KINGBRIGHT APTK2012SYC

2.0x1.25mm SMD CHIP LED LAMP
APTK2012SYC
Features
SUPER BRIGHT YELLOW
Description
2.0mmx1.25mm SMT LED, 0.75mm THICKNESS.
The Super Bright Yellow devices is made with DH InGaAlP
LOW POWER CONSUMPTION.
(on GaAs substrate) light emitting diode chip.
WIDE VIEWING ANGLE.
IDEAL FOR BACK LIGHT AND INDICATOR.
VARIOUS COLORS AND LENS TYPES AVAILABLE.
PACKAGE : 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
SPEC NO: DSAD1120
REV NO: V.2
DATE: FEB/28/2005
PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: W.J.ZHU
ERP:1204000332
Selection Guide
Part No.
Dice
APTK2012SYC
Iv (mcd)
@ 20mA
Lens Type
SUPER BRIGHT YELLOW (InGaAlP)
WATER CLEAR
Viewing
Angle
Min.
Typ.
2 θ 1/2
50
120
100°
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25°C
Symbol
Parameter
Device
Typ.
λpeak
Peak Wavelength
Super Bright Yellow
λD
Dominant Wavelength
∆λ1/2
Max.
Units
Test Conditions
590
nm
IF=20mA
Super Bright Yellow
588
nm
IF=20mA
Spectral Line Half-width
Super Bright Yellow
28
nm
IF=20mA
C
Capacitance
Super Bright Yellow
25
pF
VF=0V;f=1MHz
VF
Forward Voltage
Super Bright Yellow
2.0
2.5
V
IF=20mA
IR
Reverse Current
Super Bright Yellow
10
uA
VR = 5V
Absolute Maximum Ratings at TA=25°C
Parameter
Super Bright Yellow
Units
Power dissipation
125
mW
DC Forward Current
30
mA
Peak Forward Current [1]
150
mA
5
V
Reverse Voltage
Operating/Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAD1120
REV NO: V.2
DATE: FEB/28/2005
PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: W.J.ZHU
ERP:1204000332
Super Bright Yellow
APTK2012SYC
SPEC NO: DSAD1120
REV NO: V.2
DATE: FEB/28/2005
PAGE: 3 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: W.J.ZHU
ERP:1204000332
APTK2012MGC
APTK2012SYC
SMT
SMT Reflow
Reflow Soldering
Soldering Instructions
Instructions
Number
reflow
process
shall
lessorthan
2 times
and cooling
Number ofofreflow
process
shall
be 2be
times
less and
cooling
process
to
normal
temperature
is
required
between
first
and
process to normal temperature is required between first and
second
soldering
process.
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAD1120
REV NO: V.2
DATE: FEB/28/2005
PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: W.J.ZHU
ERP:1204000332