HANBit HMN28D Non-Volatile SRAM MODULE 16Kbit (2K x 8-Bit), 24pin DIP, 5V Part No. HMN28D GENERAL DESCRIPTION The HMN28D are 16,384-bit, fully static, nonvolatile SRAM’s organized as 2,048 bytes by 8 bits. Each NVSRAM has a self-contained lithium energy source and control circuitry, which constantly monitors Vcc for an out-of-tolerance condition. When such a condition occurs, the lithium energy source is automatically switched on and writes protection is unconditionally enabled to prevent data corruption. The HMN28D devices can be used in place of existing 2K x 8 SRAM’s directly conforming to the popular byte wide 24-pin DIP standard. There is no limit on the number of write cycles that can be executed and no additional support circuitry is required for microprocessor interfacing. The HMN28D uses extremely low standby current CMOS SRAM’s, coupled with small lithium coin cells to provide nonvolatility without long write-cycle times and the write-cycle limitations associated with EEPROM. FEATURES w Access time : 70, 85, 120 and 150ns PIN ASSIGNMENT w High-density design : 2KByte Design w Battery internally isolated until power is applied A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 Vss w JEDEC standard 24-pin DIP Package w Low-power CMOS w Unlimited writes cycles w Data retention in the absence of VCC w 10-years minimum data retention in absence of power w Automatic write-protection during power-up/power-down cycles w Data is automatically protected during power loss w Conventional SRAM operation; unlimited write cycles 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 Vcc A8 A9 /WE /OE A10 /CE DQ7 DQ6 DQ5 DQ4 DQ3 24-pin Encapsulated package OPTIONS MARKING w Timing 70 ns -70 85 ns -85 120 ns -120 150 ns -150 URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 1 HANBit Electronics Co.,Ltd HANBit HMN28D FUNCTIONAL DESCRIPTION The HMN28D executes a read cycle whenever /WE is inactive(high) and /CE is active(low). The address specified by the address inputs(A0-A10) defines which of the 2,048 bytes of data is accessed. Valid data will be available to the eight data output drivers within tACC (access time) after the last address input signal is stable. When power is valid, the HMN28D operates as a standard CMOS SRAM. During power-down and power-up cycles, the HMN28D acts as a nonvolatile memory, automatically protecting and preserving the memory contents. The HMN28D is in the write mode whenever the /WE and /CE signals are in the active (low) state after address inputs are stable. The later occurring falling edge of /CE or /WE will determine the start of the write cycle. The write cycle is terminated by the earlier rising edge of /CE or /WE. All address inputs must be kept valid throughout the write cycle. /WE must return to the high state for a minimum recovery time (tWR) before another cycle can be initiated. The /OE control signal should be kept inactive (high) during write cycles to avoid bus contention. However, if the output bus been enabled (/CE and /OE active) then /WE will disable the outputs in tODW from its falling edge. The HMN28D provides full functional capability for VCC greater than 4.5 V and write protects by 4.37 V nominal. Powerdown/power-up control circuitry constantly monitors the VCC supply for a power-fail-detect threshold VPFD . When VCC falls below the VPFD threshold, the SRAM automatically write-protects the data. All inputs to the RAM become “don’t care” and all outputs are high impedance. As VCC falls below approximately 3 V, the power switching circuit connects the lithium energy soure to RAM to retain data. During power-up, when VCC rises above approximately 3.0 volts, the power switching circuit connects external VCC to the RAM and disconnects the lithium energy source. Normal RAM operation can resume after VCC exceeds 4.5 volts. BLOCK DIAGRAM /OE PIN DESCRIPTION /WE Power A0-A10 : Address Input A0-A10 2K x 8 SRAM Block /CE : Chip Enable DQ0-DQ7 VSS : Ground DQ0-DQ7 : Data In / Data Out /CE CON /WE : Write Enable /CE Power – Fail Control VCC /OE : Output Enable VCC: Power (+5V) Lithium Cell URL : www.hbe.co.kr Rev. 0.0 (April, 2002) NC : No Connection 2 HANBit Electronics Co.,Ltd HANBit HMN28D TRUTH TABLE MODE /OE /CE /WE I/O OPERATION POWER Not selected X H X High Z Standby Output disable H L H High Z Active Read L L H DOUT Active Write X L L DIN Active ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATING DC voltage applied on VCC relative to VSS VCC -0.3V to 7.0V VT -0.3V to 7.0V Operating temperature TOPR 0 to 70°C Storage temperature TSTG -40°C to 70°C Temperature under bias TBIAS -10°C to 70°C Soldering temperature TSOLDER 260°C DC Voltage applied on any pin excluding VCC relative to VSS CONDITIONS VT≤ VCC+0.3 For 10 second NOTE: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. RECOMMENDED DC OPERATING CONDITIONS ( TA= TOPR ) PARAMETER SYMBOL MIN TYPICAL MAX Supply Voltage VCC 4.5V 5.0V 5.5V Ground VSS 0 0 0 Input high voltage VIH 2.2 - VCC+0.3V Input low voltage VIL -0.3 - 0.8V NOTE: Typical values indicate operation at TA = 25℃ URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 3 HANBit Electronics Co.,Ltd HANBit HMN28D DC ELECTRICAL CHARACTERISTICS (TA= TOPR, VCCmin £ VCC≤ VCCmax ) PARAMETER Input Leakage Current Output Leakage Current CONDITIONS SYMBOL MIN TYP. MAX UNIT VIN=VSS to VCC ILI - - ± 1 mA ILO - - ± 1 mA /CE=VIH or /OE=VIH Or /WE=VIL Output high voltage IOH=-1.0mA VOH 2.4 - - V Output low voltage IOL= 2.1mA VOL - - 0.4 V Standby supply current /CE=VIH ISB - 4 2 ㎃ ISB1 - 2.5 100 mA ICC - 65 15 ㎃ Power-fail-detect voltage VPFD 4.30 4.37 4.50 V Supply switch-over voltage VSO - 3 - V /CE≥ VCC-0.2V, Standby supply current 0V≤ VIN≤ 0.2V, or VIN≥ VCC-0.2V Operating supply current Min.cycle,duty=100%, /CE=VIL, II/O=0㎃ CAPACITANCE (TA=25℃ , f=1MHz, VCC=5.0V) DESCRIPTION CONDITIONS SYMBOL MAX MIN UNIT Input Capacitance Input voltage = 0V CIN 10 - pF Input/Output Capacitance Output voltage = 0V CI/O 10 - pF CHARACTERISTICS (Test Conditions) PARAMETER VALUE Input pulse levels 0 to 3V Input rise and fall times 5 ns Input and output timing 1.5V reference levels (unless otherwise specified) Output load (including scope and jig) URL : www.hbe.co.kr Rev. 0.0 (April, 2002) +5V 1.9KΩ DOUT 1KΩ Figure 1. Output Load A See Figures 1and 2 4 +5V 1.9KΩ DOUT 100㎊ 1KΩ 5㎊ Figure 2. Output Load B HANBit Electronics Co.,Ltd HANBit HMN28D READ CYCLE (TA= TOPR, VCCmin £ VCC≤ VCCmax ) PARAMETER SYMBOL -70 CONDITIONS -85 -120 -150 UNIT MIN MAX MIN MAX MIN MAX MIN MAX 70 - 85 - 120 - 150 - ns Read Cycle Time tRC Address Access Time tACC Output load A - 70 - 85 - 120 - 150 ns Chip enable access time tACE Output load A - 70 - 85 - 120 - 150 ns Output enable to Output valid tOE Output load A - 35 - 45 - 60 - 70 ns Chip enable to output in low Z tCLZ Output load B 5 - 5 - 5 - 10 - ns Output enable to output in low Z tOLZ Output load B 5 - 0 - 0 - 5 - ns Chip disable to output in high Z tCHZ Output load B 0 25 0 35 0 45 0 60 ns Output disable to output high Z tOHZ Output load B 0 25 0 25 0 35 0 50 ns Output hold from address change tOH Output load A 10 - 10 - 10 - 10 - ns WRITE CYCLE (TA= TOPR, Vccmin £ Vcc ≤ Vccmax ) PARAMETER SYMBOL -70 CONDITIONS -85 -120 -150 UNI MIN MAX MIN MAX MIN MAX Min Max T 70 - 85 - 120 - 150 - ns Write Cycle Time tWC Chip enable to end of write tCW Note 1 65 - 75 - 100 - 100 - ns Address setup time tAS Note 2 0 - 0 - 0 - 0 - ns Address valid to end of write tAW Note 1 65 - 75 - 100 - 90 - ns Write pulse width tWP Note 1 55 - 65 - 85 - 90 - ns Write recovery time (write cycle 1) tWR1 Note 3 5 - 5 - 5 - 5 - ns Write recovery time (write cycle 2) tWR2 Note 3 15 - 15 - 15 - 15 - ns Data valid to end of write tDW 30 - 35 - 45 - 50 - ns Data hold time (write cycle 1) tDH1 Note 4 0 - 0 - 0 - 0 - ns Data hold time (write cycle 2) tDH2 Note 4 10 - 10 - 10 - 0 - ns Write enabled to output in high Z tWZ Note 5 0 25 0 30 0 40 0 50 ns Output active from end of write tOW Note 5 5 - 0 - 0 - 5 - ns NOTE: 1. A write ends at the earlier transition of /CE going high and /WE going high. 2. A write occurs during the overlap of allow /CE and a low /WE. A write begins at the later transition of /CE going low and /WE going low. 3. Either tWR1 or tWR2 must be met. 4. Either tDH1 or tDH2 must be met. 5. If /CE goes low simultaneously with /WE going low or after /WE going low, the outputs remain in highimpedance state. URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 5 HANBit Electronics Co.,Ltd HANBit HMN28D POWER-DOWN/POWER-UP CYCLE (TA= TOPR, VCC=5V) PARAMETER SYMBOL VCC slew, 4.75 to 4.25V CONDITIONS tPF MIN TYP. MAX UNIT 300 - - ㎲ VCC slew, 4.75 to VSO tFS 10 - - ㎲ VCC slew, VSO to VPFD (max) tPU 0 - - ㎲ Chip enable recovery time tCER 40 80 120 ms 10 - - years 6 - - years 40 100 150 ㎲ Time during which SRAM is write-protected after VCC passes VPFD on power-up. Data-retention time in TA = 25℃ tDR Absence of VCC Data-retention time in TA = 25℃ ; industrial tDR-N Absence of VCC temperature range (-N) only Delay after VCC slews down Write-protect time tWPT past VPFD before SRAM is Write-protected. TIMING WAVEFORM - READ CYCLE NO.1 (Address Access)*1,2 tRC Address tACC tOH Previous Data Valid DOUT Data Valid - READ CYCLE NO.2 (/CE Access)*1,3,4 tRC /CE tACE tCHZ tCLZ DOUT URL : www.hbe.co.kr Rev. 0.0 (April, 2002) High-Z High-Z 6 HANBit Electronics Co.,Ltd HANBit HMN28D - READ CYCLE NO.3 (/OE Access)*1,5 tRC Address tACC /OE tOE DOUT tOHZ tOLZ Data Valid High-Z High-Z NOTES: 1. /WE is held high for a read cycle. 2. Device is continuously selected: /CE = /OE =VIL. 3. Address is valid prior to or coincident with /CE transition low. 4. /OE = VIL. 5. Device is continuously selected: /CE = VIL - WRITE CYCLE NO.1 (/WE-Controlled)*1,2,3 tWC Address tAW tWR1 tCW /CE tAS tWP /WE tDW DIN Data-in Valid tWZ DOUT Rev. 0.0 (April, 2002) tOW High-Z Data Undefined (1) URL : www.hbe.co.kr tDH1 7 HANBit Electronics Co.,Ltd HANBit HMN28D - WRITE CYCLE NO.2 (/CE-Controlled)*1,2,3,4,5 tWC Address tAW tAS tWR2 tCW /CE tWP /WE tDH2 tDW Data-in Valid DIN tWZ DOUT High-Z Data Undefined (2) NOTE: 1. /CE or /WE must be high during address transition. 2. Because I/O may be active (/OE low) during this period, data input signals of opposite polarity to the outputs must not be applied. 3. If /OE is high, the I/O pins remain in a state of high impedance. 4. Either tWR1 or tWR2 must be met. 5. Either tDH1 or tDH2 must be met. - POWER-DOWN/POWER-UP TIMING tPF VCC 4.75 VPFD VPFD 4.25 VSO VSO tFS tWPT tPU tCER tDR /CE URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 8 HANBit Electronics Co.,Ltd HANBit HMN28D PACKAGE DIMENSIONS Dimension Min Max A 1.320 1.340 B 0.695 0.720 C 0.390 0.415 D 0.100 0.130 E 0.017 0.030 F 0.120 0.160 G 0.090 0.110 H 0.590 0.630 J 0.008 0.012 K 0.015 0.021 F A D G K B C E All dimensions are in inches. J H B ORDERING INFORMATION H M N 2 8 D - 70 I Operating Temp. : Blank = Commercial (0 to 70 °C ) I = Industrial (-40 to 85°C) Speed options : 70 = 70 ns 100 = 100 ns 120 = 120 ns 150 = 150 ns 200 = 200 ns Device : 2K x 8 bit Dip type package Nonvolatile SRAM HANBit Memory Module URL : www.hbe.co.kr Rev. 0.0 (April, 2002) 9 HANBit Electronics Co.,Ltd