IrDA® Compliant 4 Mb/s 3 V Infrared Transceiver Technical Data HSDL-3600#007 HSDL-3600#008 HSDL-3600#107 Features Applications • Fully Compliant to IrDA 1.1 Physical Layer Specifications - 9.6 kb/s to 4 Mb/s operation • Typical Link Distance > 1.5 m • Compatible with HP-SIR and TV Remote • IEC825-Class 1 Eye Safe • Low Power Operation - 2.7 V to 3.6 V • Small Module Size - 4.0 x 12.2 x 5.1 mm (HxWxD) • Complete Shutdown - TXD, RXD, PIN diode • Low Shutdown Current - 10 nA typical • Adjustable Optical Power Management - Adjustable LED drive- current to maintain link integrity • Single Rx Data Output - Speed select by FIR Select pin • Integrated EMI Shield - Excellent noise immunity • Edge Detection Input - Prevents the LED from long turn-on time • Interface to Various Super I/O and Controller Devices • Designed to Accommodate Light Loss with Cosmetic Window • Only 2 External Components are Required • Digital Imaging - Digital Still Cameras - Photo-Imaging Printers • Data Communication - Notebook Computers - Desktop PCs - Win CE Handheld Products - Personal Digital Assistants (PDAs) - Printers - Fax Machines, Photocopiers - Screen Projectors - Auto PCs - Dongles - Set-Top Box • Telecommunication Products - Cellular Phones - Pagers • Small Industrial & Medical Instrumentation - General Data Collection Devices - Patient & Pharmaceutical Data Collection Devices • IR LANs Description The HSDL-3600 is a low-profile infrared transceiver module that provides interface between logic and IR signals for through-air, serial, half-duplex IR data link. The module is compliant to IrDA Data Physical Layer Specifications 1.1 and IEC825Class 1 Eye Safe. Functional Block Diagram VCC R1 LEDA (10) TXD (9) SP MD0 (4) HSDL-3600 MD1 (5) RXD (8) FIR_SEL (3) CX1 GND (7) CX2 VCC (1) AGND (2) 2 The HSDL-3600 contains a highspeed and high-efficiency 870 nm LED, a silicon PIN diode, and an integrated circuit. The IC contains an LED driver and a receiver providing a single output (RXD) for all data rates supported. The HSDL-3600 can be completely shut down to achieve very low power consumption. In the shut down mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. The HSDL–3600 also incorporated the capability for adjustable optical power. With two programming pins; MODE 0 and MODE 1, the optical power output can be adjusted lower when the nominal desired link distance is one-third or two-third of the full IrDA link. The HSDL-3600 comes in three package options; the front view option (HSDL-3600#007/#017), the front view guide pin option (HSDL-3600#107/#117), and the top view option (HSDL-3600#008/ #018). All options come with integrated shield that helps to ensure low EMI emission and high immunity to EMI field, thus enhancing reliable performance. Application Support Information The Application Engineering group is available to assist you with the technical understanding associated with HSDL-3600 infrared transceiver module. You can contact them through your local sales representatives for additional details. Ordering Information Package Option Package Part Number Standard Package Increment Front View HSDL-3600#007 400 Front View HSDL-3600#017 10 Top View HSDL-3600#008 400 Top View HSDL-3600#018 10 Front View (with guide pin) HSDL-3600#107 300 Front View (with guide pin) HSDL-3600#117 10 3 Functional Block Diagram I/O Pins Configuration Table VCC Pin 1 2 3 4 5 6 7 8 9 10 R1 LEDA (10) TXD (9) SP MD0 (4) HSDL-3600 MD1 (5) RXD (8) Description Supply Voltage Analog Ground FIR Select Mode 0 Mode 1 No Connection Ground Receiver Data Output Transmitter Data Input LED Anode Symbol Vcc AGND FIR_SEL MD0 MD1 NC GND RXD TXD LEDA FIR_SEL (3) CX1 GND (7) CX2 VCC (1) 10 9 8 7 6 5 4 3 2 1 BACK VIEW (HSDL-3600 #007/#017) AGND (2) 10 9 8 7 6 5 4 3 2 Transceiver Control Truth Table Mode 0 1 0 0 1 0 0 1 Mode 1 0 0 1 1 0 1 1 FIR_SEL X 0 0 0 1 1 1 RX Function Shutdown SIR SIR SIR MIR/FIR MIR/FIR MIR/FIR TX Function Shutdown Full Distance Power 2/3 Distance Power 1/3 Distance Power Full Distance Power 2/3 Distance Power 1/3 Distance Power X = Don’t Care Transceiver I/O Truth Table Transceiver Mode Active Active Active Active Shutdown X= Don’t Care Inputs FIR_SEL X 0 1 X X TXD 1 0 0 0 X[4] EI X High[1] High[2] Low Low 1 BOTTOM VIEW (HSDL-3600 #008/#018) Outputs LED RXD On Not Valid Off Low[3] Off Low[3] Off High Not Valid Not Valid EI = In-Band Infrared Intensity at detector Notes : 1. In-Band EI ≤ 115.2 kb/s and FIR_SEL = 0. 