HANBIT HMNP16MM-100

HANBit
HMNP16MM
Non-Volatile SRAM MODULE 16Mbyte (4,096K x 32Bit), PCI interface, (SMM) 5V
Part No.
HMNP16MM
GENERAL DESCRIPTION
The HMNP16MM Nonvolatile SRAM is a 16,777,216-byte static RAM organized as 8,388,608 words by 16 bits.
The HMNP16MM has a self-contained lithium energy source provide reliable non-volatility coupled with the
unlimited write cycles of standard SRAM and integral control circuitry which constantly monitors the single 5V
supply for an out-of-tolerance condition. When such a condition occurs, the lithium energy source is
automatically switched on to sustain the memory until after VCC returns valid and write protection is
unconditionally enabled to prevent garbled data.
In addition the SRAM is unconditionally write-protected to prevent an inadvertent write operation. At this time
the integral energy source is switched on to sustain the memory until after VCC returns valid.
The HMNP16MM uses extremely low standby current CMOS SRAM’s, coupled with small lithium coin cells to
provide non-volatility without long write-cycle times and the write-cycle limitations associated with EEPROM.
FEATURES
w Access time : 70, 85 and 100ns
w High-density design : 16Mbyte Design
w Battery internally isolated until power is applied
w Unlimited write cycles
w Data retention in the absence of VCC
w 10-years minimum data retention in absence of power
w Automatic write-protection during power-up/power-down cycles
w Data is automatically protected during power loss
w Industrial temperature operation
OPTIONS
MARKING
w Timing
70 ns
- 70
85 ns
- 85
100 ns
-100
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HANBit Electronics Co.,Ltd
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HMNP16MM
PIN ASSIGNMENT
P1
P2
PIN
Symbol
PIN
Symbol
PIN
Symbol
PIN
Symbol
1
NC
2
TRST*
1
TCK
2
NC
3
TMS
4
TDO
3
GND
4
INTA*
5
TDI
6
GND
5
INTB*
6
INTC*
7
GND
8
NC
7
NC
8
VCC
9
NC
10
NC
9
INTD*
10
NC
11
NC
12
NC
11
GND
12
NC
13
P_RST*
14
NC
13
P_CLK
14
GND
15
NC
16
NC
15
GND
16
P_GNT*
17
NC
18
GND
17
18
VCC
19
P_AD(30)
20
P_AD(29)
19
NC
20
P_AD(31)
21
GND
22
P_AD(26)
21
P_AD(28)
22
P_AD(27)
23
P_AD(24)
24
NC
23
P_AD(25)
24
GND
25
P_IDSEL
26
P_AD(23)
25
GND
26
P_C_BE3*
27
NC
28
P_AD(20)
27
P_AD(22)
28
P_AD(21)
29
P_AD(18)
30
GND
29
P_AD(19)
30
VCC
31
P_AD(16)
32
P_C_BE2*
31
NC
32
P_AD(17)
33
GND
34
NC
33
P_FRAME*
34
GND
35
P_TRDY*
36
NC
35
GND
36
P_IRDY*
37
GND
38
P_STOP*
37
P_DEVSEL*
38
VCC
39
P_PERR*
40
GND
39
GND
40
P_LOCK*
41
NC
42
P_SERR*
41
NC
42
NC
43
P_C_BE1*
44
GND
43
P_PAR
44
GND
45
P_AD(14)
46
P_AD(13)
45
NC
46
P_AD(15)
47
GND
48
P_AD(10)
47
P_AD(12)
48
P_AD(11)
49
P_AD(8)
50
NC
49
P_AD(9)
50
VCC
51
P_AD(7)
52
NC
51
GND
52
P_C_BE0*
53
NC
54
NC
53
P_AD(6)
54
P_AD(5)
55
NC
56
GND
55
P_AD(4)
56
GND
57
NC
58
NC
57
NC
58
P_AD(3)
59
GND
60
NC
59
P_AD(2)
60
P_AD(1)
61
ACK64*
62
NC
61
P_AD(0)
62
VCC
63
GND
64
NC
63
GND
64
REQ64*
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P_REQ*
HANBit Electronics Co.,Ltd
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HMNP16MM
FUNCTIONAL DESCRIPTION
The HMNP16MM executes a read cycle whenever /WE is inactive(high) and /CE is active(low). The address
specified by the address inputs(A0-A19) defines which of the 16,777,216 bytes of data is accessed. Valid data
will be available to the eight data output drivers within tACC (access time) after the last address input signal is
stable.
When power is valid, the HMNP16MM operates as a standard CMOS SRAM. During power-down and powerup cycles, the HMNP16MM acts as a nonvolatile memory, automatically protecting and preserving the memory
contents.
The HMNP16MM is in the write mode whenever the /WE and /CE signals are in the active (low) state after
address inputs are stable. The later occurring falling edge of /CE or /WE will determine the start of the write
cycle. The write cycle is terminated by the earlier rising edge of /CE or /WE. All address inputs must be kept
valid throughout the write cycle. /WE must return to the high state for a minimum recovery time (tWR) before
another cycle can be initiated. The /OE control signal should be kept inactive (high) during write cycles to avoid
bus contention. However, if the output bus been enabled (/CE and /OE active) then /WE will disable the
outputs in tODW from its falling edge.
The HMNP16MM provides full functional capability for Vcc greater than 4.5 V and write protects by 4.37 V
nominal. Power-down/power-up control circuitry constantly monitors the Vcc supply for a power-fail-detect
threshold VPFD. When VCC falls below the VPFD threshold, the SRAM automatically write-protects the data. All
inputs to the RAM become “don’t care” and all outputs are high impedance. As Vcc falls below approximately
3 V, the power switching circuit connects the lithium energy source to RAM to retain data. During power-up,
when Vcc rises above approximately 3.0 volts, the power switching circuit connects external Vcc to the RAM
and disconnects the lithium energy source. Normal RAM operation can resume after Vcc exceeds 4.5 volts.
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HMNP16MM
BLOCK DIAGRAM
E
X
T
E
R
N
A
L
S
L
O
T
PCI BRIDGE
BUFFER
BUFFER
BUFFER
BUFFER
BUFFER
Rev. 0.0 (April, 2002)
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
SRAM
EPLD
POWER
POWER
POWER
POWER
POWER
CONTROLLER
CONTROLLER
CONTROLLER
CONTROLLER
CONTROLLER
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SRAM
SRAM
SRAM
SRAM
SRAM
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HMNP16MM
TRUTH TABLE
MODE
/OE
/CE
/WE
I/O OPERATION
POWER
Not selected
X
H
X
High Z
Standby
Output disable
H
L
H
High Z
Active
Read
L
L
H
DOUT
Active
Write
X
L
L
DIN
Active
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATING
UNIT
Vin,VCC
-0.5 to 7.0
V
Voltage on Vcc supply relative to Vss
Vcc
-0.5 to 7.0
V
Power Dissipation
Pd
32
W
TSTG
-65 to 150
°C
0 to 70
°C
K6T4016C3C-B
-40 to 85
°C
K6T4016C3C-F
Voltage on any pin relative to Vss
Storage temperature
Operating Temperature
Ta
REMARK
NOTE: Permanent device damage may occur if Absolute Maximum Ratings are exceeded.
Functional operation should be restricted to the Recommended DC Operating Conditions detailed in this
data sheet.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER
( TA= TOPR )
SYMBOL
MIN
TYPICAL
MAX
Supply Voltage
VCC
4.5V
5.0V
5.5V
Ground
VSS
0
0
0
Input high voltage
VIH
2.2
-
VCC+0.5V
Input low voltage
VIL
-0.5
-
0.8V
NOTE: Typical values indicate operation at TA = 25℃
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HMNP16MM
DC AND OPERATING CHARACTERISTICS (TA= TOPR, VCCmin £
PARAMETER
Input Leakage Current
Output Leakage Current
CONDITIONS
VIN=VSS to VCC
/CE=VIH or /OE=VIH
or /WE=VIL
VCC≤ VCCmax )
SYMBOL
MIN
TYP.
MAX
UNIT
ILI
-1
-
1
mA
ILO
-1
-
1
mA
Output high voltage
IOH=-1.0mA
VOH
2.4
-
-
V
Output low voltage
IOL= 2.1mA
VOL
-
-
0.4
V
Standby supply
/CE=VIH,
ISB
current(TTL)
Other input = Vil or Vih
Standby supply
current(CMOS)
/CE≥VCC-0.2V,
Other inputs = 0 ~ Vcc
Operating supply current
Min.cycle,duty=100%,
/CE=VIL, II/O=0㎃ ,
A19<VIL or A19>VIH
A20<VIL or A20>VIH
CAPACITANCE (TA=25℃
DESCRIPTION
Input Capacitance
Input/Output Capacitance
-
3
㎃
ISB1
-
20
mA
ICC
-
10
㎃
, f=1MHz, VCC=5.0V)
CONDITIONS
SYMBOL
MAX
MIN
UNIT
Input voltage = 0V
CIN
8
-
pF
Output voltage = 0V
CI/O
10
-
pF
AC CHARACTERISTICS (Test Conditions)
PARAMETER
Input pulse levels
Input rise and fall times
Input and output timing
reference levels
Output load
(including scope and
jig)
VALUE
0 to 2.4V
5 ns
1.5V
(
unless
otherwise
specified)
See rignt
Cl
Cl = 100pF + 1TTL
50pF + 1TTL
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HMNP16MM
READ CYCLE (TA= TOPR, VCCmin £
PARAMETER
VCC≤ VCCmax )
55 ns
SYMBOL
Min
70 ns
Max
55
MIN
MAX
UNIT
70
-
Ns
Read Cycle Time
tRC
Address Access Time
tACC
55
-
70
Ns
Chip enable access time
tACE
55
-
70
Ns
Output enable to Output valid
tOE
25
-
35
Ns
Chip enable to output in low Z
tCLZ
5
5
-
ns
Output enable to output in low Z
tOLZ
5
5
-
ns
Chip disable to output in high Z
tCHZ
0
20
0
25
ns
Output disable to output high Z
tOHZ
0
20
0
25
ns
Output hold from address
tOH
10
10
-
ns
WRITE CYCLE (TA= TOPR, VCCmin £
VCC ≤ VCCmax )
change
SYMB
OL
MIN
Write Cycle Time
tWC
Chip enable to end of write
PARAMETER
50 ns
70ns
UNIT
MIN
MAX
55
70
-
ns
tCW
45
60
-
ns
Address setup time
tAS
0
0
-
ns
Address valid to end of write
tAW
45
60
-
ns
Write pulse width
tWP
45
55
-
ns
Write recovery time
tWR1
0
0
-
ns
Write to output high-Z
tDW
0
0
25-
ns
Data to writer time overlap
tDH1
25
30
-
ns
Data hold from write time
tDH2
0
0
-
ns
End write to output low-Z
tWZ
5
5
/LB, /UB valid to end of write
tOW
45
60
NOTE:
MAX
20
ns
-
1. A write ends at the earlier transition of /CE going high and /WE going high.
2. A write occurs during the overlap of allow /CE and a low /WE. A write begins at the later
transition of
/CE going low and /WE going low.
3. Either tWR1 or tWR2 must be met.
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ns
HANBit
HMNP16MM
4. Either tDH1 or tDH2 must be met.
5. If /CE goes low simultaneously with /WE going low or after /WE going low, the outputs
remain in high-impedance state.
TIMING WAVEFORM
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Rev. 0.0 (April, 2002)
HMNP16MM
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Rev. 0.0 (April, 2002)
HMNP16MM
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HMNP16MM
PACKAGE DIMENSION
<FRONT VIEW>
<REAR VIWE>
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Rev. 0.0 (April, 2002)
HMNP16MM
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HMNP16MM
ORDERING INFORMATION
Part Number
Density
Org.
Package
Vcc
Compone
nt
number
HMNP16MM-100
16Mbyte
x 32
128 Pin-MMC
5V
32 EA
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Rev. 0.0 (April, 2002)
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Speed
100ns
HANBit Electronics Co.,Ltd