2.0x1.25mm SMD CHIP LED LAMP APTK2012SYC Features SUPER BRIGHT YELLOW Description 2.0mmx1.25mm SMT LED, 0.75mm THICKNESS. The Super Bright Yellow devices is made with DH InGaAlP LOW POWER CONSUMPTION. (on GaAs substrate) light emitting diode chip. WIDE VIEWING ANGLE. IDEAL FOR BACK LIGHT AND INDICATOR. VARIOUS COLORS AND LENS TYPES AVAILABLE. PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1120 REV NO: V.2 DATE: FEB/28/2005 PAGE: 1 OF 4 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: W.J.ZHU ERP:1204000332 Selection Guide Part No. Dice APTK2012SYC Iv (mcd) @ 20mA Lens Type SUPER BRIGHT YELLOW (InGaAlP) WATER CLEAR Viewing Angle Min. Typ. 2 θ 1/2 50 120 100° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25°C Symbol Parameter Device Typ. λpeak Peak Wavelength Super Bright Yellow λD Dominant Wavelength ∆λ1/2 Max. Units Test Conditions 590 nm IF=20mA Super Bright Yellow 588 nm IF=20mA Spectral Line Half-width Super Bright Yellow 28 nm IF=20mA C Capacitance Super Bright Yellow 25 pF VF=0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF=20mA IR Reverse Current Super Bright Yellow 10 uA VR = 5V Absolute Maximum Ratings at TA=25°C Parameter Super Bright Yellow Units Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA 5 V Reverse Voltage Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD1120 REV NO: V.2 DATE: FEB/28/2005 PAGE: 2 OF 4 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: W.J.ZHU ERP:1204000332 Super Bright Yellow APTK2012SYC SPEC NO: DSAD1120 REV NO: V.2 DATE: FEB/28/2005 PAGE: 3 OF 4 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: W.J.ZHU ERP:1204000332 APTK2012MGC APTK2012SYC SMT SMT Reflow Reflow Soldering Soldering Instructions Instructions Number reflow process shall lessorthan 2 times and cooling Number ofofreflow process shall be 2be times less and cooling process to normal temperature is required between first and process to normal temperature is required between first and second soldering process. second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1120 REV NO: V.2 DATE: FEB/28/2005 PAGE: 4 OF 4 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: W.J.ZHU ERP:1204000332