Surface Mount Lensed Chip LEDs Technical Data HSMA-L640 HSMC-L640 HSMH-L640 HSMG-L640 Features Description • High Brightness AlInGaP Material (HSMA & HSMC) • Various Colors Available • Compatible with IR Solder Process • Narrow Viewing Angle • Small 3.0 x 1.5 mm Package • Available in 8 mm Tape on 7” (180 mm) Diameter Reels The HSMx-L640 is a Chip LED with an integrated lens. The lens concentrates the emitted light into a narrow viewing angle, which has the effect of doubling the on-axis intensity. These LEDs are optimum for light piping, backlighting buttons and switches, and applications, where as much flux as possible is required on axis. Applications The available colors are AlInGap Amber, AlInGap Red, AlGaAs Red and GaP Green. • • • • Keypad Backlighting Light Piping LCD Backlighting Front Panel Indicator The 3.0 x 1.5 mm package closely matches industry standard sizes for chip capacitors which makes it compatible with automated pick and place equipment. This package is compatible with IR and convective reflow soldering processes. Device Selection Guide AS AlInGaP Product Part Number HSMA-L640 HSMC-L640 Color Amber 590 nm Red 626 nm Package Description Untinted, Non-diffused Untinted, Non-diffused GaP Product Part Number HSMG-L640 Color Green 571 nm Package Description Untinted, Non-diffused AlGaAs Product Part Number HSMH-L640 Color Red 639 nm Package Description Untinted, Non-diffused 2 Package Dimensions 1.5 1.5 1.3 0.6 3 2 CATHODE MARK 1.8 1.6 TOLERANCES: ± 0.2 mm Notes: 1. Dimensions are in millimeters. 2. Tolerance, ± 0.2 mm Absolute Maximum Ratings at TA = 25°C Parameter DC Forward Current[3][4][5] Power Dissipation Reverse Current VR = 5 V Operating Temperature Range Storage Temperature Range[6] HSMA/C-L640 30 81 100 -30 to +85 -40 to +100 HSG/H-L640 25 65 100 -30 to +85 -40 to +100 Units mA mW µA °C °C Notes: 3. Derate linearly as shown in Figure 4. 4. Drive currents between 1 mA and the specified maximum DC forward current are recommended for best long term performance. 5. Operating at currents below 1 mA is not recommended. Please contact your Agilent representative for further information. 6. Maximum temperature for tape and reel packaging is 60°C. Optical Characteristics at TA = 25°C Part Number HSMA-L640 HSMC-L640 HSMG-L640 HSMH-L640 Color AS AlInGaP Amber AS AlInGaP Red GaP Green AlGaAs Red Luminous Intensity I V (mcd) @IF 20 mA[7] Min. Typ. 63 130 63 100 10 18 10 32 Peak Wavelength λpeak (nm) Typ. 592 635 570 650 Color, Dominant Wavelength λd[8] (nm) Typ. 590 626 572 639 Viewing Angle 2θ 1/2 Degrees[9] Typ. 70 70 70 70 Notes: 7. The luminous intensity, I V, is measured at the peak of the spatial radiation pattern. 8. The dominant wavelength, λd, is derived from the CIE Chromaticity diagram, and represents the perceived color of the device. 9. θ 1/2 is the off-axis angle where the luminous intensity is 1/ 2 the peak intensity. 3 Electrical Characteristics at TA = 25°C Part Number HSMA-L640 HSMC-L640 HSMG-L640 HSMH-L640 1.0 Forward Voltage VF (Volts) @ I F = 20 mA Typ. Max. 2.02 2.40 Color AS AlInGaP Amber AS AlInGaP Red GaP Green AlGaAs Red 1.90 2.20 1.80 Capacitance C (pF) VF = 0 f = 1 MHz Typ. 40.0 Thermal Resistance RθJ-PIN (°C/W) Typ. 500 5 5 5 40.0 8.0 4.5 500 475 475 2.40 2.60 2.20 GREEN AlGaAs RED AlInGaP AMBER RELATIVE INTENSITY Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 AlInGaP RED 0.5 0 500 550 600 650 700 WAVELENGTH – nm Figure 1. Relative Intensity vs. Wavelength. IF – FORWARD CURRENT – mA 100 AS AllnGaP AlGaAs 10 GaP GREEN 1 0.1 1.5 1.6 1.7 1.8 1.9 2.0 VF – FORWARD VOLTAGE – V Figure 2. Forward Current vs. Forward Voltage. 2.1 2.2 2.3 750 4 1.6 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 30 Figure 3a. Relative Luminous Intensity vs. DC Forward Current for AlInGaP. 10 15 20 25 30 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA 5 Figure 3b. Relative Luminous Intensity vs. DC Forward Current for GaP and AlGaAs. 35 30 25 20 15 10 5 0 0 IDC – DC FORWARD CURRENT – mA IF – FORWARD CURRENT – mA 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 4a. Maximum DC Current vs. Ambient Temperature for AlInGaP. 25 20 15 10 5 0 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 4a. Maximum DC Current vs. Ambient Temperature for AlGaAs and GaP. 5 Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M Intensity Min. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 (mcd) Max. 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 Bin ID N P Q R S T U V W X Y Intensity Min. 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 (mcd) Max. 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Color Bin Limits[1] Amber Color Bins[1] Bin ID A B C D E F Dom. Wavelength (nm) Min. Max. 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 594.5 597.0 Green Color Bins[1] Bin ID A B C D E Dom. Wavelength (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5 Tolerance: ± 0.5 nm Tolerance: ± 0.5 nm Note: 1. Bin categories are established for classification or products. Products may not be available in all bin categories. Pleae contact your Agilent representative for information of currently available bins. 6 20° 10° 0° 1.0 30° RELATIVE INTENSITY 0.8 40° 50° 0.6 60° 0.4 70° 0.2 80° 90° 1.0 0.8 0.6 0.4 0.2 0 10 20 30 40 50 60 70 80 90 100 RELATIVE INTENSITY DEGREES Figure 5. Intensity vs. Angle. 1.6 10 to 20 SEC. 255 °C (+5/-0) TEMPERATURE 217 °C 3 °C/SEC. MAX. 6 °C/SEC. MAX. 140 - 160 °C 4.4 1.6 60 to 150 SEC. MAX. 120 SEC. PWB CAMBER DIRECTION TIME * THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 6. Recommended Pb-Free Reflow Soldering Profile. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 8. Reeling Orientation. TOLERANCES: ± 0.2 mm Figure 7. Recommended Solder Patterns. 7 2 ± 0.5 Ø 21 ± 0.8 +1 Ø 60 – 0 Ø 13.0 ± 0.2 11.4 ± 1.0 +0 Ø 180 – 3 9 ± 0.3 Figure 9. Reel Dimensions. 1.7 ± 0.1 4 ± 0.1 ∅ 1.5 +0.1 0 CATHODE 0.2 ± 0.05 1.75 ± 0.1 3.5 ± 0.05 3.35 ± 0.1 8 ± 0.3 CENTER HOLE 1.8 USER DIRECTION OF FEED 2 ± 0.05 4 ± 0.1 Figure 10. Tape Dimensions. END THERE SHALL BE A MINIMUM OF 40 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 40 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. 150 mm-360 mm MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30˚ C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5988-6272EN November 13, 2003 5988-7315EN