TI TXS0108EPWR

TXS0108E
www.ti.com ..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
FEATURES
1
•
ZXY PACKAGE
(BOTTOM VIEW)
1
A2
A3
A4
A5
A6
A7
A8
OE
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
3
4
5
D
C
B
A
TERMINAL ASSIGNMENTS
1
2
3
4
5
D
VCCB
B2
B4
B6
B8
C
B1
B3
B5
B7
GND
B
A1
A3
A5
A7
OE
A
VCCA
A2
A4
A6
A8
PW PACKAGE
(TOP VIEW)
A1
VCCA
2
RGY PACKAGE
(TOP VIEW)
B1
V
B2
B3
B4
B5
B6
B7
B8
GND
VCCA
A2
A3
A4
A5
A6
A7
A8
B1
•
IEC 61000-4-2 ESD (B Port)
– ±8-kV Contact Discharge
– ±6-kV Air-Gap Discharge
1
20
2
19
3
18
4
5
6
7
17
Exposed
Center
Pad
16
15
14
8
13
9
12
10
11
GND
•
•
A1
•
No Direction-Control Signal Needed
Max Data Rates
– 60 Mbps (Push Pull)
– 2 Mbps (Open Drain)
1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on
B Port (VCCA ≤ VCCB)
No Power-Supply Sequencing Required –
Either VCCA or VCCB Can Be Ramped First
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22 (A Port)
– 2000-V Human-Body Model (A114-B)
– 150-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
OE
•
•
VCCB
B2
B3
B4
B5
B6
B7
B8
The exposed center pad, if used, must be
connected as a secondary ground or left
electrically open.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
DESCRIPTION/ORDERING INFORMATION
This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for low-voltage bidirectional translation between any
of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
TA
PACKAGE
–40°C to 85°C
(1)
(2)
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QFN – RGY
Reel of 1000
TXS0108ERGYR
YF08E
TSSOP – PW
Reel of 2000
TXS0108EPWR
YF08E
UFBGA – ZXY
Reel of 2500
TXS0108EZXYR
YF08E
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
VCCA
V CCB
OE
TXS0108E
1.8-V
System
Controller
Data
2
A1
B1
A2
B2
A3
B3
A4
B4
A5
B5
A6
B6
A7
B7
A8
B8
Submit Documentation Feedback
3.3-V
System
Data
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
MIN
MAX
–0.5
4.6
V
–0.5
5.5
V
A port
–0.5
4.6
B port
–0.5
6.5
A port
–0.5
4.6
B port
–0.5
6.5
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
Supply voltage range
UNIT
VI
Input voltage range (2)
VO
Voltage range applied to any output
in the high-impedance or power-off state (2)
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCCA, VCCB, or GND
Tstg
(1)
(2)
(3)
Storage temperature range
–65
V
V
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
THERMAL IMPEDANCE RATINGS
UNIT
PW package (1)
θJA
(1)
(2)
Package thermal impedance
70
RGY package (2)
80.9
ZXY package (1)
47
°C/W
The package thermal impedance is calculated in accordance with JESD 51-5.
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
3
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
RECOMMENDED OPERATING CONDITIONS (1) (2)
VCCA
VCCA
VCCB
Supply voltage (3)
1.2 V to 1.95 V
A-Port I/Os
VIH
High-level input voltage
1.95 V to 3.6 V
B-Port I/Os
1.2 V to 3.6 V
OE
1.2 V to 1.95 V
A-Port I/Os
VIL
VCCB
Low-level input voltage
1.95 V to 3.6 V
B-Port I/Os
OE
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.2 V to 3.6 V
1.65 V to 5.5 V
1.2 V to 3.6 V
1.65 V to 5.5 V
MIN
MAX
1.2
3.6
1.65
5.5
VCCI – 0.2
VCCI
VCCI – 0.4
VCCI
VCCI – 0.4
VCCI
VCCA × 0.65
5.5
0
0.15
0
0.15
0
0.15
0
VCCA × 0.35
UNIT
V
V
V
A-Port I/Os
push-pull driving
Δt/Δv
Input transition rise or fall
rate
TA
Operating free-air
temperature
B-Port I/Os
push-pull driving
10
ns/V
85
°C
Control input
(1)
(2)
(3)
4
–40
VCCI is the VCC associated with the data input port.
