DAC7800 DAC7801 DAC7802 SBAS005B – JANUARY 1990 – REVISED FEBRUARY 2004 Dual Monolithic CMOS 12-Bit Multiplying DIGITAL-TO-ANALOG CONVERTERS FEATURES APPLICATIONS ● TWO DACs IN A 0.3" WIDE PACKAGE ● SINGLE +5V SUPPLY ● HIGH-SPEED DIGITAL INTERFACE: Serial—DAC7800 8 + 4-Bit Parallel—DAC7801 12-Bit Parallel—DAC7802 ● MONOTONIC OVER TEMPERATURE ● LOW CROSSTALK: –94dB min ● FULLY SPECIFIED OVER –40OC TO +85OC ● ● ● ● ● PROCESS CONTROL OUTPUTS ATE PIN ELECTRONICS LEVEL SETTING PROGRAMMABLE FILTERS PROGRAMMABLE GAIN CIRCUITS AUTO-CALIBRATION CIRCUITS DESCRIPTION wide plastic DIP. The DAC7802 has a single-buffered 12-bit data word interface. Parallel data is loaded (edge triggered) into the single DAC register for each DAC. The DAC7802 is packaged in a 24-pin 0.3" wide plastic DIP. 12 VREF A RFB A CSB WR 12 12-Bit MDAC DAC A VREF B AGND A RFB B IOUT B A1 UPD A0 WR CS CLR DAC7801 8-Bit Interface 8 Bits + 4 Bits 8 12 12-Bit MDAC DAC B AGND B CS CLR UPD B DAC7800 Serial Interface CLK Serial CSA IOUT A The DAC7800 features a serial interface capable of clockingin data at a rate of at least 10MHz. Serial data is clocked (edge triggered) MSB first into a 24-bit shift register and then latched into each DAC separately or simultaneously as required by the application. An asynchronous CLEAR control is provided for power-on reset or system calibration functions. It is packaged in a 16-pin 0.3" wide plastic DIP. The DAC7801 has a 2-byte (8 + 4) double-buffered interface. Data is first loaded (level transferred) into the input registers in two steps for each DAC. Then both DACs are updated simultaneously. The DAC7801 features an asynchronous CLEAR control. The DAC7801 is packaged in a 24-pin 0.3" DAC7802 12-Bit Interface UPD A The DAC7800, DAC7801 and DAC7802 are members of a new family of monolithic dual 12-bit CMOS multiplying Digital-to-Analog Converters (DACs). The digital interface speed and the AC multiplying performance are achieved by using an advanced CMOS process optimized for data conversion circuits. High stability on-chip resistors provide true 12-bit integral and differential linearity over the wide industrial temperature range of –40°C to +85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 1990-2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ELECTROSTATIC DISCHARGE SENSITIVITY ABSOLUTE MAXIMUM RATINGS(1) At TA = +25°C, unless otherwise noted. VDD to AGND ............................................................................... 0V, +7V VDD to DGND ............................................................................... 0V, +7V AGND to DGND ....................................................................... –0.3, VDD Digital Input to DGND ..................................................... –0.3, VDD + 0.3 VREF A, VREF B to AGND .................................................................. ±16V VREF A, VREF B to DGND .................................................................. ±16V IOUT A, IOUT B to AGND ............................................................. –0.3, VDD Storage Temperature Range ....................................... –55°C to +125°C Operating Temperature Range ...................................... –40°C to +85°C Lead Temperature (soldering, 10s) .............................................. +300°C Junction Temperature ................................................................... +175°C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliaiblity. PACKAGE/ORDERING