BELLING BLH3355

BLH3355
NPN EPITAXIAL SILICON RF TRANSISTOR CHIP (BLH3355)
Description
NPN epitaxial silicon RF transistor for
microwave low-noise amplification
Features
Low noise and high gain bandwidth product
High power gain
Applications
UHF / VHF wide band amplifier
Structure
Size
Planar type
Electrodes: Aluminum alloy
Backside metal: Au alloy
Chip size: 370µm ×370µm
Chip thickness: 220±20µm.
Pad size: φ100µm
ABSOLUTE MAXIMUM RATING
Symbol
Parameter
Value
Unit
VCBO
Collector to Base Voltage
20
V
VCEO
Collector to Emitter Voltage
12
V
VEBO
Emitter to Base Voltage
3.0
V
IC
Collector Current
100
mA
Ptot
Total Power Dissipation
200
mW
Tj
Junction Temperature
150
°C
Tstg
Storage Temperature
−65 to +150
°C
ELECTRICAL CHARACTERISTICS
o
Tj = 25 C unless otherwise specified
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ICBO
Collector Cut-off Current
VCB=10V, IE=0mA
-
-
1.0
µA
IEBO
Emitter Cut-off Current
VEB=1.0V, IC=0mA
-
-
1.0
µA
hFE
DC Current Gain
VCE =10V, IC=20mA
50
120
250
nA
http://www.belling.com.cn
-1Total 2 Pages
8/18/2006
BLH3355
PATTERN DRAWING
E
E
B
B
(0.8µm design)
http://www.belling.com.cn
(0.6µm design )
-2Total 2 Pages
8/18/2006