Document No.001-71688 Rev. *C ECN # 4470755 Cypress Semiconductor Package Qualification Report QTP# 101208 VERSION *C August 2014 48-Lead SSOP NiPdAu, MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-71688 Rev. *C ECN # 4470755 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 101208 Qualification of Larger Die in SSOP48L Qualified Package at CML-RA using KEG3000 M/C, QMI-509 Epoxy and NiPdAu Lead Finish at MSL3, 260C Reflow Mar 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No.001-71688 Rev. *C ECN # 4470755 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: SP48 Package Outline, Type, or Name: 48 – Lead SSOP Mold Compound Name/Manufacturer: KEG3000 / Kyocera Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 50% Lead Frame Designation: Reduced Metal Pad Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafersaw Die Attach Supplier: Henkel Die Attach Material: QMI 509 Wire Bond Method: Thermosonic Wire Material/Size: 0.9mil / Au Thermal Resistance Theta JA C/W: 45 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML_RA MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA, KYEC Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-71688 Rev. *C ECN # 4470755 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F P High Temp Storage 130 C, 85%RH, 3.3V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 150 C, no bias Acoustic Microscopy J-STD-020 P Ball Shear JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Pressure Cooker Test Temperature Cycle Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019, Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P P P P P P Final Visual Inspection Test to determine the existence and extent of cracks, Criteria: No Package Crack JESD22-B101B Thermal Shock MIL-STD-883C, Method 1011 P X-Ray MIL-STD-883 - 2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P Document No.001-71688 Rev. *C ECN # 4470755 Reliability Test Data QTP #: 101208 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C3866PVI (8C38661B) 4942670 611023533 CML-RA COMP 15 0 CY8C3866PVI (8C38661B) 4942670 611023531 CML-RA COMP 15 0 CY8C3866PVI (8C38661B) 4942670 611023535 CML-RA COMP 15 0 4942670 611023533 CML-RA COMP 30 0 4942670 611023533 CML-RA COMP 30 0 611023533 CML-RA COMP 5 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY8C3866PVI (8C38661B) STRESS: BOND PULL CY8C3866PVI (8C38661B) STRESS: CONSTRUCTIONAL ANALYIS CY8C3866PVI (8C38661B) 4942670 STRESS: DYE PENETRATION TEST CY8C3866PVI (8C38661B) 4942670 611023533 CML-RA COMP 15 0 CY8C3866PVI (8C38661B) 4942670 611023531 CML-RA COMP 15 0 CY8C3866PVI (8C38661B) 4942670 611023535 CML-RA COMP 15 0 4942670 611023533 CML-RA COMP 10 0 STRESS: DIE SHEAR CY8C3866PVI (8C38661B) STRESS: HI-ACCEL SATURATION TEST, 130C, 3.3V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C3866PVI (8C38661B) 4942670 611023533 CML-RA 128 75 0 STRESS: HIGH TEMP STORAGE, 150C CY8C3866PVI (8C38661B) 4942670 611023533 CML-RA 500 76 0 CY8C3866PVI (8C38661B) 4942670 611023533 CML-RA 1000 76 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C3866PVI (8C38661B) 4942670 611023533 CML-RA 168 73 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C3866PVI (8C38661B) 4942670 611023533 CML-RA 500 80 0 CY8C3866PVI (8C38661B) 4942670 611023531 CML-RA 500 80 0 CY8C3866PVI (8C38661B) 4942670 611023535 CML-RA 500 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-71688 Rev. *C ECN # 4470755 Reliability Test Data QTP #: 101208 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C3866PVI (8C38661B) 4942670 611023531 CML-RA 200 40 0 CY8C3866PVI (8C38661B) 4942670 611023531 CML-RA 1000 40 0 CY8C3866PVI (8C38661B) 4942670 611023535 CML-RA 200 40 0 CY8C3866PVI (8C38661B) 4942670 611023535 CML-RA 1000 40 0 4942670 611023533 CML-RA COMP 15 0 Failure Mechanism STRESS: THERMAL SHOCK STRESS: X-RAY CY8C3866PVI (8C38661B) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-71688 Rev. *C ECN # 4470755 Document History Page Document Title: Document Number: Rev. ECN No. ** 3323176 *A 3336782 *B 4060853 *C QTP 101208: 48-LEAD SSOP, KEG3000 M/C, NIPDAU, MSL3, 260C REFLOW CML-RA 001-71688 Orig. of Change NSR NSR HSTO 4470755 HSTO Description of Change Initial spec release Corrected the QTP# on Reliability Test Data on pages 5 and 6. Sunset Review Remove the reference Cypress specs on the reliability test conditions and replace with the industry standards. Remove version 1.1 in the QTP# in title page. Updated test location facility based on current qualified test site. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7