KINGBRIGHT APTK2012MGC

2.0x1.25mm SMD CHIP LED LAMP
APTK2012MGC
MEGA GREEN
Description
Features
2.0mmx1.25mm SMT LED, 0.75mm THICKNESS.
The Mega Green source color devices are made with
LOW POWER CONSUMPTION.
DH InGaAlP on GaAs substrate Light Emitting Diode.
WIDE VIEWING ANGLE.
IDEAL FOR BACK LIGHT AND INDICATOR.
VARIOUS COLORS AND LENS TYPES AVAILABLE.
PACKAGE:2000PCS/REEL
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD1121
REV NO: V.2
DATE: FEB/28/2005
PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: W.J.ZHU
ERP:1204000313
Selection Guide
Part No.
Dice
APTK2012MGC
Iv (mcd)
@ 20mA
Lens Type
MEGA GREEN (InGaAlP)
Viewing
Angle
Min.
Typ.
2θ
θ1/2
36
80
100°
WATER CLEAR
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25°C
Symbol
Parameter
Device
λpeak
Peak Wavelength
Mega Green
λD
Dominate Wavelength
∆λ1/2
Typ.
Max.
Units
Test Conditions
574
nm
IF=20mA
Mega Green
568
nm
IF=20mA
Spectral Line Half-width
Mega Green
26
nm
IF=20mA
C
Capacitance
Mega Green
20
pF
VF=0V;f=1MHz
VF
Forward Voltage
Mega Green
2.1
2.5
V
IF=20mA
IR
Reverse Current
Mega Green
10
uA
VR = 5V
Absolute Maximum Ratings at TA=25°C
Parameter
Mega Green
Units
Power dissipation
105
mW
DC Forward Current
30
mA
Peak Forward Current [1]
150
mA
5
V
Reverse Voltage
Operating/Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAD1121
REV NO: V.2
DATE: FEB/28/2005
PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: W.J.ZHU
ERP:1204000313
Mega Green
APTK2012MGC
SPEC NO: DSAD1121
REV NO: V.2
DATE: FEB/28/2005
PAGE: 3 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: W.J.ZHU
ERP:1204000313
APTK2012MGC
APTK2012MGC
SMT
SMT Reflow
Reflow Soldering
Soldering Instructions
Instructions
Number
reflow
process
shall
lessorthan
2 times
and cooling
Number ofofreflow
process
shall
be 2be
times
less and
cooling
process
to
normal
temperature
is
required
between
first
and
process to normal temperature is required between first and
second
soldering
process.
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD1121
REV NO: V.2
DATE: FEB/28/2005
PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: W.J.ZHU
ERP:1204000313