HITACHI HM5117400LS-7

HM5116400 Series
HM5117400 Series
4,194,304-word
4-bit Dynamic RAM
ADE-203-648C (Z)
Rev. 3.0
Feb. 27, 1997
Description
The Hitachi HM5116400 Series, HM5117400 Series are CMOS dynamic RAMs organized 4,194,304-word
4-bit. They employ the most advanced 0.5 m CMOS technology for high performance and low power.
The HM5116400 Series, HM5117400 Series offer Fast Page Mode as a high speed access mode. They
have package variations of standard 300-mil 26-pin plastic SOJ and standard 300-mil 26-pin plastic TSOP.
Features
•
•
•
•
•
•
•
•
Single 5 V ( 10%)
Access time: 50 ns/60 ns/70 ns (max)
Power dissipation
Active mode : 495 mW/440 mW/385 mW (max) (HM5116400 Series)
: 550 mW/495 mW/440 mW (max) (HM5117400 Series)
Standby mode : 11 mW (max)
: 0.83 mW (max) (L-version)
Fast page mode capability
Long refresh period
4096 refresh cycles : 64 ms (HM5116400 Series)
: 128 ms (L-version)
2048 refresh cycles : 32 ms (HM5117400 Series)
: 128 ms (L-version)
3 variations of refresh
-only refresh
-beforerefresh
Hidden refresh
Battery backup operation (L-version)
Test function
16-bit parallel test mode
HM5116400 Series, HM5117400 Series
Ordering Information
Type No.
Access time
Package
HM5116400S-5
HM5116400S-6
HM5116400S-7
50 ns
60 ns
70 ns
300-mil 26-pin plastic SOJ
(CP-26/24DB)
HM5116400LS-5
HM5116400LS-6
HM5116400LS-7
50 ns
60 ns
70 ns
HM5117400S-5
HM5117400S-6
HM5117400S-7
50 ns
60 ns
70 ns
HM5117400LS-5
HM5117400LS-6
HM5117400LS-7
50 ns
60 ns
70 ns
HM5116400TS-5
HM5116400TS-6
HM5116400TS-7
50 ns
60 ns
70 ns
HM5116400LTS-5
HM5116400LTS-6
HM5116400LTS-7
50 ns
60 ns
70 ns
HM5117400TS-5
HM5117400TS-6
HM5117400TS-7
50 ns
60 ns
70 ns
HM5117400LTS-5
HM5117400LTS-6
HM5117400LTS-7
50 ns
60 ns
70 ns
2
300-mil 26-pin plastic TSOP II
(TTP-26/24DA)
HM5116400 Series, HM5117400 Series
Pin Arrangement
HM5116400S/LS Series
HM5116400TS/LTS Series
VCC
1
26
VSS
VCC
1
26
VSS
I/O1
2
25
I/O4
I/O1
2
25
I/O4
I/O2
3
24
I/O3
I/O2
3
24
I/O3
4
23
4
23
5
22
5
22
A11
6
21
A9
A11
6
21
A9
A10
8
19
A8
A10
8
19
A8
A0
9
18
A7
A0
9
18
A7
A1
10
17
A6
A1
10
17
A6
A2
11
16
A5
A2
11
16
A5
A3
12
15
A4
A3
12
15
A4
VCC
13
14
VSS
VCC
13
14
VSS
(Top view)
(Top view)
Pin Description
Pin name
Function
A0 to A11
Address input
— Row/Refresh address A0 to A11
— Column address
A0 to A9
I/O1 to I/O4
Data input/Data output
Row address strobe
Column address strobe
Write enable
Output enable
VCC
Power supply
VSS
Ground
3
HM5116400 Series, HM5117400 Series
Pin Arrangement
HM5117400S/LS Series
HM5117400TS/LTS Series
VCC
1
26
VSS
VCC
1
26
VSS
I/O1
2
25
I/O4
I/O1
2
25
I/O4
I/O2
3
24
I/O3
I/O2
3
24
I/O3
4
23
4
23
5
22
5
22
NC
6
21
A9
NC
6
21
A9
A10
8
19
A8
A10
8
19
A8
A0
9
18
A7
A0
9
18
A7
A1
10
17
A6
A1
10
17
A6