INFORMATION RELATIVE ACCURACY GAIN ERROR PACKAGE-LEAD PACKAGE DESIGNATOR(1) DAC7800KP DAC7800LP DAC7800KU DAC7800LU ±1LSB ±1/2 LSB — — ±3LSB ±1LSB — — DIP-16 DIP-16 SO-16 SO-16 N N DW DW DAC7801KP DAC7801LP DAC7801KU DAC7801LU ±1LSB ±1/2 LSB — — ±3LSB ±1LSB — — DIP-24 DIP-24 SO-24 SO-24 NTG NTG DW DW DAC7802KP DAC7802LP DAC7802KU DAC7802LU ±1LSB ±1/2 LSB — — ±3LSB ±1LSB — — DIP-24 DIP-24 SO-24 SO-24 NTG NTG DW DW PRODUCT SPECIFIED TEMPERATURE RANGE –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY DAC7800KP DAC7800KP DAC7800LP DAC7800LP DAC7800KU DAC7800KU/1K Tape DAC7800LU DAC7800LU/1K Tape Rails, 25 Rails, 25 and Reel, 1000 and Reel, 1000 DAC7801KP DAC7801KP DAC7801LP DAC7801LP DAC7801KU DAC7801KU/1K Tape DAC7801LU DAC7801LU/1K Tape Rails, 15 Rails, 15 and Reel, 1000 and Reel, 1000 DAC7802KP DAC7802KP DAC7802LP DAC7802LP DAC7802KU DAC7802KU/1K Tape DAC7802LU DAC7802LU/1K Tape Rails, 15 Rails, 15 and Reel, 1000 and Reel, 1000 NOTE: (1 ) For the most current specifications and package information, see the package option addendum located at the end of this data sheet. ELECTRICAL CHARACTERISTICS At VDD = +5VDC, VREF A = VREF B = +10V, TA = –40°C to +85°C, unless otherwise noted. DAC7800, 7801, 7802K PARAMETER ACCURACY Resolution Relative Accuracy Differential Nonlinearity Gain Error Gain Temperature Coefficient(1) Output Leakage Current CONDITIONS MAX DAC7800, 7801, 7802L MIN TYP MAX UNITS ±1/2 ✻ ±1 Bits LSB LSB LSB ✻ ✻ ✻ ✻ ✻ ✻ ppm/°C nA nA ✻ ✻ ✻ 2 kΩ % ✻ ✻ ✻ ✻ ✻ V V µA µA pF ✻ ✻ ✻ V mA %/% ✻ ±1 ±1 ±3 Measured Using RFB A and RFB B. All Registers Loaded with All 1s. TA = +25°C TA = –40°C to +85°C 6 2 0.005 3 5 10 150 10 0.5 14 3 0.8 0.8 ±1 ±10 10 TA = +25°C TA = –40°C to +85°C 4.5 0.2 VDD from 4.5V to 5.5V ✻ ✻ 2 CIN (Input Capacitance) POWER SUPPLY VDD IDD Power-Supply Rejection TYP 12 REFERENCE INPUT Input Resistance Input Resistance Match DIGITAL INPUTS VIH (Input HIGH Voltage) VIL (Input LOW Voltage) IIN (Input Current) MIN 5.5 2 0.002 ✻ ✻ ✻ Same specification as for DAC7800, 7801, 7802K. 2 DAC7800, 7801, 7802 www.ti.com SBAS005A AC PERFORMANCE OUTPUT OP AMP IS OPA602. At VDD = +5VDC, VREF A = VREF B = +10V, TA = +25°C, unless otherwise noted. These specifications are fully characterized but not subject to test. DAC7800, 7801, 7802K PARAMETER CONDITIONS TYP MAX OUTPUT CURRENT SETTLING TIME To 0.01% of Full-Scale RL = 100Ω, CL = 13pF 0.4 0.8 DIGITAL-TO-ANALOG GLITCH IMPULSE VREF A = VREF B = 0V RL = 100Ω, CL = 13pF 0.9 fVREF = 10kHz –75 –72 ✻ ✻ dB DAC Loaded with All 0s DAC Loaded with All 1s 30 70 50 100 ✻ ✻ ✻ ✻ pF pF AC FEEDTHROUGH OUTPUT CAPACITANCE CHANNEL-TO-CHANNEL ISOLATION VREF A to IOUT B MIN DAC7800, 7801, 7802L fVREF A = 10kHz VREF B = 0V, Both DACs Loaded with 1s fVREF B = 10kHz VREF A = 0V, Both DACs Loaded with 1s VREF B to IOUT A DIGITAL CROSSTALK MIN TYP MAX UNITS ✻ ✻ µs ✻ nV-s –90 –94 ✻ ✻ dB –90 –101 ✻ ✻ dB ✻ nV-s Full-Scale Transition RL = 100Ω, CL = 13pF 0.9 ✻ Same specification as for DAC7800, 7801, and 7802K. NOTE: (1) Ensured but not tested. DAC7800 BLOCK DIAGRAM PIN CONFIGURATION VDD Top View DIP 12 10 UPD B DAC B Register 15 I OUT B 12 16 AGND B 14 RFB B Bit 11 13 V REF B Bit 12 4 VREF A 3 R FB A 2 I OUT A DAC A Register 1 AGND A 12 6 UPD A 12 Control Logic and Shift Register DAC7800 5 DAC B Bit 0 Bit 23 DAC A 12 8 CLK CS 7 Data In 11 9 CLR DGND AGND A 1 16 AGND B I OUT A 2 15 IOUT B R FB A 3 14 R FB B VREF A 4 13 VREF B CLK 5 12 VDD UPD A 6 11 CLR Data In 7 10 UPD B CS 8 9 DGND DAC7800 LOGIC