ICMIC X24C01IM

TM
ICmic
This X24C01 device has been acquired by
IC Microsystems from Xicor, Inc.
IC MICROSYSTEMS
X24C01
1K
128 x 8 Bit
2
Serial E PROM
FEATURES
DESCRIPTION
•2.7V to 5.5V Power Supply
•Low Power CMOS
The X24C01 is a CMOS 1024 bit serial E PROM,
internally organized as 128 x 8. The X24C01 features a
—Active Current Less Than 1 mA
—Standby Current Less Than 50 µA
•Internally Organized 128 x 8
serial interface and software protocol allowing operation
on a simple two wire bus.
•2 Wire Serial Interface
Xicor E PROMs are designed and tested for applications requiring extended endurance. Inherent data
2
2
—Bidirectional Data Transfer Protocol
•Four Byte Page Write Mode
•Self Timed Write Cycle
retention is greater than 100 years.
—Typical Write Cycle Time of 5 ms
•High Reliability
—Endurance: 100,000 Cycles
—Data Retention: 100 Years
•8-Pin Mini-DIP, 8-PIN MSOP, and 8-PIN SOIC
Packages
FUNCTIONAL DIAGRAM
(8) V CC
(4) V SS
(5) SDA
H.V. GENERATION
TIMING
& CONTROL
START CYCLE
START
STOP
LOGIC
CONTROL
LOGIC
2
INC
LOAD
(6) SCL
E PROM
32 X 32
XDEC
WORD
ADDRESS
COUNTER
R/W
YDEC
8
CK
PIN
D
DATA REGISTER
OUT
D
OUT
ACK
3837 FHD F01
© Xicor, 1991 Patents Pending
3837-1.2 7/28/97 T1/C0/D0 SH
1
Characteristics subject to change without notice
X24C01
PIN DESCRIPTIONS
PIN CONFIGURATION
Serial Clock (SCL)
The SCL input is used to clock all data into and out of
the device.
DIP
PLASTIC
Serial Data (SDA)
SDA is a bidirectional pin used to transfer data into and
out of the device. It is an open drain output and may be
NC
NC
NC
wire-ORed with any number of open drain or open
collector outputs.
V
SS
1
8
2
7
3
X24C01
4
V
CC
NC
6
SCL
SDA
5
3837 FHD F02
An open drain output requires the use of a pull-up
resistor. For selecting typical values, refer to the Guidelines for Calculating Typical Values of Bus Pull-Up
Resistors graph.
SOIC/MSOP
NC
NC
PIN NAMES
Symbol
NC
Description
NC
VSS
VCC
SDA
SCL
V
SS
No Connect
Ground
Supply Voltage
Serial Data
Serial Clock
1
8
2
7
3
X24C01
4
6
5
V
CC
NC
SCL
SDA
3837 FHD F03
3837 PGM T01
EQUIVALENT A.C. LOAD CIRCUIT
A.C. CONDITIONS OF TEST
Input Pulse Levels
Input Rise and
Fall Times
Input and Output
Timing Levels
5V
VCC x 0.1 to VCC x 0.9
2190Ο
10 ns
OUTPUT
VCC x 0.5
100pF
3837 PGM T02
3837 FHD F16
2
X24C01
DEVICE OPERATION
The X24C01 supports a bidirectional bus oriented protocol. The protocol defines any device that sends data
Clock and Data Conventions
Data states on the SDA line can change only during SCL
LOW. SDA state changes during SCL HIGH are re-
onto the bus as a transmitter and the receiving device as
the receiver. The device controlling the transfer is a
served for indicating start and stop conditions. Refer to
Figures 1 and 2.
master and the device being controlled is the slave. The
master will always initiate data transfers and provide the
Start Condition
All commands are preceded by the start condition,
which is a HIGH to LOW transition of SDA when SCL is
clock for both transmit and receive operations. Therefore, the X24C01 will be considered a slave in all
applications.
