-C265 WILL BE THE OPPOSITE OF WHAT IS SHOWN ON ABOVE DRAWING. Absolute Maximum Ratings TA = 25°C Parameter HSMD/G/S/Y-C265 HSMH-C265 Units DC Forward Current [1] 25 25 mA Peak Pulsing Current[2] 100 100 mA Power Dissipation 65 65 mW Reverse Voltage (IR = 100 µA) 5 5 V LED Junction Temperature 95 95 °C Operating Temperature Range –30 to +85 –30 to +85 °C Storage Temperature Range –40 to +85 –40 to +85 °C Soldering Temperature Notes: 1. Derate linearly as shown in Figure 4. 2. Pulse condition of 1/10 duty and 0.1 ms width. 2 See IR soldering profile (Figure 6) Electrical Characteristics TA = 25°C Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ.[1] Thermal Resistance RθJ-PIN (°C/W) Typ. HSMS-C265 2.1 2.6 5 8 250 HSMD-C265 2.2 2.6 5 6 250 HSMY-C265 2.1 2.6 5 7 250 HSMG-C265 2.2 2.6 5 6 250 HSMH-C265 1.8 2.6 5 18 300 Optical Characteristics TA = 25°C Part Number Color Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength λpeak (nm) Typ. Dominant Wavelength λd (nm)[2] Typ. Viewing Angle 2θ1/2 Degrees [3] Typ. HSMS-C265 HER 2.5 10.0 630 626 170 HSMD-C265 Orange 2.5 8.0 605 604 170 HSMY-C265 Yellow 2.5 8.0 589 586 170 HSMG-C265 Green 4.0 15.0 570 572 170 HSMH-C265 AlGaAs 6.3 17.0 660 639 170 Notes: 1. The luminous intensity, I v, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3 Color Bin Limits Green Color Bins[1] Bin ID A B C D E Dom. Wavelength (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5 Tolerance: ±0.5 nm Orange Color Bins[1] Dom. Wavelength (nm) Bin ID Min. A 597.0 B 600.0 C 603.0 D 606.0 E 609.0 F 612.0 Yellow/Amber Color Bins[1] Dom. Wavelength (nm) Bin ID Min. A 582.0 B 584.5 C 587.0 D 589.5 E 592.0 F 594.5 Tolerance: ±0.5 nm Max. 600.0 603.0 606.0 609.0 612.0 615.0 Tolerance: ±1 nm Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 Bin ID N P Q R S T U V W X Y Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Tolerance: ±15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 4 Max. 584.5 587.0 589.5 592.0 594.5 597.0 1.0 RELATIVE INTENSITY GREEN YELLOW 0.5 ORANGE 0 500 HER 550 600 650 700 750 WAVELENGTH – nm 1.6 HER LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 GREEN 10 1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 1.2 0.8 0.4 0 2.3 0 10 20 IF – FORWARD CURRENT – mA VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle. Note: 1. All dimensions in millimeters (inches). 5 30 40 IF MAX. – MAXIMUM FORWARD CURRENT – mA Figure 1. Relative intensity vs. wavelength. 35 30 25 20 RθJ-A = 600°C/W 15 RθJ-A = 800°C/W 10 5 0 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum forward current vs. ambient temperature. 2.2 (0.087) DIA. PCB HOLE TEMPERATURE 10 SEC. MAX. 230°C MAX. 4°C/SEC. MAX. 140-160°C 1.25 (0.049) 3°C/SEC. MAX. 4°C/SEC. MAX. 1.4 (0.055) OVER 2 MIN. TIME Figure 6. Recommended reflow soldering profile. 2.3 (0.091) 1.4 (0.055) Figure 7. Recommended soldering pad pattern. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 9. Reel dimensions. Note: 1. All dimensions in millimeters (inches). 6 6 PS 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) Figure 10. Tape dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape leader and trailer dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm (0.004 in.) unless otherwise specified. 7 MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30°C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 ± 5°C for 20 hours. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes 5988-4568EN April 18, 2002 5988-6270EN