PHOTODIODE Si PIN photodiode S5106, S5107, S7509, S7510 Chip carrier package for surface mount S5106, S5107, S7509 and S7510 are Si PIN photodiodes sealed in chip carrier packages suitable for surface mount using automated solder reflow techniques. These photodiodes have large active areas, making them suitable for spatial light transmission where a wide field-of-view angle is required. Other applications include POS scanners, power meters and analytical instruments. Features Applications l Active area l Spatial light transmission l Laser radar l Power meter l Bar-code reader S5106: 5 × 5 mm S5107: 10 × 10 mm S7509: 2 × 10 mm S7510: 6 × 11 mm l Ceramic chip carrier package for surface mount l Suitable for solder reflow l High sensitivity ■ General ratings / Absolute maximum ratings Type No. S5106 S5107 S7509 S7510 Dimensional outline/ Window material * ➀/R ➁/R ➂/R ➃/R Active area size Effective active area (mm) 5×5 10 × 10 2 × 10 6 × 11 (mm2) 25 100 20 66 Reverse voltage VR Max (V) Absolute maximum ratings Power Operating Storage dissipation temperature temperature P Topr Tstg (mW) (°C) (°C) 30 50 -40 to +100 -40 to +125 ■ Electrical and optical characteristics (Typ. Ta=25 °C, unless otherwise noted) Type No. Spectral Peak response sensitivity range wavelength λp λ (nm) S5106 S5107 320 to 1100 S7509 S7510 * Window R: Resin coating Photo sensitivity S (A/W) λp 660 n m 780 n m 830 n m (nm) 960 0.72 0.45 0.57 0.62 Short circuit current Isc 100 lx (µA) 27 110 22 72 Cut-off Terminal Dark Temp. frequency capacitance current coefficient fc Ct ID of ID RL=50 Ω f=1 MHz TCID VR=10 V VR=10 V VR=10 V Typ. Max. (nA) (nA) (times/°C) (MHz) (pF) 0.4 5 20 40 0.9 10 10 150 1.15 0.5 5 20 40 1.0 10 15 80 NEP VR=10 V λ=λp (W/Hz1/2) 1.6 × 10-14 2.4 × 10-14 1.7 × 10-14 2.5 × 10-14 Note) S5106, S7509: For mass production, order unit is 100 pieces. S5107, S7510: For mass production, order unit is 50 pieces. 1 Si PIN photodiode ■ Spectral response ■ Photo sensitivity temperature characteristic (Typ. Ta=25 ˚C) PHOTO SENSITIVITY (A/W) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 400 600 800 (Typ.) +1.5 TEMPERATURE COEFFICIENT (%/˚C) 0.8 0 200 S5106, S5107, S7509, S7510 +1.0 +0.5 0 -0.5 200 1000 400 600 800 1000 WAVELENGTH (nm) WAVELENGTH (nm) KPINB0093EC KPINB0165EA ■ Dark current vs. reverse voltage ■ Terminal capacitance vs. reverse voltage (Typ. Ta=25 ˚C) DARK CURRENT 1 nA 100 pA S5107, S7510 S7509 (Typ. Ta=25 ˚C, f=1 MHz) 10 nF TERMINAL CAPACITANCE 10 nA S5106 10 pA 1 nF S5107 S7510 100 pF S5106 S7509 1 pA 0.1 1 10 100 REVERSE VOLTAGE (V) 1 10 100 REVERSE VOLTAGE (V) KPINB0166EA 2 10 pF 0.1 KPINB0128EA Si PIN photodiode S5106, S5107, S7509, S7510 ■ Dimensional outlines (unit: mm) ➀ S5106 ➁ S5107 8.80 ± 0.2 14.5 ± 0.2 (4 ×) R0.3 ACTIVE AREA 1.26 ± 0.15 16.5 ± 0.2 SILICONE RESIN 3.0 1.5 1.8 2.5 1.5 PHOTOSENSITIVE SURFACE 0.46 SILICONE RESIN 1.26 ± 0.15 PHOTOSENSITIVE SURFACE 0.46 10.6 ± 0.2 (4 ×) R0.3 ACTIVE AREA (10 ×) 0.6 1.8 (10 ×) 1.2 1.27 NC (excluding pins ) Burrs shall protrude no more than 0.3 mm on any side of package. 2.54 NC (excluding pins ) Burrs shall protrude no more than 0.3 mm on any side of package. KPINA0002EE ➂ S7509 KPINA0013EC ➃ S7510 15.35 (4 ×) R0.3 ACTIVE AREA ACTIVE AREA PHOTOSENSITIVE SURFACE SILICONE RESIN 1.26 ± 0.15 11.5 ± 0.2 1.26 ± 0.15 SILICONE RESIN 0.46 6.50 PHOTOSENSITIVE SURFACE 14.8 ± 0.2 0.46 (4 ×) R0.25 (18 ×) 0.6 2 2 2 (16 ×) 0.6 2 1.27 NC (excluding pins ) Burrs shall protrude no more than 0.3 mm on any side of package. 1.27 NC (excluding pins ) Burrs shall protrude no more than 0.3 mm on any side of package. KPINA0055EB KPINA0056EB 3 Si PIN photodiode S5106, S5107, S7509, S7510 Precautions for use ● The light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window to prevent such troubles. ● Use rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 °C maximum for 5 seconds maximum time under the conditions that no moisture absorption occurs. Reflow soldering conditions differ depending on the type of PC board and reflow oven. Carefully check these conditions before use. ● Silicone resin swells when it absorbs organic solvent, so do not use any solvent other than alcohol. ● Avoid unpacking until you actually use this product to prevent the terminals from oxidation and dust deposits or the coated resin from absorbing moisture. When the product is stored for 3 months while not unpacked or 24 hours have elapsed after unpacking, perform baking in nitrogen atmosphere at 150 °C for 3 to 5 hours or at 120 °C for 12 to 15 hours before use. Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. ©2006 Hamamatsu Photonics K.K. HAMAMATSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184, www.hamamatsu.com U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658 France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777 North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01 Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741 4 Cat. No. KPIN1033E04 Aug. 2006 DN