2. In-Band EI ≥ 0.576 Mb/s and FIR_SEL = 1. 3. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity. 4. To maintain low shutdown current, TXD needs to be driven high or low and not left floating. 4 Recommended Application Circuit Components Component R1 CX1[5] CX2[6] Recommended Value 2.2 Ω ± 5%, 0.5 Watt, for 2.7 ≤ Vcc ≤ 3.3 V operation 2.7 Ω ± 5%, 0.5 Watt, for 3.0 ≤ Vcc ≤ 3.6 V operation 0.47 µF ± 20%, X7R Ceramic 6.8 µF ± 20%, Tantalum Notes: 5. CX1 must be placed within 0.7 cm of the HSDL-3600 to obtain optimum noise immunity. 6. In environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in “HSDL-3600 Functional Block Diagram” in page 3. 450 0.7 400 0.6 350 LOP (mW/sr) ILED (A) 0.5 0.4 0.3 0.2 300 250 200 150 100 0.1 0 1.3 50 1.5 1.7 1.9 2.1 2.3 LEDA VOLTAGE (V) ILED vs. LEDA. Marking Information 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 ILED (A) Light Output Power (LOP) vs. ILED. Ma The HSDL-3600#007/017 is marked “3600YYWW’ on the shield where “YY” indicates the unit’s manufacturing year, and “WW” refers to the work week in which the unit is tested. The HSDL-3600#008/018 is marked a “black” dot on the shield. CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 5 Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature DC LED Current Peak LED Current LED Anode Voltage Supply Voltage Transmitter Data Input Current Receiver Data Output Voltage [7] Symbol TS TA ILED(DC) ILED (PK) Minimum -40 -20 Maximum +100 +70 165 650 Unit °C °C mA mA 750 mA VLEDA Vcc ITXD(DC) -0.5 0 -12 7 7 12 V V mA VO -0.5 Vcc+0.5 V Conditions ≤ ≤ ≤ ≤ 90 µs pulse width, 25% duty cycle 2 µs pulse width, 10% duty cycle |IO(RXD)| = 20 µA Note: 7. For implementations where case to ambient thermal resistance ≤ 50°C/W. Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Logic High Input Voltage for TXD, MD0, MD1, and FIR_SEL Logic Low Transmitter Input Voltage LED (Logic High) Current Pulse Amplitude Receiver Signal Rate Ambient Light Symbol TA Vcc VIH Min. -20 2.7 2 Vcc/3 Max. +70 3.6 Vcc Unit °C V V VIL 0 Vcc/3 V ILEDA 400 650 mA 0.0024 4 Mb/s Conditions See IrDA Serial Infrared Physical Layer Link Specification, Appendix A for ambient levels 6 Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25°C and 3.3 V unless otherwise noted. Parameter Transceiver Supply Shutdown Current Idle Digital Input Logic Current Low/High Transmitter Transmitter Logic High Radiant Intensity Intensity Peak Wavelength Spectral Line Half Width Viewing Angle Optical Pulse Width Symbol ICC1 ICC2 IL/H -1 IEH 100 Typ. Max. Unit 10 200 nA 2.5 5 1 mA µA 250 400 mW/sr λP 875 nm ∆λ1/2 35 nm 60 ° 1.6 1.8 µs 148 217 260 ns 115 125 135 ns 40 ns 50 µs 2.4 V 100 nA 2θ1/2 30 tpw (IE) 1.5 Rise and Fall Times tr (IE), tf (IE) Maximum Optical Pulse Width tpw (max) LED Anode On State Voltage LED Anode Off State Leakage Current Min. 20 VON(LEDA) ILK(LEDA) 1 Conditions VI(TXD) VI(TXD) VI(TXD) 0 ≤ VI ≤ ≤ V IL or ≥ V IH ≤ V IL, EI = 0 VCC V IH = 3.0 V ILEDA = 400 mA θ1/2 ≤ 15° tpw(TXD) = 1.6 µs at 115.2 kb/s tpw(TXD) = 217 ns at 1.15 Mb/s tpw(TXD) = 125 ns at 4.0 Mb/s tpw(TXD) = 125 ns at 4.0 Mb/s tr/f(TXD) = 10 ns TXD pin stuck high ILEDA = 400 mA, VI(TXD) ≥ V IH VLEDA = VCC = 3.6 V, VI(TXD) ≤ V IL 7 Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test conditions can be anywhere in their operating range. All typical values are at 25°C and 3.3 V unless otherwise noted. Parameter Receiver Receiver Logic Low[9] Data Output Voltage Logic High Viewing Angle Logic High Receiver Input Irradiance Symbol Min. Typ. Max. Unit