PDB-C201 Blue Enhanced Bi-Cell Silicon Photodiode PACKAGE DIMENSIONS INCH [mm] PACKAGE DIMENSIONS INCH [mm] .168 [4.27] 45° .075 [1.91] 3X Ø.018 [0.46] 1 Ø.200 [5.08] PIN CIRCLE Ø.330 [8.38] Ø.320 [8.13] 72° VIEWING Ø.255 [6.48] ANGLE Ø.245 [6.22] 2 3X .50 [12.7] MIN CHIP DIMENSIONS INCH [mm] 1 ANODE CELL #1 2 CASE GROUND & COMMON CATHODE 3 ANODE CELL #2 CELL 1 .150 [3.81] SQUARE CHIP DIMENSIONS INCH [mm] CELL 2 2X .050 [1.27] ACTIVE AREA 1 3 Ø .362 [9.19] Ø .357 [9.07] .010 [0.25] MAX GLASS ABOVE CAP TOP EDGE TO-46 PACKAGE SCHEMATIC 2 .004 [0.10] GAP TO-5 PACKAGE 2X .100 [2.54] ACTIVE AREA DESCRIPTION APPLICATIONS The PDB-C201 is a blue enhanced Bi-Cell silicon photodiode used for nulling, centering, or measuring small positional changes packaged in a hermetic TO-5 metal package. • Emitter Alignment • Position sensing • Medical and Industrial SPECTRAL RESPONSE ABSOLUTE MAXIMUM RATING (TA)= 23°C UNLESS OTHERWISE NOTED ELECTRO-OPTICAL CHARACTERISTICS RATING (TA)= 23°C UNLESS OTHERWISE NOTED SYMBOL ISC ID RSH CJ lrange VBR NEP tr CHARACTERISTIC Short Circuit Current Dark Current Shunt Resistance Junction Capacitance Spectral Application Range Breakdown Voltage Noise Equivalent Power Response Time** TEST CONDITIONS H = 100 fc, 2850 K VR = 5V VR = 10 mV VR =10 V, f = 1 MHz Spot Scan I = 10 μA VR = 0V @ l=Peak RL = 50 Ω,VR = 0 V RL = 50 Ω,VR = 10 V MIN 50 250 350 50 TYP 75 0.5 500 15 MAX 2.0 1100 75 1X10-14 190 13 UNITS µA nA MΩ pF nm V W/ √ Hz nS **Response time of 10% to 90% is specified at 660nm wavelength light. Information in this technical datasheet is believed to be correct and reliable. However, no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change without notice. www.lasercomponents.com Issue: 08/06 / V1 / HW / api/si-pin/bi-cells/ pdb-c201.pdf Germany and other countries: LASER COMPONENTS GmbH, Phone: +49 8142 2864 0, Fax: +49 8142 2864 11, [email protected] Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, [email protected] 1150 1100 Wavelength (nm) 1050 250 * 1/16 inch from case for 3 seconds max. 0.10 0.00 950 °C 1000 +240 0.30 0.20 900 +125 0.50 0.40 850 Soldering Temperature* -40 °C °C 800 TS +150 750 Operating Temperature -55 0.70 0.60 700 TO V 650 Storage Temperature 100 600 TSTG UNITS 550 Reverse Voltage MAX 500 VBR MIN 300 PARAMETER Responsivity (A/W) SYMBOL 0.80 450 Low capacitance Blue enhanced High speed Low dark current 400 • • • • 350 FEATURES