VISHAY SFH692AT_08

SFH692AT
Vishay Semiconductors
Optocoupler, Photodarlington Output,
SOP-4 Mini-Flat Package
FEATURES
• SOP (small outline package)
• Isolation test voltage, 3750 VRMS (1.0 s)
• High collector emitter breakdown voltage,
VCEO = 300 V
• Low saturation voltage
A 1
4 C
C 2
3 E
• Fast switching times
• Temperature stable
• Low coupling capacitance
• End stackable, 0.100" (2.54 mm) spacing
i179067
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC and
WEEE 2002/96/EC
DESCRIPTION
The SFH692AT has a GaAs infrared emitting diode emitter,
which is optically coupled to silicon planar photodarlington
detector, and is incorporated in a 4 pin 100 mil lead pitch
miniflat package. It features a high current transfer ratio, low
coupling capacitance, and high isolation voltage.
The coupling devices are designed for signal
transmission between two electrically separated circuits.
The SFH692AT is available only on tape and reel.
APPLICATIONS
• High density mounting or space sensitive PCBs
• PLCs
• Telecommunication
AGENCY APPROVALS
• UL1577, file no. E52744 system code U
• DIN EN 60747-5-5 available with option 1
• FIMKO
ORDER INFORMATION
PART
REMARKS
SFH692AT
CTR > 1000 %, SMD-4
ABSOLUTE MAXIMUM RATINGS
PARAMETER
(1)
TEST CONDITION
SYMBOL
VALUE
UNIT
INPUT
DC forward current
IF
50
mA
Reverse voltage
VR
6.0
V
tp ≤ 10 µs
Surge forward current
IFSM
2.5
A
Pdiss
80
mW
Collector emitter voltage
VCE
300
V
Emitter collector voltage
VEC
0.3
V
IC
50
mA
Total power dissipation
OUTPUT
Collector current
tp = 1.0 ms
IC
150
mA
Pdiss
200
mW
VISO
3750
VRMS
VIO = 500 V, Tamb = 25 °C
VIO = 500 V, Tamb = 100 °C
Total power dissipation
COUPLER
Isolation test voltage between emitter
and detector
Isolation resistance
Document Number: 83720
Rev. 1.8, 16-May-08
1.0 s
RIO
≥
1012
Ω
RIO
≥ 1011
Ω
For technical questions, contact: [email protected]
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SFH692AT
Vishay Semiconductors Optocoupler, Photodarlington Output,
SOP-4 Mini-Flat Package
(1)
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
Storage temperature range
Tstg
- 55 to + 150
°C
Ambient temperature range
Tamb
- 55 to + 100
°C
Tj
100
°C
Tsld
260
°C
COUPLER
Junction temperature
Soldering temperature (2)
max. 10 s dip soldering distance
to seating plane ≥ 1.5 mm
Notes
(1) T
amb = 25 °C, unless otherwise specified.
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum
ratings for extended periods of the time can adversely affect reliability.
(2) Refer to reflow profile for soldering conditions for surface mounted devices.
ELECTRICAL CHARACTERISTICS
PARAMETER
TEST CONDITION
SYMBOL
Forward voltage
IF = 10 mA
Reverse current
VR = 6.0 V
MIN.
TYP.
MAX.
UNIT
VF
1.2
1.5
V
IR
0.01
10
µA
INPUT
Capacitance
VR = 0 V, f = 1.0 MHz
Thermal resistance
CO
14
pF
Rthja
750
K/W
OUTPUT
Collector emitter leakage current
Collector emitter capacitance
VCE = 200 V
ICEO
VCE = 5.0 V, f = 1.0 MHz
CCE
39
pF
Rthja
500
K/W
Thermal resistance
200
nA
COUPLER
Collector emitter saturation voltage
Coupling capacitance
IF = 1.0 mA, IC = 10 mA
VCEsat
IF = 10 mA, IC = 100 mA
VCEsat
f = 1.0 MHz,VI-O = 0 V
CC
1.0
0.3
1.2
6.0
V
V
pF
Note
Tamb = 25 °C, unless otherwise specified.
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering
evaluation. Typical values are for information only and are not part of the testing requirements.
CURRENT TRANSFER RATIO
PARAMETER
TEST CONDITION
SYMBOL
MIN.
Current transfer ratio
IF = 1.0 mA, VCE = 1.0 V
CTR
1000
TYP.
MAX.
UNIT
%
Current transfer ratio
(collector emitter saturated)
IF = 10 mA, VCE = 1.0 V
CTRCEsat
500
%
MIN.
SWITCHING CHARACTERISTICS
PARAMETER
Rise time
TEST CONDITION
SYMBOL
IC = 10 mA, VCC = 10 V, RL = 100 Ω
tr
IC = 16 mA, VCC = 10 V, RL = 180 Ω
tr
Fall time
IC = 10 mA, VCC = 10 V, RL = 100 Ω
tf
IC = 16 mA, VCC = 10 V, RL = 180 Ω
tf
Turn-on time
IC = 10 mA, VCC = 10 V, RL = 100 Ω
ton
IC = 16 mA, VCC = 10 V, RL = 180 Ω
ton
IC = 10 mA, VCC = 10 V, RL = 100 Ω
toff
IC = 16 mA, VCC = 10 V, RL = 180 Ω
toff
Turn-off time
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TYP.
MAX.
3.5
1.0
µs
µs
14.5
20.5
µs
µs
4.5
1.5
µs
µs
29
53.5
UNIT
µs
µs
Document Number: 83720
Rev. 1.8, 16-May-08
SFH692AT
Optocoupler, Photodarlington Output, Vishay Semiconductors
SOP-4 Mini-Flat Package
SAFETY AND INSULATION RATINGS
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
Climatic classification
(according to IEC 68 part 1)
MAX.
UNIT
55/100/21
Comparative tracking index
CTI
175
399
VIOTM
6000
V
VIORM
707
V
PSO
350
mW
ISI
150
mA
TSI
175
Creepage distance
5
°C
mm
Clearance distance
5
mm
Insulation thickness
0.4
mm
Note
As per IEC 60747-5-2, § 7.4.3.8.1, this optocoupler is suitable for "safe electrical insulation" only within the safety ratings. Compliance with the
safety ratings shall be ensured by means of protective circuits.
TYPICAL CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
V CC = 10.0 V
IF
RL = 100 Ω
VO
isfh692at_0
1
Fig. 1 - Linear Operation (without Saturation)
PACKAGE DIMENSIONS in inches (millimeters)
4
3
R 0.010 (0.25)
0.014 (0.36)
0.190 (4.83)
0.170 (4.32)
0.100 (2.54)
0.036 (0.91)
1
2
Pin on ID
0.184 (4.67)
0.164 (4.17)
ISO method A
0.200 (5.08)
0.290 (7.37)
(on chamfer side
of package)
0.024 (0.61)
0.017 (0.43)
0.013 (0.35)
6°
0.034 (0.86)
0.018 (0.46)
0.014 (0.36)
Document Number: 83720
Rev. 1.8, 16-May-08
0.220 (5.59)
0.200 (5.08)
40°
10°
0.008 (0.20)
0.004 (0.10)
0.080 (2.03)
0.075 (1.91)
i178039
0.045 (1.14)
0.105 (2.67)
0.095 (2.41)
Leads coplanarity
0.004 (0.10) max.
0.025 (0.63)
0.015 (0.38)
0.284 (7.21)
0.264 (6.71)
For technical questions, contact: [email protected]
www.vishay.com
765
SFH692AT
Vishay Semiconductors Optocoupler, Photodarlington Output,
SOP-4 Mini-Flat Package
OZONE DEPLETING SUBSTANCES POLICY STATEMENT
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with
respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone
depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use
within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in
the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively.
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency
(EPA) in the USA.
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do
not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application by the
customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall
indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any
claim of personal damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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For technical questions, contact: [email protected]
Document Number: 83720
Rev. 1.8, 16-May-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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