Surface Mount PIN Diodes Technical Data HSMP-38XX and HSMP-48XX Series Features • Diodes Optimized for: Low Current Switching Low Distortion Attenuating Ultra-Low Distortion Switching Microwave Frequency Operation • Surface Mount SOT-23 and SOT-143 Packages Single and Dual Versions Tape and Reel Options Available • Low Failure in Time (FIT) Rate[1] Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Description/Applications The HSMP-380X and HSMP-381X series are specifically designed for low distortion attenuator applications. The HSMP-382X series is optimized for switching applications where ultra-low resistance is required. The HSMP-3880 switching diode is an ultra low distortion device optimized for higher power applications from 50 MHz to 1.5 GHz. The HSMP-389X series is optimized for switching applications where low resistance at low current and low capacitance are required. The HSMP-48XX series are special products featuring ultra low parasitic inductance in the SOT-23 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional SOT-23 PIN diodes. The HSMP-4810 diode is a low distortion attenuating PIN designed for operation to 3 GHz. The HSMP-4820 diode is ideal for limiting and low inductance switching applications up to 1.5 GHz. The HSMP-4890 is optimized for low current switching applications up to 3 GHz. The HSMP-386X series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low cost is the driving issue for the designer. The HSMP-386X series Total Capacitance (CT) and Total Resistance (RT) are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383X series is recommended. For low distortion Package Lead Code Identification SINGLE #0 SERIES COMMON ANODE #2 COMMON CATHODE UNCONNECTED PAIR #4 DUAL ANODE DUAL CATHODE #A #B #3 #5 attenuators, the HSMP-380X or -381X series are recommended. For high performance switching applications, the HSMP-389X series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. 2 Absolute Maximum Ratings[1] TA = 25°C Symbol If Pt Piv Tj TSTG Parameter Forward Current (1 ms Pulse) Total Device Dissipation Peak Inverse Voltage Junction Temperature Storage Temperature Units Absolute Maximum Amp mW [2] — °C °C 1 250 Same as VBR 150 -65 to 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. 2. CW Power Dissipation at TLEAD = 25°C. Derate to zero at maximum rated temperature. PIN Attenuator Diodes Electrical Specifications TA = 25°C (Each Diode) Nearest Equivalent Minimum Maximum Maximum Minimum Maximum Axial Lead Breakdown Series Total High Low Part No. Voltage Resistance Capacitance Resistance Resistance 5082VBR (V) RS (Ω) CT (pF) RH (Ω) RL (Ω) Part Number HSMP- Package Marking Code[1] 3800 3802 3804 D0 D2 D4 0 2 4 Single Series Common Cathode 3080 100 2.0 0.37 1000 8 3810 3812 3813 3814 E0 E2 E3 E4 0 2 3 4 Single Series Common Anode Common Cathode 3081 100 3.0 0.35 1500 10 VR = VBR Measure IR ≤ 10 µA IF = 100 mA f = 100 MHz VR = 50 V f = 1 MHz Lead Code Configuration Test Conditions IF = 0.01 mA IF = 20 mA f = 100 MHz f= 100 MHz PIN Switching Diodes Electrical Specifications TA = 25°C Part Number HSMP- Package Marking Code[1] 3820 3822 3823 3824 F0 F2 F3 F4 Lead Code Configuration 0 2 3 4 Single Series Common Anode Common Cathode Nearest Equivalent Axial Lead Part No. 5082- Minimum Breakdown Voltage VBR (V) Maximum Series Resistance RS (Ω) Maximum Total Capacitance CT (pF) Maximum Shunt Mode Harmonic Distortion Hmd (dBc) 3188 50 0.6* 0.8* — 3880 S0 0 Single — 100 6.5 0.40 –55 3890 3892 3893 3894 3895 G0 G2 G3 G4 G5 0 2 3 4 5 Single Series Common Anode Common Cathode Unconnected Pair — 100 2.5 0.30** — VR = VBR Measure IR ≤ 10 µA IF = 5 mA f = 100 MHz IF = 10 mA* VR = 50 V f = 1 MHz VR = 20 V* VR = 5 V** 2 fo, Zo = 50 W f o = 400 MHz Pin = +30 dBm 0 V bias Test Conditions Note: 1. Package marking code is white. 3 PIN General Purpose Diodes, Electrical Specifications TA = 25°C Part Number HSMP- Package Marking Code[1] Lead Code Configuration 3830 3832 3833 3834 K0 K2 K3 K4 0 2 3 4 Single Series Common Anode Common Cathode Nearest Equivalent Axial Lead Part No. 5082- Minimum Breakdown Voltage VBR (V) Maximum Series Resistance RS (Ω) Maximum Total Capacitance CT (pF) 3077 200 1.5 0.3 VR = VBR Measure IR ≤ 10 mA IF = 100 mA f = 100 MHz VR = 50 V f = 1 MHz Test Conditions High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes, Electrical Specifications TA = 25°C Part Number HSMP- Package Marking Code Lead Code 4810 EB B Configuration Dual Cathode Minimum Breakdown Voltage VBR (V) Maximum Series Resistance RS (Ω) Typical Total Capacitance CT (pF) Maximum Total Capacitance CT (pF) Typical Total Inductance LT (nH) 100 3.0 0.35 0.4 1.0 Attenuator Application 4820 FA A Dual Anode 50 0.6* 0.75* 1.0 1.0* Limiter 4890 GA A Dual Anode 100 2.5** 0.33 0.375 1.0 Switch VR = VBR Measure IR ≤ 10 µA IF = 100 mA IF = 10 mA* IF = 5 mA** VR = 50 V f = 1 MHz VR = 20 V* VR = 50 V f = 1 MHz VR = 0 V f = 500 MHz – 3 GHz VR = 20 V* PIN General Purpose Diodes, Typical Specifications TA = 25°C Part Number HSMP- Code Marking Code[1] Lead Code Configuration 3860 3862 3863 3864 L0 L2 L3 L4 0 2 3 4 Single Series Common Anode Common Cathode Test Conditions Minimum Breakdown Voltage VBR (V) Typical Series Resistance RS (Ω) Typical Total Capacitance CT (pF) 50 3.0/1.5* 0.20 VR = VBR Measure IR ≤ 10 µA IF = 10 mA f = 100 MHz VR = 50 V f = 1 MHz *IF = 100 mA Typical Parameters at TA = 25°C Part Number HSMP- Series Resistance RS (Ω) Carrier Lifetime τ (ns) Reverse Recovery Time Trr (ns) Total Capacitance CT (pF) 380X 381X 382X 383X 388X 389X 55 75 1.5 20 3.8 3.8 1800 1500 70* 500 2500 200* 500 300 7 80 550 – 0.32 @ 50 V 0.27 @ 50 V 0.60 @ 20 V 0.20 @ 50 V 0.30 @ 50 V 0.20 @ 5 V IF = 1 mA f = 100 MHz IF = 10 mA* IF = 50 mA IR = 250 mA IF = 10 mA* IR = 6 mA* VR = 10 V IF = 20 mA 90% Recovery Test Conditions Note: 1. Package marking code is white. 4 Typical Parameters at TA = 25°C (unless otherwise noted), Single Diode 0.35 0.40 0.35 1 MHz 0.30 0.25 30 MHz 0.20 frequency>100 MHz 0 2 4 6 8 HSMP-381x, /HSMP-4810 0.30 1 MHz 0.25 100 MHz 0.20 0.15 10 12 14 16 18 20 1 GHz 0 2 REVERSE VOLTAGE (V) 6 8 1000 RF RESISTANCE (OHMS) TA = +85°C TA = +25°C TA = –55°C 100 10 10 1 HSMP-382x, -4820 Figure 3. Resistance at 25°C vs. Forward Bias Current. Figure 2. RF Capacitance vs. Reverse Bias, HSMP-3830 Series. 