A2
11
16
A5
A2
11
16
A5
A3
12
15
A4
A3
12
15
A4
VCC
13
14
VSS
VCC
13
14
VSS
(Top view)
Pin Description
Pin name
Function
A0 to A10
Address input
— Row/Refresh address A0 to A10
— Column address
A0 to A10
I/O1 to I/O4
Data input/Data output
Row address strobe
Column address strobe
Write enable
Output enable
VCC
Power supply
VSS
Ground
NC
No connection
(Top view)
HM5116400 Series, HM5117400 Series
Block Diagram (HM5116400 Series)
Timing and control
A0
Column decoder
A1
to
•
•
•
Column
4M array
address
buffers
A9
•
•
•
Row
address
Row decoder
4M array
I/O buffers
4M array
I/O1
to
I/O4
buffers
A10
4M array
A11
5
HM5116400 Series, HM5117400 Series
Block Diagram (HM5117400 Series)
Timing and control
A0
Column decoder
A1
to
•
•
•
Column
4M array
address
buffers
A10
•
•
•
Row
address
Row decoder
4M array
I/O buffers
4M array
buffers
4M array
6
I/O1
to
I/O4
HM5116400 Series, HM5117400 Series
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Voltage on any pin relative to V SS
VT
–1.0 to +7.0
V
Supply voltage relative to VSS
VCC
–1.0 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
1.0
W
Operating temperature
Topr
0 to +70
C
Storage temperature
Tstg
–55 to +125
C
Recommended DC Operating Conditions (Ta = 0 to +70˚C)
Parameter
Symbol
Min
Typ
Max
Unit
Note
Supply voltage
VCC
4.5
5.0
5.5
V
1
Input high voltage
VIH
2.4
—
6.5
V
1
Input low voltage
VIL
–1.0
—
0.8
V
1
Note:
1. All voltage referred to VSS.
7
HM5116400 Series, HM5117400 Series
DC Characteristics
(Ta = 0 to +70˚C, VCC = 5 V
10%, VSS = 0 V) (HM5116400 Series)
HM5116400
-5
Parameter
-6
-7
Symbol
Min Max Min Max Min Max Unit
Test conditions
Operating current* , * 2
I CC1
—
90
—
80
—
70
mA
t RC = min
Standby current
I CC2
—
2
—
2
—
2
mA
TTL interface
,
= VIH
Dout = High-Z
—
1
—
1
—
1
mA
CMOS interface
,
VCC – 0.2 V
Dout = High-Z
I CC2
—
150 —
150
A
CMOS interface
,
VCC – 0.2 V
Dout = High-Z
I CC3
—
90
—
80
—
70
mA
t RC = min
I CC5
—
5
—
5
—
5
mA
= VIH
= VIL
Dout = enable
I CC6
—
90
—
80
—
70
mA
t RC = min
Fast page mode current*1, * 3
I CC7
—
80
—
70
—
60
mA
t PC = min
Battery backup current
(Standby with CBR refresh)
(L-version)
I CC10
—
350 —
350
A
CMOS interface
Dout = High-Z, CBR
refresh: tRC = 31.3 s
t RAS 0.3 s
Input leakage current
I LI
–10 10
–10 10
–10 10
A
0V
Output leakage current
I LO
–10 10
–10 10
–10 10
A
0 V Vin 7 V
Dout = disable
Output high voltage
VOH
2.4
VCC 2.4
VCC 2.4
VCC
V
High Iout = –5 mA
Output low voltage
VOL
0
0.4
0.4
0.4
V
Low Iout = 4.2 mA
1
Standby current
(L-version)
-only refresh current*2
1
Standby current*
-beforecurrent
refresh
0
150 —
350 —
0
Vin
7V
Notes : 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while
= VIL.
3. Address can be changed once or less while
= VIH.
8
HM5116400 Series, HM5117400 Series
DC Characteristics
(Ta = 0 to +70˚C, VCC = 5 V
10%, VSS = 0 V) (HM5117400 Series)
HM5117400
-5
Parameter
-6
-7
Symbol
Min Max Min Max Min Max Unit
Test conditions
Operating current* , * 2
I CC1
—
100 —
Standby current
I CC2
—
2
—
1
I CC2
—
150 —
150 —
I CC3
—
100 —
90
I CC5
—
5
I CC6
—
Fast page mode current*1, * 3
I CC7
—
90
Battery backup current
(Standby with CBR refresh)
(L-version)
I CC10
—
350 —
Input leakage current
I LI
–10 10
–10 10
Output leakage current
I LO
–10 10
–10 10
Output high voltage
VOH
2.4
VCC 2.4
VCC 2.4
VCC
V
High Iout = –5 mA
Output low voltage
VOL
0
0.4
0.4
0.4
V
Low Iout = 4.2 mA
1
Standby current
(L-version)
-only refresh current*2
1
Standby current*
-beforecurrent
refresh
90
—
80
mA
t RC = min
—
2
—
2
mA
TTL interface
,
= VIH
Dout = High-Z
—
1
—
1
mA
CMOS interface
,
VCC – 0.2 V
Dout = High-Z
150
A
CMOS interface
,
VCC – 0.2 V
Dout = High-Z
—
80
mA
t RC = min
5
—
5
mA
= VIH
= VIL
Dout = enable
100 —
90
—
80
mA
t RC = min
—
80
—
70
mA
t PC = min
350
A
CMOS interface
Dout = High-Z, CBR
refresh: tRC = 62.5 s
t RAS 0.3 s
–10 10
A
0V
–10 10
A
0 V Vin 7 V
Dout = disable
—
0
350 —
0
Vin
7V
Notes : 1. I CC depends on output load condition when the device is selected. ICC max is specified at the
output open condition.
2. Address can be changed once or less while
= VIL.
3. Address can be changed once or less while
= VIH.
9
HM5116400 Series, HM5117400 Series
Capacitance (Ta = 25˚C, VCC = 5 V 10%)
Parameter
Symbol
Typ
Max
Unit
Notes
Input capacitance (Address)
CI1
—
5
pF
1
Input capacitance (Clocks)
CI2
—
7
pF
1
Output capacitance (Data-in, Data-out)
CI/O
—
7
pF
1, 2
Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method.
2.
= VIH to disable Dout.
AC Characteristics (Ta = 0 to +70˚C, VCC = 5 V 10%, VSS = 0 V) *1, *2, *18, *19
Test Conditions
•
•
•
10
Input rise and fall time: 5 ns
Input timing reference levels: 0.8 V, 2.4 V
Output load: 2 TTL gate + C L (100 pF) (Including scope and jig)
HM5116400 Series, HM5117400 Series
Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters)
HM5116400/HM5117400
-5
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Unit
Random read or write cycle time
t RC
90
—
110
—
130
—
ns
precharge time
t RP
30
—
40
—
50
—
ns
precharge time
t CP
7
—
10
—
10
—
ns
pulse width
t RAS
50
10000 60
10000 70
10000 ns
pulse width
t CAS
13
10000 15
10000 18
10000 ns
Row address setup time
t ASR
0
—
0
—
0
—
ns
Row address hold time
t RAH
7
—
10
—
10
—
ns
Column address setup time
t ASC
0
—
0
—
0
—
ns
Column address hold time
t CAH
7
—
10
—
15
—
ns
t RCD
17
37
20
45
20
52
ns
3
to column address delay time
t RAD
12
25
15
30
15
35
ns
4
hold time
t RSH
13
—
15
—
18
—
ns
hold time
t CSH
50
—
60
—
70
—
ns
to
t CRP
5
—
5
—
5
—
ns
to Din delay time
t OED
13
—
15
—
18
—
ns
5
delay time from Din
t DZO
0
—
0
—
0
—
ns
6
t DZC
0
—
0
—
0
—
ns
6
tT
3
50
3
50
3
50
ns
7
to
delay time
precharge time
delay time from Din
Transition time (rise and fall)
Notes
11
HM5116400 Series, HM5117400 Series
Read Cycle
HM5116400/HM5117400
-5
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Unit
Notes
Access time from
t RAC
—
50
—
60
—
70
ns
8, 9, 20
Access time from
t CAC
—
13
—
15
—
18
ns
9, 10, 17,
20
Access time from address
t AA
—
25
—
30
—
35
ns
9, 11, 17,
20
Access time from
t OEA
—
13
—
15
—
18
ns
9, 20
Read command setup time
t RCS
0
—
0
—
0
—
ns
Read command hold time to
t RCH
0
—
0
—
0
—
ns
12
Read command hold time to
t RRH
0
—
0
—
0
—
ns
12
Column address to
lead time
t RAL
25
—
30
—
35
—
ns
Column address to
lead time
t CAL
25
—
30
—
35
—
ns
t CLZ
0
—
0
—
0
—
ns
Output data hold time
t OH
3
—
3
—
3
—
ns
Output data hold time from
t OHO
3
—
3
—
3
—
ns
Output buffer turn-off time
t OFF
—
13
—
15
—
15
ns
13
Output buffer turn-off to
t OEZ
—
13
—
15
—
15
ns
13
t CDD
13
—
15
—
18
—
ns
5
to output in low-Z
to Din delay time
Write Cycle
HM5116400/HM5117400
-5
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Unit
Notes
Write command setup time
t WCS
0
—
0
—
0
—
ns
14
Write command hold time
t WCH
7
—
10
—
15
—
ns
Write command pulse width
t WP
7
—
10
—
10
—
ns
Write command to
lead time
t RWL
13
—
15
—
18
—
ns
Write command to
lead time
t CWL
13
—
15
—
18
—
ns
Data-in setup time
t DS
0
—
0
—
0
—
ns
15
Data-in hold time
t DH
7
—
10
—
15
—
ns
15
12
HM5116400 Series, HM5117400 Series
Read-Modify-Write Cycle
HM5116400/HM5117400
-5
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Unit
Read-modify-write cycle time
t RWC
131
—
155
—
181
—
ns
Notes
to
delay time
t RWD
73
—
85
—
98
—
ns
14
to
delay time
t CWD
36
—
40
—
46
—
ns
14
t AWD
48
—
55
—
63
—
ns
14
t OEH
13
—
15
—
18
—
ns
Column address to
delay time
hold time from
Refresh Cycle
HM5116400/HM5117400
-5
Parameter
Symbol
-6
-7
Min
Max
Min
Max
Min
Max
Unit
setup time (CBR refresh cycle) t CSR
5
—
5
—
5
—
ns
hold time (CBR refresh cycle) t CHR
7
—
10
—
10
—
ns
setup time (CBR refresh cycle) t WRP
0
—
0
—
0
—
ns
hold time (CBR refresh cycle)
t WRH
7
—
10
—
10
—
ns
t RPC
5
—
5
—
5
—
ns
precharge to
hold time
Notes
Fast Page Mode Cycle
HM5116400/HM5117400
-5
-6
-7
Min Max
Min Max
Parameter
Symbol
Min Max
Fast page mode cycle time
t PC
35
—
Fast page mode
pulse width
t RASP
—
100000 —
Access time from
precharge
t CPA
—
30
—
35
30
—
35
—
hold time from
precharge t CPRH
40
—
45
100000 —
—
Unit
Notes
ns
100000 ns
16
—
40
ns
9, 17, 20
40
—
ns
13
HM5116400 Series, HM5117400 Series
Fast Page Mode Read-Modify-Write Cycle
HM5116400/HM5117400
-5
-6
-7
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Unit
Fast page mode read-modify-write
cycle time
t PRWC
76
—
85
—
96
—
ns
53
—
60
—
68
—
ns
14
Notes
delay time from
precharge t CPW
Notes
Test Mode Cycle *19
HM5116400/HM5117400
-5
Parameter
-6
-7
Symbol
Min
Max
Min
Max
Min
Max
Unit
Test mode
setup time
t WTS
0
—
0
—
0
—
ns
Test mode
hold time
t WTH
7
—
10
—
10
—
ns
Refresh (HM5116400 Series)
Parameter
Symbol
Max
Unit
Notes
Refresh
t REF
64
ms
4096 cycles
Refresh (L-version)
t REF
128
ms
4096 cycles
Parameter
Symbol
Max
Unit
Notes
Refresh period
t REF
32
ms
2048 cycles
Refresh period (L-version)
t REF
128
ms
2048 cycles
Refresh (HM5117400 Series)
14
HM5116400 Series, HM5117400 Series
Notes: 1. AC measurements assume t T = 5 ns.
2. An initial pause of 200 s is required after power up followed by a minimum of eight initialization
cycles (any combination of cycles containing
-only refresh or
-beforerefresh). If
the internal refresh counter is used, a minimum of eight
-beforerefresh cycles are
required.
3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a
reference point only; if t RCD is greater than the specified tRCD (max) limit, then access time is
controlled exclusively by tCAC .
4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a
reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is
controlled exclusively by tAA.
5. Either t OED or tCDD must be satisfied.
6. Either t DZO or tDZC must be satisfied.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition
times are measured between V IH (min) and VIL (max).
8. Assumes that t RCD tRCD (max) and tRAD tRAD (max). If tRCD or tRAD is greater than the maximum
recommended value shown in this table, t RAC exceeds the value shown.
9. Measured with a load circuit equivalent to 2 TTL loads and 100 pF.
10. Assumes that t RCD tRCD (max) and tRCD + tCAC (max) tRAD + t AA (max).
11. Assumes that t RAD tRAD (max) and tRCD + tCAC (max) tRAD + t AA (max).
12. Either t RCH or tRRH must be satisfied for a read cycles.
13. t OFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition
and are not referred to output voltage levels.
14. t WCS, t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the
data sheet as electrical characteristics only; if t WCS tWCS (min), the cycle is an early write cycle
and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD
tRWD (min), tCWD tCWD (min), and tAWD tAWD (min), or tCWD tCWD (min), tAWD tAWD (min) and tCPW
t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the
selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out
(at access time) is indeterminate.
leading edge in early write cycles and to
leading
15. These parameters are referred to
edge in delayed write or read-modify-write cycles.
16. t RASP defines
pulse width in Fast page mode cycles.
17. Access time is determined by the longest among t AA, t CAC and t CPA.
18. In delayed write or read-modify-write cycles,
must disable output buffer prior to applying data
to the device.
19. The 16M DRAM offers a 16-bit time saving parallel test mode. Address CA0 and CA1 for the 4M
4 are don’t care during test mode. Test mode is set by performing a
-and-before(WCBR) cycle. In 16-bit parallel test mode, data is written into 4 bits in parallel at each I/O (I/O1
to I/O4) and read out from each I/O.
If 4 bits of each I/O are equal (all 1s or 0s), data output pin is a high state during test mode read
cycle, then the device has passed. If they are not equal, data output pin is a low state, then the
device has failed.
Refresh during test mode operation can be performed by normal read cycles or by WCBR
refresh cycles.
To get out of test mode and enter a normal operation mode, perform either a regular
beforerefresh cycle or
-only refresh cycle.
20. In a test mode read cycle, the value of tRAC , t AA, t CAC and t CPA is delayed by 2 ns to 5 ns for the
specified value. These parameters should be specified in test mode cycles by adding the above
value to the specified value in this data sheet.
15
HM5116400 Series, HM5117400 Series
21. XXX: H or L (H: VIH (min) VIN VIH (max), L: VIL (min) VIN VIL (max))
///////: Invalid Dout
When the address, clock and input pins are not described on timing waveforms, their pins must
be applied VIH or VIL.
+16
HM5116400 Series, HM5117400 Series
Notes: 1. AC measurements assume t T = 5 ns.
2. An initial pause of 200 s is required after power up followed by a minimum of eight initialization
cycles (any combination of cycles containing
-only refresh or
-beforerefresh). If
the internal refresh counter is used, a minimum of eight
-beforerefresh cycles are
required.
3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a
reference point only; if t RCD is greater than the specified tRCD (max) limit, then access time is
controlled exclusively by tCAC .
4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a
reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is
controlled exclusively by tAA.
5. Either t OED or tCDD must be satisfied.
6. Either t DZO or tDZC must be satisfied.
7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition
times are measured between V IH (min) and VIL (max).
8. Assumes that t RCD tRCD (max) and tRAD tRAD (max). If tRCD or tRAD is greater than the maximum
recommended value shown in this table, t RAC exceeds the value shown.
9. Measured with a load circuit equivalent to 2 TTL loads and 100 pF.
10. Assumes that t RCD tRCD (max) and tRCD + tCAC (max) tRAD + t AA (max).
11. Assumes that t RAD tRAD (max) and tRCD + tCAC (max) tRAD + t AA (max).
12. Either t RCH or tRRH must be satisfied for a read cycles.
13. t OFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition
and are not referred to output voltage levels.
14. t WCS, t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the
data sheet as electrical characteristics only; if t WCS tWCS (min), the cycle is an early write cycle
and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD
tRWD (min), tCWD tCWD (min), and tAWD tAWD (min), or tCWD tCWD (min), tAWD tAWD (min) and tCPW
t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the
selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out
(at access time) is indeterminate.
leading edge in early write cycles and to
leading
15. These parameters are referred to
edge in delayed write or read-modify-write cycles.
16. t RASP defines
pulse width in Fast page mode cycles.
17. Access time is determined by the longest among t AA, t CAC and t CPA.
18. In delayed write or read-modify-write cycles,
must disable output buffer prior to applying data
to the device.
19. The 16M DRAM offers a 16-bit time saving parallel test mode. Address CA0 and CA1 for the 4M
4 are don’t care during test mode. Test mode is set by performing a
-and-before(WCBR) cycle. In 16-bit parallel test mode, data is written into 4 bits in parallel at each I/O (I/O1
to I/O4) and read out from each I/O.
If 4 bits of each I/O are equal (all 1s or 0s), data output pin is a high state during test mode read
cycle, then the device has passed. If they are not equal, data output pin is a low state, then the
device has failed.
Refresh during test mode operation can be performed by normal read cycles or by WCBR
refresh cycles.
To get out of test mode and enter a normal operation mode, perform either a regular
beforerefresh cycle or
-only refresh cycle.
20. In a test mode read cycle, the value of tRAC , t AA, t CAC and t CPA is delayed by 2 ns to 5 ns for the
specified value. These parameters should be specified in test mode cycles by adding the above
value to the specified value in this data sheet.
15
HM5116400 Series, HM5117400 Series
Early Write Cycle
t RC
t RAS
t RP
RAS
t CSH
t RCD
t CRP
t RSH
t CAS
tT
CAS
t ASR
Address
t RAH
Row
t ASC
t CAH
Column
t WCS
t WCH
WE
t DS
Din
Dout
t DH
Din
High-Z*
* t WCS
18
t WCS (min)
HM5116400 Series, HM5117400 Series
Delayed Write Cycle*18
t RC
t RAS
t RP
RAS
t CRP
t CSH
t RCD
t RSH
t CAS
tT
CAS
t ASR
Address
t RAH
t ASC
Row
t CAH
Column
t CWL
t RWL
t WP
t RCS
WE
t DZC
Din
t DS
High-Z
t DH
Din
t DZO
t OEH
t OED
OE
t OEZ
t CLZ
High-Z
Dout
Invalid Dout
19
HM5116400 Series, HM5117400 Series
Read-Modify-Write Cycle*18
t RWC
t RAS
t RP
RAS
tT
t RCD
t CAS
t CRP
CAS
t RAD
t ASR
Address
t RAH
t ASC
Row
t CAH
Column
t RCS
t CWD
t CWL
t AWD
t RWL
t RWD
t WP
WE
t DZC
t DH
t DS
High-Z
Din
Din
t OED
t DZO
t OEH
t OEA
OE
t CAC
t OEZ
t AA
t RAC
t OHO
Dout
Dout
t CLZ
20
High-Z
HM5116400 Series, HM5117400 Series
-Only Refresh Cycle
t RC
t RAS
t RP
tT
t CRP
t RPC
t ASR
Address
t CRP
t RAH
Row
t OFF
Dout
High-Z
21
HM5116400 Series, HM5117400 Series
-Before-
Refresh Cycle
t RC
t RP
t RPC
t RAS
t CSR
t RP
t CHR
t RPC
tT
t CP
t WRP
t WRH
t CP
Address
t OFF
Dout
22
High-Z
t CRP
HM5116400 Series, HM5117400 Series
Hidden Refresh Cycle
t RC
t RAS
t RP
t RC
t RAS
t RC
t RP
t RAS
t RP
RAS
tT
t RSH
t CHR
t CRP
t RCD
CAS
t RAD
t ASC
t ASR t RAH
Address
t RAL
Row
t CAH
Column
t WRP
t RRH
t RCS
t WRH
t WRP
t WRH
WE
t DZC
t CDD
High-Z
Din
t DZO
t OED
t OEA
OE
t CAC
t OEZ
t OHO
t AA
t RAC
t OFF
t OH
t CLZ
Dout
Dout
23
HM5116400 Series, HM5117400 Series
Fast Page Mode Read Cycle
t RASP
t CPRH
t RP
RAS
tT
t PC
t CSH
t RCD
t CAS
t CP
t RSH
t CP
t CAS
t CRP
t CAS
CAS
t RAD
Address
t RAL
t CAL
t ASR t RAH
t CAL
t ASC t CAH
t CAL
t ASC t CAH
t ASC t CAH
Row
Column 1
Column 2
Column N
t RCS
t RCS
t RCH
t RCS
t RRH
t RCH
t RCH
WE
t DZC
Din
t DZO
t DZC
t DZC
t CDD
t CDD
High-Z
High-Z
t OED
t DZO t OED
t CDD
High-Z
t DZO
t OED
OE
t RAC
t AA
t OH
t OEA
24
t OHO
t OH
t OEA
t OFF t CAC
t OEZ t CLZ
t CAC
t CLZ
Dout
t CPA
t AA
Dout 1
t CPA
t AA
t OHO
t OFF
t OEZ
Dout 2
t OH
t OHO
t OEA
t CAC
t CLZ
t OFF
t OEZ
Dout N
HM5116400 Series, HM5117400 Series
Fast Page Mode Early Write Cycle
t RASP
t RP
RAS
tT
t CSH
t RCD
t CAS
t PC
t CP
t CAS
t CP
t RSH
t CAS
t CRP
CAS
Address
t ASR t RAH
t ASC t CAH
t ASC t CAH
t ASC t CAH
ROW
Column 1
Column 2
Column N
t WCS t WCH
t WCS
t WCH
t WCS
t WCH
WE
t DS
Din
Dout
t DH
Din 1
t DS
t DH
Din 2
t DS
t DH
Din N
High-Z*
* t WCS
t WCS (min)
25
HM5116400 Series, HM5117400 Series
Fast Page Mode Delayed Write Cycle*18
t RASP
t RP
RAS
tT
t CP
t CSH
t RCD
t CRP
t CP
t PC
t CAS
t RSH
t CAS
t CAS
CAS
t RAD
t ASR
t ASC
t RAH
Address
t ASC
t CAH
Row
t ASC
t CAH
Column 1
t CAH
Column 2
t CWL
Column N
t CWL
t CWL
t RWL
t RCS
t RCS
t RCS
WE
t WP
t WP
t WP
t DZC t DS
t DZC t DS
t DZC t DS
t DH
t DH
Din
1
Din
t DZO
t DH
Din
2
t DZO
t OED
Din
N
t DZO
t OED
t OED
t OEH
t OEH
t OEH
OE
t CLZ
t CLZ
t OEZ
t CLZ
t OEZ
t OEZ
High-Z
Dout
Invalid Dout
26
Invalid Dout
Invalid Dout
HM5116400 Series, HM5117400 Series
Fast Page Mode Read-Modify-Write Cycle*18
t RASP
t RP
RAS
tT
t PRWC
t CP
t RCD
t RSH
t CP
t CAS
t CAS
t CRP
t CAS
CAS
t RAD
t ASR
Address
t ASC
t RAH
Row
t ASC
t CAH
t CAH
Column 1
t ASC
t CAH
Column 2
t RWD
t CWL
Column N
t CPW
t AWD
t CWL
t CPW
t AWD
t CWD
t RCS
t CWL
t AWD
t CWD
t RCS
t RWL
t CWD
WE
t RCS
t WP
t WP
t DZC t DS
t WP
t DZC t DS
t DZC t DS
t DH
t DH
Din
1
Din
t DZO
t OED
t DH
Din
2
t OED
t DZO
t OEH
Din
N
t OED
t DZO
t OEH
t OEH
OE
t OHO
t OEA
t CAC
t OHO
t OEA
t CAC
t AA
t AA
t CPA
t RAC
t OEZ
t CLZ
t OHO
t OEA
t CAC
t AA
t CPA
t OEZ
t CLZ
t OEZ
t CLZ
High-Z
Dout
Dout 1
Dout 2
Dout N
27
HM5116400 Series, HM5117400 Series
Test Mode Cycle*19
Set Cycle**
Test Mode Cycle
*,**
Reset Cycle
Normal Mode
RAS
CAS
WE
* CBR or RAS-only refresh
** Address, Din, OE: H or L
28
HM5116400 Series, HM5117400 Series
Test Mode Set Cycle
t RC
t RP
t RAS
t RP
RAS
t RPC
t CSR
t CHR
t RPC
t CRP
tT
CAS
t CP
t WTS
t WTH
t CP
WE
Address
t OFF
Dout
High-Z
29
HM5116400 Series, HM5117400 Series
Package Dimensions
HM5116400S/LS Series
HM5117400S/LS Series (CP-26/24DB)
26
1
16.90
17.27 Max
21 19
6 8
0.74
Unit: mm
14
13
1.30 Max
0.43 ± 0.10
0.41 ± 0.08
1.27
2.54
6.71 ± 0.25
0.10
Hitachi Code
JEDEC Code
EIAJ Code
Weight
30
CP-26/24DB
MO-077-AA
SC-632-A
0.8 g
HM5116400 Series, HM5117400 Series
HM5116400TS/LTS Series
HM5117400TS/LTS Series (TTP-26/24DA)
26
0.42
0.40
17.14
17.54 Max
21
19
1
6 8
1.27
0.08
0.06
0.21 M
1.15 Max
Unit: mm
14
13
0.80
9.22
0.20
0–5
0.50
2.54
0.10
0.10
Hitachi Code
JEDEC Code
EIAJ Code
Weight
TTP-26/24DA
MO-132AB
—
0.30 g
31
HM5116400 Series, HM5117400 Series
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of
this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any
other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any intellectual
property claims or other problems that may result from applications based on the examples described
herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third party or
Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products are
requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
Hitachi, Ltd.
Semiconductor & IC Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan
Tel: Tokyo (03) 3270-2111
Fax: (03) 3270-5109
For further information write to:
Hitachi America, Ltd.
Semiconductor & IC Div.
2000 Sierra Point Parkway
Brisbane, CA. 94005-1835
USA
Tel: 415-589-8300
Fax: 415-583-4207
32
Hitachi Europe GmbH
Electronic Components Group
Continental Europe
Dornacher Straße 3
D-85622 Feldkirchen
München
Tel: 089-9 91 80-0
Fax: 089-9 29 30 00
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Electronic Components Div.
Northern Europe Headquarters
Whitebrook Park
Lower Cookham Road
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United Kingdom
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Fax: 0628-778322
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Tel: 535-2100
Fax: 535-1533
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Unit 706, North Tower,
World Finance Centre,
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon
Hong Kong
Tel: 27359218
Fax: 27306071
HM5116400 Series, HM5117400 Series
Revision Record
Rev.
Date
Contents of Modification
Drawn by
Approved by
1.0
Oct. 14, 1996
Initial issue
Y. Kasama
M. Mishima
2.0
Nov. 14, 1996
Addition of HM5116400-5 Series
Y. Kasama
Y. Matsuno
Addition of HM5117400-5 Series
Power dissipation (active)
605/550 mW(max) to 550/495/440 mW (max)
(HM5117400 Series)
DC Characteristics (HM5117400 Series)
I CC1 max: 110/100 mA to 100/90/80 mA
I CC3 max: 110/100 mA to 100/90/80 mA
I CC6 max: 110/100 mA to 100/90/80 mA
3.0
Feb. 27, 1997
AC Characteristics
t RRH min: 5/5/5 ns to 0/0/0 ns
33