BUF04701 0470 1A ® SBOS214B – SEPTEMBER 2001 – REVISED JULY 2004 4-Channel, Rail-to-Rail, CMOS BUFFER AMPLIFIER FEATURES DESCRIPTION ● UNITY GAIN BUFFER The BUF04701 is a 4-channel, low-power, high-voltage railto-rail input/output buffer. Operating on supplies ranging from 3.5V to 12V (±1.75V to ±6V), the BUF04701 has a 3dB bandwidth of 8MHz with a slew rate of 10V/µs, and requires only 1.1mA quiescent current. The BUF04701 features railto-rail input and output capability, giving maximum dynamic range at any supply voltage. ● RAIL-TO-RAIL INPUT/OUTPUT ● WIDE BANDWIDTH: 8MHz ● HIGH SLEW RATE: 10V/µs ● LOW QUIESCENT CURRENT: 1.1mA ● TINY PACKAGE: MSOP-10, TSSOP-14 Featuring fast slewing and settling times, as well as a high output drive, the BUF04701 is ideal for use as a voltage reference buffer in Thin Film Transistor Liquid Crystal Displays (TFT-LCDs). APPLICATIONS ● TFT-LCD REFERENCE DRIVERS The BUF04701 is available in an MSOP-10 package, providing the smallest footprint and thinnest package option available, as well as the TSSOP-14 package with a pinout that corresponds to standard quad op amps. This makes it easy to replace quad op amps in existing LCD displays with the low cost BUF04701, without changing the layout. The BUF04701 operates over a temperature range of –40°C to +125°C. ● NOTEBOOKS ● ELECTRONIC GAMES ● ELECTRONIC BOOKS ● PERSONAL COMMUNICATION DEVICES ● PDA ● ACTIVE FILTERS BUF04701 RELATED PRODUCTS ● ADC/DAC BUFFER Out A 1 NC(1) 2 A 14 Out D 13 NC(1) PRODUCT 1.2 MHz BW, 3.3mA IQ 7MHz GBW, 1.5mA IQ, VS 3.5 - 12 5.9MHz GBW, 4.5mA IQ, VS = 4V - 44V 10MHz GBW, 2.5mA IQ, 16V/µs SR BUF11702 OPA4743 TLE2144/2 TLC084 C Out A 1 10 Out D In A 2 9 In D In C +V 3 8 –V In A 3 12 In D +V 4 11 –V In B 5 10 B FEATURES D NC(1) 6 9 NC(1) In B 4 7 In C Out B 7 8 Out C Out B 5 6 Out C MSOP-10 (DGS) TSSOP-14 (PW) NOTE: (1) NC Means No Internal Connection Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 2001-2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC DISCHARGE SENSITIVITY Supply Voltage, V+ to V– ................................................................. 13.2V Signal Input Terminals, Voltage(2) ................... (V–) –0.5V to (V+) + 0.5V Current(2) .................................................... 10mA Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –40°C to +125°C Storage Temperature ..................................................... –65°C to +150°C Junction Temperature .................................................................... +150°C Lead Temperature (soldering, 10s) ............................................... +300°C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current-limited to 10mA or less. (3) Short-circuit to ground, one amplifier per package. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR Quad BUF04701 BUF04701 MSOP-10 TSSOP-14 DGS PW SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY –40°C to +125°C –40°C to +125°C BUF04701 04701A BUF04701AIDGSR BUF04701AIPWR Tape and Reel, 2500 Tape and Reel, 2500 NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet. 2 BUF04701 www.ti.com SBOS214B ELECTRICAL CHARACTERISTICS: VS = +3.5V to +12V Boldface limits apply over the specified temperature range, TA = –40°C to +125°C At TA = +25°C, RL = 10kΩ connected to VS / 2 and VOUT = VS / 2, unless otherwise noted. BUF04701 PARAMETER OFFSET VOLTAGE Input Offset Voltage Drift vs Power Supply Over Temperature Channel Separation, DC f = 10kHz CONDITION VOS dVOS/dT PSRR INPUT VOLTAGE RANGE Common-Mode Voltage Range INPUT BIAS CURRENT Input Bias Current MIN VS = ±5, VCM = 0 VS = 3.5V to 12V, VCM = VS/2 – 0.5V VS = 3.5V to 12V, VCM = VS/2 – 0.5V VCM IB en in VCM = VS/2 POWER SUPPLY Specified Voltage Range, Single Supply Specified Voltage Range, Dual Supplies Operating Voltage Range Quiescent Current (per amplifier) over Temperature TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance TSSOP Surface Mount MSOP Surface Mount VS = ±6V, VCM = 0 VS = ±6V, VCM = 0 VS = ±6V, VCM = 0 RL = 10kΩ RL = 2kΩ RL = 2kΩ mV µV/°C 100 200 µV/V µV/V µV/V dB ±10 pA 5 • 1012 || 4 Ω || pF 11 30 2.5 µVrms nV/√Hz fA/√Hz 1.000 1.000 75 150 ISC 1.0025 1.005 ±32 mV mV mV mA 8 10 9 0.2 0.001 MHz V/µs µs µs % 200 250 CL = 10pF BW SR tS THD+N VS = ±6V VS = ±6V, 5V Step VIN = VS VS = ±6V, VO = 1Vrms, G = 1, f = 6kHz, VCM = VS/2 VS IQ 3.5 ±1.75 12 ±6 +3.5 to +12 1.1 IO = 0 –40 –40 –65 θJA 100 200 BUF04701 SBOS214B ±7 1 0.9975 0.995 OUTPUT Voltage Output Swing from Rail FREQUENCY RESPONSE Bandwidth –3dB Slew Rate Settling Time, 0.1% Overload Recovery Time Total Harmonic Distortion + Noise ±1.5 ±8 20 UNITS Limited by Output Range TRANSFER CHARACTERISTIC Gain over Temperature over Temperature Short-Circuit Current MAX 1 110 INPUT IMPEDANCE Common-Mode NOISE Input Voltage Noise, f = 0.1Hz to 10Hz Input Voltage Noise Density, f = 10kHz Input Current Noise Density, f = 1kHz TYP www.ti.com 1.5 1.7 V V V mA mA +125 +125 +150 °C °C °C °C/W °C/W 3 TYPICAL CHARACTERISTICS At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted. PSRR vs FREQUENCY MAXIMUM AMPLITUDE vs FREQUENCY 120 7 V+ 6 100 5 Amplitude (V) PSRR (dB) V– 80 60 40 4 VS = ± 6V 3 2 20 1 0 0 10 100 1k 10k 100k 1M 10 100 1k 10k 100k 1M Frequency (Hz) Frequency (Hz) CHANNEL SEPARATION vs FREQUENCY INPUT CURRENT AND VOLTAGE SPECTRAL NOISE vs FREQUENCY 140 10M 10k 10k 1k 1k 100 80 60 40 100 100 10 10 1 1 20 0 0.1 10 100 1k 10k 100k Frequency (Hz) 1M 10M 0.1 0.1 1 10 100 1k 100k 1M Frequency (Hz) GAIN vs FREQUENCY GAIN vs FREQUENCY 20 20 CL = 1000pF RL = 10kΩ CL 10 RL CL 10 CL = 10pF Gain (dB) RL = 1kΩ Gain (dB) 10k RL = 500Ω 0 RL = 350Ω RL CL = 500pF RL = 200Ω CL = 100pF 0 CL = 10pF RL = 200Ω –10 –10 RL = 100Ω –20 –20 10k 100k 1M 10M 100M Frequency (Hz) 4 10k 100k 1M 10M 100M Frequency (Hz) BUF04701 www.ti.com SBOS214B Current Noise (fA/√Hz) Voltage Noise (nV/√Hz) Channel Separation (dB) 120 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted. INPUT BIAS CURRENT (IB) vs COMMON-MODE VOLTAGE (VCM) TEMPERATURE = 85°C INPUT BIAS CURRENT (IB) vs COMMON-MODE VOLTAGE (VCM) TEMPERATURE = 25ºC 15 500 400 10 300 VS = ±5V 100 IB (pA) IB (pA) VS = ±5V 200 5 0 0 –100 –5 –200 –300 –10 –400 –500 –15 –6 –5 –4 –3 –2 –1 0 1 2 3 4 5 –6 6 –5 –4 –3 –2 VCM (V) INPUT BIAS (IB) AND CURRENT vs TEMPERATURE –1 0 1 VCM (V) 2 3 4 5 6 PSRR vs TEMPERATURE 120 100k 10k 110 PSRR (dB) Bias Current (pA) IB 1k 100 10 100 90 80 1.0 70 0.1 0.01 –50 –25 0 25 50 75 100 125 150 60 –100 –75 –50 –25 175 QUIESCENT CURRENT vs TEMPERATURE 25 50 75 100 125 150 175 GAIN vs TEMPERATURE 2.0 1.005 1.5 Gain (V/V) IQ per Amplitude (mA) 0 Temperature (°C) Temperature (°C) 1.0 1.000 0.5 0.0 –100 –75 –50 –25 0 25 50 75 Temperature (°C) 0.995 –100 100 125 150 175 0 50 100 150 ?? Temperature (°C) BUF04701 SBOS214B –50 www.ti.com 5 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted. THD+N vs FREQUENCY (Gain = ±1 V/V, VOUT = 1.0Vrms, BW = 80kHz) QUIESCENT CURRENT vs SUPPLY VOLTAGE 0.1 IQ per Amplifier (mA) 2.0 THD+N (%) 0.01 0.001 1.5 1.0 0.5 RL = 10kΩ 0.0001 0.0 1 10 100 1k Frequency (Hz) 10k 100k 2 50 40 40 Sourcing 30 20 Sinking 10 0 –100 –75 –50 –25 5 6 7 8 9 10 Supply Voltage (V) 11 12 13 14 Sourcing 30 Sinking 20 10 0 0 25 50 75 Temperature (°C) 100 125 150 175 2 3 4 5 6 7 8 9 10 Supply Voltage (V) 11 12 13 14 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT (Sourcing) OUTPUT VOLTAGE SWING vs OUTPUT CURRENT (Sinking) 6.0 –5.0 Output Voltage (V) –4.5 Output Voltage (V) 4 SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 50 Short-Circuit Current (mA) Short-Circuit Current (mA) SHORT-CIRCUIT CURRENT vs TEMPERATURE 3 85°C 125°C 25°C –5.5 25°C –40°C 5.5 85°C 125°C 5.0 –40°C 4.5 –6.0 0 5 10 15 Output Current (mA) 6 0 5 10 15 Output Current (mA) BUF04701 www.ti.com SBOS214B TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, VS = ±6V, and RL = 10kΩ, unless otherwise noted. VOS PRODUCTION DISTRIBUTION OVERSHOOT (%) vs CAPACITANCE 15 100 90 70 Frequency (%) Overshoot (%) 80 60 50 40 30 10 5 20 10 0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 –1.0 –2.0 –3.0 Load Capacitance Value (pF) –4.0 10k –5.0 1k –7.0 100 –6.0 0 10 Voltage Offset (mV) SMALL SIGNAL STEP RESPONSE (G = +1V/V, RL = 10kΩ, CL = 15pF) VOS DRIFT DISTRIBUTION 30 20 10mV/div Frequency (%) 25 15 10 5 100ns/div 60 50 40 30 20 10 0 –10 –20 –30 –40 –50 0 Voltage Offset Drift (µV/°C) 2V/div LARGE SIGNAL STEP RESPONSE (G = +1V/V, RL = 10kΩ, CL = 15pF) 1µs/div BUF04701 SBOS214B www.ti.com 7 APPLICATIONS INFORMATION Figure 1 shows the BUF04701 connected as a buffer. Power supplies should be bypassed with capacitors connected close to the device pins. Capacitor values as low as 0.1µF will assure stable operation in most applications, but high output current and fast output slewing can demand large current transients from the power supplies. Rail-to-rail input and output swing helps maintain dynamic range, especially in low supply applications. Figure 2 shows the input and output waveforms for the BUF04701. On a ±6V supply with a 100kΩ load connected to VS/2, the output is tested to swing within 50mV to the rail. OPERATING VOLTAGE The BUF04701 is fully specified and tested from 3.5V to 12V over a temperature range of –40°C to +125°C. Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristic Curves. V+ 0.1µF 1/4 BUF04701 VIN RL 0.1µF RAIL-TO-RAIL INPUT The input common-mode voltage range of the BUF04701 extends 100mV beyond the supply rails at room temperature; however, due to the fixed gain at G = 1, the output will limit the useable input range. This wide swing is achieved with a complementary input stage—an N-channel input differential pair in parallel with a P-channel differential pair. The N-channel pair is active for input voltages close to the positive rail, typically (V+) – 2.0V to 100mV above the positive supply, while the P-channel pair is on for inputs from 100mV below the negative supply to approximately (V+) – 1.5V. There is a small transition region, typically (V+) – 2.0V to (V+) – 1.5V, in which both pairs are on. This 500mV transition region can vary ±100mV with process variation. Thus, the transition region (both stages on) can range from (V+) – 2.1V to (V+) – 1.4V on the low end, up to (V+) – 1.9V to (V+) – 1.6V on the high end. INPUT PROTECTION Device inputs are protected by ESD diodes that will conduct if the input voltages exceed the power supplies by more than approximately 300mV. Momentary voltages greater than 300mV beyond the power supply can be tolerated if the current is limited to 10mA. This is easily accomplished with an input resistor, in series with the buffer input shown in Figure 3. Many input signals are inherently current-limited to less than 10mA; therefore, a limiting resistor is not always required. The BUF04701 features no phase inversion when the inputs extend beyond supplies if the input current is limited, as shown in Figure 4. V+ V– RS FIGURE 1. Basic Connections. 8 VIN 6 VOUT V– G = +1, VS ± 6V Input 1/4 BUF04701 FIGURE 3. Limiting Input Current on the BUF04701. 4 2V/div 2 VS = ±6V, VIN = 13Vp-p, G = +1 0 –2 –4 2V/div –6 Output (Inverted on oscilloscope) –8 20µs/div FIGURE 2. Rail-to-Rail Input and Output. 20µs/div FIGURE 4. BUF04701—No Phase Inversion with Inputs Greater than the Power-Supply Voltage. 8 BUF04701 www.ti.com SBOS214B RAIL-TO-RAIL OUTPUT VDC A class AB output stage with common-source transistors is used to achieve rail-to-rail output. This output stage is capable of driving 1kΩ loads connected to any point between V+ and V–. For light resistive loads (> 100kΩ), the output voltage can swing to 100mV from the supply rail. With 2kΩ resistive loads, the output is specified to swing to within 200mV of the supply rails while maintaining high open-loop gain (see the typical characteristic curve Output Voltage Swing vs Output Current). GMA1 RS 20Ω 1/4 BUF04701 CL 100nF GMA4 1/4 BUF04701 GMA5 CL 100nF The BUF04701 can drive up to 1000pF pure capacitive load. One method of improving capacitive load drive is to insert a 10 to 20Ω resistor in series with the output, as shown in Figure 5. This reduces ringing with large capacitive loads while maintaining DC accuracy. 1/4 BUF04701 GMA3 RS 20Ω CAPACITIVE LOAD AND STABILITY VIN GMA2 GMA6 RS 20Ω 1/4 BUF04701 GMA7 CL 100nF GMA8 GMA9 20Ω RS 20Ω VOUT 1/4 BUF04701 GMA10 CL 100nF LCD Source Driver FIGURE 5. Improving Capacitive Load Drive. FIGURE 6. BUF04701 as LCD Display Buffer. APPLICATION CIRCUITS REFERENCE BUFFER FOR LCD SOURCE DRIVERS In modern high-resolution TFT-LCD displays, gamma correction must be performed to correct for nonlinearities in the glass transmission characteristics of the LCD panel. The typical LCD source driver for 64 bits of grayscale uses internal Digital-toAnalog Converters (DACs) to convert the 6-bit data into analog voltages applied to the LCD. These DACs typically require external voltage references for proper operation. Normally these external reference voltages are generated using a simple resistive ladder, like the one shown in Figure 6. Typical laptop or desktop LCD panels require 6 to 8 of the source driver circuits in parallel to drive all columns of the panel. Although the resistive load of one internal string of a DAC is only around 10kΩ to 16kΩ, 6 to 8 strings in parallel represent a very substantial load. The power supply used for the LCD source drivers for laptops is typically in the order of 10V. To maximize the dynamic range of the DAC, rail-to-rail output performance is required for the upper and lower buffer. The ability of the BUF04701 to operate on 12V supplies, to drive heavy resistive loads (as low as 2kΩ), and to swing to within 200mV of the supply rails, makes it very well suited as a buffer for the reference voltage inputs of LCD source drivers. During conversion of the DAC, internal switches create current glitches on the output of the reference buffer. The capacitor CL (typically 100nF) functions as a charge reservoir that provides/absorbs most of the glitch energy. The series resistor RS isolates the outputs of the BUF04701 from the heavy capacitive load and helps to improve settling time. 4-POLE LOW-PASS SALLEN-KEY FILTER The high open-loop gain and wide bandwidth of the BUF04701 make it optimal for active filtering applications. Figure 7 shows the BUF04701 in a 4-pole Butterworth low-pass active filter configuration of 20kHz bandwidth. 2.2nF 2.18kΩ 19.4kΩ VIN 1/4 BUF04701 6.8nF 1.68kΩ 680pF 16.8kΩ 1/4 BUF04701 VOUT 330pF FIGURE 7. BUF04701 Configured as a 4-Pole Sallen-Key Butterworth Low-Pass Filter. BUF04701 SBOS214B www.ti.com 9 PACKAGE OPTION ADDENDUM www.ti.com 13-Oct-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TBD Lead/Ball Finish Call TI MSL Peak Temp (3) BUF04701AIDGS ACTIVE MSOP DGS 10 BUF04701AIDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Call TI Level-2-260C-1 YEAR BUF04701AIPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BUF04701AIPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. 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