BRUS7 MINIBRIDGE 50 ns. ULTRA-FAST RECOVERY Approximately 25 AMPERES* SINGLE-PHASE, FULL-WAVE BRIDGES SPACE SAVING IN-LINE DESIGN INTEGRALLY MOLDED HEAT SINKS PROVIDE LOW THERMAL RESISTANCE This product has recognition under the component program of Underwriters Laboratories, inc. PRV/LEG 50V TYPE NUMBER BRUS705 100V BRUS710 200V 400V 500V 600V BRUS720 BRUS740 BRUS750 BRUS760 ELECTRICAL CHARACTERISTICS PER LEG (at TA =25 C U nle ss O the rwis e Sp eci fie d) BRUS7 UNITS Average Output Current, lo @ 60 C TC 25 Amps Max.Forward Voltage Drop, VF @ IF=12A pk 1.5 Volts Max.DC Reverse Current @ PRV and 25 C , I R 10 A Max.DC Reverse Current @ PRV and 100 C ,I R 200 A Max.Reverse Recovery Time,Trr (Fig.3) 50 Nanosec. Max.Peak Surge Current, lFSM (8.3ms) 320 Amps O Thermal Resistance (Total Bridge), R0- j -c 1.5 typ. o C/W Storage Temperature Range, TSTG -55 to+150 o Ambient Operating Temperature Range,TA -55 to+150 o Note 1:Derate Io by 20% for capacitive loads NOTE: Maximum lead and terminal temperature for soldering, 3/8 inch from case,5 seconds at 250 OC. EDI reserves the right to change these specifications at any time without notice. C C BRUS7 FIG.2 NON-REPETITIVE SURGE CURRENT FIG.1 CURRENT DERATING 1000 lO.AVERAGE L FORWARD CURRENT(AMP) 60 REDUCE RATING B Y 20% FOR C APACATIVE LOADS 500 MAX.PEAK SURGE CURRENT IFSM 50 BRIDGE OUTPUT RES.-IND. LOADS 40 30 20 10 200 100 50 20 0 10 0 25 75 50 100 125 1 150 5 2 10 20 50 100 NUMBER OF CYCLES AT 60 CPS O TC =TEMPERATURE ( C) FIG. 3 REVERSE RECOVERY TEST METHOD T RR R1 50 OHM ZERO REFERENCE 0.5A D.U.T. + - 1.0A 0.25A PULSE GENERATOR R2 1 OHM SCOPE R1, R2 NON-INDUCTIVE RESISTORS PULSE GENERATOR - HEWLETT PACKARD 214A OR EQUIV. IKC REP.RATE, 10 SEC. PULSE WIDTH ADJUST PULSE AMPLITUDE FOR PEAK IR BRUS7 MECHANICAL OUTLINE 1.125 SQ Dielectric test voltage 2500 volts rms, max. 50-60Hz. .405 MAX .193 DIA THRU HOLE METAL HEAT SINK AC .625 MIN _ + .750 MIN .050 DIA.TYP. 1/8 NOM. .20TYP ON CENTERS ALL DIMENSIONS IN INCHES NOTE: 1. Corrosion resistant terminals designed for .250 female quick connector, wrap around or solder. 2. A thin film of silicone thermal compound is recommended between the Minibridge R case and mounting surface for improved thermal conduction. 3. Higher dielectric strengths available. Consult factory. ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951. 21 GRAY OAKS AVENUE * YONKERS. NEW YORK 10710 914-965-4400 Ee-mail:[email protected] *Wwebsite: http://www.edidiodes.com * FAX 914-965-5531 * 1-800-678-0828