NEC's 870 MHz GaAs CATV MC-7834-KC 20 dB PUSH-PULL AMPLIFIER OUTLINE DIMENSIONS (Units in mm) FEATURES • GaAs ACTIVE DEVICES PACKAGE OUTLINE H02 • LOW DISTORTION • HIGH LINEAR GAIN: MC-7834-KC - GL = 21 dB MIN at f = 870 MHz • LOW RETURN LOSS • LOW GAIN CHANGE OVER TEMPERATURE • SPECIFIED FOR 79, 110, and 132 CHANNELS PERFORMANCE • HIGH RELIABILITY AND RUGGEDNESS: Withstands environmental extremes as well as Silicon devices (Surge, ESD, Etc.) 45.08 MAX 38.1±0.25 27.5 MAX 3.2 MAX 4.25 + 0.25 - 0.35 VDD 5 14.85 MAX 4.0±0.25 8.1 MAX 19.05±0.38 1 9 In Out 6-32 unc 2B 25.4±0.25 2 3 7 8 2.54±0.25 0.51±0.050 Gnd 21.5 MAX 7 8 9 DESCRIPTION 4.19±0.13 NEC's MC-7834-KC is a GaAs Multi-Chip Module designed for use as input stages in CATV applications up to 870 MHz. Because this unit is a GaAs device, it has low distortion, low noise figure, and low return loss across the entire frequency band. The MC-7834-KC is similar to NEC's standard push-pull devices, but with the higher current allows better distortion performance, especially X-Mod. Like the previous generation of products, these devices survive such hazards as surge and ESD as well as their silicon competitors, but deliver superior performance with low DC current required. All devices are assembled and tested using fully automated equipment to maximize consistency in part to part performance, and reliability is assured by NEC's stringent quality and process control procedures. These parts come in industry compatible hybrid packages. 2.62–0.35 12.9 MAX 1 2 3 5 10.75±0.25 2.54±0.38 A 6.3 0.38.. A 2.5 ±0.05 APPLICATIONS • CATV HEADEND SYSTEMS • CATV OPTICAL NODES • CATV DISTRIBUTION AMPS ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω) PART NUMBER SYMBOLS BW GL S Gf NF CHARACTERISTICS Frequency Range Linear Gain Gain Slope Gain Flatness Noise Figure 1 Noise Figure 2 MC-7834-KC UNITS MIN TYP MAX MHz dB dB dB dB 50 20.0 0.2 – – – 20.0 19.0 17.5 16.0 180 – – – – – – – – – – – – – – – – – 870 21.0 1.0 0.7 6.5 7.0 – – – – 325 -59 -52 -59 RL Input/Output Return Loss dB IDD CTB XMod CSO Operating Current Composite Triple Beat Cross Modulation Composite Second Order mA dBc dBc dBc TEST CONDITIONS f = 870 MHz f = 40 to 870 MHz 40 to 870 MHz; Peak to Valley f = 50 MHz f = 870 MHz 40 to 160MHz 160 to 320 MHz 320 to 640 MHz 640 to 870 MHz RF OFF f = 40 to 870 MHz; 110 Channels, VOUT = 44 dBmV, Flat California Eastern Laboratories MC-7834-KC RECOMMENDED OPERATING CONDITIONS (Zs = ZL = 75Ω) ABSOLUTE MAXIMUM RATINGS1 (TCASE= 30 °C) UNITS RATINGS SYMBOLS VDD Supply Voltage V 30 VDD VI Input Voltage2 dBmV 65 SYMBOLS TC TSTG PARAMETERS Operating Case Temperature °C -30 to +100 Storage Temperature °C -40 to +100 Note: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Maximum single channel power applied to the input for 1 minute with no measurable degradation in performance. PARAMETERS UNITS MIN TYP MAX Supply Voltage MC-7834-KC V 23.5 24.0 24.5 1 Vi Input Voltage MC-7834-KC TC Operating Case Temperature MC-7834-KC dBmV – 21.0 27.5 °C -30 +25 +85 Note: 1. Test Conditions: 110 Channels, Flat ORDERING INFORMATION PART NUMBER PACKAGE QUANTITY MC-7834-KC 7-pin special with heatsink 50pcs max/ Tray NOTES ON CORRECT USE RECOMMENDED SOLDERING CONDITIONS 1. The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress on the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Recommended space is 2.0 to 3.0 mm typical. 2. Recommended torque strength of the screw is 59 to 78 Ncm. 3. Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Soldering Method Soldering Conditions Condition Symbol Pin Part Heating Pin area temperature: less than 260°C1 Hour: Within 2 sec./pin – Note. 1. The point of pin part heating must be kept at a distance of more than 1.2 mm from the root of lead. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 01/28/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd.