SILICON RFIC HI-IP3 FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER FEATURES UPC8187TB BLOCK DIGRAM • HIGH OUTPUT FREQUENCY: fRFout = 0.8 to 2.5 GHz (Top View) • SUPPLY VOLTAGE: VCC = 2.7 to 3.3 V LO input • HIGH IP3 AND CONVERSION GAIN: OIP3 = +10 dBm typ at fRFout = 0.9 GHz CG = +11 dBm typ at fRFout = 0.9 GHz • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package GND VCC GND RF output IF input DESCRIPTION APPLICATIONS NEC's UPC8187TB is a silicon monolithic integrated circuit designed as a frequency up-converter for wireless transceivers. This IC has higher operating frequency, lower distortion and higher conversion gain than the conventional UPC8163TB. This device is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. • TDMA, PCS, CDMA • Digital Cellular/Cordless Phones • Wireless Tranceivers NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = VRFOUT = 2.8 V, fIFin = 150 MHz, PLOin = -5 dBm) PART NUMBER PACKAGE OUTLINE SYMBOLS ICC CG1 CG2 CG3 PO(SAT)1 PO(SAT)2 PO(SAT)3 OIP31 OIP32 OIP33 IIP31 IIP32 IIP33 SSB•NF1 SSB•NF2 SSB•NF3 PARAMETERS AND CONDITIONS1 UPC8187TB S06 UNITS MIN TYP MAX Circuit Current (no signal) mA 11 15 19 fRFout = 0.83 GHz, PIFin = -20 dBm Conversion Gain, fRFout = 1.9 GHz, PIFin = -20 dBm fRFout = 2.4 GHz, PIFin = -20 dBm fRFout = 0.83 GHz, PIFin = 0 dBm Saturated RF Output Power, fRFout = 1.9 GHz, PIFin = 0 dBm fRFout = 2.4 GHz, PIFin = 0 dBm Output Third-Order Distortion Intercept Point, fRFout = 0.83 GHz fIFin1 = 150 MHz fRFout = 1.9 GHz fIFin2 = 151 MHz fRFout = 2.4 GHz Input Third-Order Distortion Intercept Point, fRFout = 0.83 GHz fIFin1 = 150 MHz fRFout = 1.9 GHz fIFin2 = 151 MHz fRFout = 2.4 GHz fRFout = 0.83 GHz SSB Noise Figure, fRFout = 1.9 GHz fIFin1 = 150 MHz fRFout = 2.4 GHz dB dB dB dBm dBm dBm 8 8 7 +1.5 0 -1.5 11 11 10 +4 +2.5 +1 14 14 13 – – – dBm dBm dBm – – – 10 10 8.5 – – – dBm dBm dBm dB dB dB – – – – – – -1.0 -1.0 -1.5 11 12 12.5 – – – – – – Note: 1. fRFout < fLOin @ fRFout = 0.83 GHz fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz California Eastern Laboratories UPC8187TB ABSOLUTE MAXIMUM RATINGS1 (TA = +25°C unless otherwise specified) SYMBOLS PARAMETERS RECOMMENDED OPERATING CONDITIONS UNITS RATINGS V 3.6 VCC Power Dissipation2 mW 270 TA Operating Ambient Temperature °C -40 to +85 VCC Supply Voltage PD TA SYMBOLS UNITS MIN V Operating Ambient Temperature Local Input Level2 PLOin TSTG Storage Temperature °C -55 to +150 fRFout PIN Maximum Input Power dBm +10 fIFin Notes: 1. Operation in excess of any one of these conditions may result in permanent damage. 2. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy glass PWB, TA = +85°C. PARAMETERS Supply Voltage1 RF Output Frequency3 IF Input Frequency TYP MAX 2.7 2.8 3.3 ˚C -40 +25 +85 dBm -10 -5 0 GHz 0.8 – 2.5 MHz 50 – 400 Notes: 1. Same voltage applied to pins 5 and 6. 2. ZS = 50 Ω (without matching). 3. With external matching circuit. SERIES PRODUCTS1 (TA = +25°C, VCC = VPS = VRFout = 3.0 V, ZS = ZL = 50 Ω) Part Number ICC fRFout (mA) (GHz) @RF 0.9 GHz2 @RF 1.9 GHz UPC8187TB 15 0.8 to 2.5 11 11 10 +10 +10 UPC8106TB 9 0.4 to 2.0 9 7 – +5.5 UPC8172TB 9 0.8 to 2.5 9.5 8.5 8.0 UPC8109TB 5 0.4 to 2.0 6 4 – 16.5 0.8 to 2.0 9 5.5 – +9.5 UPC8163TB CG (dB OIP3 (dBm) PO(SAT) @RF 2.4 GHz @RF 0.9 GHz2 @RF 1.9 GHz @RF 2.4 GHz @RF 0.9 GHz2 @RF 1.9 GHz @RF 2.4 GHz +8.5 +4 +2.5 +1 +2.0 – -2 -4 – +7.5 +6.0 +4.0 +0.5 0 -0.5 +1.5 -1.0 – -5.5 -7.5 – +6.0 – +0.5 -2 – Notes: 1. Typical performance. 2. fRFout = 0.83 GHz @ UPC8163TB and UPC8187TB. PIN FUNCTIONS (Pin Voltage is measured at VCC = VPS = VRFOUT = 2.8V) Pin No. Pin Name Applied Voltage (V) Pin Voltage (V) 1 IFinput — 1.2 2 4 GND GND — Function and Explanation This pin is the IF input pin to the double balanced mixer (DBM). The input is designed as a high impedance. The circuit helps suppress spurious signals. Also this symmetrical circuit can keep specified performance insensitive to processcondition distribution. For that reason, a double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track length should be kept as short as possible to minimize ground inductance. 3 LOinput – 2.1 Local input pin. Recommended input level is -10 to 0 dBm. 5 VCC 2.7 to 3.3 — Supply voltage pin. — This pin is the RF output from the double balanced mixer. This pin is designed as an open collector. Due to the high impedance output, this pin should be externally equipped with an LC matching circuit to the next stage. 6 RFoutput Same bias as VCC through external inductor Equivalent Circuit 5 6 3 1 2 UPC8187TB TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) fRFout = 0.83 GHz RF OUTPUT POWER vs. IF INPUT POWER CONVERSION GAIN vs. LOCAL INPUT POWER 10 RF Output Power, PRFout (dBm) Conversion Gain, CG (dB) 15 10 5 0 -5 -10 -30 fIFin = 150 MHz fLOin = 980 MHz PIFin = -20 dBm VCC = 2.8 V -20 -10 0 5 0 -5 -10 fIFin = 150 MHz fLOin = 980 MHz PIFin = -5 dBm VCC = 2.8 V -15 -20 -20 -10 -20 -20 -20 -20 IF Input Power, PIFin (dBm) Local Input Power, PLOin (dBm) fRFout = 1.9 GHz RF OUTPUT POWER vs. IF INPUT POWER CONVERSION GAIN vs. LOCAL INPUT POWER 10 10 5 0 -5 fIFin = 150 MHz fLOin = 1750 MHz PIFin = -20 dBm VCC = 2.8 V -10 -10 -10 -10 -10 RF Output Power, PRFout (dBm) Conversion Gain, CG (dB) 15 0 -10 -20 -30 -30 -10 fIFin = 150 MHz fLOin = 1750 MHz PIFin = -5 dBm VCC = 2.8 V -20 -10 0 10 IF Input Power, PIFin (dBm) Local Input Power, PLOin (dBm) fRFout = 2.4 GHz RF OUTPUT POWER vs. IF INPUT POWER CONVERSION GAIN vs. LOCAL INPUT POWER 10 10 5 0 -5 fIFin = 150 MHz fLOin = 2250 MHz PIFin = -20 dBm VCC = 2.8 V -10 -30 -20 -10 0 Local Input Power, PLOin (dBm) 10 RF Output Power, PRFout (dBm) Conversion Gain, CG (dB) 15 0 -10 -20 -30 -30 fIFin = 150 MHz fLOin = 2250 MHz PIFin = -5 dBm VCC = 2.8 V -20 -10 0 IF Input Power, PIFin (dBm) 10 UPC8187TB TYPICAL SCATTERING PARAMETERS (TA = 25˚C) RF port (without matching) LO port S22 S11 1.0 GHz 2.25 GHz START STOP 1.0 GHz 1.75 GHz 0.1 GHz 3.1 GHz VCC = VRFOUT = 2.8 V parameters are monitored at DUT pins IF port S11 150 MHz START STOP 0.1 GHz 1.0 GHz 2.25 GHz 1.75 GHz START STOP 0.1 GHz 3.1 GHz UPC8187TB TEST CIRCUIT 1 (fRFout = 0.83 GHz) Strip Line C6 100 pF Spectrum Analyzer Signal Generator L2 5.6 nH 50Ω 1000 pF L1 12 nH 6 RFoutput IFinput 1 C2 5 VCC GND 50 Ω 2 Signal Generator 100 pF 4 VCC C5 C4 10 pF C3 0.1 µF GND LOinput 3 C1 50 Ω 1000 pF ILLUSTRATION OF THE TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD COMPONENT LIST FORM Chip Capacitor Chip Inductor SYMBOL VALUE C1, C6 100 pF C4 10 pF C2, C3 1000 pF C5 0.1µF L1 12 nH L2 5.6nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes UPC8187TB TEST CIRCUIT 2 (fRFout = 1.9 GHz) Strip Line Spectrum Analyzer C6 100 pF 1000 pF Signal Generator 6 RFoutput IFinput 1 50 Ω L2 1.2 nH L1 C2 8.2 nH 5 VCC 2 100 pF 1000 pF VCC GND 4 GND C3 C5 10 pF C4 12 pF 50 Ω Signal Generator LOinput 3 C1 50 Ω 1000 pF ILLUSTRATION OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD COMPONENT LIST FORM SYMBOL VALUE Chip Capacitor C1, C2, C4 1000 pF C7 0.1µF C6 100 pF C3 12 pF C5 10 pF L1 8.2 nH L2 1.2 nH Chip Inductor 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes UPC8187TB TEST CIRCUIT 3 (fRFout = 2.4 GHz) Strip Line Spectrum Analyzer C6 100 pF L C1 470 nH 5 VCC C3 GND 2 100 pF 1000 pF VCC 4 GND C4 10 pF C5 1000 pF Signal Generator 6 RFoutput IFinput 1 C7 1.2 pF 50 Ω 1000 pF C9 1.8 pF 50 Ω C10 1.5 pF Signal Generator LOinput 3 C2 50 Ω 1000 pF ILLUSTRATION OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD COMPONENT LIST FORM SYMBOL VALUE Chip Capacitor C1, C3, C5 1000 pF C2, C6 100 pF C4 10 pF C7 1.2 pF C9 1.8 pF C10 1.5 pF L 470 nH Chip Inductor 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes UPC8187TB OUTLINE DIMENSIONS (Units in mm) PIN CONNECTIONS PACKAGE OUTLINE S06 3 +0.10 0.2 -0.05 0.65 2 0.65 1 1.3 C3G 1.25 ±0.1 2.0 ±0.2 (Bottom View) (Top View) 2.1 ±0.1 4 4 3 5 5 2 6 6 1 0.1 MIN PIN NO. PIN NAME 1 IFinput 0.9 ± 0.1 0.7 0.15 +0.10 0 to 0.1 -0.05 Note: All dimensions are typical unless otherwise specified. 2 GND 3 LOinput 4 GND 5 VCC 6 RFoutput ORDERING INFORMATION Part Number Quantity UPC8187TB-E3-A 3 K pcs/reel Note: Embossed tape, 8 mm wide. Pins 1, 2 and 3 face the tape perforation side. SYSTEM APPLICATION EXAMPLE (Schematic of IC location in the system) LNA DEMO RX VCO ÷N I Q PLL SW PLL I 0˚ Phase Shifter 90˚ TX PA UPC8187TB Q Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 06/14/2001 DATA SUBJECT TO CHANGE WITHOUT NOTICE 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. 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