HIGH. The X24C01 continuously monitors the SDA and
SCL lines for the start condition and will not respond to
any command until this condition has been met.
Figure 1. Data Validity
SCL
SDA
DATA STABLE
DATA
CHANGE
3837 FHD F06
3
X24C01
The X24C01 will respond with an acknowledge after
recognition of a start condition, a seven bit word address
Stop Condition
All communications must be terminated by a stop condition, which is a LOW to HIGH transition of SDA when
and a R/W bit. If a write operation has been selected, the
X24C01 will respond with an acknowledge after each
SCL is HIGH. The stop condition is also used by the
X24C01 to place the device in the standby power mode
byte of data is received.
after a read sequence. A stop condition can only be
issued after the transmitting device has released the bus.
In the read mode the X24C01 will transmit eight bits of data,
release the SDA line and monitor the line for an
Acknowledge
Acknowledge is a software convention used to indicate
successful data transfers. The transmitting device will
acknowledge. If an acknowledge is detected and no
stop condition is generated by the master, the X24C01
will continue to transmit data. If an acknowledge is not
detected, the X24C01 will terminate further data trans-
release the bus after transmitting eight bits. During the ninth
clock cycle the receiver will pull the SDA line LOW
missions. The master must then issue a stop condition to
return the X24C01 to the standby power mode and
to acknowledge that it received the eight bits of data.
Refer to Figure 3.
place the device into a known state.
Figure 2. Definition of Start and Stop
SCL
SDA
START CONDITION
STOP CONDITION
3837 FHD F07
Figure 3. Acknowledge Response From Receiver
SCL FROM
MASTER
1
8
9
DATA
OUTPUT
FROM
TRANSMITTER
DATA
OUTPUT
FROM
RECEIVER
START
ACKNOWLEDGE
3837 FHD F08
4
X24C01
WRITE OPERATIONS
the page address. The X24C01 is capable of a four byte page
write operation. It is initiated in the same manner as
Byte Write
To initiate a write operation, the master sends a start
condition followed by a seven bit word address and a write
bit. The X24C01 responds with an acknowledge, then waits
for eight bits of data and then responds with an
the byte write operation, but instead of terminating the
transfer of data after the first data byte, the master can
acknowledge. The master then terminates the transfer by
generating a stop condition, at which time the X24C01
After the receipt of each data byte, the two low order address
bits are internally incremented by one. The high
begins the internal write cycle to the nonvolatile memory.
While the internal write cycle is in progress, the X24C01
order five bits of the address remain constant. If the
master should transmit more than four data bytes prior
inputs are disabled, and the device will not respond to any
requests from the master. Refer to Figure 4 for the
address, acknowledge and data transfer sequence.
to generating the stop condition, the address counter will “roll
over” and the previously transmitted data will be
Page Write
The most significant five bits of the word address define
Refer to Figure 5 for the address, acknowledge and data
transfer sequence.
transmit up to three more bytes. After the receipt of each data
byte, the X24C01 will respond with an acknowledge.
overwritten. As with the byte write operation, all inputs are
disabled until completion of the internal write cycle.
Figure 4. Byte Write
S
T
BUS ACTIVITY:
SDA LINE
WORD
A ADDRESS (n)
R
T
S
T
DATA n
O
P
P
S
L R A
S / C
K
B
M
S
BUS ACTIVITY:
X24C01
B
A
C
K
W
3837 FHD F09
Figure 5. Page Write
S
T
BUS ACTIVITY:
A
R
WORD
ADDRESS (n)
DATA n
DATA n+1
S
T
DATA n+3
O
P
T
SDA LINE
BUS ACTIVITY:
X24C01
S
P
M
S
B
L R A
S / C
B
WK
A
C
A
C
A
C
K
K
K
3837 FHD F10
5
X24C01
Figure 6. ACK Polling Sequence
Acknowledge Polling
The disabling of the inputs can be used to take advantage
of the typical 5 ms write cycle time. Once the stop
WRITE OPERATION
COMPLETED
condition is issued to indicate the end of the host’s write
operation the X24C01 initiates the internal write cycle.
