H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690 Series Features Description • Improved Reliability Through Elimination of Internal Wire Bond • -40 to 85°C Operating Temperature Range • Small Size • Industry Standard Footprint • Diffused Optics • Compatible with IR Solder Process • Four Colors Available • Available in 8 mm Tape on 7" (178 mm) Diameter Reels The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved. Applications • Keypad Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel Indicator The HSMX-H670 and HSMX-H690 are available in four colors. The HSMX-H670 adheres to the industry standard 2.0 x 1.25 mm footprint and is intended for designs where space is limited. The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. The HSMX-H690 adheres to the 1.6 x 0.8 mm industry standard footprint. The low 0.6 mm profile make this excellent for designs where space is limited. Both packages are compatible with IR and convective reflow soldering processes. Device Selection Guide Footprint (mm)[1][2] High Efficiency Red Orange Yellow Green 1.6 x 0.8 x 0.6 HSMS-H690 HSMD-H690 HSMY-H690 HSMG-H690 2.0 x 1.25 x 1.1 HSMS-H670 HSMD-H670 HSMY-H670 HSMG-H670 Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. Package Dimensions HSMX-H670 Series HSMX-H690 Series CATHODE MARK POLARITY , POLARITY 2.00 (0.079) 1.27 (0.050) 1.25 (0.049) 0.50 (0.020) 0.40 (0.016) 0.60 1.00 1.10 (0.043) 0.40 (0.016) 0.30 TOPSIDE CATHODE MARK 0.80 1.60 0.48 (0.019) BOTTOMSIDE CATHODE MARK NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE, UNLESS OTHERWISE SPECIFIED, ± 0.1 mm (± 0.004 INCH). 3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05 MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS. Absolute Maximum Ratings at TA = 25°C Parameter HSMX-H670 HSMX-H690 Units DC Forward Current[1] 20 20 mA Power Dissipation 50 50 mW Reverse Voltage (IR = 100 µA) 5 5 V Operating Temperature Range -40 to +85 -40 to +85 °C Storage Temperature Range[2] -40 to +85 -40 to +85 °C Notes: 1. Derate linearly as shown in Figure 4 for temperatures above 25°C. 2. Maximum temperature for tape and reel packaging is 60°C. Optical Characteristics at TA = 25°C Part Number HSMS-H6X0 Color Luminous Intensity Peak IV (mcd) Wavelength @ IF = 20 mA[1] λpeak (nm) Min. Typ. Typ. Color, Viewing Dominant Angle Wavelength 2θ1/2 λd[2] (nm) Degrees[3] Typ. Typ. Luminous Efficacy ηv (lm/W) High Efficiency Red 1.6 5.0 639 626 165 145 HSMD-H6X0 Orange 1.6 4.0 606 604 165 380 HSMY-H6X0 Yellow 1.6 5.0 584 586 165 500 HSMG-H6X0 Green 4.0 9.0 566 571 165 595 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA = 25°C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN (°C/W) Part Number Color HSMS-H670 HSMS-H690 High Efficiency Red 2.0 2.6 5 6 250 HSMD-H670 HSMD-H690 Orange 2.0 2.6 5 5 250 HSMY-H670 HSMY-H690 Yellow 2.1 2.6 5 5 250 HSMG-H670 HSMG-H690 Green 2.3 2.6 5 5 250 Green Color Bins[1] Bin ID A B C D E F G H J Minimum (nm) 561.0 564.0 567.0 570.0 573.0 561.0 564.0 567.0 570.0 Maximum (nm) 565.0 568.0 571.0 574.0 577.0 568.0 571.0 574.0 577.0 Minimum (nm) 581.5 584.0 586.5 589.0 581.5 584.0 586.5 591.5 594.0 Maximum (nm) 585.0 587.5 590.0 592.5 587.5 590.0 592.5 595.0 597.5 Notes Bin A & Bin B Bin B & Bin C Bin C & Bin D Bin D & Bin E Yellow Color Bins[1] Bin ID A B C D E F G H J Notes Bin A & Bin B Bin B & Bin C Bin C & Bin D Luminous Intensity Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Minimum (med) 0.10 0.16 0.25 0.40 0.63 1.00 1.60 2.50 4.00 6.30 10.00 16.00 25.00 40.00 63.00 100.00 160.00 250.00 400.00 630.00 1000.00 1600.00 2500.00 Maximum (med) 0.20 0.32 0.50 0.80 1.25 2.00 3.20 5.00 8.00 12.50 20.00 32.00 50.00 80.00 125.00 200.00 320.00 500.00 800.00 1250.00 2000.00 3200.00 5000.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Hewlett-Packard representative for information on currently available bins. RELATIVE INTENSITY 1.0 ORANGE GREEN HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 700 750 WAVELENGTH – nm Figure 1. Relative Intensity vs. Wavelength. 1.2 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) YELLOW ORANGE 15 HER GREEN 10 5 0 1.0 1.5 2.0 2.5 1.0 0.8 0.6 0.4 0.2 0 3.0 VF – FORWARD VOLTAGE – V 0 5 Figure 2. Forward Current vs. Forward Voltage. 15 20 Figure 3. Relative Luminous Intensity vs. DC Forward Current. 40 IF – FORWARD CURRENT – mA 10 IDC – DC FORWARD CURRENT – mA 20° 10° 0° 1.0 30° 35 40° 30 NORMALIZED INTENSITY IF – FORWARD CURRENT – mA 20 .8 50° 25 .6 60° 20 15 70° 10 80° .4 .2 5 0 0 20 40 60 80 100 90° 10° 20° 30° 40° 50° 60° 70° 80° 90°100° ANGLE TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum DC Current vs. Ambient Temperature. Figure 5. Intensity vs. Angle. 0.8 (0.031) 0.80 0.80 0.85 10 SEC. MAX. HSMX-H690 SERIES TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 1.1 (0.043) 4°C/SEC. MAX. 1.25 (0.049) OVER 2 MIN. 1.25 (0.049) 1.1 (0.043) TIME HSMX-H670 SERIES Figure 6. Recommended Reflow Soldering Profile. Figure 7. Recommended Solder Patterns. USER FEED DIRECTION CATHODE SIDE , ,, , 180 Ø (7.08) 21.0 (0.83) PRINTED LABEL 2.0 (0.08) Figure 8. Reeling Orientation. 60.0 Ø (2.36) Ø 13.0 (0.51) LABEL 60° 60° Figure 9. Reel Dimensions. NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES). 1.5 TYP. (0.06) 13.0 (0.51) 10.0 (0.39) ,, ,,,,, , ,,,,, , 4.00 ± 0.10 (0.157 ± 0.004) 1.50 + 0.10 0 Ø (0.059 + 0.004) 0 1.30 ± 0.10 (0.051 ± 0.004) CATHODE 0.20 ± 0.05 (0.008 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) USER FEED DIRECTION 4.00 ± 0.10 (0.157 ± 0.004) CARRIER TAPE COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMX-H670 SERIES HSMX-H690 SERIES DIM. A DIM. B ± 0.10 (0.004) ± 0.10 (0.004) 2.40 (0.094) 1.98 (0.078) 1.60 (0.064) 1.02 (0.040) Figure 10. Tape Dimensions. END MOUNTED WITH THERE SHALL BE A COMPONENTS MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START THERE SHALL BE A MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. Convective IR Reflow Soldering For information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMI LED Indicator Components. 150 mm-360 mm (5.9 - 14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. H For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: (65) 290-6305 Japan: (81 3) 3331-6111 Europe: Call your local HP sales office listed in your telephone directory. Ask for a Components representative. Data subject to change. Copyright © 1996 Hewlett-Packard Co. Printed in U.S.A. 5965-1521E (5/96)