TRUTH TABLE CLK UPD A UPD B CS CLR X X X X X 0 1 0 X X X 1 0 0 X 1 0 0 0 0 0 X 1 1 1 1 X X X X = Don’t care. FUNCTION All register contents set to 0’s (asynchronous). No data transfer. Input data is clocked into input register (location Bit 23) and previous data shifts. Input register bits 23 (LSB) - 12 (MSB) are loaded into DAC A. Input register bits 11 (LSB) - 0 (MSB) are loaded into DAC B. Input register bits 23 (LSB) - 12 (MSB) are loaded into DAC A, and input register bits 11 (LSB) - 0 (MSB) are loaded into DAC B. means falling edge triggered. DAC7800, 7801, 7802 SBAS005A www.ti.com 3 DAC7800 (Cont.) DATA INPUT FORMAT DAC7800 Digital Interface Block Diagram UPD B UPD A DAC A Register DAC B Register LSB MSB Bit 23 Bit 12 LSB MSB Bit 11 Bit 0 CLK Data In 24-Bit Shift Register DAC7800 Data Input Sequence CLK Data In Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Bit 8 Bit 9 Bit 10 Bit 11 Bit 12 Bit 13 Bit 14 Bit 15 Bit 16 Bit 17 Bit 18 Bit 19 Bit 20 MSB DAC B Bit 21 Bit 22 Bit 23 LSB MSB DAC B DAC A LSB DAC A TIMING CHARACTERISTICS VDD = +5V, VREF A = VREF B = +10V, TA = –40°C to +85°C. t5 PARAMETER t1 — Data Setup Time t2 — Data Hold Time t3 — Chip Select to CLK, Update, Data Setup Time t4 — Chip Select to CLK, Update, Data Hold Time t5 — CLK Pulse Width t6 — Clear Pulse Width t7 — Update Pulse Width t8 — CLK Edge to UPD A or UPD B 4 MINIMUM CLK 0V t1 15ns 15ns 15ns DATA 40ns CS 40ns 40ns 40ns 15ns UPD A UPD B 5V 0V t3 t2 5V t8 t7 t4 5V t6 5V CLR NOTES: (1) All input signal rise and fall times are measured from 10% to 90% of +5V. t R = t F = 5ns. (2) Timing measurement reference level is VIH + V IL . 2 DAC7800, 7801, 7802 www.ti.com SBAS005A DAC7801 BLOCK DIAGRAM PIN CONFIGURATION VDD Top View DIP 20 DAC7801 DAC A LS Input Reg DAC A MS Input Reg AGND A 1 24 AGND B IOUT A 2 23 I OUT B RFB A 3 22 RFB B VREF A 4 21 V REF B 20 V DD 19 UPD 4 8 DAC A Register 2 I OUT A 1 AGND A 3 R FB A CS 5 4 V REF A DB0 6 21 V REF B DB1 7 18 WR 22 R FB B DB2 8 17 CLR 23 I OUT B DB3 9 16 A1 24 AGND B DB4 10 15 A0 DB5 11 14 DB7 DGND 12 13 DB6 12 19 A1 16 A0 15 CS 5 WR 18 CLR 17 DAC A Control Logic UPD DAC B 12 DAC B Register 14 4 8 DAC B MS Input Reg DAC B LS Input Reg DAC7801 12 6 DGND DB7–DB0 LOGIC TRUTH TABLE CLR UPD CS WR A1 A0 1 1 0 1 1 1 1 1 1 1 1 X 1 1 1 1 0 0 1 X X 0 0 0 0 1 0 X 1 X 0 0 0 0 0 0 X X X 0 0 1 1 X X X X X 0 1 0 1 X X FUNCTION No Data Transfer No Data Transfer All Registers Cleared DAC A LS Input Register Loaded with DB7 - DB0 (LSB) DAC A MS Input Register Loaded with DB3 (MSB) - DB0 DAC B LS Input Register Loaded with DB7 - DB0 (LSB) DAC B MS Input Register Loaded with DB3 (MSB) - DB0 DAC A, DAC B Registers Updated Simultaneously from Input Registers DAC A, DAC B Registers are Transparent X = Don’t care. TIMING CHARACTERISTICS VDD = +5V, VREF A = VREF B = +10V, TA = –40°C to +85°C. t1 t2 5V 0V A0–A1 t3 PARAMETER t1 — Address Valid to Write Setup Time t2 — Address Valid to Write Hold Time t3 — Data Setup Time t4 — Data Hold Time t5 — Chip Select or Update to Write Setup Time t6 — Chip Select or Update to Write Hold Time t7 — Write Pulse Width t8 — Clear Pulse Width MINIMUM 10ns 10ns 30ns 10ns 0ns 0ns 40ns 40ns t4 5V 0V DATA t5 t6 5V 0V CS, UPD t7 WR t8 CLR 5V 0V 5V 0V NOTES: (1) All input signal rise and fall times are measured from 10% to 90% of +5V. t = t = 5ns. (2) Timing measurement reference level is VIH + VIL . R F 2 DAC7800, 7801, 7802 SBAS005A www.ti.com 5 DAC7802 BLOCK DIAGRAM PIN CONFIGURATION Top View DIP VDD 21 12 DAC7802 DAC A Register CK 12 DAC A 5 CS A CS B DAC B 20 12 WR 19 CK 2 IOUT A 3 R FB A 4 V REF A 22 V REF B 23 R FB B 24 I OUT B 1 AGND DGND 18 1 24 I OUT B IOUT A 2 23 R FB B R FB A 3 22 V REF B V REF A 4 21 V DD CS A 5 20 CS B (LSB) DB0 6 19 WR DB1 7 18 DB11 (MSB) DB2 8 17 DB10 DB3 9 16 DB9 DB4 10 15 DB8 DB5 11 14 DB7 DGND 12 13 DB6 DAC7802 DAC B Register 12 12 AGND 6 DB11–DB0 TIMING CHARACTERISTICS At VDD = +5V, and TA = –40oC to +85oC. t1 t2 5V 0V DATA PARAMETER t1 t2 t3 t4 t5 - t3 MINIMUM Data Setup Time Data Hold Time Chip Select to Write Setup Time Chip Select to Write Hold Time Write Pulse Width t4 CSA, CSB 20ns 15ns 30ns 0ns 30ns t5 5V 5V WR NOTES: (1) All input signal rise and fall times are measured from 10% to 90% of +5V. tR = tR = 5ns. (2) Timing measurement reference level VIH + VIL is . 2 LOGIC TRUTH TABLE CSA CSB WR X X 1 No Data Transfer 1 1 X No Data Transfer 0 A Rising Edge on CSA or CSB Loads Data to the Respective DAC 0 1 DAC A Register Loaded from Data Bus 1 0 DAC B Register Loaded from Data Bus 0 0 DAC A and DAC B Registers Loaded from Data Bus X = Don’t care. 6 FUNCTION means rising edge triggered. DAC7800, 7801, 7802 www.ti.com SBAS005A TYPICAL CHARACTERISTICS OUTPUT OP AMP IS OPA602. TA = +25°C, VDD = +5V. OUTPUT LEAKAGE CURRENT vs TEMPERATURE THD + NOISE vs FREQUENCY –60 –65 100n –70 THD + Noise (dB) Output Leakage Current (A) 1µ 10n 1n 100p –75 1Vrms –80 3Vrms –85 6Vrms –90 10p –95 1p –100 –75 –50 –25 0 +25 +50 +75 +100 +125 10 100 100k Frequency (Hz) CHANNEL-TO-CHANNEL ISOLATION vs FREQUENCY FEEDTHROUGH vs FREQUENCY –20 0 –30 –10 –40 –20 –50 –30 Feedthrough (dB) Crosstalk (dB) 10k 1k Temperature (°C) –60 –70 –80 –90 –40 –50 –60 –70 –80 –100 –110 –90 –120 –100 1k 10k 100k 1M 10M 1k 10k 1M 100k Frequency (Hz) 10M Frequency (Hz) PSRR vs FREQUENCY FREQUENCY RESPONSE +30 70 CF = 0pF +20 CF = 5pF 60 +10 50 0 40 PSRR (dB) Gain (dB) DAC Loaded w/0s –10 CF = 10pF –20 30 20 –30 10 –40 0 DAC Loaded w/1s –10 –50 1k 10k 100k 1M 10M DAC7800, 7801, 7802 SBAS005A 1k 10k 100k 1M Frequency (Hz) Frequency (Hz) www.ti.com 7 DISCUSSION OF SPECIFICATIONS constant and can be driven by either a voltage or current, AC or DC, positive or negative polarity, and have a voltage range up to ±20V. RELATIVE ACCURACY This term, also known as end point linearity or integral linearity, describes the transfer function of analog output to digital input code. Relative accuracy describes the deviation from a straight line, after zero and full-scale errors have been adjusted to zero. VREF A R 2R R R 2R 2R 2R 2R R RFB A IOUT A DIFFERENTIAL NONLINEARITY Differential nonlinearity is the deviation from an ideal 1LSB change in the output when the input code changes by 1LSB. A differential nonlinearity specification of 1LSB maximum ensures monotonicity. AGND DB11 (MSB) DB10 DB9 DB0 (LSB) FIGURE 1. Simplified Circuit Diagram for DAC A. GAIN ERROR Gain error is the difference between the full-scale DAC output and the ideal value. The ideal full scale output value for the DAC780x is –(4095/4096)VREF . Gain error may be adjusted to zero using external trims, see Figures 5 and 7. OUTPUT LEAKAGE CURRENT The current which appears at IOUT A and IOUT B with the DAC loaded with all zeros. OUTPUT CAPACITANCE The parasitic capacitance measured from IOUT A or IOUT B to AGND. CHANNEL-TO-CHANNEL ISOLATION A CMOS switch transistor, included in series with the ladder terminating resistor and in series with the feedback resistor, RFB A, compensates for the temperature drift of the ON resistance of the ladder switches. Figure 2 shows an equivalent circuit for DAC A. COUT is the output capacitance due to the N-channel switches and varies from about 30pF to 70pF with digital input code. The current source ILKG is the combination of surface and junction leakages to the substrate. ILKG approximately doubles every 10°C. RO is the equivalent output resistance of the DAC and it varies with input code. The AC output error due to capacitive coupling from DAC A to DAC B or DAC B to DAC A. R RFB A VREF A MULTIPLYING FEEDTHROUGH ERROR The AC output error due to capacitive coupling from VREF to IOUT with the DAC loaded with all zeros. R DIN VREF x 4096 R RO ILKG IOUT A COUT AGND A OUTPUT CURRENT SETTLING TIME The time required for the output current to settle to within +0.01% of final value for a full-scale step. INSTALLATION DIGITAL-TO-ANALOG GLITCH ENERGY The integrated area of the glitch pulse measured in nanovoltseconds. The key contributor to DAC glitch is charge injected by digital logic switching transients. DIGITAL CROSSTALK Glitch impulse measured at the output of one DAC but caused by a full-scale transition on the other DAC. The integrated area of the glitch pulse is measured in nanovolt-seconds. CIRCUIT DESCRIPTION Figure 1 shows a simplified schematic of one half of a DAC780x. The current from the VREF A pin is switched between IOUT A and AGND by 12 single-pole double-throw CMOS switches. This maintains a constant current in each leg of the ladder regardless of the input code. The input resistance at VREF is therefore 8 FIGURE 2. Equivalent Circuit for DAC A. ESD PROTECTION All digital inputs of the DAC780x incorporate on-chip ESD protection circuitry. This protection is designed to withstand 2.5kV (using the Human Body Model, 100pF and 1500Ω). However, industry standard ESD protection methods should be used when handling or storing these components. When not in use, devices should be stored in conductive foam or rails. The foam or rails should be discharged to the destination socket potential before devices are removed. POWER-SUPPLY CONNECTIONS The DAC780x are designed to operate on VDD = +5V +10%. For optimum performance and noise rejection, power-supply decoupling capacitors CD should be added as shown in the application circuits. These capacitors (1µF tantalum recommended) should be located close to the DAC. AGND and DAC7800, 7801, 7802 www.ti.com SBAS005A DGND should be connected together at one point only, preferably at the power-supply ground point. Separate returns minimize current flow in low-level signal paths if properly connected. Output op amp analog common (+ input) should be connected as near to the AGND pins of the DAC780x as possible. DATA INPUT ANALOG OUTPUT MSB ↓ ↓ LSB 1111 1111 1111 1000 0000 0000 0000 0000 0001 0000 0000 0000 –VREF (4095/4096) –VREF (2048/4096) = –1/2VREF –VREF (1/4096) 0 Volts TABLE II. Unipolar Output Code. WIRING PRECAUTIONS To minimize AC feedthrough when designing a PC board, care should be taken to minimize capacitive coupling between the VREF lines and the IOUT lines. Similarly, capacitive coupling between DACs may compromise the channel-tochannel isolation. Coupling from any of the digital control or data lines might degrade the glitch and digital crosstalk performance. Solder the DAC780x directly into the PC board without a socket. Sockets add parasitic capacitance (which can degrade AC performance). VDD VREF A +5V CD 1µF + RFB A IOUT A DAC A DAC780X IOUT B DAC B DGND VREF B VDD +5V CD 1µF + – A2 + VOUT B A1, A2 OPA602 or 1/2 OPA2107. DAC7802 has a single analog common, AGND. R1 100Ω RFB A R2 IOUT A DAC A C1 10pF – A1 + VOUT A RFB B R4 DAC B V REF B DGND 47Ω AGND A IOUT B R3 100Ω 47Ω AGND B C2 10pF – A2 + VOUT B A1, A2 OPA602 or 1/2 OPA2107. DAC7802 has a single analog common, AGND. V IN B FIGURE 4. Unipolar Configuration with Gain Trim. The operational amplifiers used in this circuit can be single amplifiers such as the OPA602, a dual amplifier such as the OPA2107, or a quad amplifier like the OPA404. C1 and C2 provide phase compensation to minimize settling time and overshoot when using a high speed operational amplifier. The bipolar offset resistors R5–R7 and R8–R10 should be ratiomatched to 0.01% to ensure the specified gain error performance. DAC7800, 7801, 7802 SBAS005A AGND B C2 10pF VIN A DAC780X See Figure 5 for the DAC780x in a typical bipolar (fourquadrant) multiplying configuration. See Table III for the listing of the analog output values versus digital input code. VOUT A V REF A Figure 3 shows DAC780x in a typical unipolar (two-quadrant) multiplying configuration. The analog output values versus digital input code are listed in Table II. The operational amplifiers used in this circuit can be single amplifiers such as the OPA602, or a dual amplifier such as the OPA2107. C1 and C2 provide phase compensation to minimize settling time and overshoot when using a high speed operational amplifier. BIPOLAR CONFIGURATION – A1 + FIGURE 3. Unipolar Configuration. UNIPOLAR CONFIGURATION If an application requires the DAC to have zero gain error, the circuit shown in Figure 4 may be used. Resistors R2 and R4 induce a positive gain error greater than worst-case initial negative gain error. Trim resistors R1 and R3 provide a variable negative gain error and have sufficient trim range to correct for the worst-case initial positive gain error plus the error produced by R2 and R4. AGND A RFB B AMPLIFIER OFFSET VOLTAGE The output amplifier used with the DAC780x should have low input offset voltage to preserve the transfer function linearity. The voltage output of the amplifier has an error component which is the offset voltage of the op amp multiplied by the “noise gain” of the circuit. This “noise gain” is equal to (RF /RO + 1) where RO is the output impedance of the DAC IOUT terminal and RF is the feedback network impedance. The nonlinearity occurs due to the output impedance varying with code. If the 0 code case is excluded (where RO = infinity), the RO will vary from R-3R providing a “noise gain” variation between 4/3 and 2. In addition, the variation of RO is nonlinear with code, and the largest steps in RO occur at major code transitions where the worst differential nonlinearity is also likely to be experienced. The nonlinearity seen at the amplifier output is 2VOS – 4VOS /3 = 2VOS /3. Thus, to maintain good nonlinearity the op amp offset should be much less than 1/2 LSB. C1 10pF www.ti.com 9 If an application requires the DAC to have zero gain error, the circuit may be used, see Figure 6. Resistors R2 and R4 induce a positive gain error greater than worst-case initial negative gain error. Trim resistors R1 and R3 provide a variable negative gain error and have sufficient trim range to correct for the worst-case initial positive gain error plus the error produced by R2 and R4. DATA INPUT ANALOG OUTPUT MSB ↓ ↓ LSB 1111 1111 1111 1000 0000 0001 1000 0000 0000 0111 1111 1111 0000 0000 0000 +VREF (2047/2048) +VREF (1/2048) 0 Volts –VREF (1/2048) –VREF (2048/2048) TABLE III. Bipolar Output Code. R1 20k Ω +5V VDD VREF A R2 20k Ω – CD + 1µF A2 R3 10k Ω VOUT A + RFB A C1 10pF IOUT A DAC A – A1 AGND A + DAC7802 has a single analog common, AGND. A1–A4, OPA602 or 1/2 OPA2107. DAC780X RFB B C2 10pF IOUT B DAC B AGND B – A3 + R5 10k Ω R6 20k Ω R4 20k Ω – DGND A4 VOUT B + VREF B FIGURE 5. Bipolar Configuration. APPLICATIONS 12-BIT PLUS SIGN DACS For a bipolar DAC with 13 bits of resolution, two solutions are possible. The addition of a precision difference amplifier and a high speed JFET switch provides a 12-bit plus sign voltageoutput DAC, see Figure 7. When the switch selects the op amp output, the difference amplifier serves as a noninverting output buffer. If the analog ground side of the switch is selected, the output of the difference amplifier is inverted. Another option, see Figure 8, also produces a 12-bit plus sign output without the additional switch and digital control line. DIGITALLY PROGRAMMABLE ACTIVE FILTER See Figure 9 for the DAC780x in a digitally programmable active filter application. The design is based on the statevariable filter, Texas Instruments UAF42, an active filter topology that offers stable and repeatable filter characteristics. 10 DAC1 and DAC2 can be updated in parallel with a single word to set the center frequency of the filter. DAC 4, which makes use of the uncommitted op amp in UAF42, sets the Q of the filter. DAC3 sets the gain of the filter transfer function without changing the Q of the filter. The reverse is also true. The center frequency is determined by fC = 1/2πRC where R is the ladder resistance of the DAC (typical value, 10kΩ) and C the internal capacitor value (1000pF) of the UAF42. External capacitors can be added to lower the center frequency of the filter. But the highest center frequency for this circuit will be about 16kHz because the effective series resistance of the DAC cannot be less than 10kΩ. Note that the ladder resistance of the DAC may vary from device to device. Thus, for best tracking, DAC2 and DAC3 should be in the same package. Some calibration may be necessary from one filter to another. DAC7800, 7801, 7802 www.ti.com SBAS005A R5 20k Ω +5V VDD VIN A R6 20k Ω – CD + 1µF + VREF A RFB A R7 10k Ω R2 47 Ω C1 10pF IOUT A DAC A RFB B + DAC7802 has a single analog common, AGND. A1–A4, OPA602 or 1/2 OPA2107. R4 47 Ω C2 10pF IOUT B DAC B – A1 AGND A DAC7802 AGND B – A3 + R9 10kΩ 10k Ω R8 20k Ω VREF B R3 100 Ω DGND VOUT A A2 R1 100 Ω R10 20k Ω – VOUT B A4 + VIN B FIGURE 6. Bipolar Configuration with Gain Trim. +15V 2 +10V 6 REF102 +5V 4 VDD CD 1µF VREF A RFB A IOUT A DAC A AGND A C1 10pF R A1 R 2 DAC780X 6 R ±10V 13 Bits 3 R Sign Control DAC B DGND VREF B DG188 AGND B 1 INA105 DAC7802 has a single analog common, AGND. A1 OPA602 or 1/2 OPA2107. FIGURE 7. 12-Bit Plus Sign DAC. DAC7800, 7801, 7802 SBAS005A www.ti.com 11 +15V 2 +10V 6 REF102 +5V 4 VDD CD 1µF VREF A RFB A C1 10pF IOUT A DAC A R A1 AGND A R 2 DAC780X DGND R INA105 A2 AGND B VREF B ±10V 13 Bits 3 C2 10pF IOUT B DAC B 6 R RFB B 1 DAC7802 has a single analog common, AGND. A1 OPA602 or 1/2 OPA2107. FIGURE 8. 13-Bit Bipolar DAC. Q Adjust VREF 2 DAC 2 f C Adjust V REF 4 IOUT 2 DAC 4 AGND 2 VREF 1 I OUT 4 AGND 4 1/2 DAC780X IOUT 1 DAC 1 R FB 4 AGND 1 DAC780X High-Pass Out Filter Input 13 R Low-Pass Out Band-Pass Out 8 7 1 14 5 VREF 3 I OUT 3 DAC 3 C R C 12 AGND 3 1/2 DAC780X Gain Adjust 6 3 R R UAF 42 R = 50k Ω ±0.5% C = 1000pF ±0.5% 11 2 4 FIGURE 9. Digitally Programmable Universal Active Filter. 12 DAC7800, 7801, 7802 www.ti.com SBAS005A PACKAGE OPTION ADDENDUM www.ti.com 12-Feb-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty DAC7800KP NRND PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC7800KPG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC7800KU ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7800KU/1K ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7800KU/1KG4 ACTIVE SOIC DW 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7800KUG4 ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7800LP NRND PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC7800LPG4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type DAC7800LU ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7800LU/1K OBSOLETE SOIC DW 16 TBD Call TI DAC7800LUG4 ACTIVE SOIC DW 16 48 Green (RoHS & no Sb/Br) CU NIPDAU DAC7801KP NRND PDIP NT 24 15 Green (RoHS & no Sb/Br) Call TI N / A for Pkg Type DAC7801KPG4 ACTIVE PDIP NT 24 15 Green (RoHS & no Sb/Br) Call TI N / A for Pkg Type DAC7801KU ACTIVE SOIC DW 24 33 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7801KU/1K ACTIVE SOIC DW 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7801KU/1KG4 ACTIVE SOIC DW 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7801KUG4 ACTIVE SOIC DW 24 33 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7801LP NRND PDIP NT 24 15 Green (RoHS & no Sb/Br) Call TI DAC7801LU ACTIVE SOIC DW 24 33 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7801LU/1K ACTIVE SOIC DW 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7801LU/1KG4 ACTIVE SOIC DW 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7801LUG4 ACTIVE SOIC DW 24 33 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7802KP NRND PDIP NTG 24 15 Green (RoHS & no Sb/Br) Call TI DAC7802KU ACTIVE SOIC DW 24 33 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DAC7802KU/1K ACTIVE SOIC DW 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) Call TI Level-3-260C-168 HR N / A for Pkg Type N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 12-Feb-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty DAC7802KU/1KG4 ACTIVE SOIC DW 24 DAC7802KUG4 ACTIVE SOIC DW 24 33 DAC7802LP NRND PDIP NTG 24 DAC7802LU ACTIVE SOIC DW 24 DAC7802LU/1K ACTIVE SOIC DW DAC7802LU/1KG4 ACTIVE SOIC DAC7802LUG4 ACTIVE SOIC 1000 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-3-260C-168 HR Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 15 Green (RoHS & no Sb/Br) Call TI 33 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DW 24 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR DW 24 CU NIPDAU Level-3-260C-168 HR 33 Green (RoHS & no Sb/Br) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DAC7800KU/1K SOIC DW 16 1000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1 DAC7801KU/1K SOIC DW 24 1000 330.0 24.4 10.85 15.8 2.7 12.0 24.0 Q1 DAC7801LU/1K SOIC DW 24 1000 330.0 24.4 10.85 15.8 2.7 12.0 24.0 Q1 DAC7802KU/1K SOIC DW 24 1000 330.0 24.4 10.85 15.8 2.7 12.0 24.0 Q1 DAC7802LU/1K SOIC DW 24 1000 330.0 24.4 10.85 15.8 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC7800KU/1K SOIC DW 16 1000 346.0 346.0 33.0 DAC7801KU/1K SOIC DW 24 1000 346.0 346.0 41.0 DAC7801LU/1K SOIC DW 24 1000 346.0 346.0 41.0 DAC7802KU/1K SOIC DW 24 1000 346.0 346.0 41.0 DAC7802LU/1K SOIC DW 24 1000 346.0 346.0 41.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated