MC-7847-KC D 870 MHz GaAs CATV 25 dB POWER DOUBLER AMPLIFIER OUTLINE DIMENSIONS (Units in mm) FEATURES • GaAs ACTIVE DEVICES UE PACKAGE OUTLINE H02 45.08 MAX 38.1±0.25 27.5 MAX 3.2 MAX + 0.25 - 0.35 VDD 14.85 MAX 5 4.0±0.25 8.1 MAX 19.05±0.38 4.19±0.13 0.38.. A SC O 9 In Out 2 3 7 8 0.51±0.05 Gnd 21.5 MAX 2.62±0.35 12.9 MAX 7 8 9 0.51±0.05 10.75 ±0.25 2.54 ±0.38 A NT The MC-7847-KC is a GaAs Multi-Chip Modules designed for use as output stages in CATV applications up to 870 MHz. This is a high gain device offering 25 dB minimum gain at 870 MHz. Because this unit is a GaAs device it has low distortion, low noise figure, and low return loss across the entire frequency band. The MC-7847-KC is similar to the standard push-pull devices, but the higher current allows for better distortion performance, especially X-mod. Like the previous generation of products, these devices survive such hazards as surge and ESD as well as their silicon competitors, but deliver superior performance with low DC current required. All devices are assembled and tested using fully automated equipment to maximize consistency in part to part performance, and reliability is assured by stringent quality and process control procedures. These parts come in industry compatible hybrid packages. 5 1 6-32 unc 2B 25.4±0.25 2.54±0.25 1 2 3 DESCRIPTION 4.25 IN • LOW DISTORTION • HIGH LINEAR GAIN: MC-7847-KC - GL = 25 dB MIN at f = 870 MHz • LOW RETURN LOSS • LOW GAIN CHANGE OVER TEMPERATURE • SPECIFIED FOR 79, 110, and 132 CHANNELS PERFORMANCE • HIGH RELIABILITY AND RUGGEDNESS: Withstands environmental extremes as well as Silicon devices (Surge, ESD, Etc.) 6.3 2.5 ±0.05 APPLICATIONS • CATV HEADEND SYSTEMS • CATV OPTICAL NODES • CATV DISTRIBUTION AMPS ELECTRICAL CHARACTERISTICS (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω) PART NUMBER CHARACTERISTICS Frequency Range Linear Gain Gain Slope Gain Flatness Noise Figure 1 Noise Figure 2 Input Return Loss DI SYMBOLS BW GL S Gf NF RLi RLO IDD CTB XMod CSO Output Return Loss Operating Current Composite Triple Beat Cross Modulation1 Composite Second Order UNITS MHz dB dB dB dB dB mA mA dBc dBc dBc MIN 50 25.0 1.0 – – – 20.0 20.0 19.5 17.0 20.0 350 – – – MC-7847-KC TYP – – 1.4 – – – – – – – – – – – – 1. Measured per US standard methods and procedures (using selective level meter). Date Published January 2007 MAX 870 26.0 1.8 0.6 5.5 6.0 – – – – – 420 -60 -55 -63 TEST CONDITIONS f = 870 MHz f = 40 to 870 MHz 40 to 870 MHz; Peak to Valley f = 50 MHz f = 870 MHz 40 to 160MHz 160 to 320 MHz 320 to 640 MHz 640 to 870 MHz 40 to 160MHz RF OFF 110 Channels VOUT = 50 dBmV at 745.25 MHz, 10 dB tilted across the band MC-7847-KC VDD PARAMETERS Supply Voltage UNITS RATINGS V 30 VDD Vi VI Input Voltage (Single Tone)2 dBmV 65 TC Operating Case Temperature °C -30 to +100 Storage Temperature °C -40 to +100 TSTG Note: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Maximum single channel power applied to the input for 1 minute with no measurable degradation in performance. SYMBOLS PARAMETERS Supply Voltage V Input Voltage1, MC-7847-KC TC Operating Case Temperature UNITS MIN TYP MAX 23.5 24.0 24.5 dBmV – 32.0 35.0 °C -30 +25 +85 Note: 1. Test Conditions: 110 Channels, 10 dB tilted across the band. UE SYMBOLS RECOMMENDED OPERATING CONDITIONS (Zs = ZL = 75Ω) D ABSOLUTE MAXIMUM RATINGS1 (TCASE= 30 °C) ORDERING INFORMATION PACKAGE QUANTITY 7-pin special with heatsink (Pb-Free) 25 pcs max/ Tray NT IN PART NUMBER MC-7847-KC-AZ RECOMMENDED SOLDERING CONDITIONS 1. The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress on the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. SC O NOTES ON CORRECT USE Recommended space is 2.0 to 3.0 mm typical. 2. Recommended torque strength of the screw is 59 to 78 Ncm. 3. Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) DI All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Soldering Method Soldering Conditions Condition Symbol Pin Part Heating Pin area temperature: less than 260°C1 Hour: Within 2 sec./pin – Note. 1. The point of pin part heating must be kept at a distance of more than 1.2 mm from the root of lead. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.