VOL 0 - 0.4 V VOH Vcc – 0.2 - Vcc V 2θ1/2 30 EIH 0.0036 IOL = 1.0 mA, EI ≥ 3.6 µW/cm2, θ1/2 ≤ 15° IOH = -20 µA, EI ≤ 0.3 µW/cm2, θ1/2 ≤ 15° ° 500 mW/cm2 For in-band signals ≤ 115.2 kb/s[8] 2 500 mW/cm 0.576 Mb/s ≤ in-band signals ≤ 4 Mb/s[8] 0.3 µW/cm2 For in-band signals[8] 0.0090 Logic Low Receiver Input Irradiance Receiver Peak Sensitivity Wavelength EIL Receiver SIR Pulse Width tpw (SIR) 1 4.0 µs Receiver MIR Pulse Width tpw (MIR) 100 500 ns Receiver FIR Pulse Width tpw (FIR) 85 165 ns 190 ns λP Conditions 880 Receiver ASK Pulse Width tpw (ASK) 1 Receiver Latency Time for FIR Receiver Latency Time for SIR Receiver Rise/Fall Times Receiver Wake Up Time tL (FIR) tL (SIR) tr/f (RXD) tW 40 20 25 nm µs 50 50 100 µs µs ns µs θ1/2 ≤ 15°[10], CL =10 pF θ1/2 ≤ 15°[11], CL =10 pF θ1/2 ≤ 15°[12], CL =10 pF, VCC = 3 - 3.6 V θ1/2 ≤ 15°[12], CL =10 pF, VCC = 2.7 V 500 kHz/50% duty cycle carrier ASK[13] [14] Notes : 8. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 9. Logic Low is a pulsed response. The condition is maintained for duration dependent on pattern and strength of the incident intensity. 10. For in-band signals ≤ 115.2 kb/s where 3.6 µW/cm2 ≤ EI ≤ 500 mW/cm 2. 11. For in-band signals at 1.15 Mb/s where 9.0 µW/cm2 ≤ EI ≤ 500 mW/cm2. 12. For in-band signals of 125 ns pulse width, 4 Mb/s, 4 PPM at recommended 400 mA drive current. 13. Pulse width specified is the pulse width of the second 500 kHz carrier pulse received in a data bit. The first 500 kHz carrier pulse may exceed 2 µs in width, which will not affect correct demodulation of the data stream. An ASK or DASK system using the HSDL-3600 has been shown to correctly receive all data bits for 9 µW/cm2 ≤ EI ≤ 500 mW/cm2 incoming signal strength. ASK or DASK should use the FIR channel enabled. 14. Wake up time is the time between the transition from a shutdown state to an active state and the time when the receiver is active and ready to receive infrared signals. 15. Shields to be grounded. 8 TXD “Stuck ON” Protection RXD Output Waveform TXD VOH tpw 90% 50% VOL LED 10% tf tpw (MAX.) LED Optical Waveform tr Receiver Wake Up Time Definition (when MD0 ≠ 1 and MD1 ≠ 0) tpw RX LIGHT LED ON 90% 50% RXD VALID DATA 10% LED OFF tw tr tf 9 HSDL-3600#007 and HSDL3600#017 Package Outline with Dimension and Recommended PC Board Pad Layout HSDL-3600#007/#017 (Front Option) MOUNTING CENTER 6.10 PIN FUNCTION PIN FUNCTION 1 VCC 6 NC 2 AGND 7 GND 3 FIR_SEL 8 RXD 4 MD0 9 TXD 5 MD1 10 LEDA 1.15 4.60 5.09 TOP VIEW 2.55 R 2.00 R 1.77 4.00 1.90 1.90 PIN 1 0.80 1.68 3.24 4.05 PIN 10 0.82 1.20 3.84 12.20 +0.50 0 SIDE VIEW FRONT VIEW ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED. MOUNTING CENTER MID OF LAND PIN 1 PIN 10 0.70 0.43 1.05 PIN 10 2.40 PIN 1 2.08 0.45 0.70 2.35 4.95 10 CASTELLATION: PITCH 1.1 ± 0.1 CUMULATIVE 9.90 ± 0.1 BACK VIEW 2.84 LAND PATTERN 10 HSDL-3600#008 and HSDL3600#018 Package Outline with Dimension and Recommended PC Board Pad Layout HSDL-3600#008/#018 (Top Option) R 2.00 PIN FUNCTION PIN R 1.78 FUNCTION 1 VCC 6 NC 2 AGND 7 GND 3 FIR_SEL 8 RXD 4 MD0 9 TXD 5 MD1 10 LEDA 1.35 4.89 4.40 LEGEND: MC – MOUNTING CENTER OC – OPTICAL CENTER 0.90 FRONT VIEW SHIELD PAD RECEIVE 5.00 2.40 2.50 TRANSMIT 0.30 0.85 MC OC 2.08 1.46 1.50 4.16 OC 2.08 2.57 0.30 2.25 3.24 3.83 5.00 SIDE VIEW 5.10 12.20 ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED. TOP VIEW 5.70 1.60 2.85 1.70 PIN 10 PIN 1 1.95 1.30 0.43 0.70 PIN 1 10 CASTELLATION: PITCH 1.1 ± 0.1 CUM. OF 9 PITCH – 9.9 ± 0.1 9.90 BOTTOM VIEW PIN 10 0.20 PITCH 9 x 1.10 10 x 0.60 PAD LAND PAD PATTERN 11 HSDL-3600#107 and HSDL-3600#117 Package Outline with Dimension and Recommended PC Board Pad Layout HSDL-3600#107/#117 (Top Option) 2.65 12.2 4 ± 0.1 3.0 1.925 0.5 90° ± 0 2-R 0.5 0.64 0.3 0.8 1.1 1.4 1.55 1.65 0.74 1.0 3.24 0.3 3.83 12.4 1.9 2.4 4.05 R 2.0 R 1.78 5.19 4.7 1.2 TOLERANCE ± 0.2 MIN. UNIT = mm 0.9 0.3 10 9 8 7 6 5 4 3 2 1 0.425 10-R 0.25 ± 0.1 0.7 ± 0.1 4.95 P1.1 ± 0.1 x 9 = 9.9 ± 0.1 1 VDD 6 N.C. 2 AGND 7 GND 3 FIREN 8 RXD 4 MD0 9 TXD 5 MD1 10 LEDA 12 Tape and Reel Dimensions (HSDL-3600#007, #017) All dimensions in millimeters (mm) Quantity = 400 pieces per reel (HSDL-3600#007) Quantity = 10 pieces per tape (HSDL-3600#017) 13.00 ± 0.50 R 1.00 (40 mm MIN.) EMPTY (400 mm MIN.) LEADER PARTS MOUNTED 21.00 ± 0.80 EMPTY (40 mm MIN.) 2.00 ± 0.50 DIRECTION OF PULLING CONFIGURATION OF TAPE LABEL SHAPE AND DIMENSIONS OF REELS 4.00 ± 0.10 2.00 ± 0.10 1.75 ± 0.10 1.50 + 0.10 0 11.50 ± 0.10 POLARITY A 24.00 ± 0.20 12.40 ± 0.10 178.00 ± 2.00 60.00 ± 2.00 VDD 0.40 ± 0.05 5.50 ± 0.10 8.00 ± 0.10 4.20 ± 0.10 DIRECTION OF PULLING + 0.50 25.50 - 1.00 TAPE DIMENSIONS 1.60 ± 0.50 13 Tape and Reel Dimensions (HSDL-3600#008, #018) All dimensions in millimeters (mm) Quantity = 400 pieces per reel (HSDL-3600#008) Quantity = 10 pieces per tape (HSDL-3600#018) 13.00 ± 0.50 R 1.00 (40 mm MIN.) EMPTY (400 mm MIN.) LEADER PARTS MOUNTED 21.00 ± 0.80 EMPTY (40 mm MIN.) 2.00 ± 0.50 DIRECTION OF PULLING CONFIGURATION OF TAPE LABEL SHAPE AND DIMENSIONS OF REELS 4.00 ± 0.10 2.00 ± 0.10 1.75 ± 0.10 1.50 + 0.10 11.50 ± 0.10 POLARITY VDD 24.00 ± 0.20 12.80 ± 0.10 178.00 ± 2.00 60.00 ± 2.00 A 4.80 ± 0.10 0.40 ± 0.05 5.30 ± 0.10 5.65 ± 0.10 8.00 ± 0.10 5.10 ± 0.10 DIRECTION OF PULLING + 0.50 25.50 - 1.00 TAPE DIMENSIONS 1.60 ± 0.50 14 Tape and Reel Dimensions (HSDL-3600#107, #117) All dimensions in millimeters (mm) Quantity = 300 pieces per reel (HSDL-3600#107) Quantity = 10 pieces per tape (HSDL-3600#117) 2.0 ± 0.5 13.0 ± 0.5 60.0 ± 2.0 R 1.0 178.0 ± 2.0 21.0 ± 0.8 LABEL PASTED HERE 1.6 ± 0.5 + 1.0 25.5 – 0.5 SHAPE AND DIMENSIONS OF REEL 4.0 ± 0.1 + 0.1 φ 1.5 – 0 0.7 ± 0.1 POLARITY A 1.75 ± 0.1 11.5 ± 0.1 24.0 ± 0.2 12.7 ± 0.10 VDD 0.4 ± 0.05 5.7 ± 0.1 8.0 ± 0.1 4.3 ± 0.1 DIRECTION OF PULLING OUT DIMENSIONS OF TAPE (40 mm MIN.) EMPTY (400 mm MIN.) LEADER PARTS MOUNTED DIRECTION OF PULLING OUT EMPTY (40 mm MIN.) N = 300 PCS CONFIGURATION OF TAPE 15 Moisture Proof Packaging All HSDL-3600 options are shipped in moisture proof package. Once opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 25°C, AND LESS THAN 60% RH? YES NO BAKING IS NECESSARY NO PACKAGE IS OPENED MORE THAN 3 DAYS? NO YES PERFORM RECOMMENDED BAKING CONDITIONS Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In Reel In Bulk Temperature 60°C 100°C 125°C Baking should only be done once. Time ≥ 48 hours ≥ 4 hours ≥ 2 hours 16 Reflow Profile MAX. 245°C T – TEMPERATURE – (°C) 230 R3 200 183 170 150 R2 90 sec. MAX. ABOVE 183°C 125 R1 100 R4 R5 50 25 0 50 100 150 200 250 300 t-TIME (SECONDS) P1 HEAT UP Process Zone Heat Up Solder Paste Dry P2 SOLDER PASTE DRY Symbol P1, R1 P2, R2 P3, R3 Solder Reflow Cool Down P3, R4 P4, R5 The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different ∆T/∆time temperature change rates. The ∆T/∆time rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3600 castellation I/O pins are heated to a temperature of 125°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4°C per second to allow for even heating of both the PC board and HSDL3600 castellation I/O pins. P3 SOLDER REFLOW P4 COOL DOWN ∆T 25°C to 125°C 125°C to 170°C 170°C to 230°C (245°C at 10 seconds max.) 230°C to 170°C 170°C to 25°C Process zone P2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 170°C (338°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 230°C (446°F) for optimum results. The dwell time above the liquidus point of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 90 seconds, the intermetallic growth within the solder connections becomes excessive, Maximum ∆T/∆time 4°C/s 0.5°C/s 4°C/s - 4°C/s -3°C/s resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170°C (338°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed -3°C per second maximum. This limitation is necessary to allow the PC board and HSDL-3600 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3600 transceiver. 17 Appendix A: Test Method A1. Background Light and Electromagnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field: 3 V/m maximum (please refer to IEC 801-3, severity level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 µW/cm2 (with no modulation) at the optical port. The light source faces the optical port. 3. Incandescent Lighting: 1000 lux maximum. This is produced with general service, tungsten-filament, gas-filled, inside frosted lamps in the 60 Watt to 100 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 Kelvin range and a spectral peak in the 850 to 1050 nm range. 4. Fluorescent Lighting: 1000 lux maximum. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 µW/cm2 minimum and 0.3 µW/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circumstances. It will provide a common floor for IrDA operation. This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radiation is covered by the incandescent condition. All Agilent IR transceivers operating under the recommended drive conditions are classified as CENELEC EN60825-1 Accessible Emission Limit (AEL) Class 1. This standard is in effect in Europe as of January 1, 1997. AEL Class 1 LED devices are considered eye safe. Please see Application Note 1094 for more information. 18 Appendix B : HSDL-3600#007/#017 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1.0. Stencil and PCBA. 1.1 Recommended Land Pattern for HSDL-3600#007/#017 Dim. a b c (pitch) d e f g mm 2.40 0.70 1.10 2.35 2.80 3.13 4.31 Inches 0.095 0.028 0.043 0.093 0.110 0.123 0.170 SHIELD SOLDER PAD Rx LENS Tx LENS e d g b Y f a X theta FIDUCIAL 10x PAD Figure 2.0. Top View of Land Pattern. c FIDUCIAL 19 1.2 Adjacent Land Keep-out and Solder Mask Areas Dim. h j k l mm min. 0.2 13.4 4.7 3.2 Inches min. 0.008 0.528 0.185 0.126 Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended. j • Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. • “h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads. • It is recommended that 2 fiducial cross be placed at mid-length of the pads for unit alignment. 2.0 Recommended Solder Paste/cream Volume for Castellation Joints Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). Tx LENS LAND Rx LENS SOLDER MASK h k Y l Figure 3.0. HSDL-3600#007/#017 PCBA – Adjacent Land Keep-out and Solder Mask. 20 2.1 Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: See Fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.8 ± 0.05 0.110 ± 0.002 0.127 0.005 3.4 ± 0.05 0.134 ± 0.002 w, the width of aperture is fixed at 0.70 mm (0.028 inches) Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions APERTURE AS PER LAND DIMENSIONS t (STENCIL THICKNESS) SOLDER PASTE w l Figure 4.0 Solder Paste Stencil Aperture. 3.0 Pick and Place Misalignment Tolerance and Product Self-Alignment after Solder Reflow If the printed solder paste volume is adequate, the unit will selfalign in the X-direction after solder reflow. Units should be properly reflowed in IR Hot Air convection oven using the recommended reflow profile. The direction of board travel does not matter. Allowable Misalignment Tolerance X – direction Theta – direction ≤ 0.2 mm (0.008 inches) +/- 2 degrees 21 3.1 Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during placement of the unit. The castellations will completely selfalign to the pads during solder reflow as seen in the pictures below. Photo 1.0. Castellation misaligned to land pads in x-axis before reflow. 3.2 Tolerance for Rotational (Theta) Misalignment Units when mounted should not be rotated more than ± 2 degrees with reference to center X-Y as specified in Fig 2.0. Pictures 3.0 and 4.0 show units before and Photo 3.0. Unit is rotated before reflow. Photo 2.0. Castellation self-align to land pads after reflow. after reflow. Units with a Theta misalignment of more than 2 degrees do not completely self align after reflow. Units with ± 2 degree rotational or Theta misalignment self-aligned completely after solder reflow. Photo 4.0. Unit self-aligns after reflow. 22 3.3 Y-axis Misalignment of Castellation In the Y-direction, the unit does not self-align after solder reflow. It is recommended that the unit be placed in line with the fiducial mark (mid-length of land pad.) This will enable sufficient land length (minimum of 1/2 land length.) to form a good joint. See Fig 5.0. LENS EDGE FIDUCIAL Y MINIMUM 1/2 THE LENGTH OF THE LAND PAD Figure 5.0. Section of a Castellation in Y-axis. 3.4 Example of Good HSDL3600#007/#017 Castellation Solder Joints 4.0 Solder Volume Evaluation and Calculation Geometry of an HSDL-3600#007/#017 solder fillet. 0.425 0.20 0.8 Photo 5.0. Good Solder Joint. This joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. It should be reflowed in IR Hot-air convection reflow oven. Direction of board travel does not matter. 0.4 1.2 0.70 0.7 23 Appendix C: HSDL-3600#008/#018 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture METAL STENCIL FOR SOLDER PASTE PRINTING STENCIL APERTURE LAND PATTERN SOLDER MASK PCBA Figure 1.0. Stencil and PCBA. 1.1 Recommended Land Pattern for HSDL-3600#008/#018 Dim. a b c (pitch) d e f g h mm 1.95 0.60 1.10 1.60 5.70 3.80 2.40 0.80 Inches 0.077 0.024 0.043 0.063 0.224 0.150 0.094 0.032 SHIELD SOLDER PAD e d g Y Rx LENS b Tx LENS theta f X h a FIDUCIAL 10x PAD Figure 2.0. Top View of Land Pattern. c FIDUCIAL 24 1.2 Adjacent Land Keep-out and Solder Mask Areas Dim. h j k l mm min. 0.2 13.4 5.8 3.5 Inches min. 0.008 0.528 0.228 0.130 Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended. j Rx LENS • Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. LAND Tx LENS SOLDER MASK h k Y • “h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads. l • It is recommended that 2 fiducial cross be placed at midlength of the pads for unit alignment. Figure 3.0. HSDL-3600#008/#018 PCBA – Adjacent Land Keep-out and Solder Mask. 2.0 Recommended Solder Paste/cream Volume for Castellation Joints Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.28 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). 25 2.1 Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: See Fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 3.1 ± 0.05 0.122 ± 0.002 0.127 0.005 3.7 ± 0.05 0.147 ± 0.002 w, the width of aperture is fixed at 0.60 mm (0.024 inches) Aperture opening for shield pad is 5.7 mm x 1.6 mm as per land dimensions APERTURE AS PER LAND DIMENSIONS t (STENCIL THICKNESS) SOLDER PASTE w l Figure 4.0. Solder Paste Stencil Aperture. 3.0 Pick and Place Misalignment Tolerance and Product Self-Alignment after Solder Reflow If the printed solder paste volume is adequate, the unit will selfalign in X-direction after solder reflow. Units should be properly reflowed in IR Hot Air convection oven using the recommended reflow profile. The direction of board travel does not matter. Allowable Misalignment Tolerance X – direction ≤ 0.2 mm (0.008 inches) 26 3.1 Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during placement of the unit. The castellations will completely selfalign to the pads during solder reflow as seen in the pictures below. § § Solder Castellation Photo 1.0. Castellation mis-aligned to land pads in X-axis before reflow. 3.2 Tolerance for Rotational (Theta) Misalignment Units when mounted should not be rotated more than ± 1 degrees with reference to center X-Y as specified in Fig. 2.0. Photos 3.0 Photo 3.0. Unit is rotated before reflow. Photo 2.0. Castellation self-aligned to land pads after reflow. and 4.0 show that unit cannot be self-aligned back due to the small wetting force. Units with a Theta misalignment of more than 1 degree do not completely self align after reflow. Photo 4.0. Unit not self-aligned after reflow. 27 3.3 Y-axis Misalignment of Castellation In the Y-direction, the unit does not self align after solder reflow. It is recommended that the unit be placed in line with the fiducial mark. This will enable sufficient land length to form a good joint. See Fig. 5.0. Tx LENS Rx LENS FIDUCIAL EDGE Y Figure 5.0. Section of a Castellation in Y-axis. 3.4 Example of Good Castellation Solder Joints Photo 6.0. Good Attachment before Reflow. This joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. It should be Photo 7.0. Good Solder Joint after Reflow. reflowed in IR Hot-air convection reflow oven. Direction of board travel does not matter. 28 4.0 Solder Volume Evaluation and Calculation Geometry of an HSDL-3600#008/#018 solder fillet. 0.46 0.6 0.6 0.1 0.8 1.15 Vsolder = (0.8 x 0.6 x 0.1) + (0.5 x 0.6 x 0.46 (0.6 + 1.15)/2) = 0.1662 mm3 Vpaste = Vsolder/0.6 = 0.277 mm3 29 Appendix D: General Application Guide for the HSDL-3600 Infrared IrDA® Compliant 4 Mb/s Transceiver Description The HSDL-3600 wide voltage operating range infrared transceiver is a low-cost and small form factor that is designed to address the mobile computing market such as notebooks, printers and LAN access as well as small embedded mobile products such as digital cameras, cellular phones, and PDAs. It is fully compliant to IrDA 1.1 specification up to 4 Mb/s, and supports HP-SIR, Sharp ASK, and TV Remote modes. The design of the HSDL3600 also includes the following unique features: • Low passive component count. • Adjustable Optical Power Management (full, 2/3, 1 /3 power). • Shutdown mode for low power consumption requirement. • Single-receive output for all data rates. Adjustable Optical Power Management The HSDL-3600 transmitter offers user-adjustable optical power levels. The use of two logic-level mode-select input pins, MODE 0 and MODE 1, offers shutdown mode as well as three transmit power levels as shown in the Table below. The power levels are setup to correspond nominally to maximum, two-third, and onethird of the transmission distance. This unique feature allows lower optical power to be transmitted at shorter link distances to reduce power consumption. MODE 1 0 0 1 MODE 1 0 0 1 1 Transmitter Shutdown Full Power 2 /3 Power 1/3 Power There are 2 basic means to adjust the optical power of the HSDL3600: 250 mW/sr of intensity at the recommended minimum peak pulse LED current of 400 mA. Dynamic: This implementation enables the transceiver pair to adjust their transmitter power according to the link distance. However, this requires the IrDA protocol stack (mainly the IrLAP layer) to be modified. Please contact Hewlett Packard Application group for further details. Interface to Recommended I/O Chips The HSDL-3600’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Static: Pre-program the ROM BIOS of the system (e.g. notebook PC, digital camera, cell phones, or PDA) to allow the end user to select the desired optical power during the system setup stage. Selection of Resistor R1 Resistor R1 should be selected to provide the appropriate peak pulse LED current over different ranges of Vcc. The recommended R1 for the voltage range of 2.7 V to 3.3 V is 2.2 Ω while for 3.0 V to 3.6 V is 2.7 Ω. The HSDL-3600 typically provides Data rate from 9.6 kb/s up to 4 Mb/s is available at the RXD pin. The FIR_SEL pin selects the data rate that is receivable through RXD. Data rates up to 115.2 kb/s can be received if FIR_SEL is set to logic low. Data rates up to 4 Mb/s can be received if FIR_SEL is set to logic high. Software driver is necessary to program the FIR_SEL to low or high at a given data rate. 4 Mb/s IR link distance of greater than 1.5 meters have been demonstrated using typical HSDL-3600 units with National Semiconductor’s PC87109 3 V Endec and Super I/Os, and the SMC Super I/O chips. 30 (A) National Semiconductor Super I/O and Infrared Controller For National Semiconductor Super I/O and Infrared Controller chips, IR link can be realized with the following connections: • Connect IRTX of the National Super I/O or IR Controller to TXD (pin 9) of the HSDL-3600. • Connect IRRX1 of the National Super I/O or IR Controller to RXD (pin 8) of the HSDL-3600. • Connect IRSL0 of the National Super I/O or IR Controller to FIR_SEL (pin 3) of the HSDL-3600. Please refer to the table below for the IR pin assignments for the National Super I/O and IR Controllers that support IrDA 1.1 up to 4 Mb/s: IRTX 63 81 39 15 PC97/87338VJG PC87308VUL PC87108AVHG PC87109VBE IRRX1 65 80 38 16 IRSL0 66 79 37 14 Please refer to the National Semiconductor data sheets and application notes for updated information. VCC Functional Block Diagram R1 LEDA (10) TXD (9) SP IRTX NATIONAL SEMICONDUCTOR SUPER I/O OR IR CONTROLLER MD0 (4) IRRX1 HSDL-3600 MD1 (5) * * RXD (8) IRSL0 FIR_SEL (3) CX1 GND (7) CX2 * MODE GROUND FOR FULL POWER OPERATION VCC (1) AGND (2) S 31 (B) HSDL-3600 Interoperability with National Semiconductor PC97338VJG SIO Evaluation Report Introduction The objective of this report is to demonstrate the interoperability of the HSDL-3600 IR transceiver IR module as wireless communication ports at the speed of 2.4 kb/s - 4 Mb/s with NS’s PC97338VJG Super I/O under typical operating conditions. Test Procedures 1. Two PC97338VJG evaluation boards were connected to the ISA Bus of two PCs (Pentium 200 MHz) running Microsoft’s DOS operating system. One system with an HSDL-3600 IR transceiver connected to the PC97338VJG evaluation board will act as the master device. Another system with an HSDL-3600 IR transceiver connected to the PC97338VJG will act as the slave device (i.e. Device Under Test). 2. The test software used in this interoperability test is provided by National Semiconductor. A file size of 1.7M byte from the master device, with the PC97338VJG performing the framing, encoding is transmitted to the slave device. The slave device, with the PC97338VJG performing the decoding, and Functional Block Diagram CRC checksum, will receive the file. The file is then checked for error by comparing the received file with the original file using the DOS “fc” command. 3. The link distance is measured by adjusting the distance between the master and slave for errorless data communications. VCC 14.314 MHz CLOCK R1 LEDA (10) A0 - A3 TXD (9) SP IRTX (63) SYSTEM BUS RD, WR, CS D0 - D7 DRQ DACK, TC IRQ NATIONAL SEMICONDUCTOR PC97338VJG SUPER I/O MD0 (4) IRRX1 (65) HSDL-3600 MD1 (5) * * RXD (8) IRSL0 (66) FIR_SEL (3) CX1 GND (7) CX2 * MODE GROUND FOR FULL POWER OPERATION VCC (1) AGND (2) HSDL 3600 32 HSDL-3600 Interoperability with NS PC97338 Report (i) Test Conditions Vcc = 3.0 – 3.6 V RLED = 2.7 Ω Optical transmitter pulse width = 125 ns Mode set to full power (ii) Test Result The interoperability test results show that HSDL-3600 IR transceiver can operate ≥ 1.5 meter link distance from 3 V to 3.6 V with NS’s PC97338 at any IrDA 1.1 data rate without error. (C) Standard Micro System Corporation (SMC) Super and Ultra I/O Controllers For SMC Super and Ultra I/O Controller chips, IR link can be realized with the following connections: • Connect IRTX of the SMC Super or Ultra I/O Controller to TXD (pin 9) of the HSDL3600. • Connect IRRX of the SMC Super or Ultra I/O Controller to RXD (pin 8) of the HSDL3600. • Connect IRMODE of the Super or Ultra I/O Controller to FIR_SEL (pin 3) of the HSDL3600. Please refer to the table below for the IR pin assignments for the SMC Super or Ultra I/O Controllers that support IrDA 1.1 up to 4Mb/s: FDC37C669FR FDC37N769 FDC37C957/8FR IRTX 89 87 204 IRRX 88 86 203 IRMODE 23 21 145 or 190 HSDL-3600 Interoperability with SMC 669/769 Report (i) Test Conditions Vcc = 3.0 – 3.6 V RLED = 2.7 Ω Optical transmitter pulse width = 125 ns Mode set to full power (ii) Test Result The interoperability test results show that HSDL-3600 IR transceiver can operate ≥ 1.5 meter link distance from 3 V to 3.6 V with SMC 669/769 at any IrDA 1.1 data rate without error. 33 HSDL-3600 Interoperability with SMC’s Super I/O or IR Controller VCC R1 LEDA (10) IRRX STANDARD MICROSYSTEM CORPORATION SUPER I/O OR IR CONTROLLER IRMODE RXD (8) FIR_SEL (3) HSDL-3600 IRTX TXD (9) SP MD0 MD1 CX1 GND (7) MODE GROUND FOR FULL POWER OPERATION CX2 4 5 VCC (1) AGND (2) www.semiconductor.agilent.com Data subject to change. Copyright © 2001 Agilent Technologies Inc. March 13, 2001 Obsoletes 5980-0460E (4/00) 5988-2311EN