ENTER ACK POLLING
ACK polling can be initiated immediately. This involves
issuing the start condition followed by the word address
for a write operation. If the X24C01 is still busy with the
write operation no ACK will be returned. If the X24C01
ISSUE
START
has completed the write operation an ACK will be
returned and the controller can then proceed with the
next read or write operation.
ISSUE SLAVE
ADDRESS AND R/W = 0
READ OPERATIONS
ISSUE STOP
Read operations are initiated in the same manner as
write operations with exception that the R/W bit of the
ACK
RETURNED?
word address is set to a one. There are two basic read
operations: byte read and sequential read.
NO
YES
It should be noted that the ninth clock cycle of the read
operation is not a “don’t care.” To terminate a read
NEXT
OPERATION
operation, the master must either issue a stop condition
during the ninth cycle or hold SDA HIGH during the ninth
NO
A WRITE?
clock cycle and then issue a stop condition.
YES
ISSUE STOP
Byte Read
To initiate a read operation, the master sends a start
condition followed by a seven bit word address and a
read bit. The X24C01 responds with an acknowledge and
then transmits the eight bits of data. The read
PROCEED
PROCEED
operation is terminated by the master; by not responding
with an acknowledge and by issuing a stop condition.
3837 FHD F11
Refer to Figure 7 for the start, word address, read bit,
acknowledge and data transfer sequence.
Figure 7. Byte Read
S
T
BUS ACTIVITY:
MASTER
WORD
A ADDRESS n
R
SDA LINE
S
BUS ACTIVITY:
X24C01
S
T
O
P
T
P
L R A
S / C
K
B
M
S
B
W
6
DATA n
3837 FHD F12
X24C01
The data output is sequential, with the data from address
n followed by the data from n + 1. The address counter
Sequential Read
Sequential read is initiated in the same manner as the
byte read. The first data byte is transmitted as with the
for read operations increments all address bits, allowing
the entire memory contents to be serially read during
byte read mode, however, the master now responds
with an acknowledge, indicating it requires additional
one operation. At the end of the address space (address
127) the counter “rolls over” to zero and the X24C01
data. The X24C01 continues to output data for each
acknowledge received. The read operation is termi-
continues to output data for each acknowledge received. Refer to Figure 8 for the address, acknowledge
nated by the master; by not responding with an acknowledge and by issuing a stop condition.
and data transfer sequence.
Figure 8. Sequential Read
BUS ACTIVITY: ADDRESS
A
C
A
C
A
C
K
K
K
S
T
O
P
SDA LINE
P
A
BUS ACTIVITY:
X24C01
R
/ C
WK
DATA n
DATA n+1
DATA n+2
DATA n+x
3837 FHD F13
Figure 9. Typical System Configuration
V
CC
PULL-UP
RESISTORS
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
MASTER
TRANSMITTER
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
3837 FHD F14
7
X24C01
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias .................. –65°C to +135°C
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
Storage Temperature ....................... –65°C to +150°C
Voltage on any Pin with
Respect to VSS ............................ –1.0V to +7.0V
D.C. Output Current ............................................ 5 mA
Lead Temperature (Soldering,
............................. 300°C
10 Seconds)
This is a stress rating only and the functional operation of
the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature
Min.
Max.
Commercial
Industrial
Military
0°C
–40°C
–55°C
70°C
+85°C
+125°C
Supply Voltage
Limits
X24C01
X24C01-3.5
X24C01-3
X24C01-2.7
4.5V to 5.5V
3.5V to 5.5V
3.0V to 5.5V
2.7V to 5.5V
D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)
Limits
Symbol
ICC(1)
ICC(2)
ISB1(1)
Parameter
VCC Supply Current (Read)
VCC Supply Current (Write)
VCC Standby Current
ISB2(1)
ILI
ILO
VlL(2)
VIH(2)
VOL
VCC Standby Current
Input Leakage Current
Output Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Min.
Max.
