SILICON RFIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER FEATURES UPC8172TB BLOCK DIAGRAM • RECOMMENDED OPERATING FREQUENCY: fRFout = 0.8 to 2.5 GHz • SUPPLY VOLTAGE: VCC = 2.7 to 3.3 V • HIGHER IP3 AND CONVERSION GAIN: CG = 9.5 dB TYP OIP3 = +7.5 dBm TYP @ fRFout = 0.9 GHz • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (Top View) LO input PS VCC GND RF output IF input DESCRIPTION APPLICATIONS NEC's UPC8172TB is a silicon monolithic integrated circuit designed as a frequency up-converter for a wireless transceiver transmitter stage. This IC is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This IC has the same circuit current as the conventional UPC8106TB, but operates at higher frequency, higher gain and lower distortion. Such performance and operation from a 3 volts supply makes this device ideal for mobile communications and wireless LAN applications. • PCS1900 MHz • 2.4 GHz band transmitter/receiver system (wireless LAN, etc.) NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = VRFOUT = 3.0 V, fIFin = 240 MHz, PLOin = -5 dBm, and VPS ≥2.7 V unless otherwise specified)) PART NUMBER PACKAGE OUTLINE SYMBOLS ICC ICC(PS) CG1 CG2 CG3 PO(SAT)1 PO(SAT)2 PO(SAT)3 OIP31 OIP32 OIP33 IIP31 IIP32 IIP33 SSB•NF1 SSB•NF2 SSB•NF3 TPS(rise) TPS(fall) PARAMETERS AND CONDITIONS1 UPC8172TB S06 UNITS MIN TYP MAX Circuit Current (no signal) mA 5.5 9.0 13.0 Circuit Current in Power Save Mode, VPS = 0 V fRFout = 0.9 GHz, PIFin = -30 dBm Conversion Gain, fRFout = 1.9 GHz, PIFin = -30 dBm fRFout = 2.4 GHz, PIFin = -30 dBm fRFout = 0.9 GHz, PIFin = 0 dBm Saturated RF Output Power, fRFout = 1.9 GHz, PIFin = 0 dBm fRFout = 2.4 GHz, PIFin = 0 dBm Output Third-Order Distortion Intercept Point, fRFout = 0.9 GHz fIFin1 = 240 MHz fRFout = 1.9 GHz fIFin2 = 241 MHz fRFout = 2.4 GHz Input Third-Order Distortion Intercept Point, fRFout = 0.9 GHz fIFin1 = 240 MHz fRFout = 1.9 GHz fIFin2 = 241 MHz fRFout = 2.4 GHz fRFout = 0.9 GHz, fIFin1 = 240 MHz SSB Noise Figure, fRFout = 1.9 GHz, fIFin1 = 240 MHz fRFout = 2.4 GHz, fIFin1 = 240 MHz Power Save Response Time Rise Time, VPS: GND’VCC Fall Time, VPS: VCC’GND µA dB dB dB dBm dBm dBm – 6.5 5.5 5.0 -2.5 -3.5 -4.0 – 9.5 8.5 8.0 0.5 0 -0.5 2 12.5 11.5 11.0 – – – dBm dBm dBm – – – 7.5 6.0 4.0 – – – dBm dBm dBm dB dB dB µs µs – – – – – – – – -2.0 -2.5 -4.0 9.5 10.4 10.6 1 1.5 – – – – – – – – Note: 1. fRFout < fLOin @ fRFout = 0.9 GHz fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz California Eastern Laboratories UPC8172TB ABSOLUTE MAXIMUM RATINGS1 RECOMMENDED OPERATING CONDITIONS (TA = +25°C unless otherwise specified) SYMBOLS PARAMETERS UNITS RATINGS VCC Supply Voltage V 3.6 VPS PS Pin Input Voltage V 3.6 PD Power Dissipation2 mW 270 TA Operating Ambient Temperature °C -40 to +85 Storage Temperature °C -55 to +150 dBm +10 TSTG PIN Input Power SYMBOLS VCC TA PARAMETERS UNITS MIN Supply Voltage1 V Operating Ambient Temperature TYP MAX 2.7 3.0 3.3 +85 ˚C -40 +25 PLOin Local Input Level2 dBm -10 -5 0 fRFout RF Output Frequency3 GHz 0.8 – 2.5 IF Input Frequency MHz 50 – 400 fIFin Note: 1. Same voltage applied to pins 5 and 6. 2. ZS = 50 Ω (without matching). 3. With external matching circuit. Notes: 1. Operation in excess of any one of these conditions may result in permanent damage. 2. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy glass PWB, TA = +85°C. SERIES PRODUCTS1 (TA = +25°C, VCC = VRFout = 3.0 V, ZS = ZL = 50 Ω) Part Number UPC8172TB ICC fRFout (mA) (GHz) @RF 0.9 GHz2 @RF 1.9 GHz CG (dB @RF 2.4 GHz @RF 0.9 GHz2 @RF 1.9 GHz OIP3 (dBm) @RF 2.4 GHz 9 0.8 to 2.5 9.5 8.5 8.0 +7.5 +6.0 +4.0 UPC8106TB 9 0.4 to 2.0 9 7 – +5.5 -1.0 – UPC8109TB 5 0.4 to 2.0 6 4 – +1.5 +2.0 – UPC8163TB 16.5 0.8 to 2.0 9 5.5 – +9.5 +6.0 – Notes: 1. Typical performance. 2. fRFout = 0.83 GHz @ UPC8163TB PIN FUNCTIONS (Voltage is measured at VCC = VPS = VRFOUT = 3.0 V) Pin No. Pin Name Applied Voltage (V) Pin Voltage (V) 1 IFinput — 1.4 2 GND GND — Function and Explanation This pin is the IF input pin to the double balanced mixer (DBM). The input is designed as a high impedance. The circuit helps suppress spurious signals. Also this symmetrical circuit can keep specified performance insensitive to processcondition distribution. For that reason, a double balanced mixer is adopted. LOinput – 2.3 Local input pin. Recommendable input level is -10 to 0 dBm. 5 VCC 2.7 to 3.3 — Supply voltage pin. — This pin is the RF output from the double balanced mixer. This pin is designed as an open collector. Due to the high impedance output, this pin should be externally equipped with an LC matching circuit to the next stage. 4 RFoutput Same bias as VCC through external inductor PS VCC/GND 5 6 3 GND pin. Ground pattern on the board should be formed as wide as possible. Track length should be kept as short as possible to minimize ground inductance. 3 6 Equivalent Circuit 2 Power save control pin. Bias controls operate as follows: Pin Bias VCC GND 1 VCC 5 Control Operation Power Save 4 GND 2 UPC8172TB TYPICAL PERFORMANCE CURVES (TA = 25°C) CIRCUIT CURRENT vs. PS PIN INPUT VOLTAGE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 10 10 Circuit Current, ICC (mA) 12 Circuit Current, ICC (mA) 12 TA = +85°C 8 6 TA = +25°C 4 TA = -40°C 8 6 4 2 2 no signal VCC = VPS VCC = 3.0 V 0 0 0 1 2 3 4 0 1 2 3 4 PS Pin Input Voltage, VPS (V) Supply Voltage, VCC (V) CONVERSION GAIN vs. LOCAL INPUT LEVEL PS PIN CONTROL RESPONSE TIME 15 ATT = 10 dB 10 dB/DIV (Vertical axis) CENTER = 0.9 GHz SPAN = 0 Hz RBW = 3 MHz VBW = 3 MHz SWP = 50 µsec Conversion Gain, CG (dB) REF LVL = 0 dBm 10 VCC = 3.0 V 5 0 -5 fRFout = 900 MHz fLOin = 1140 MHz PIFin = -30 dBm VCC = VPS -10 5 µsec/DIV (Horizontal axis) -15 -30 -25 -20 -15 -10 -5 0 5 10 Local Input Level, PLOin (dBm) RF OUTPUT LEVEL vs. IF INPUT LEVEL CONVERSION GAIN vs. LOCAL INPUT LEVEL 15 0 Conversion Gain, CG (dB) RF Output Level, PRFout (dBm) 5 VCC = 3.0 V -5 -10 -15 fRFout = 900 MHz fLOin = 1140 MHz PLOin = -5 dBm VCC = VPS -20 10 VCC = 3.0 V 5 0 -5 fRFout = 1.9 GHz fLOin = 1660 MHz PLOin = -30 dBm VCC = VPS -10 -15 -25 -30 -25 -20 -15 -10 -5 0 IF Input Level, PIFin (dBm) 5 10 -30 -25 -20 -15 -10 -5 0 5 Local Input Level, PLOin (dBm) 10 UPC8172TB TYPICAL PERFORMANCE CURVES (TA = 25°C) CONVERSION GAIN vs. LOCAL INPUT LEVEL RF OUTPUT LEVEL vs. IF INPUT LEVEL 15 0 Conversion Gain, CG (dB) RF Output Level, PRFout (dBm) 5 VCC = 3.0 V -5 -10 -15 fRFout = 1.9 GHz fLOin = 1660 MHz PLOin = -5 dBm VCC = VPS -20 -25 -30 -25 -20 -15 -10 -5 0 5 10 VCC = 3.0 V 5 0 –5 –15 –30 10 0 VCC = 3.0 V –5 –10 –15 fRFout = 2.4 GHz fLOin = 2160 MHz PLOin = –5 dBm VCC = VPS –25 –20 –15 –10 –5 0 5 10 3rd Order Intermodulation Distortion, IM3 (dBm) RF Output Level of Each Tone, PRFout (dBm) IF Input Level, PIFin (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 –40 TA = +25ºC Vcc = VPS = 3.0 V fRFout = 1.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1660 MHz PLOin = –5 dBm –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 IF Input Level, PIFin (dBm) 0 5 3rd Order Intermodulation Distortion, IM3 (dBm) RF Output Level of Each Tone, PRFout (dBm) RF Output Level, PRFout (dBm) 5 3rd Order Intermodulation Distortion, IM3 (dBm) RF Output Level of Each Tone, PRFout (dBm) RF OUTPUT LEVEL vs. IF INPUT LEVEL –25 –30 –25 –20 –15 –10 –5 0 5 10 Local Input Level, PLOin (dBm) IF Input Level, PIFin (dBm) –20 fRFout = 2.4 GHz fLOin = 2160 MHz PIFin = –30 dBm VCC = VPS –10 IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 –40 TA = +25ºC Vcc = VPS = 3.0 V fRFout = 900 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 1140 MHz PLOin = –5 dBm –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 5 0 IF Input Level, PIFin (dBm) IM3, RF OUTPUT LEVEL vs. IF INPUT LEVEL 10 0 –10 –20 –30 –40 TA = +25ºC Vcc = VPS = 3.0 V fRFout = 2.4 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fLOin = 2160 MHz PLOin = –5 dBm –50 –60 –70 –80 –30 –25 –20 –15 –10 –5 IF Input Level, PIFin (dBm) 0 5 UPC8172TB TYPICAL PERFORMANCE CURVES (TA = 25°C) LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY 0 Local Leakage at IF Pin LOif (dBm) Local Leakage at IF Pin, LOif (dBm) 0 –10 –20 –30 –40 fRFout = 900 MHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 –40 fRFout = 1.9 GHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 Local Input Frequency, fLOin (GHz) Local Input Frequency, fLOin (GHz) LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 3 0 Local Leakage at RF Pin LOrf, (dBm) Local Leakage at RF Pin, LOrf (dBm) –30 3 0 –10 –20 –30 –40 fRFout = 900 MHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 –10 –20 –30 –40 fRFout = 1.9 GHz PLOin = –5 dBm Vcc = VPS = 3.0 V –50 –50 0 3 0.5 1 1.5 2 2.5 Local Input Frequency, fLOin (GHz) Local Input Frequency, fLOin (GHz) LOCAL LEAKAGE AT IF PIN vs. LOCAL INPUT FREQUENCY LOCAL LEAKAGE AT RF PIN vs. LOCAL INPUT FREQUENCY 0 3 0 Local Leakage at RF Pin LOrf, (dBm) Local Leakage at IF Pin LOrf, (dBm) –20 –50 –50 –10 –20 –30 –40 –50 –10 fRFout = 2.4 GHz PLOin = –5 dBm Vcc = VPS = 3.0 V 0 0.5 1 1.5 2 2.5 Local Input Frequency, fLOin (GHz) 3 –10 –20 –30 –40 fRFout = 2.4 GHz PLOin = –5 dBm Vcc = VPS = 3.0 V –50 0 0.5 1 1.5 2 2.5 Local Input Frequency, fLOin (GHz) 3 UPC8172TB SYSTEM APPLICATION EXAMPLE Wireless Transceiver LNA DEMO RX VCO ÷N I Q PLL SW PLL I 0˚ Phase Shifter 90˚ TX PA UPC8172TB Q UPC8172TB S-PARAMETERS FOR EACH PORT (VCC = VPS = VRFout = 3.0 V) (The paramters are monitored at DUT pins) LO port RF port (without matching) S11 Z REF 1.0 Units 1 200.0 mUnits/ 21.625 Ω -91.148 Ω hp MARKER 1 1.15 GHz MARKER 2 1.65 GHz MARKER 3 2.15 GHz Z S22 REF 1.0 Units 1 200.0 mUnits/ 71.5 Ω -240.34 Ω hp MARKER 1 900 MHz MARKER 2 1.9 GHz MARKER 3 2.5 GHz ∆ ∆ 1 1 3 3 START STOP 2 START STOP 0.400000000 GHz 2.500000000 GHz IF port S11 Z REF 1.0 Units 1 200.0 mUnits/ 332.63 Ω -601.34 Ω hp MARKER 1 240.0 MHz ∆ 1 START STOP 0.100000000 GHz 1.000000000 GHz 0.400000000 GHz 2.500000000 GHz 2 UPC8172TB TEST CIRCUIT 1 (fRFout = 900 MHz) Strip Line Spectrum Analyzer 6 50 Ω C3 C8 RFoutput IFinput 1 50 Ω C1 10 nH L 5 VCC GND 2 Signal Generator 100 pF 100 pF VCC Signal Generator 100 pF 100 pF 1 pF 4 C5 C7 C6 C4 PS LOinput 3 50 Ω C2 1000 pF 1 µF 68 pF 1 µF EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD LOinput PS Bias C4 C2 PS VCC GND C5 C7 C6 L Voltage Supply C8 IFinput C1 C3 RFoutput UPC8172TB COMPONENT LIST FORM Chip Capacitor SYMBOL VALUE C1, C2, C3 100 pF C4 1000 pF C5, C6 1 µF C7 68 pF C8 1 pF L 10 nH1 Chip Inductor Note: 1. 10 nH: LL1608-FH10N (TOKO Co., Ltd.) (*1) 35x42x0.4 mm polymide board, double-sided copper clad (*2) Ground pattern on rear of the board (*3) Solder plated patterns (*4) mmm : Through holes UPC8172TB TEST CIRCUIT 2 (fRFout = 1.9 GHz) Strip Line Spectrum Analyzer 50 Ω 2.75 pF 6 L C8 RFoutput 1 50 Ω C1 GND 2 Signal Generator 100 pF 100 pF C5 IFinput 470 nH 5 VCC VCC Signal Generator 100 pF 100 pF C3 4 C7 C6 PS LOinput 3 50 Ω C2 1000 pF C4 1 µF 30 pF 1 µF EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD LOinput PS Bias C4 C2 PS VCC GND L C5 C7 C6 Voltage Supply IFinput C1 C3 RFoutput UPC8172TB COMPONENT LIST FORM Chip Capacitor SYMBOL VALUE C1, C2, C3 100 pF C4 1000 pF C5, C6 1 µF C7 30 pF Chip Inductor Note: 1. 470 nH: LL2012-FR47 (TOKO Co., Ltd.) C8 2.75 pF L 470 nH1 (*1) 35 x 42 x 0.4 mm polymide board, double-sided copper clad (*2) Ground pattern on rear of the board (*3) Solder plated patterns (*4) m m m: Through holes UPC8172TB TEST CIRCUIT 3 (fRFout = 2.4 GHz) Strip Line Spectrum Analyzer 50 Ω 1.75 pF 6 C8 RFoutput IFinput 1 50 Ω C1 470 nH L 5 VCC GND 2 Signal Generator 100 pF 100 pF VCC Signal Generator 100 pF 100 pF C3 4 C5 C7 C6 PS LOinput 3 50 Ω C2 1000 pF C4 1 µF 10 pF 1 µF EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD LOinput PS Bias C4 C2 PS VCC GND L C5 C7 C6 Voltage Supply IFinput C1 C8 C3 RFoutput UPC8172TB COMPONENT LIST FORM Chip Capacitor SYMBOL VALUE C1, C2, C3 100 pF C4 1000 pF C5, C6 1 µF Chip Inductor Note: 1. 470 nH: LL2012-FR47 (TOKO Co., Ltd.) C7 10 pF C8 1.75 pF L 470 nH1 (*1) 35 x 42 x 0.4 mm polymide board, double-sided copper clad (*2) Ground pattern on rear of the board (*3) Solder plated patterns (*4) m m m: Through holes UPC8172TB OUTLINE DIMENSIONS (Units in mm) BLOCK DIAGRAM PACKAGE OUTLINE S06 (Top View) 2.1 ±0.1 LO input PS 1.25 ±0.1 +0.10 VCC GND 0.2 -0.05 0.65 2.0 ±0.2 1.3 RF output IF input 0.65 0.1 MIN 0.9 ± 0.1 0.7 0 to 0.1 0.15 +0.10 -0.05 Note: All dimensions are typical unless otherwise specified. PIN CONNECTIONS (Bottom View) 3 2 1 C3A (Top View) 4 4 3 5 5 2 6 6 1 PIN NO. PIN NAME 1 IFinput 2 GND 3 LOinput 4 PS 5 VCC 6 RFoutput ORDERING INFORMATION Part Number Quantity UPC8172TB-E3-A 3 K pcs/reel Note: Embossed tape, 8 mm wide. Pins 1, 2 and 3 face the tape perforation side. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 06/14/2001 DATA SUBJECT TO CHANGE WITHOUT NOTICE 5-150 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected -AZ (*) ; Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. 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