MC-7847-KC NEC's 870 MHz GaAs CATV 25 dB POWER DOUBLER AMPLIFIER OUTLINE DIMENSIONS (Units in mm) FEATURES • GaAs ACTIVE DEVICES PACKAGE OUTLINE H02 • LOW DISTORTION • HIGH LINEAR GAIN: MC-7847-KC - GL = 25 dB MIN at f = 870 MHz • LOW RETURN LOSS • LOW GAIN CHANGE OVER TEMPERATURE • SPECIFIED FOR 79, 110, and 132 CHANNELS PERFORMANCE • HIGH RELIABILITY AND RUGGEDNESS: Withstands environmental extremes as well as Silicon devices (Surge, ESD, Etc.) 45.08 MAX 38.1±0.25 27.5 MAX 3.2 MAX 4.25 + 0.25 - 0.35 VDD 14.85 MAX 5 4.0±0.25 8.1 MAX 19.05±0.38 1 9 In Out 6-32 unc 2B 25.4±0.25 2 3 7 8 2.54±0.25 0.51±0.05 Gnd 21.5 MAX DESCRIPTION 7 8 9 4.19±0.13 2.62±0.35 NEC's MC-7847-KC is a GaAs Multi-Chip Modules designed for use as output stages in CATV applications up to 870 MHz. This is a high gain device offering 25 dB minimum gain at 870 MHz. Because this unit is a GaAs device it has low distortion, low noise figure, and low return loss across the entire frequency band. The MC-7847-KC is similar to NEC's standard push-pull devices, but the higher current allows for better distortion performance, especially X-mod. Like the previous generation of products, these devices survive such hazards as surge and ESD as well as their silicon competitors, but deliver superior performance with low DC current required. All devices are assembled and tested using fully automated equipment to maximize consistency in part to part performance, and reliability is assured by NEC's stringent quality and process control procedures. These parts come in industry compatible hybrid packages. 5 12.9 MAX 1 2 3 10.75 ±0.25 2.54 ±0.38 A 0.38.. A 0.51±0.05 6.3 2.5 ±0.05 APPLICATIONS • CATV HEADEND SYSTEMS • CATV OPTICAL NODES • CATV DISTRIBUTION AMPS ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω) SYMBOLS BW GL S Gf NF RLi RLO IDD CTB XMod CSO PART NUMBER CHARACTERISTICS Frequency Range Linear Gain Gain Slope Gain Flatness Noise Figure 1 Noise Figure 2 Input Return Loss Output Return Loss Operating Current Composite Triple Beat Cross Modulation1 Composite Second Order UNITS MHz dB dB dB dB dB mA mA dBc dBc dBc MIN 50 25.0 1.0 – – – 20.0 20.0 19.5 17.0 20.0 350 – – – MC-7847-KC TYP – – 1.4 – – – – – – – – – – – – 1. Measured per US standard methods and procedures (using selective level meter). Date Published January 2007 MAX 870 26.0 1.8 0.6 5.5 6.0 – – – – – 420 -60 -55 -63 TEST CONDITIONS f = 870 MHz f = 40 to 870 MHz 40 to 870 MHz; Peak to Valley f = 50 MHz f = 870 MHz 40 to 160MHz 160 to 320 MHz 320 to 640 MHz 640 to 870 MHz 40 to 160MHz RF OFF 110 Channels VOUT = 50 dBmV at 745.25 MHz, 10 dB tilted across the band MC-7847-KC ABSOLUTE MAXIMUM RATINGS1 (TCASE= 30 °C) RECOMMENDED OPERATING CONDITIONS (Zs = ZL = 75Ω) VDD VI SYMBOLS TC TSTG PARAMETERS UNITS RATINGS Supply Voltage Input Voltage (Single Tone) 2 Operating Case Temperature Storage Temperature V 30 dBmV 65 °C -30 to +100 °C -40 to +100 Note: 1. Operation in excess of any one of these parameters may result in permanent damage. 2.Maximum single channel power applied to the input for 1 minute with no measurable degradation in performance. SYMBOLS VDD V i PARAMETERS UNITS MIN TYP MAX Supply VoltageV 23.5 Input Voltage , 24.0 24.5 1 – 32.0 35.0 dBmV MC-7847-KC TC Operating Case °C -30 +25 +85 Temperature Note: 1. Test Conditions: 110 Channels, 10 dB tilted across the band. ORDERING INFORMATION PART NUMBER Package QUANTITY MC-7847-KC-AZ 7-pin special with heatsink 25 pcs max/ Tray (Pb-Free) NOTES ON CORRECT USE RECOMMENDED SOLDERING CONDITIONS 1. The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress on the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Recommended space is 2.0 to 3.0 mm typical. 2.Recommended torque strength of the screw is 59 to 78 Ncm. 3.Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Soldering Method Pin Part Heating Soldering Conditions Condition Symbol Pin area temperature: less – than 260°C1 Hour: Within 2 sec./pin Note. 1. The point of pin part heating must be kept at a distance of more than 1.2 mm from the root of lead. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do agree to fully indemnify CEL for all damages resulting from such improper use or sale. ucts can reasonably so at their own risk and The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. 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