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2002 California Micro Devices Corp. All rights reserved.
08/29/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
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2002 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
08/29/02
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2002 California Micro Devices Corp. All rights reserved.
08/29/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
3
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2002 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
08/29/02
$
!&2'
G
.@
G
.!
150
GROUND CURRENT [uA]
GROUND CURRENT [uA]
120
100
80
60
40
20
100
75
50
25
0
0
0
1
2
3
4
5
INPUT VOLTAGE [V]
0
6
!
@?O
50
100
150
LOAD CURRENT [mA]
250
DROPOUT VOLTAGE [mV]
3.31
3.30
3.29
200
150
100
50
0
3.28
0
50
100
150
0
200
50
100
150
LOAD CURRENT [mA]
LOAD CURRENT [mA]
!
)
&*.!
3.5
200
4.0
3.4
OUTPUT VOLTAGE [V
OUTPUT VOLTAGE [V
200
!
.@?O5F
3.32
OUTPUT VOLTAGE [V
125
3.3
3.2
3.1
3.0
3.0
3.5
4.0
4.5
5.0
INPUT VOLTAGE [V]
5.5
6.0
3.0
2.0
1.0
0.0
0
100
200
300
400
500
LOAD CURRENT [mA]
2002 California Micro Devices Corp. All rights reserved.
08/29/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
5
$&'
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2002 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
08/29/02
$&'
! The overall junction to ambient thermal resistance
(θJA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction
to the case (θJC) which is defined by the package style,
and the second path is case to ambient (θCA) thermal
resistance which is dependent on board layout. The
final operating junction temperature for any set of conditions can be estimated by the following thermal equation:
4.1'(2;
( ( ; ( .147:+ (
123423'5*(;
3.('
50
TJUNC = TAMB + PD ∗ (θJC) + PD ∗ (θCA)
40
30
OUTPUT CHANGE [mV]
= TAMB + PD ∗ (θJA)
The CMPWR163-33MA with the Power MSOP packaging option uses a thermally enhanced MSOP-8 package where all the GND pins (5 through 8) are integral
to the leadframe. When this package is mounted on a
double sided printed circuit board with two square
inches of copper allocated for “heat spreading”, the
resulting θJA is 70°C/W.
20
10
0
-10
-20
-30
-40
-50
-50
-25
Based on a maximum power dissipation of 0.255W
(Load x Vin-Vout = 150mA x 1.7V) with an ambient of
70°C the resulting junction temperature will be:
0
25
50
75
100 125
TEMPERATURE [oC]
TJUNC = TAMB + PD ∗ (θJA)
= 70°C + 0.255W ∗ (70°C/W)
G
.'
= 70°C + 18°C = 88°C
100
GROUND CURRENT [uA]
'((
&
&
( " ( ; (G?;#(
%
Measurements showing performance up to a junction
temperature of 125°C are presented in ) . They
were performed under light load conditions (5mA); this
allows the ambient temperature to be representative of
the internal junction temperature.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no
copper area being dedicated for heat spreading, a
multi-layer board construction using only the minimum
size pad layout will typically provide the CMPWR16333MA (in an MSOP package) with an overall θJA of
90°C/W, which allows up to 600mW to be dissipated
safely.
80
60
40
20
0
0
25
50
75
100
125
TEMPERATURE [oC]
2002 California Micro Devices Corp. All rights reserved.
08/29/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
7
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2002 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
08/29/02
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2002 California Micro Devices Corp. All rights reserved.
08/29/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
9