1.4 10000 3000 HSMP-383x, -386x 100 0.1 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) 10 12 14 16 18 20 REVERSE VOLTAGE (V) Figure 1. RF Capacitance vs. Reverse Bias, HSMP-3810 Series. RF RESISTANCE (OHMS) 4 1000 TA = +85°C TA = +25°C TA = –55°C 1000 1.2 CAPACITANCE (pF) 0.15 10000 RESISTANCE (OHMS) TOTAL CAPACITANCE (pF) TOTAL CAPACITANCE (pF) 0.45 100 10 1 HSMP-382X 0.8 0.6 HSMP-3880 HSMP-3800 HSMP-381X 0.4 0.2 HSMP-3830 0.1 1 10 1 0.01 0.1 1 10 100 IF – FORWARD BIAS CURRENT (mA) 100 IF – FORWARD BIAS CURRENT (mA) 120 90 HSMP-3830 80 70 HSMP-3810 60 HSMP-3830 50 40 1000 INPUT INTERCEPT POINT (dBm) INPUT INTERCEPT POINT (dBm) 120 Diode Mounted as a Series Attenuator in a 115 50 Ohm Microstrip and Tested at 123 MHz 110 105 HSMP-3880 100 HSMP-3820 95 HSMP-3830 90 HSMP-3890 85 100 10 DIODE RF RESISTANCE (OHMS) Figure 7. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance for Attenuator Diodes. 1 10 30 IF – FORWARD BIAS CURRENT (mA) Figure 8. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switch Diodes. 0 10 HSMP-3890 20 30 40 50 VR – REVERSE VOLTAGE (V) Figure 5. RF Resistance vs. Forward Bias Current for HSMP-3810/ HSMP-4810. Figure 4. RF Resistance vs. Forward Bias Current for HSMP-3800. Diode Mounted as a 110 Series Attenuator in a 50 Ohm Microstrip 100 and Tested at 123 MHz 0 Figure 6. Capacitance vs. Reverse Voltage. Trr – REVERSE RECOVERY TIME (ns) 1 0.01 100 HSMP-382X VR = 2V VR = 5V 10 VR = 10V 1 10 20 30 FORWARD CURRENT (mA) Figure 9. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. HSMP-3820 Series. 5 HSMP-3830 VR = 5V VR = 10V 100 VR = 20V 10 10 20 1000 900 800 700 600 500 VR = 5V VR = 10V 400 300 VR = 20V 200 100 10 30 Figure 10. Reverse Recovery Time vs. Forward Current for Various Reverse Voltage. HSMP-3830 Series. 25 30 1 0.1 125°C 0.2 0.4 25°C –50°C 0.6 0.8 1.0 10 1 0.1 125°C 25°C –50°C 0.01 1.2 0 0.2 0.4 0.6 0.8 1.0 1 0.1 125°C 25°C –50°C 0.01 1.0 0 10 1.2 VF – FORWARD VOLTAGE (mA) Figure 16. Forward Current vs. Forward Voltage. HSMP-3830 Series. 20 25 30 HSMP-382X HSMP-482X 10 1 0.1 125°C 25°C –50°C 0 0.2 0.4 0.6 0.8 1.0 1.2 100 10 1 0.1 125°C 0.01 15 Figure 15. Forward Current vs. Forward Voltage. HSMP-3820 and HSMP-4820 Series. IF – FORWARD CURRENT (mA) IF – FORWARD CURRENT (mA) 10 0.8 VR = –10V VF – FORWARD VOLTAGE (mA) 100 HSMP-3830 0.6 VR = –5V 40 0.01 1.2 Figure 14. Forward Current vs. Forward Voltage. HSMP-3810 and HSMP-4810 Series. 100 0.4 80 VF – FORWARD VOLTAGE (mA) Figure 13. Forward Current vs. Forward Voltage. HSMP-3800 Series. 0.2 120 100 HSMP-3810 HSMP-4810 VF – FORWARD VOLTAGE (mA) 0 VR = –2V Figure 12. Typical Reverse Recovery Time vs. Reverse Voltage. HSMP-3890 Series. IF – FORWARD CURRENT (mA) 10 0 160 FORWARD CURRENT (mA) 100 HSMP-3800 IF – FORWARD CURRENT (mA) IF – FORWARD CURRENT (mA) 20 Figure 11. Typical Reverse Recovery Time vs. Reverse Voltage. HSMP-3880 Series. 100 IF – FORWARD CURRENT (mA) 15 200 FORWARD CURRENT (mA) FORWARD CURRENT (mA) 0.01 TRR - REVERSE RECOVERY TIME (nS) 1000 REVERSE RECOVERY TIME (nS) Trr - REVERSE RECOVERY TIME (nS) Typical Parameters (continued) 0 0.2 0.4 25°C –55°C 0.6 0.8 1.0 1.2 VF – FORWARD CURRENT (mA) Figure 17. Forward Current vs. Forward Voltage. HSMP-3880 Series. 10 1 0.1 0.01 –55°C 125°C 25°C 0 0.2 0.4 0.6 0.8 1.0 VF – FORWARD VOLTAGE (mA) Figure 18. Forward Current vs. Forward Voltage. HSMP-3890 and HSMP-4890 Series. 1.2 6 Typical Parameters (continued) 0.5 100 100 10 1 0.01 TA = +125°C TA = +25°C TA = –50°C 10 CT – CAPACITANCE (pF) TA = +85°C TA = +25°C TA = –55°C IF – FORWARD CURRENT (mA) RESISTANCE (OHMS) 1000 1 0.1 1 10 100 0 BIAS CURRENT (mA) Cp 0.08 pF Lp Rs 2.0 nH 1.5 Ω 0.4 0.6 0.8 1.0 Figure 20. Forward Current vs. Forward Voltage for HSMP-3860. Equivalent Circuit Model HSMS-3860 0.2 VF – FORWARD VOLTAGE (V) Figure 19. Typical RF Resistance vs. Forward Bias Current for HSMP-3860. Rj Cj RT = 1.5 + R j 0.12 pF* CT = CP + Cj * Measured at -20 V 12 R j = 0.9 Ω I I = Forward Bias Current in mA 0.3 0.2 0.1 0 0.01 0.1 0.4 1.2 0 5 10 15 20 VR – REVERSE VOLTAGE (V) Figure 21. Typical Capacitance vs. Reverse Bias for HSMP-3860. 7 Typical Applications for Multiple Diode Products RF COMMON RF COMMON RF 2 RF 1 RF 2 RF 1 BIAS 2 BIAS 1 BIAS BIAS Figure 23. High Isolation SPDT Switch, Dual Bias. Figure 22. Simple SPDT Switch, Using Only Positive Current. RF COMMON RF COMMON BIAS RF 1 RF 2 RF 2 RF 1 BIAS Figure 24. Switch Using Both Positive and Negative Bias Current. Figure 25. Very High Isolation SPDT Switch, Dual Bias. 8 Typical Applications for Multiple Diode Products (continued) VARIABLE BIAS RF IN/OUT INPUT FIXED BIAS VOLTAGE Figure 26. Four Diode π Attenuator. BIAS Figure 27. High Isolation SPST Switch (Repeat Cells as Required). Figure 28. Power Limiter Using HSMP-3822 Diode Pair. 9 Typical Applications for HSMP-48XX Low Inductance Series 3 0.5nH 0.3 pF* 3 3 0.5 nH 1 2 HSMP-4810 1 2 HSMP-4820 & HSMP-4890 Figure 29. Internal Connections. 0.5 nH 1 2 *0.8pF TYPICAL FOR HSMP-3820 Figure 30. Equivalent Circuit. 0.25 nH 0.3 pF* 0.5 nH *0.8 pF TYPICAL FOR HSMP-3820 Figure 31. Circuit Layout. Microstrip Series Connection for HSMP-48XX Series In order to take full advantage of the low inductance of the HSMP-48XX series when using them in series application, both lead 1 and lead 2 should be connected together, as shown above. Figure 32. Equivalent Circuit. 10 1.5 nH 1.5 nH 50 OHM MICROSTRIP LINES 0.3 pF* 0.3 nH 0.3 nH PAD CONNECTED TO GROUND BY TWO VIA HOLES *0.8 pF TYPICAL FOR HSMP-4820 Figure 33. Circuit Layout. Figure 34. Equivalent Circuit. Microstrip Shunt Connections for HSMP-48XX Series HSMP-38XX series diode are placed across the resulting gap. This forces the 0.5 nH lead inductance of leads 1 and 2 to appear as part of a low pass filter, reducing the shunt parasitic inductance and In the diagram above, the center conductor of the microstrip line is interrupted and leads 1 and 2 of the increasing the maximum available attenuation. The 0.3 nH of shunt inductance external to the diode is created by the via holes, and is a good estimate for 0.032" thick material. Co-Planar Waveguide Groundplane Center Conductor 0.3 pF* Groundplane 0.75 nH *0.8 pF TYPICAL FOR HSMP-4820 Figure 35. Circuit Layout. Co-Planar Waveguide Shunt Connection for HSMP-48XX Series Co-Planar waveguide, with ground on the top side of the printed circuit board, is shown Figure 36. Equivalent Circuit. in the diagram above. Since it eliminates the need for via holes to ground, it offers lower shunt parasitic inductance and higher maximum attenuation when compared to a microstrip circuit. 11 Package Dimensions PC Board Footprints Outline 23 (SOT-23) SOT-23 1.02 (0.040) 0.89 (0.035) 0.54 (0.021) 0.37 (0.015) PACKAGE MARKING CODE (XX) 0.037 0.95 3 1.40 (0.055) 1.20 (0.047) XXX 2.65 (0.104) 2.10 (0.083) 2 1 0.50 (0.024) 0.45 (0.018) 0.037 0.95 DATE CODE (X) 0.079 2.0 2.04 (0.080) 1.78 (0.070) TOP VIEW 0.035 0.9 0.152 (0.006) 0.066 (0.003) 3.06 (0.120) 2.80 (0.110) 0.031 0.8 1.02 (0.041) 0.85 (0.033) DIMENSIONS IN inches mm 0.69 (0.027) 0.45 (0.018) 0.10 (0.004) 0.013 (0.0005) SIDE VIEW END VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES) SOT-143 Outline 143 (SOT-143) 0.92 (0.036) 0.78 (0.031) DATE CODE (X) E PACKAGE MARKING CODE (XX) 1.40 (0.055) 1.20 (0.047) XXX B 0.112 2.85 C 0.079 2 2.65 (0.104) 2.10 (0.083) 0.033 0.85 E 0.60 (0.024) 0.45 (0.018) 2.04 (0.080) 1.78 (0.070) 0.075 1.9 0.54 (0.021) 0.37 (0.015) 3.06 (0.120) 2.80 (0.110) 0.071 1.8 0.108 2.75 0.033 0.85 0.15 (0.006) 0.09 (0.003) 0.047 1.2 1.04 (0.041) 0.85 (0.033) 0.10 (0.004) 0.013 (0.0005) 0.041 1.05 0.69 (0.027) 0.45 (0.018) DIMENSIONS ARE IN MILLIMETERS (INCHES) Package Characteristics Lead Material ...................................................................................... Alloy 42 Lead Finish ............................................................................ Tin-Lead 85-15% Maximum Soldering Temperature .............................. 260°C for 5 seconds Minimum Lead Strength .......................................................... 2 pounds pull Typical Package Inductance .................................................................. 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads) 0.031 0.033 0.8 0.85 DIMENSIONS IN inches mm Profile Option Descriptions -BLK = Bulk -TR1 = 3K pc. Tape and Reel, Device Orientation; See Figures 37 and 38 -TR2 = 10K pc. Tape and Reel, Device Orientation; See Figures 37 and 38 Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.” Ordering Information Specify part number followed by option under. For example: H SMP - 38XX - XXX Bulk or Tape and Reel Option Part Number Surface Mount PIN Diode Hewlett-Packard REEL CARRIER TAPE USER FEED DIRECTION COVER TAPE TOP VIEW END VIEW 4 mm 8 mm www.hp.com/go/rf Figure 37. Options -TR1, -TR2 for SOT-23 Packages. TOP VIEW END VIEW For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 4 mm Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 8 mm Europe: Call your local HP sales office. Data subject to change. Copyright © 1999 Hewlett-Packard Co. Figure 38. Options -TR1, -TR2 for SOT-143 Packages. Obsoletes 5968-3435E 5968-5439E (6/99)