OPA827 OPA2827 SBOS376A − NOVEMBER 2006 Low-Noise, High-Precision, JFET-Input, OPERATIONAL AMPLIFIER FEATURES DESCRIPTION OFFSET: 250µV (max) DRIFT: 1µV/°C LOW NOISE: 4.5nV//Hz at 1kHz BANDWIDTH: 18MHz SLEW RATE: 22V/µs BIAS CURRENT: 3pA QUIESCENT CURRENT: 4.5mA/Ch WIDE SUPPLY RANGE: +4V to +18V SINGLE PACKAGES: MSOP-8, SO-8 DUAL PACKAGES: TSSOP-8, SO-8 The OPA827 series of JFET operational amplifiers combines outstanding dc precision with excellent ac performance. It offers 100µV of offset, very low drift (1µV/°C) over temperature, low bias currents, and very low flicker noise of 400nVPP (0.1Hz to 10Hz). It operates over a very wide supply voltage range of ±4V to ±18V on a low 4.5mA supply current. A dual version is also available for the OPA827 family. APPLICATIONS D D D D D D D D D D PRECISION +10V INPUT FRONT-ENDS TRANSIMPEDANCE AMPLIFIERS INTEGRATORS ACTIVE FILTERS A/D CONVERTER DRIVERS DAC OUTPUT BUFFERS HIGH-PERFORMANCE AUDIO PROCESS CONTROL TEST EQUIPMENT MEDICAL EQUIPMENT Excellent ac characteristics, such as 18MHz gain bandwidth (GBW) and 22V/µs slew rate, and precision dc characteristics make the OPA827 series well-suited for a wide range of applications such as 16- to 18-bit data acquisition systems, transimpedance (I/V−conversion) amplifiers, filters, precision ±10V front-ends, and professional audio applications. The single version (OPA827) is available in both MSOP-8 and standard SO-8 surface-mount packages. The dual version (OPA2827) is available in the small TSSOP-8 and in the standard SO-8 packages. All versions are specified from −40°C to +125°C. +15V 2.2µF 100nF 100pF 500Ω ADS8505 200Ω VIN 33.2kΩ 500Ω REF VIN 100pF OPA827 2.2µF AGND1 2.2µF CAP 100nF 2.2µF DGND AGND2 −15V Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. ! Copyright 2006, Texas Instruments Incorporated www.ti.com PRODUCT PREVIEW D D D D D D D D D D "#$% www.ti.com SBOS376A − NOVEMBER 2006 ABSOLUTE MAXIMUM RATINGS(1) PRODUCT PREVIEW Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20V Signal Input Terminals, Voltage(2) . . . . . . . . (V−)−0.7 to (V+)+0.7V Current(2) . . . . . . . . . . . . . . . . . . . . ±10mA Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . TBD V Output Short-Circuit(3) . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Operating Temperature . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.7V beyond the supply rails should be current-limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING OPA827A Low Grade OPA827A OPA2827A SO-8 D MSOP-8 DGK TBD SO-8 D OPA2827A TSSOP-8 PW TBD OPA827 High Grade OPA827I OPA2827I SO-8 D MSOP-8 DGK TBD SO-8 D OPA2827 TSSOP-8 PW TBD (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN CONFIGURATIONS TOP VIEW OPA827 (1) NC −IN +IN V− 1 OPA2827 8 2 7 3 6 4 5 (1) NC −IN A V+ OUT (1) NC SO−8, MSOP−8 (1) NC denotes no internal connection. 2 OUT A 1 2 +IN A 3 V− 4 A B TSSOP−8, SO−8 8 V+ 7 OUT B 6 −IN B 5 +IN B "#$% www.ti.com SBOS376A − NOVEMBER 2006 ELECTRICAL CHARACTERISTICS: VS = +4V to +18V BOLDFACE limits apply over the specified temperature range, TA = −405C to +1255C. At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted. OPA827A, OPA2827A PARAMETER CONDITIONS MIN TYP MAX TBD 1 TBD OPA827I, OPA2827I MIN TYP MAX UNIT 250 TBD TBD µV 3.5 TBD TBD µV/5C 10 TBD TBD µV/V TBD µV/V OFFSET VOLTAGE Input Offset Voltage Drift vs Power Supply VOS dVOS/dT PSRR Over Temperature VCM = 0V, VS = ±15V VS = ±4V to ±18V, VCM = 0V VS = +4V to +18V, VCM = 0V 30 Channel Separation, dc TBD µV/V TBD INPUT BIAS CURRENT Input Bias Current IB Over Temperature Input Offset Current IOS ±3 TBD * TBD pA TBD TBD TBD TBD pA ±3 TBD * TBD pA NOISE Input Voltage Noise f=0.1 to 10Hz en VS = ±18V, VCM = 0V 0.4 * µVPP en en VS = ±18V, VCM = 0V VS = ±18V, VCM = 0V 4.5 * nV/√Hz 4.5 * nV/√Hz in VS = ±18V, VCM = 0V TBD * fA/√Hz f = 1kHz f = 10kHz PRODUCT PREVIEW Input Voltage Noise Density Input Current Noise Density f = 1kHz INPUT VOLTAGE RANGE Common-Mode Voltage Range (V−)+2.5 VCM Common-Mode Rejection Ratio CMRR (V−)+2.5V < VCM < (V+)−2.5V (V+)−2.5 108 Over Temperature * * TBD V dB TBD TBD dB 1013 || TBD * Ω || pF 1013 ||7 * Ω || pF INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN AOL Open-Loop Voltage Gain Over Temperature FREQUENCY RESPONSE 114 120 TBD TBD dB 108 TBD TBD TBD dB CL = 100pF Gain-Bandwidth Product GBW Slew Rate Settling Time, 0.1% 18 * MHz SR G = +1 22 * V/µs tS 4V Step, G = +1 TBD * ns 4V Step, G = +1 TBD * ns VIN • Gain > VS G = +1, f = 1kHz TBD * µs TBD * % 0.01% (16-bit) Overload Recovery Time Total Harmonic Distortion + Noise RL = 1kΩ, (V−)+2.75V<VO<(V+)−2.1V RL = 1kW, (V−)+2.75V<VO<(V+)−2.1V THD+N OUTPUT Voltage Output Swing from Rail Over Temperature Output Current Short-Circuit Current Capacitive Load Drive IOUT ISC RL = 1kΩ, AOL > 114dB RL = 1kW, AOL > 108dB |VS − VOUT| < 1.5V (V−)+2.75 (V+)−2.1 * * (V−)+2.75 (V+)−2.1 * * CLOAD 30 V V * mA ±40 * mA TBD TBD pF NOTE: * indicates same specifications as for low-grade version of device. 3 "#$% www.ti.com SBOS376A − NOVEMBER 2006 ELECTRICAL CHARACTERISTICS: VS = +4V to +18V (continued) BOLDFACE limits apply over the specified temperature range, TA = −405C to +1255C. At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted. OPA827A, OPA2827A PARAMETER CONDITIONS MIN OPA827I, OPA2827I TYP MAX MIN ±18 * 4.5 TBD TYP MAX UNIT POWER SUPPLY Specified Voltage Quiescent Current (per amp.) VS IQ ±4 IO = 0 Over Temperature * TBD * V * mA * mA TEMPERATURE RANGE Specified Range −40 +125 * * °C Operating Range −55 +125 * * °C Thermal Resistance qJA SO-8, MSOP-8, TSSOP-8 PRODUCT PREVIEW NOTE: * indicates same specifications as for low-grade version of device. 4 150 * °C/W PACKAGE OPTION ADDENDUM www.ti.com 22-Nov-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty OPA827AID PREVIEW SOIC D 8 75 TBD Call TI Call TI POPA827AID PREVIEW SOIC D 8 1500 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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