Units
1
2
100
mA
50
10
10
VCC x 0.3
–1.0
VCC x 0.7VCC + 0.5
0.4
Test Conditions
SCL = VCC x 0.1/VCC x 0.9 Levels
@ 100 KHz, SDA = Open
∝A
SCL = SDA = VCC,
VCC = 5V ± 10%
∝A
∝A
∝A
SCL = SDA = VCC, VCC = 2.7V
V
V
V
VIN = GND to VCC
VOUT = GND to VCC
IOL = 2.1 mA
3837 PGM T03
CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V
Symbol
CI/O
CIN(3)
(3)
Parameter
Input/Output Capacitance (SDA)
Input Capacitance (SCL)
Max.
Units
8
6
pF
pF
Test Conditions
VI/O = 0V
VIN = 0V
3837 PGM T05
Notes: (1) Must perform a stop command prior to measurement.
(2) VIL min. and VIH max. are for reference only and are not tested.
(3) This parameter is periodically sampled and not 100% tested.
8
X24C01
A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)
Read & Write Cycle Limits
Symbol
fSCL
TI
tAA
tBUF
tHD:STA
tLOW
tHIGH
tSU:STA
tHD:DAT
tSU:DAT
tR
tF
tSU:STO
tDH
Parameter
Min.
Max.
Units
SCL Clock Frequency
Noise Suppression Time
Constant at SCL, SDA Inputs
SCL Low to SDA Data Out Valid
Time the Bus Must Be Free Before a
New Transmission Can Start
Start Condition Hold Time
Clock Low Period
Clock High Period
Start Condition Setup Time
Data In Hold Time
Data In Setup Time
SDA and SCL Rise Time
SDA and SCL Fall Time
Stop Condition Setup Time
Data Out Hold Time
0
100
100
KHz
ns
0.3
4.7
3.5
∝s
∝s
∝s
∝s
∝s
∝s
∝s
4.0
4.7
4.0
4.7
0
250
ns
∝s
1
300
ns
∝s
4.7
300
ns
3837 PGM T06
POWER-UP TIMING
Symbol
Parameter
Max.
Units
tPUR(4)
tPUW(4)
Power-up to Read Operation
Power-up to Write Operation
1
5
ms
ms
3837 PGM T07
Bus Timing
t
t
F
t
HIGH
t
LOW
R
SCL
t
SU:STA
t
HD:STA
t
t
HD:DAT
SU:DAT
t
SU:STO
SDA IN
t
t
AA
DH
t
BUF
SDA OUT
3837 FHD F04
Note:
(4) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated. These parameters
are periodically sampled and not 100% tested.
9
X24C01
WRITE CYCLE LIMITS
Symbol
t
Parameter
(5)
Min.
Typ.
Write Cycle Time
(6)
WR
Max.
Units
10
ms
5
3837 PGM T08
The write cycle time is the time from a valid stop
condition of a write sequence to the end of the internal
erase/program cycle. During the write cycle, the X24C01
bus interface circuits are disabled, SDA is allowed to remain
high, and the device does not respond to its word address.
Write Cycle Timing
SCL
SDA
ACK
8th BIT
WORD n
t
WR
STOP
CONDITION
START
CONDITION
X24C01
ADDRESS
3837 FHD F05
Notes: (5) Typical values are for TA = 25°C and nominal supply voltage (5V).
(6) tWR is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum
time the device requires to automatically complete the internal write operation.
SYMBOL TABLE
Guidelines for Calculating Typical Values of
Bus Pull-Up Resistors
WAVEFORM
RESISTANCE (KΟ)
120
V
R
MIN
100
80
=
R
MAX
=
CC MAX
I
OL MIN
=2.6KΟ
t
R
C
BUS
MAX.
RESISTANCE
60
40
20
MIN.
RESISTANCE
0
0
20
40
60
INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from Low to
High
Will change
from Low to
High
May change
from High to
Low
Will change
from High to
Low
Don’t Care:
Changes
Changing:
State Not
Known
Allowed
80100120
N/A
BUS CAPACITANCE (pF)
3837 FHD F15
10
Center Line
is High
Impedance
X24C01
PACKAGING INFORMATION
8-LEAD PLASTIC IN-LINE PACKAGE TYPE P
0.430 (10.92)
0.360 (9.14)
0.092 (2.34)
DIA. NOM.
0.255 (6.47)
0.245 (6.22)
PIN 1 INDEX
PIN 1
0.300
(7.62) REF.
HALF SHOULDER WIDTH ON
ALL END PINS OPTIONAL
0.060 (1.52)
0.020 (0.51)
0.140 (3.56)
0.130 (3.30)
SEATING
PLANE
0.020 (0.51)
0.015 (0.38)
0.150 (3.81)
0.125 (3.18)
0.062 (1.57)
0.058 (1.47)
0.110 (2.79)
0.090 (2.29)
0.015 (0.38)
MAX.
0.020 (0.51)
0.016 (0.41)
0.325 (8.25)
0.300 (7.62)
0°
15°
TYP. 0.010 (0.25)
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
11
X24C01
PACKAGING INFORMATION
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
PIN 1 INDEX
PIN 1
0.014 (0.35)
0.019 (0.49)
0.188 (4.78)
0.197 (5.00)
(4X) 7°
0.053 (1.35)
0.069 (1.75)
0.004 (0.19)
0.010 (0.25)
0.050 (1.27)
0.010 (0.25)
X 45°
0.020 (0.50)
0° – 8°
0.0075 (0.19)
0.010 (0.25)
0.027 (0.683)
0.037 (0.937)
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESIS IN MILLIMETERS)
3926 FHD F22
12
X24C01
PACKAGING INFORMATION
8-LEAD MINIATURE SMALL OUTLINE GULL WING PACKAGE TYPE M
0.118 ± 0.002
(3.00 ± 0.05)
0.012 + 0.006 / -0.002
(0.30 + 0.15 / -0.05)
0.0256 (0.65) TYP
R 0.014 (0.36)
0.118 ± 0.002
(3.00 ± 0.05)
0.030 (0.76)
0.0216 (0.55)
0.036 (0.91)
0.032 (0.81)
0.040 ± 0.002
(1.02 ± 0.05)
0.007 (0.18)
0.005 (0.13)
7° TYP
0.008 (0.20)
0.004 (0.10)
0.150 (3.81)
REF.
0.193 (4.90)
REF.
NOTE:
1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)
3003 ILL 01
13
X24C01
ORDERING INFORMATION
X24C01
P
T
G -V
Device
VCC Limits
Blank = 4.5V to 5.5V
3.5 = 3.5V to 5.5V
3 = 3.0V to 5.5V
2.7 = 2.7V to 5.5V
G=RoHS Compliant Lead Free package
Blank = Standard package. Non lead free
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial = –40°C to +85°C
M = Military = –55°C to +125°C
Package
P = 8-Lead Plastic DIP
S = 8-Lead SOIC
M = 8-Lead MSOP
Part Mark Convention
X24C01
XG
Blank = 8-Lead SOIC
P = 8-Lead Plastic DIP
M = 8-Lead MSOP
G = RoHS compliant lead free
X
Blank = 4.5V to 5.5V, 0°C to +70°C
F = 2.7V to 5.5V, 0°C to +70°C
G = 2.7V to 5.5V, –40°C to +85°C
I = 4.5V to 5.5V, –40°C to +85°C
B = 3.5V to 5.5V, 0°C to +70°C
C = 3.5V to 5.5V, –40°C to +85°C
D = 3.0V to 5.5V, 0°C to +70°C
E = 3.0V to 5.5V, –40°C to +85°C
M = 4.5V to 5.5V, –55°C to +125°C
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express,
statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no
warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without
notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402;
4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents
pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection
and correction, redundancy and back-up features to prevent such an occurrence.
Xicor's products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose
failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
14