VCCO is the VCC associated with the output port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
ELECTRICAL CHARACTERISTICS (1) (2) (3)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
IOH = –20 µA,
VIB ≥ VCCB – 0.4 V
VOHA
VOLA
1.2 V
1.4 V to 3.6 V
IOZ
0.4
IOL = 400 µA,
VIB ≤ 0.15 V
3V
0.55
1.2 V
1.4 V to 3.6 V
VI = VCCI or GND
0.4
1.65 V to 5.5 V
V
V
VCCB × 0.67
1.65 V
0.4
2.3 V
0.4
3V
0.55
4.5 V
0.55
V
±1
2
µA
1.2 V
1.65 V to 5.5 V
±1
±2
µA
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
2.3 V to 5.5 V
2
3.6 V
0V
2
1.5
±2
0V
5.5 V
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
2.3 V to 5.5 V
6
3.6 V
0V
–1
0V
5.5 V
ICCZA
VI = VO = Open,
IO = 0, OE = GND
1.4 V to 3.6 V
ICCZB
VI = VO = Open,
IO = 0, OE = GND
1.4 V to 3.6 V
(1)
(2)
(3)
1.65 V to 5.5 V
1.65 V to 5.5 V
1.4 V to 3.6 V
B port
0.4
1.2 V
ICCA + ICCB
Cio
0.25
1.2 V to 3.6 V
VI = VCCI or GND,
IO = 0
A port
UNIT
V
VCCA × 0.67
2.3 V
VI = VO = Open,
IO = 0
OE
VCCA × 0.67
IOL = 300 µA,
VIB ≤ 0.15 V
ICCB
Ci
MAX
1.65 V
VI = VO = Open,
IO = 0
ICCA
MIN
IOL = 220 µA,
VIB ≤ 0.15 V
IOL = 620 µA,
VIA ≤ 0.15 V
A or
B port
MAX
1.4 V
IOL = 400 µA,
VIA ≤ 0.15 V
OE
1.65 V to 5.5 V
–40°C to 85°C
TYP
IOL = 180 µA,
VIB ≤ 0.15 V
IOL = 300 µA,
VIA ≤ 0.15 V
II
TA = 25°C
MIN
1.2 V
IOL = 220 µA,
VIA ≤ 0.15 V
VOLB
VCCB
IOL = 135 µA,
VIB ≤ 0.15 V
IOH = –20 µA,
VIA ≥ VCCA – 0.2 V
VOHB
VCCA
1.2 V
1.2 V
1.2 V
3.3 V
3.3 V
2.3 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
3.3 V
3.3 V
µA
–1
1.5
µA
1
3
8
0.05
2
4
6
4.5
5.5
6
7
5.5
6
µA
µA
µA
pF
pF
VCCO is the VCC associated with the output port.
VCCI is the VCC associated with the input port.
VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
5
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
TIMING REQUIREMENTS
TA=25°C, VCCA = 1.2 V
Data rate
tw
Pulse duration
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
TYP
TYP
TYP
TYP
Push-pull driving
20
20
20
20
Open-drain driving
2
2
2
2
Push-pull driving
Data inputs
Open-drain driving
UNIT
Mbps
50
50
50
50
500
500
500
500
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
MIN
Data rate
MAX
Push-pull driving
Pulse duration
Push-pull driving
Data inputs
Open-drain driving
MIN
MAX
VCCB= 3.3 V
± 0.3 V
MIN
VCCB= 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
40
60
60
50
2
2
2
2
Open-drain driving
tw
VCCB = 2.5 V
± 0.2 V
25
16.7
16.7
20
500
500
500
500
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
MIN
Data rate
Push-pull driving
Open-drain driving
tw
Pulse duration
Push-pull driving
Open-drain driving
Data inputs
VCCB = 2.5 V
± 0.2 V
VCCB= 3.3 V
± 0.3 V
VCCB= 5 V
± 0.5 V
MIN
UNIT
MAX
MIN MAX
MIN MAX
40
60
60
60
2
2
2
2
25
16.7
16.7
16.7
500
500
500
500
MAX
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
MIN
Data rate
tw
Pulse duration
Push-pull driving
VCCB = 3.3 V
± 0.3 V
MAX
Open-drain driving
Data inputs
MAX
MIN
UNIT
MAX
60
60
60
2
2
2
Open-drain driving
Push-pull driving
MIN
VCC = 5 V
± 0.5 V
16.7
16.7
16.7
500
500
500
Mbps
ns
TIMING REQUIREMENTS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
MIN
Data rate
tw
6
Pulse duration
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data inputs
Submit Documentation Feedback
VCC = 5 V
± 0.5 V
MAX
MIN
UNIT
MAX
60
60
2
2
16.7
16.7
500
500
Mbps
ns
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.2 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPHL
A
B
tPLH
tPHL
B
A
ten
OE
A or B
tdis
OE
A or B
tPLH
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel
skew
Max data rate
A or B
TEST
CONDITIONS
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
TYP
TYP
TYP
TYP
UNIT
Push-pull driving
6.5
5.9
5.7
5.5
Open-drain driving
11.9
11.1
11.0
11.1
Push-pull driving
7.1
6.3
6.2
6.6
Open-drain driving
293
236
197
152
Push-pull driving
6.4
6
5.8
5.6
Open-drain driving
8.5
6.8
6.2
5.9
Push-pull driving
5.6
4.1
3.6
3.2
Open-drain driving
312
248
192
132
200
200
200
200
ns
16.8
13.9
13.2
13.5
ns
Push-pull driving
Push-pull driving
7.9
6.7
6.5
6.4
Open-drain driving
296
238
185
127
Push-pull driving
6.3
3.3
1.8
1.5
Open-drain driving
236
164
115
60
Push-pull driving
5.8
4.8
4.3
3.8
Open-drain driving
5.9
4.7
4.1
3.5
Push-pull driving
4.6
2.8
2.2
1.9
Open-drain driving
4.5
2.7
2.2
1.9
1
1
1
1
Push-pull driving
20
20
20
20
Open-drain driving
2
2
2
2
Push-pull driving
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
ns
ns
ns
ns
ns
ns
Mbps
7
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 1.8 V
± 0.15 V
A
B
tPLH
Open-drain driving
MAX
4
14.4
B
A
ten
OE
A or B
tdis
OE
A or B
tPLH
Open-drain driving
182
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel
skew
Max data rate
A or B
3.6
12.8
720
3.4
143
Push-pull driving
MAX
3.5
12.2
3.1
9.6
603
473
2.8
8.5
81
384
2.5
7.5
519
1.6
84
407
200
200
200
ns
28.1
22
20.1
19.6
ns
3.5
13.1
3
9.8
3.1
9
3.2
8.3
Open-drain driving
147
982
115
716
92
592
66
481
Push-pull driving
2.9
11.4
1.9
7.4
0.9
4.7
0.7
2.6
Open-drain driving
135
1020
91
756
58
653
20
370
Push-pull driving
2.3
9.9
1.7
7.7
1.6
6.8
1.7
6
Open-drain driving
2.4
10
2.1
7.9
1.7
7
1.5
6.2
2
8.7
1.3
5.5
0.9
3.8
0.8
3.1
1.2
11.5
1.3
8.6
1
9.6
0.5
7.7
1
1
1
Open-drain driving
Push-pull driving
Push-pull driving
Open-drain driving
ns
200
Push-pull driving
Push-pull driving
ns
12
5.1
118
12
9.7
11
6.2
147
8.6
3.5
9.8
114
UNIT
MIN MAX
8.6
11.1
13.2
745
554
VCCB = 5 V
± 0.5 V
MIN
10
9.5
186
VCCB = 3.3 V
± 0.3 V
9.2
12.7
Push-pull driving
Open-drain driving
MAX
12
Push-pull driving
tPHL
MIN
11
Push-pull driving
Open-drain driving
VCCB = 2.5 V
± 0.2 V
MIN
Push-pull driving
tPHL
8
TEST
CONDITIONS
1.1
1
40
60
60
50
2
2
2
2
Submit Documentation Feedback
ns
ns
ns
ns
Mbp
s
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V(unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 1.8 V
± 0.15 V
A
B
tPLH
Open-drain driving
MAX
3.6
11.4
194
B
A
ten
OE
A or B
tdis
OE
A or B
tPLH
Open-drain driving
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
A or B
3.4
12.1
155
Push-pull driving
733
MIN
9.9
584
2.8
8.5
578
MAX
MIN
9.3
126
466
7.3
90
346
2.1
6.2
459
5
93
323
200
200
ns
25.1
18.8
16.5
15.3
ns
11.9
2.6
8.6
2.7
7.8
2.8
7.2
Open-drain driving
155
996
124
691
100
508
72
350
Push-pull driving
2.8
10.5
1.8
7.2
1.2
5.2
0.7
2.7
Open-drain driving
132
1001
106
677
73
546
32
323
Push-pull driving
2.1
8.8
1.6
6.6
1.4
5.7
1.4
4.9
Open-drain driving
2.2
9
1.7
6.7
1.4
5.8
1.2
5.2
2
8.3
1.3
5.4
0.9
3.9
0.7
3
0.8
10.5
0.7
10.7
1
9.6
0.6
7.8
Push-pull driving
Push-pull driving
Open-drain driving
ns
200
3.1
Open-drain driving
ns
200
Push-pull driving
Push-pull driving
UNIT
7
5.8
129
8.9
6.3
7.4
2.5
MA
X
5.6
3.1
6.5
7
159
VCCB = 5 V
± 0.5 V
5.7
3.1
8
10.2
197
MAX
2.1
9.8
Push-pull driving
Open-drain driving
729
VCCB = 3.3 V
± 0.3 V
6.4
3.2
9
Push-pull driving
tPHL
MIN
8.2
Push-pull driving
Open-drain driving
VCCB = 2.5 V
± 0.2 V
MIN
Push-pull driving
tPHL
Max data rate
TEST
CONDITIONS
1
1
1
1
40
60
60
60
2
2
2
2
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
ns
ns
ns
ns
Mbps
9
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
B
tPLH
Open-drain driving
B
A
ten
OE
A or B
tdis
OE
A or B
tPLH
trA
A-port rise time
149
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
A or B
2.3
6.3
592
2.5
7.3
595
488
2.2
6
93
481
368
4.9
3.5
94
345
200
200
ns
15.7
12.9
11.2
ns
2
7.3
2.1
6.4
2.2
5.8
110
692
93
529
68
369
Push-pull driving
1.8
6.5
1.3
5.1
0.7
3.4
Open-drain driving
107
693
79
483
41
304
Push-pull driving
1.5
5.7
1.2
4.7
1.3
3.8
Open-drain driving
1.5
5.6
1.2
4.7
1.1
4
Push-pull driving
1.4
5.4
0.9
4.1
0.7
3
Open-drain driving
0.4
14.2
0.5
19.4
0.4
3
Push-pull driving
Open-drain driving
1
1.2
1
60
60
60
2
2
2
Submit Documentation Feedback
ns
200
Open-drain driving
Push-pull driving
ns
4.2
1.8
4.4
126
5.8
3.9
4.7
5.9
150
3.7
2.2
4.3
125
UNIT
MIN MAX
4
5.4
Push-pull driving
Push-pull driving
MAX
5.2
Push-pull driving
Open-drain driving
6.9
VCCB = 5 V
± 0.5 V
MIN
5
2.4
Push-pull driving
Open-drain driving
VCCB = 3.3 V
± 0.3 V
MIN MAX
Push-pull driving
Open-drain driving
tPHL
10
VCCB = 2.5 V
± 0.2 V
Push-pull driving
tPHL
Max data rate
TEST
CONDITIONS
ns
ns
ns
ns
Mbps
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
MIN
A
2
111
B
A
ten
OE
A or B
tdis
OE
A or B
2.1
trA
A-port rise time
trB
B-port rise time
tfA
A-port fall time
tfB
B-port fall time
tSK(O)
Channel-to-channel skew
112
Push-pull driving
352
4.5
449
86
339
200
200
ns
11.9
9.8
ns
1.8
5.7
1.9
5
Open-drain driving
75
446
57
337
Push-pull driving
1.5
5
1
3.6
Open-drain driving
72
427
40
290
Push-pull driving
1.2
4.5
1.1
3.5
Open-drain driving
1.1
4.4
1
3.7
Push-pull driving
1.1
4.2
0.8
3.1
1
4.2
0.8
3.1
Push-pull driving
1
Push-pull driving
Open-drain driving
ns
4.3
Push-pull driving
Open-drain driving
A or B
1.7
3.8
Open-drain driving
ns
3.8
5.5
Push-pull driving
tPLH
87
4.2
Open-drain driving
4.8
3.5
439
Push-pull driving
tPHL
1.9
3.9
Open-drain driving
UNIT
MAX
3.1
5.3
Push-pull driving
tPLH
MIN
3.8
Open-drain driving
B
VCCB = 5 V
± 0.5 V
MAX
Push-pull driving
tPHL
Max data rate
VCCB = 3.3 V
± 0.3 V
TEST
CONDITIONS
ns
ns
ns
1
60
60
2
2
ns
Mbps
OPERATING CHARACTERISTICS
TA=25°C
VCCA
PARAMETER
CpdA
CpdB
CpdA
CpdB
1.2 V
1.2 V
1.5 V
1.8 V
5V
1.8 V
1.8 V
1.8 V
TEST CONDITIONS
2.5 V
2.5 V
3.3 V
2.5 V
5V
3.3 V to 5 V
VCCB
UNIT
TYP
TYP
TYP
TYP
TYP
TYP
TYP
5.9
5.7
5.9
5.9
6.7
6.9
8
10.2
10.3
9.9
9.7
9.7
9.4
9.8
29.9
22.2
21.5
20.8
21
23.4
23
B-port input,
A-port output
22.9
16.7
16.7
16.8
17.8
20.8
20.9
A-port input,
B-port output
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.06
0.01
0.01
0.01
0.01
0.01
0.01
0.06
0.01
0.01
0.01
0.01
0.03
0.02
0.06
0.01
0.01
0.01
0.01
0.03
0.02
A-port input,
B-port output
B-port input,
A-port output
A-port input,
B-port output
B-port input,
A-port output
A-port input,
B-port output
CL = 0, f = 10 MHz,
tr= tf= 1ns,
OE = VCCA
(outputs enabled)
CL = 0, f = 10 MHz,
tr= tf= 1ns,
OE = GND
(outputs disabled)
B-port input,
A-port output
pF
pF
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
11
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
PRINCIPLES OF OPERATION
Applications
The TXS0108E can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another. The TXS0108E is ideal for use in applications where an open-drain
driver is connected to the data I/Os. The TXS0108E can also be used in applications where a push-pull driver is
connected to the data I/Os, but the TXB0104 might be a better option for such push-pull applications. The
TXS0108E device is a semi-buffered auto-direction-sensing voltage translator design is optimized for translation
applications (e.g. MMC Card Interfaces) that require the system to start out in a low-speed open-drain mode and
then switch to a higher speed push-pull mode.
Architecture
To address these application requirements, a semi-buffered architecture design is used and is illustrated below
(see Figure 1). Edge-rate accelerator circuitry (for both the high-to-low and low-to-high edges), a High-Ron
n-channel pass-gate transistor (on the order of 300 Ω to 500 Ω) and pull-up resistors (to provide DC-bias and
drive capabilities) are included to realize this solution. A direction-control signal (to control the direction of data
flow from A to B or from B to A) is not needed. The resulting implementation supports both low-speed open-drain
operation as well as high-speed push-pull operation.
VCCB
VCCA
OS3
One-Shot
Rpua
Translator
Rpub
OS4
T1
One-Shot
Bias
R1
A
P2
N2
B
R2
Npass
OS1
P1
One-Shot
OS2
N1
One-Shot
Translator
T2
Figure 1. Architecture of a TXS01xx Cell
When transmitting data from A to B ports, during a rising edge the One-Shot (OS3) turns on the PMOS transistor
(P2) for a short-duration and this speeds up the low-to-high transition. Similarly, during a falling edge, when
transmitting data from A to B, the One-Shot (OS4) turns on NMOS transistor (N2) for a short-duration and this
speeds up the high-to-low transition. The B-port edge-rate accelerator consists of one-shots OS3 and OS4,
Transistors P2 and N2 and serves to rapidly force the B port high or low when a corresponding transition is
detected on the A port.
When transmitting data from B to A ports, during a rising edge the One-Shot (OS1) turns on the PMOS transistor
12
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
TXS0108E
www.ti.com ..................................................................................................................................... SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008
(P1) for a short-duration and this speeds up the low-to-high transition. Similarly, during a falling edge, when
transmitting data from B to A, the One-Shot (OS2) turns on NMOS transistor (N1) for a short-duration and this
speeds up the high-to-low transition. The A-port edge-rate accelerator consists of one-shots OS1 and OS2,
Transistors P1 and N1 components and form the edge-rate accelerator and serves to rapidly force the A port
high or low when a corresponding transition is detected on the B port.
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first.
Enable and Disable
The TXS0108E has an OE input that is used to disable the device by setting OE low, which places all I/Os in the
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
Each A-port I/O has a pull-up resistor (Rpua) to VCCA and each B-port I/O has a pull-up resistor (Rpub) to VCCB.
Rpua and Rpub have a value of 40 kΩ when the output is driving low. Rpua and Rpub have a value of 4 kΩ when the
output is driving high. Rpua and Rpub are disabled when OE = Low.
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
13
TXS0108E
SCES642B – DECEMBER 2007 – REVISED SEPTEMBER 2008 ..................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCCI
VCCO
VCCI
VCCO
DUT
IN
DUT
IN
OUT
OUT
1 MW
15 pF
1 MW
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × VCCO
50 kW
From Output
Under Test
15 pF
S1
Open
50 kW
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
TEST
S1
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
tw
VCCI
VCCI/2
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
0V
tPLZ
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VCCO/2
VOH
VCCO/2
VOL
0.9 y VCCO
0.1 y VCCO
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VCCA/2
VCCO
VCCO/2
0.1 y VCCO
VOL
tPHZ
tPZH
VOH
0.9 y VCCO
VCCO/2
0V
tf
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
14
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXS0108E
PACKAGE OPTION ADDENDUM
www.ti.com
31-Mar-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
TXS0108EPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0108EPWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TXS0108ERGYR
ACTIVE
VQFN
RGY
20
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TXS0108EZXYR
ACTIVE
ZXY
20
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Mar-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TXS0108EPWR
TXS0108ERGYR
TXS0108EZXYR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
VQFN
RGY
20
3000
180.0
12.4
3.8
4.8
1.6
8.0
12.0
Q1
ZXY
20
2500
330.0
12.4
2.8
3.3
1.0
4.0
12.0
Q2
BGA MI
CROSTA
R JUNI
OR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Mar-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXS0108EPWR
TSSOP
PW
20
2000
346.0
346.0
33.0
TXS0108ERGYR
VQFN
RGY
20
3000
190.5
212.7
31.8
TXS0108EZXYR
BGA MICROSTAR
JUNIOR
ZXY
20
2500
340.5
338.1
20.6
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated