TI 2H_

TXS0102
www.ti.com .............................................................................................................................................. SCES640B – JANUARY 2007 – REVISED JANUARY 2009
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
FEATURES
1
• No Direction-Control Signal Needed
• Max Data Rates
– 24 Mbps (Push Pull)
– 2 Mbps (Open Drain)
• Available in the Texas Instruments NanoFree™
Package
• 1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on
B port (VCCA ≤ VCCB)
• VCC Isolation Feature – If Either VCC Input Is at
GND, Both Ports Are in the High-Impedance
State
• No Power-Supply Sequencing Required –
Either VCCA or VCCB Can Be Ramped First
• Ioff Supports Partial-Power-Down Mode
Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– A Port
– 2500-V Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
– B Port
– 8-kV Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
2
TYPICAL LEVEL-SHIFTER
APPLICATIONS
•
•
•
I2C/SMBus
UART
GPIO
DCT OR DCU PACKAGE
(TOP VIEW)
B2
1
8
B1
GND
2
7
VCCB
VCCA
3
6
OE
A2
4
5
A1
YZP PACKAGE
(BOTTOM VIEW)
A2
D1
4 5
D2
VCCA
C1
3 6
C2
A1
OE
GND
B1
2 7
B2
VCCB
B2
A1
1 8
A2
B1
DESCRIPTION/ORDERING INFORMATION
This two-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track VCCB. VCCA
must be less than or equal to VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for
low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2009, Texas Instruments Incorporated
TXS0102
SCES640B – JANUARY 2007 – REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com
ORDERING INFORMATION
TA
PACKAGE
(1) (2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
–40°C to 85°C
SSOP – DCT
VSSOP – DCU
(1)
(2)
(3)
ORDERABLE PART NUMBER
TOP-SIDE MARKING (3)
Reel of 3000
TXS0102YZPR
2H_
Reel of 3000
TXS0102DCTR
NFE_ _ _
Tube of 250
TXS0102DCTT
NFE _ _ _
Reel of 3000
TXS0102DCUR
NFE_
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
PIN DESCRIPTION
(DCT AND DCU PACKAGES)
NO.
NAME
FUNCTION
1
B2
2
GND
Input/output B. Referenced to VCCB.
Ground
3
VCCA
A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB
4
A2
Input/output A. Referenced to VCCA.
5
A1
Input/output A. Referenced to VCCA.
6
OE
3-state output mode enable. Pull OE low to place all outputs in 3-state mode.
Referenced to VCCA.
7
VCCB
8
B1
B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V
Input/output B. Referenced to VCCB.
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
0.1 mF
0.1 mF
1.8 V
System
Controller
Data
2
VCCA
VCCB
OE
A1
A2
B1
B2
1 mF
3.3 V
System
Data
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
TXS0102
www.ti.com .............................................................................................................................................. SCES640B – JANUARY 2007 – REVISED JANUARY 2009
ABSOLUTE MAXIMUM RATINGS (1)
over recommended operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCCA
Supply voltage range
–0.5
4.6
V
VCCB
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
A port
–0.5
4.6
B port
–0.5
6.5
VO
Voltage range applied to any output
in the high-impedance or power-off state (2)
A port
–0.5
4.6
B port
–0.5
6.5
VO
Voltage range applied to any output in the high or low state (2) (3)
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCCA, VCCB, or GND
θJA
Package thermal impedance (4)
Tstg
(1)
(2)
(3)
(4)
DCT package
220
DCU package
227
YZP package
102
Storage temperature range
–65
150
UNIT
V
V
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1) (2)
VCCA
VCCA
VCCB
Supply
voltage (3)
VIH
High-level
input voltage
1.65 V to 1.95 V
A-port I/Os
2.3 V to 3.6 V
B-port I/Os
OE input
VCCB
2.3 V to 5.5 V
1.65 V to 3.6 V
2.3 V to 5.5 V
1.65 V to 3.6 V
2.3 V to 5.5 V
A-port I/Os
Low-level
input voltage
VIL
B-port I/Os
OE input
Δt/Δv
TA
(1)
(2)
(3)
A-port I/Os, push-pull driving
Input transition
B-port I/Os, push-pull driving
rise or fall rate
Control input
MIN
MAX
1.65
3.6
2.3
5.5
VCCI – 0.2
VCCI
VCCI – 0.4
VCCI
VCCI – 0.4
VCCI
VCCA × 0.65
5.5
0
0.15
0
0.15
0
VCCA × 0.35
UNIT
V
V
V
10
1.65 V to 3.6 V
2.3 V to 5.5 V
Operating free-air temperature
10
ns/V
10
–40
85
°C
VCCI is the supply voltage associated with the input port.
VCCO is the supply voltage associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
3
TXS0102
SCES640B – JANUARY 2007 – REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com
ELECTRICAL CHARACTERISTICS (1) (2) (3)
over recommended operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
VCCA
VCCB
VOHA
IOH = –20 µA,
VIB ≥ VCCB – 0.4 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOLA
IOL = 1 mA,
VIB ≤ 0.15 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOHB
IOH = –20 µA,
VIA ≥ VCCA – 0.2 V
1.65 V to 3.6 V
2.3 V to 5.5 V
VOLB
IOL = 1 mA,
VIA ≤ 0.15 V
1.65 V to 3.6 V
2.3 V to 5.5 V
PARAMETER
II
Ioff
IOZ
4
VCCA × 0.67
UNIT
V
0.4
VCCB × 0.67
V
V
0.4
V
2.3 V to 5.5 V
±1
±2
µA
0V
0 to 5.5 V
±1
±2
µA
B port
0 to 3.6 V
0V
±1
±2
µA
1.65 V to 3.6 V
2.3 V to 5.5 V
±1
±2
µA
1.65 V to VCCB
2.3 V to 5.5 V
2.4
3.6 V
0V
2.2
0V
5.5 V
–1
1.65 V to VCCB
2.3 V to 5.5 V
12
3.6 V
0V
–1
0V
5.5 V
1
1.65 V to VCCB
2.3 V to 5.5 V
OE
3.3 V
3.3 V
2.5
A or B port
3.3 V
3.3 V
10
A or B port
VI = VO = open,
IO = 0
VI = VO = open,
IO = 0
ICCA + ICCB
(1)
(2)
(3)
MIN MAX
1.65 V to 3.6 V
ICCB
Cio
–40°C to 85°C
TYP MAX
A port
OE
ICCA
CI
TA = 25°C
MIN
VI = VCCI or GND,
IO = 0
A port
5
6
B port
6
7.5
µA
µA
14.4
µA
3.5
pF
pF
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
TXS0102
www.ti.com .............................................................................................................................................. SCES640B – JANUARY 2007 – REVISED JANUARY 2009
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN
Data rate
tw
Pulse
duration
MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCC = 3.3 V
± 0.3 V
MIN
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
21
22
24
2
2
2
47
45
41
500
500
500
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN
Data rate
tw
Pulse
duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCC = 3.3 V
± 0.3 V
MAX
MIN
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
20
22
24
2
2
2
50
45
41
500
500
500
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCC = 3.3 V
± 0.3 V
MIN
Data rate
tw
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
23
24
2
2
43
41
500
500
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
Mbps
ns
5
TXS0102
SCES640B – JANUARY 2007 – REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3
V
± 0.3 V
VCCB = 5 V
± 0.5 V
MIN MAX
MIN MAX
MIN MAX
5.3
5.4
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
2.3
Push-pull driving
Open-drain driving
B
A
ten
OE
A or B
tdis
OE
A or B
tPLH
Open-drain driving
45
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
2.4
260
1.9
5.3
36
175
208
1.1
4.4
36
140
27
198
4
0.5
27
40
200
ns
35
ns
3.2
9.5
2.3
9.3
2
7.6
Open-drain driving
38
165
30
132
22
95
Open-drain driving
Push-pull driving
4
10.8
2.7
9.1
2.7
7.6
34
145
23
106
10
58
2
5.9
1.9
6
1.7
13.3
Open-drain driving
4.4
6.9
4.3
6.4
4.2
6.1
Push-pull driving
2.9
13.8
2.8
16.2
2.8
16.2
Open-drain driving
6.9
13.8
7.5
16.2
7
16.2
0.7
Push-pull driving
Open-drain driving
Submit Documentation Feedback
0.7
0.7
21
22
24
2
2
2
ns
102
Push-pull driving
Push-pull driving
ns
4.7
1.2
200
50
10
7.5
4.5
200
UNIT
6.8
2.6
4.5
5.3
45
9.6
7.1
4.4
Push-pull driving
Open-drain driving
8.8
6.8
Push-pull driving
tPHL
6
TEST
CONDITIONS
ns
ns
ns
ns
Mbps
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
TXS0102
www.ti.com .............................................................................................................................................. SCES640B – JANUARY 2007 – REVISED JANUARY 2009
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB = 2.5
V
± 0.2 V
MIN MAX
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
1.7
B
A
ten
OE
A or B
tdis
OE
A or B
tPLH
Open-drain driving
43
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
2
250
1.8
4.7
36
170
3.8
2.1
206
2.6
4.2
27
37
140
190
4
1
27
200
50
40
200
ns
35
ns
2.8
7.4
2.6
6.6
1.8
5.6
Open-drain driving
34
149
28
121
24
89
Push-pull driving
3.2
8.3
2.9
7.2
2.4
6.1
Open-drain driving
35
151
24
112
12
64
Push-pull driving
1.9
5.7
1.9
5.5
1.8
5.3
Open-drain driving
4.4
6.9
4.3
6.2
4.2
5.8
Push-pull driving
2.2
7.8
2.4
6.7
2.6
6.6
Open-drain driving
5.1
8.8
5.4
9.4
5.4
10.4
Push-pull driving
Open-drain driving
0.7
0.7
20
22
24
2
2
2
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
ns
103
Push-pull driving
0.7
ns
4.3
1.2
1.6
200
5.8
4.4
3.6
2.5
44
6
UNIT
MIN MAX
4.1
3
Push-pull driving
Open-drain driving
6.3
MAX
VCCB = 5 V
± 0.5 V
3.7
3.5
Push-pull driving
tPHL
MIN
3.2
Push-pull driving
Open-drain driving
VCCB = 3.3 V
± 0.3 V
ns
ns
ns
ns
ns
Mbps
7
TXS0102
SCES640B – JANUARY 2007 – REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 3.3 V
± 0.3 V
MIN
Push-pull driving
tPHL
A
B
tPLH
Open-drain driving
4.2
36
204
3.1
1.4
124
4.6
4.4
28
2.5
1
UNIT
MIN MAX
4.2
Push-pull driving
Open-drain driving
MAX
VCCB = 5 V
± 0.5 V
2.4
1.3
Push-pull driving
Open-drain driving
tPHL
ns
165
3.3
1
97
B
A
ten
OE
A or B
200
200
ns
tdis
OE
A or B
40
35
ns
tPLH
Push-pull driving
Open-drain driving
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
Max data rate
8
TEST
CONDITIONS
2.5
3
139
2.6
3
105
Push-pull driving
2.3
5.6
1.9
4.8
Open-drain driving
25
116
19
85
Push-pull driving
2.5
6.4
2.1
7.4
Open-drain driving
26
116
14
72
Push-pull driving
2
5.4
1.9
5
Open-drain driving
4.3
6.1
4.2
5.7
Push-pull driving
2.3
7.4
2.4
7.6
5
7.6
4.8
8.3
Open-drain driving
0.7
Push-pull driving
Open-drain driving
Submit Documentation Feedback
0.7
23
24
2
2
ns
ns
ns
ns
ns
ns
Mbps
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
TXS0102
www.ti.com .............................................................................................................................................. SCES640B – JANUARY 2007 – REVISED JANUARY 2009
PRINCIPLES OF OPERATION
Applications
The TXS0102 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another. The TXS0102 is ideal for use in applications where an open-drain
driver is connected to the data I/Os. The TXS0102 can also be used in applications where a push-pull driver is
connected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications.
Architecture
The TXS0102 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A.
VCCB
VCCA
T1
Oneshot
Oneshot
10k
T2
10k
Gate Bias
A
B
Figure 1. Architecture of a TXS01xx Cell
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot
turns on the PMOS transistors (T1, T2) for a short duration, which speeds up the low-to-high transition.
Input Driver Requirements
The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of
the TXS0102. Similarly, the tPHL and max data rates also depend on the output impedance of the external driver.
The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance of the
external driver is less than 50 Ω.
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first.
Enable and Disable
The TXS0102 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
9
TXS0102
SCES640B – JANUARY 2007 – REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com
Pullup or Pulldown Resistors on I/O Lines
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O
to VCCA or VCCB (in parallel with the internal 10-kΩ resistors).
10
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
TXS0102
www.ti.com .............................................................................................................................................. SCES640B – JANUARY 2007 – REVISED JANUARY 2009
PARAMETER MEASUREMENT INFORMATION
VCCI
VCCO
VCCI
VCCO
DUT
IN
DUT
IN
OUT
OUT
1 MW
15 pF
1 MW
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × VCCO
50 kW
From Output
Under Test
15 pF
S1
Open
50 kW
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
TEST
S1
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
tw
VCCI
VCCI/2
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
0V
tPLZ
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VCCO/2
0.9 y VCCO
0.1 y VCCO
VOH
VCCO/2
VOL
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VCCA/2
VCCO
VCCO/2
0.1 y VCCO
VOL
tPHZ
tPZH
VOH
0.9 y VCCO
VCCO/2
0V
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
Submit Documentation Feedback
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): TXS0102
11
PACKAGE OPTION ADDENDUM
www.ti.com
16-Dec-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TXS0102DCTR
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102DCTRE4
ACTIVE
SM8
DCT
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102DCTT
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102DCTTE4
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102DCTTG4
ACTIVE
SM8
DCT
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102DCUR
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102DCURG4
ACTIVE
US8
DCU
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102DCUT
ACTIVE
US8
DCU
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102DCUTG4
ACTIVE
US8
DCU
8
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0102YZPR
ACTIVE
DSBGA
YZP
8
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Dec-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TXS0102DCUR
US8
DCU
8
3000
180.0
9.2
2.25
3.35
1.05
4.0
8.0
Q3
TXS0102YZPR
DSBGA
YZP
8
3000
180.0
8.4
1.1
2.1
0.56
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Dec-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXS0102DCUR
US8
DCU
8
3000
202.0
201.0
28.0
TXS0102YZPR
DSBGA
YZP
8
3000
220.0
220.0
34.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated