INFINEON HYB25T256160TC-37

Product Information 2004
MEMORY SPECTRUM
w w w. i n f i n e o n . c o m / m e m o r y
w w w. i n f i n e o n . c o m / m e m o r y / f l a s h
Never stop thinking.
Introduction
A P R I L 2 0 0 4 . This edition of Memory Spectrum has been developed
to enable you to easily view the entire range of Infineon’s memory products.
For more related product information and the latest datasheets, please visit
our websites: www.infineon.com/memory and www.infineon.com/memory/flash.
Technology and Trends
DDR400 Components and DIMMs (PC3200)
As a leading memory products
2 GB DDR2 Unbuffered DIMM
supplier, Infineon continues to
4 GB DDR2 Registered DIMM
expand its portfolio with the
16 Mb and 32 Mb CellularRAM
recent introduction of:
512 Mb Mobile-RAM
“Green**”, DRAM Components and Modules
512 Mb and 1 Gb TwinNAND Components
SD Cards / MultiMediaCards
** Lead & Halogen-Free
DRAM Components
Double Data Rate (DDR / DDR2)
and Single Data Rate (SDR).
Synchronous Dynamic Random
Access Memory.
16 Mb
DDR DRAMs
DDR2 DRAMs
SDR DRAMs
Reduced Latency (RLDRAM™ )
Graphics RAM
Mobile-RAM
CellularRAM™
DRAM Modules
Double Data Rate (DDR / DDR2),
Dual Inline Memory Modules
(DIMMs).
Thin Small Outline Package (TSOP).
+
64 MB
2
512 Mb
1 Gb
+
+
+
+
+
+
+
+
+
+
128 MB
256 MB 512 MB
+
+
+
+
+
+
+
128 Mb
+
+
+
+
+
+
256 Mb 512 Mb
TwinFlash™
+
64 MB
MultiMediaCards
SD Cards
+
+
+
+
+
+
+
128 MB 256 MB 512 MB
+
+
+
64 Mb
+
+
+
+
+
+
+
+
Unbuffered SDR
Registered SDR
SO-DIMM SDR
Flash Cards
MultiMediaCards and SD Cards.
256 Mb
+
+
+
Unbuffered DDR
Registered DDR
Registered DDR Reduced Height
SO-DIMM DDR
Unbuffered DDR2
Registered DDR2
SO-DIMM DDR2
Flash Components
128 Mb
+
64 MB
Single Data Rate (SDR), Dual Inline
Memory Modules (DIMMs).
32 Mb
128 MB 256 MB 512 MB
+
+
1 GB
+
+
+
+
+
+
+
1 GB
2 GB
4 GB
+
+
+
+
+
2 GB
4 GB
2 Gb
4 Gb
2 GB
4 GB
+
1 Gb
+
1 GB
+
+
RLDRAM™ and CellularRAM™ are registered trademarks of Infineon Technologies AG. TwinFlash™ is
a trademark of Infineon Technologies AG, based on Saifun NROM technology.
Content
DRAM Components
4–8
DDR Components
5–6
DDR2 Components
7
SDR Components
8
DRAM Modules
9 – 20
DDR Modules
10 – 14
DDR2 Modules
15 – 17
SDR Modules
18 – 20
Specialty DRAMs
21 – 24
Flash
25 – 26
3
DRAM Components
DRAM Components
Nomenclature DRAM Components
HYB
25
D
128
80
0
C
T
-6
(Example)
DRAM Modules
Specialty DRAMs
Speed/Performance
3
3.7
5
6
7
7F
7.5
8
=
=
=
=
=
=
=
=
Power
none =
L
=
Standard Power
Low-Power Product
Package
C
T
E
F
G
FBGA
TSOP 400 mil
TSOP 400 mil
FBGA
TSOP stack
Product Revision
Die Revision
Product Variation
0
=
Standard Product
Organization
40
80
16
=
=
=
x4
x8
x 16
Memory Density
128
256
512
1G
=
=
=
=
128 Mb
256 Mb
512 Mb
1024 Mb
Memory Type
S
D
T
=
=
=
SDR
DDR
DDR2
Supply Voltage
39
25
18
=
=
=
3.3 V
2.5 V
1.8 V
Prefix
HYB
=
Memory Components
=
=
=
=
=
DDR2-667 4-4-4
DDR2-533 4-4-4
DDR2-400 3-3-3/DDR400B 3-3-3
DDR333 2.5-3-3/PC166 3-3-3
DDR266A 2-3-3/PC133 2-2-2
DDR266 2-2-2
DDR266B 2.5-3-3/PC133 3-3-3
DDR200 2-2-2/PC100 2-2-2
Contains Lead
Contains Lead
Lead and Halogen-Free (ROHS*-compliant)
Lead and Halogen-Free (ROHS*-compliant)
Lead and Halogen-Free (ROHS*-compliant)
Single Data Rate SDRAM
Double Data Rate SDRAM
Double Data Rate 2 SDRAM
* ROHS = Restriction Of Hazardous Substances
Flash
4 4
(DDR2)
(DDR2)
(DDR2/DDR)
(DDR/SDR)
(DDR/SDR)
(DDR)
(DDR/SDR)
(DDR/SDR)
DRAM Components
DDR Components
TSOP-66 (400 mil)
16 M x 8
TSOP-66 (400 mil)
8 M x 16
TSOP-66 (400 mil)
256 Mb
64 M x 4
32 M x 8
TSOP-66 (400 mil)
TSOP-66 (400 mil)
Latency
2-3-3
HYB25D128400AT-
7
Q67100
Q4309
Now
HYB25D128400CE-
6
Q67100
Q1455
2Q04
DDR266A
2-3-3
HYB25D128800AT-
7
Q67100
Q4311
Now
DDR333
2.5-3-3
HYB25D128800CE-
6
Q67100
Q1459
2Q04
DDR266A
2-3-3
DDR333
2.5-3-3
DDR333
2.5-3-3
DDR266A
2-3-3
DDR266
2-2-2
DDR266A
2-3-3
DDR333
2.5-3-3
DDR400
3-3-3
HYB25D256800BT-
Q67100
Q5044
6
Q67100
Q1458
7
Q67100
Q4587
7F
Q67100
Q4880
7
Q67100
Q5049
6
Q67100
Q4589
5
Q67100
Q4275
Now
2Q04
XX
Now
Now
XX
Now
HYB25D256800CE-
6
Q67100
Q5051
Now
XX
HYB25D256800CEL-
6
Q67100
Q1753
Now
XX
DDR400
3-3-3
HYB25D256800CE-
5
Q67100
Q5180
Now
XX
7
Q67100
Q4593
HYB25D256160BT-
6
Q67100
Q4592
5
Q67100
Q4277
6
Q67100
Q5045
Now
XX
5
Q67100
Q5182
Now
XX
7
Q67100
Q4615
6
Q67100
Q4614
2.5-3-3
DDR400
3-3-3
256 Mb
DDR266A
2-3-3
FBGA
DDR333
2.5-3-3
HYB25D256160CE-
HYB25D256400BC-
DDR400
3-3-3
5
Q67100
Q1071
DDR333
2.5-3-3
6
Q67100
Q4764
DDR400
3-3-3
5
Q67100
Q1418
DDR266A
2-3-3
7
Q67100
Q4596
6
Q67100
Q4595
6
Q67100
Q4443
6
Q67100
Q4767
5
Q67100
Q1419
DDR333
2.5-3-3
DDR333
2.5-3-3
DDR333
2.5-3-3
DDR400
FBGA 60 (8 x 12 mm)
HYB25D256400CE-
Q4313
2.5-3-3
DDR333
16 M x 16
HYB25D256400BT-
Q67100
XX
2.5-3-3
3-3-3
FBGA 60 (8 x 12 mm)
HYB25D128160CE-
7
6
XX
DDR333
DDR400
32 M x 8
HYB25D128160AT-
Green
DDR333
2-3-3
FBGA 60 (8 x 12 mm)
Prod.
2.5-3-3
2.5-3-3
64 M x 4
Ordering Code
DDR333
DDR333
TSOP-66 (400 mil)
Speed No.
DDR266A
DDR266A
16 M x 16
Sales Description
3-3-3
DDR266A
2-3-3
DDR333
2.5-3-3
DDR333
2.5-3-3
HYB25D256400CC-
HYB25D256800BCHYB25D256800CFHYB25D256800CC-
HYB25D256160BCHYB25D256160CC-
7
Q67100
Q4599
6
Q67100
Q4598
6
Q67100
Q4770
DRAM Modules
32 M x 4
Speed
Now
Specialty DRAMs
Package
128 Mb
Now
2Q04
Now
2Q04
2Q04
XX
Flash
Generation Organization
Now
2Q04
XX = Lead and Halogen-Free
5
DRAM Components
DDR Components
Generation Organization
512 Mb
Package
Speed
Latency
128 M x 4
TSOP-66 (400 mil)
DDR266A
2-3-3
256 M x 4
TSOP stack (400 mil)
DDR266A
2-3-3
DDR266A
2-3-3
DDR333
2.5-3-3
DDR333
2.5-3-3
DDR400
3-3-3
DDR266A
2-3-3
DDR333
2.5-3-3
DDR333
2.5-3-3
DDR400
3-3-3
DDR333
2.5-3-3
DDR400
3-3-3
DDR333
2.5-3-3
DDR333
2.5-3-3
DDR400
64 M x 8
32 M x 16
512 Mb
128 M x 4
TSOP-66 (400 mil)
TSOP-66 (400 mil)
FBGA 60 (10 x 12 mm)
DRAM Modules
FBGA
64 M x 8
32 M x 16
FBGA 60 (10 x 12 mm)
FBGA 60 (10 x 12 mm)
XX = Lead and Halogen-Free
Specialty DRAMs
Flash
6
Sales Description
Speed No.
Ordering Code
HYB25D512400AT-
7
Q67100
Q4413
HYB25D512400BE-
7
Q67100
Q5202
HYB25D1G400BG-
7
On request
Prod.
Now
Now
7
Q67100
Q4412
6
Q67100
Q4415
6
Q67100
Q5205
5
Q67100
Q5204
HYB25D512160AT-
7
Q67100
Q4411
Now
HYB25D512160AT-
6
Q67100
Q4416
Now
6
Q67100
Q5209
5
Q67100
Q5208
6
Q67100
Q1661
5
Q67100
Q1693
HYB25D512800BC-
6
Q67100
Q1663
Now
HYB25D512800BF-
6
Q67100
Q5215
Now
3-3-3
HYB25D512800BC-
5
Q67100
Q1451
Now
DDR400
3-3-3
HYB25D512800BF-
5
Q67100
Q1452
Now
DDR333
2.5-3-3
6
Q67100
Q1453
DDR400
3-3-3
5
Q67100
Q1454
HYB25D512800AT-
HYB25D512800BE-
HYB25D512160BE-
HYB25D512400BC-
HYB25D512160BC-
Green
XX
Now
Now
Now
XX
XX
Now
Now
XX
XX
64 M x 4
PTFBGA-60
32 M x 8
16 M x 16
512 Mb
128 M x 4
64 M x 8
32 M x 16
1 Gb
256 M x 4
128 M x 8
64 M x 16
PTFBGA-60
PTFBGA-84
PTFBGA-60
PTFBGA-60
PTFBGA-84
PTFBGA-68
PTFBGA-68
PTFBGA-92
Speed
Latency
DDR2 400
3-3-3
DDR2 533
4-4-4
DDR2 400
3-3-3
DDR2 533
4-4-4
DDR2 400
3-3-3
DDR2 533
4-4-4
DDR2 400
3-3-3
DDR2 533
4-4-4
DDR2 400
3-3-3
DDR2 533
4-4-4
DDR2 400
3-3-3
DDR2 533
4-4-4
DDR2 400
3-3-3
DDR2 533
4-4-4
DDR2 400
3-3-3
DDR2 533
4-4-4
DDR2 400
3-3-3
DDR2 533
4-4-4
Sales Description
HYB18T256400AC-
HYB18T256800AC-
HYB18T256160AC-
HYB18T512400AC-
HYB18T512800AC-
HYB18T512160AC-
HYB18T1G400AC-
HYB18T1G800AC-
HYB18T1G160AC-
Speed No.
Ordering Code
5
Q67100 Q1314
3.7
Q67100 Q1311
5
Q67100 Q1322
3.7
Q67100 Q1320
5
Q67100 Q1301
3.7
Q67100 Q1293
5
Q67100 Q1350
3.7
Q67100 Q1349
5
Q67100 Q1354
3.7
Q67100 Q1352
5
Q67100 Q1347
3.7
Q67100 Q1346
5
Q67100 Q1619
3.7
Q67100 Q1618
5
Q67100 Q1622
3.7
Q67100 Q1621
5
Q67100 Q1625
3.7
Q67100 Q1624
Production Green
3Q04
2Q04
3Q04
DRAM Modules
Package
Specialty DRAMs
256 Mb
Organization
Flash
Generation
DRAM Components
DDR2 Components
7
DRAM Components
SDR Components
DRAM Modules
Generation Organization
Package
Speed
Latency
Sales Description
32 M x 4
TSOP-54 (400 mil)
PC133
2-2-2
HYB39S128400CT-
7
Q67100 Q4101
16 M x 8
TSOP-54 (400 mil)
PC133
2-2-2
HYB39S128800CT-
7
Q67100 Q4107
8 M x 16
TSOP-54 (400 mil)
PC133
2-2-2
HYB39S128160CT-
7
Q67100 Q4113
64 M x 4
TSOP-54 (400 mil)
PC133
2-2-2
HYB39S256400DT-
7
Q67100 Q4330
32 M x 8
TSOP-54 (400 mil)
PC133
2-2-2
HYB39S256800DT-
7
Q67100 Q4332
16 M x 16
TSOP-54 (400 mil)
PC133
2-2-2
HYB39S256160DT-
7
Q67100 Q4334
256 Mb
64 M x 4
FBGA-54 (8 x 12 mm)
PC133
2-2-2
HYB39S256400DC-
7
Q67100 Q4772
FBGA
32 M x 8
FBGA-54 (8 x 12 mm)
PC133
2-2-2
HYB39S256800DC-
7
Q67100 Q4774
16 M x 16
FBGA-54 (8 x 12 mm)
PC133
2-2-2
HYB39S256160DC-
7
Q67100 Q4808
128 M x 4
TSOP-54 (400 mil)
PC133
3-3-3
HYB39S512400AT-
7.5
Q67100 Q4404
128 Mb
256 Mb
512 Mb
Specialty DRAMs
Flash
8
Speed No. Ordering Code
64 M x 8
TSOP-54 (400 mil)
PC133
3-3-3
HYB39S512800AT-
7.5
Q67100 Q4403
32 M x 16
TSOP-54 (400 mil)
PC133
3-3-3
HYB39S512160AT-
7.5
Q67100 Q4402
Production Green
Now
Now
Now
Now
DRAM Components
DRAM Modules
Nomenclature DDR / DDR2 Modules
32
2
2
0
G
D
L
-6
-A
(Example)
Part Number
Extension
Component Die Revision Indicator
Speed
8
7.5
7
7F
6
5
3.7
3
Power
L
=
none =
Low Power
Standard Power
Module Family
U
R
D
BD
BR
=
=
=
=
=
Unbuffered DIMM
Registered DIMM
SO-DIMM
SO-DIMM
Registered DIMM
Package Type
G
H
E
=
=
=
Contains Lead
Lead-Free (ROHS*-compliant)
Lead and Halogen-Free available on request (ROHS*-compliant)
Designator
Product Variations
Number of
Memory Ranks
0
2
Designator
Data Sheet Defined
Memory Density
per DQ
16
32
64
128
256
=
=
=
=
=
16 Mb
32 Mb
64 Mb
128 Mb
256 Mb
Power Supply
D
T
=
=
2.5 V (DDR Modules)
1.8 V (DDR2 Modules)
Data Width
64
72
=
=
x 64 (Non-ECC)
x 72 (ECC)
Prefix
HYS
=
Standard Prefix for SDRAM-based Memory Modules
=
=
=
=
=
=
=
=
=
=
PC1600 2-2-2
PC2100 2.5-3-3
PC2100 2-3-3
PC2100 2-2-2
PC2700 2.5-3-3
PC3200 3-3-3 / PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-5300 4-4-4
DDR200
DDR266B
DDR266A
DDR266
DDR333
DDR400 / DDR2-400
DDR2-533
DDR2-667
TSOP-based for DDR / FBGA-based for DDR2
TSOP-based for DDR / FBGA-based for DDR2
TSOP-based for DDR / FBGA-based for DDR2
FBGA-based
FBGA-based
Specialty DRAMs
D
One Memory Module Rank
Two Memory Module Ranks
Flash
HYS 64
DRAM Modules
Unbuffered DIMM, Registered DIMM (184-pin) and SO-DIMM (200-pin)
* ROHS = Restriction Of Hazardous Substances
9
DRAM Components
DDR Modules
Unbuffered DDR DIMM – 184-pin
Module
Density
Organization
Compo.
GeneraCompo. # of Ranks Module
Organization Package on Module Height
tion
128 MB
Module
Speed
Sales
Description
Speed
No.
Ordering
Code
6-B
Q67100 Q4940
5-B
Q67100 Q5136
PC2700
6-C
Q67100 Q1448
PC3200
5-C
Q67100 Q1754
PC2700
PC3200
16 M x 64 256 M
16 M x 16
TSOP
1
1.25"
PC2700
PC3200
128 MB ECC 16 M x 72 128 M
16 M x 8
TSOP
1
1.25"
256 MB
HYS64D16301GU-
HYS64D16301HU-
DRAM Modules
TSOP
1
1.25"
Q67100 Q4367
Now
PC2100
HYS64D32000GU-
7-B
Q67100 Q4517
Now
6-B
Q67100 Q4944
5-B
Q67100 Q5081
PC2700
6-C
Q67100 Q5184
PC3200
5-C
Q67100 Q1755
6-C
Q67100 Q4996
5-C
Q67100 Q5189
7-B
Q67100 Q4519
HYS64D32300GU-
HYS64D32300HU-
PC3200
PC2100
HYS72D32000GU-
PC2100-222
32 M x 8
TSOP
1
1.25"
PC3200
Specialty DRAMs
512 MB
32 M x 8
TSOP
2
1.25"
Q67100 Q4957
6-C
Q67100 Q1768
PC3200
5-C
Q67100 Q1756
6-C
Q67100 Q4998
PC3200
5-C
Q67100 Q5191
PC2100
HYS64D64020GU- 7-B
Q67100 Q4521
PC2700
6-B
Q67100 Q4948
HYS72D32300GU-
HYS72D32300HU-
5-B
Q67100 Q5084
PC2700
6-C
Q67100 Q1449
PC3200
5-C
Q67100 Q1761
6-C
Q67100 Q5001
5-C
Q67100 Q5190
7-B
Q67100 Q4525
PC2700
HYS64D64320GU-
HYS64D64320HU-
PC3200
PC2100
512 MB ECC
PC2100-222
64 M x 72 256 M
32 M x 8
TSOP
2
1.25"
7F-B Q67100 Q5030
6-B
Q67100 Q4950
PC3200
5-B
Q67100 Q4958
PC2700
6-C
Q67100 Q1757
PC3200
5-C
Q67100 Q1762
6-C
Q67100 Q4997
5-C
Q67100 Q5192
PC3200
Flash
10
HYS72D64020GU-
PC2700
PC2700
X = Lead-Free
Q67100 Q4946
5-B
PC3200
64 M x 64 256 M
6-B
PC2700
PC2700
X
Now
Now
X
Now
7F-B Q67100 Q5029
PC2700
32 M x 72 256 M
Now
7-A
PC2700
256 MB ECC
Q67100 Q5188
HYS72D16000GU-
PC3200
32 M x 8
Q67100 Q4995
Green
Now
PC2100
PC2700
32 M x 64 256 M
6-C
5-C
Prod.
HYS72D64320GU-
HYS72D64320HU-
Now
Now
X
Now
Now
Now
X
Now
Now
Now
X
1 GB
128 M x 64 512 M
64 M x 8
TSOP
2
1.25"
Module
Speed
Sales
Description
TSOP
2
1.25"
PC2700
6-A
Q67100 Q4823
PC2700
HYS64D128320GU- 6-B
Q67100 Q1779
PC3200
5-B
Q67100 Q1780
6-B
Q67100 Q1426
5-B
Q67100 Q1427
HYS72D128020GU- 7-A
Q67100 Q4658
PC2700
6-A
Q67100 Q4935
PC2700
HYS72D128320GU- 6-B
Q67100 Q1781
PC3200
5-B
Q67100 Q1782
HYS64D128320HU-
PC2700
PC3200
X = Lead-Free
Now
Q67100 Q4656
PC2100
64 M x 8
Prod.
HYS64D128020GU- 7-A
PC3200
128 M x 72 512 M
Ordering
Code
PC2100
PC2700
1 GB ECC
Speed
No.
HYS72D128320HU-
Now
Now
6-B
Q67100 Q1065
5-B
Q67100 Q1064
Green
X
Now
Now
Now
X
DRAM Modules
Compo.
GeneraCompo. # of Ranks Module
tion
Organization Package on Module Height
Specialty DRAMs
Organization
Flash
Module
Density
DRAM Components
Unbuffered DDR DIMM – 184-pin
11
DRAM Components
Registered DDR DIMM (Reduced Height) – 184-pin
Module
Density
Organization
Genera- Compo.
Compo. # of Ranks Module
tion Organization Package on Module Height
128 MB 16 M x 72 128 M
256 MB
128M
Module
Speed
Sales
Description
Speed
No.
HYS72D16500GR-
7-A
HYS72D32501GR-
7-A
Q67100
Q4377
HYS72D32501HR-
7-C
Q67100
Q1471
16 M x 8
TSOP
1
1.2"
PC2100
32 M x 4
TSOP
1
1.2"
PC2100
256 M 32 M x 8
TSOP
1
1.2"
32 M x 72
256 M 32 M x 8
512 MB
FBGA
TSOP
1
1
1.125"
1.2"
PC2100
DRAM Modules
FBGA
1
1.125"
64 M x 72 256 M
7-B
Q67100
Q4457
Q67100
Q4533
PC2700
6-B
Q67100
Q4671
1 GB
128 M x 4
FBGA
TSOP
stack
2
2
1.125"
1.2"
Specialty DRAMs
256 M
64 M x 4
FBGA
2
1.2"
Q67100
Q1461
Q1413
2Q04
PC3200
5-C
Q67100
Q1673
3Q04
7-B
Q67100
Q4463
7F-B
Q67100
Q5007
PC2100
7-B
Q67100
Q4673
PC2700
6-B
Q67100
Q4686
5-B
Q67100
Q1462
PC2700
6-C
Q67100
Q1415
2Q04
PC3200
5-C
Q67100
Q1685
3Q04
PC2100
7-B
Q67100
Q4687
6-B
Q67100
Q4693
5-B
Q67100
Q1463
PC2700
6-C
Q67100
Q1414
2Q04
PC3200
5-C
Q67100
Q1684
3Q04
PC3200
PC3200
HYS72D64300GBR-
PC2100
HYS72D64320GBR-
7-B
Q67100
Q4752
PC2100-222
7F-B
Q67100
Q5008
PC2100
7-B
Q67100
Q4674
PC2700
HYS72D128521GR-
HYS72D128320GBR-
512 M
Q67100
Q4668
Q1412
2Q04
7-A
Q67100
Q4990
Now
7-B
Q67100
Q1429
6-B
Q67100
Q1032
5-B
Q67100
Q1687
7-B
Q67100
Q1422
6-B
Q67100
Q1043
5-B
Q67100
Q1686
7-A
Q67100
Q4661
PC2100
7-B
Q67100
Q1031
PC2700
HYS72D256320GBR- 6-B
Q67100
Q1030
PC3200
5-B
Q67100
Q1689
1.2"
PC2100
FBGA
1
1.125"
PC2700
HYS72D128500GR-
PC2100
HYS72D128300GBR-
PC2100
2
1.125"
PC2700
HYS72D128321GBR-
PC3200
2 GB
256 M x 4
TSOP
stack
2
1.2"
256 M x 72 512 M
128 M x 4
X = Lead-Free
Flash
12
FBGA
2
1.2"
Now
Q67100
1
FBGA
Now
6-C
PC3200
64 M x 8
Now
6-B
TSOP
128 M x 4
Now
Q67100
PC2700
128 M x 72
3Q04
6-C
HYS72D64500GR-
PC2100
HYS72D256520GR-
Green
Now
5-B
PC2100
HYS72D32300GBR-
Prod.
PC2700
PC2700
32 M x 8
Q4446
7-B
PC2100-222
64 M x 4
Q67100
PC2100
PC3200
HYS72D32500GR-
Ordering
Code
Now
Now
Now
Now
X
16 M x 72 128 M
16 M x 8
TSOP
1
1.7"
Module
Speed
PC1600
PC2100
256 MB
128 M
32 M x 4
TSOP
1
1.7"
Sales
Description
HYS72D16000GR-
PC1600
PC2100
HYS72D32001GR-
Speed
No.
Ordering
Code
8-A
Q67100 Q4372
7-A
Q67100 Q4373
8-A
Q67100 Q4375
7-A
Q67100 Q4378
8-B
Q67100 Q4508
7-B
Q67100 Q4509
8-B
Q67100 Q4510
7-B
Q67100 Q4511
32 M x 72
256 M
32 M x 8
TSOP
1
1.7"
64 M x 72 256 M
64 M x 4
TSOP
1
1.7"
128 M x 72 256 M
128 M x 4
TSOP
stack
2
1.7"
512 MB
PC1600
PC2100
HYS72D32000GR-
PC1600
1 GB
EOL = End of Life
PC2100
HYS72D64000GR-
PC1600
PC2100
HYS72D128021GR-
8-B
Q67100 Q4743
7-B
Q67100 Q4694
Prod.
EOL
Green
EOL
EOL
EOL
DRAM Modules
Compo.
GeneraCompo. # of Ranks Module
Organization Package on Module Height
tion
Specialty DRAMs
128 MB
Organization
Flash
Module
Density
DRAM Components
Registered DDR DIMM – 184-pin
13
DRAM Components
SO-DIMM DDR – 200-pin
DRAM Modules
Module
Density
Organization
Compo.
GeneraCompo. # of Ranks Module
tion Organization Package on Module Height
128 MB
Module
Speed
Sales
Description
PC2100
PC2700
16 M x 16
TSOP
1
1,25"
PC2700
256 MB
16 M x 16
TSOP
2
1,25"
HYS64D16000GDL-
6-B Q67100 Q4670
HYS64D16000HDL-
6-C Q67100 Q5078 2Q04
6-C Q67100 Q1763 2Q04
7-B Q67100 Q4454
PC2700
6-B Q67100 Q4667 Now
HYS64D32020GDL-
6-C Q67100 Q1767
PC3200
5-C Q67100 Q1769
Specialty DRAMs
PC3200
256M
32 M x 8
FBGA
2
1,25"
512 M
32 M x 16
TSOP
2
1,25"
7-B Q67100 Q4680
6-B Q67100 Q4681 Now
PC3200
HYS64D64020GBDL- 5-B Q67100 Q1193
PC2700
6-C Q67100 Q1450
PC3200
5-C Q67100 Q1702
HYS64D64020HBDL-
7-A Q67100 Q4663
PC2700
6-A Q67100 Q4744
HYS64D64020GDL-
PC2700
6-B Q67100 Q1774
PC3200
5-B Q67100 Q1783
HYS64D64020HDL-
512M
64Mx8
FBGA
2
1,25"
PC2700
Flash
128 M x 64 512 M
64 M x 8
FBGA
2
1,25"
PC3200
PC2700
PC3200
X = Lead-Free
14
6-B Q67100 Q1423
X
Now
Now
X
5-B Q67100 Q1698
HYS64D128021GBDL- 6-B Q67100 Q1416 Now
PC2700
1 GB
X
2Q04
6-C Q67100 Q4835 3Q04
PC2100
PC3200
128Mx64
2Q04
5-C Q67100 Q1699
PC2700
PC2700
1GB
2Q04
PC2100
PC2700
64 M x 64
6-C Q67100 Q4831
HYS64D32020HDL-
X
5-B Q67100 Q5227
PC2700
PC2700
512 MB
Now
PC2100
PC3200
32 M x 64 256 M
Prod. Green
6-B Q67100 Q5187
7-B Q67100 Q4531
PC2700
PC2700
Ordering
Code
7-B Q67100 Q5179
HYS64D16001GDL-
PC2100
16 M x 64 256 M
Speed
No.
6-B Q67100 Q1416
HYS64D128021GBDL-
HYS64D128021HBDL-
5-B Q67100 Q1694
6-B Q67100 Q1028
5-B Q67100 Q1695
Now
Now
X
DRAM Components
DDR2 Modules
Nomenclature DDR / DDR2 Modules
D
32
2
2
0
G
D
L
-6
-A
(Example)
Part Number
Extension
Component Die Revision Indicator
Speed
8
7.5
7
7F
6
5
3.7
3
Power
L
=
none =
Low Power
Standard Power
Module Family
U
R
D
BD
BR
=
=
=
=
=
Unbuffered DIMM
Registered DIMM
SO-DIMM
SO-DIMM
Registered DIMM
Package Type
G
H
E
=
=
=
Contains Lead
Lead-Free (ROHS* -compliant)
Lead and Halogen-Free available on request (ROHS* -compliant)
Designator
Product Variations
Number of
Memory Ranks
0
2
Designator
Data Sheet Defined
Memory Density
per DQ
16
32
64
128
256
=
=
=
=
=
16 Mb
32 Mb
64 Mb
128 Mb
256 Mb
Power Supply
D
T
=
=
2.5 V (DDR Modules)
1.8 V (DDR2 Modules)
Data Width
64
72
=
=
x 64 (Non-ECC)
x 72 (ECC)
Prefix
HYS
=
Standard Prefix for SDRAM-based Memory Modules
=
=
=
=
=
=
=
=
=
=
PC1600 2-2-2
PC2100 2.5-3-3
PC2100 2-3-3
PC2100 2-2-2
PC2700 2.5-3-3
PC3200 3-3-3 / PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-5300 4-4-4
DDR200
DDR266B
DDR266A
DDR266
DDR333
DDR400 / DDR2-400
DDR2-533
DDR2-667
TSOP-based for DDR / FBGA-based for DDR2
TSOP-based for DDR / FBGA-based for DDR2
TSOP-based for DDR / FBGA-based for DDR2
FBGA-based
FBGA-based
Specialty DRAMs
64
One Memory Module Rank
Two Memory Module Ranks
Flash
HYS
DRAM Modules
Unbuffered DIMM, Registered DIMM (240-pin) and SO-DIMM (200-pin)
* ROHS = Restriction Of Hazardous Substances
15
DRAM Components
Unbuffered DDR2 DIMM – 240-pin
Module
Density
256 MB
Organization
Genera- Compo.
tion Organization
32Mx64 512M
Compo.
Package
32Mx16 PTFBGA84
# of Ranks Module
on Module Height
1
30 mm
Module
Speed
PC2-3200 3-3-3
Sales
Description
HYS64T32000GU
PC2-4300 4-4-4
256 MB ECC
512 MB
32 M x 72 256 M 32 M x 8 PTFBGA60
1
30 mm
64 M x 64 512 M 64 M x 8 PTFBGA60
1
30 mm
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
512 MB ECC
1 GB
DRAM Modules
1 GB ECC
2 GB
2 GB ECC
64 M x 72 512 M 64 M x 8 PTFBGA60
1
30 mm
128 M x 64 512 M 64 M x 8 PTFBGA60
2
30 mm
128 M x 72 512 M 64 M x 8 PTFBGA60
2
30 mm
256 M x 64
1G
128 M x 8 PTFBGA68
2
30 mm
256 M x 72
1G
128 M x 8 PTFBGA68
2
30 mm
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
Ordering
Code
5-A Q67100 Q1386
Prod. Green
2Q04
3.7-A Q67100 Q1387
HYS72T32000GU-
HYS64T64000GU-
HYS72T64000GU-
HYS64T128020GU-
HYS72T128020GU-
PC2-3200 3-3-3
PC2-4300 4-4-4
Speed
No.
5-A Q67100 Q1371
5-A Q67100 Q1389
HYS72T256020GU-
2Q04
3.7-A Q67100 Q1390
5-A Q67100 Q1392
2Q04
3.7-A Q67100 Q1393
5-A Q67100 Q1395
2Q04
3.7-A Q67100 Q1396
5-A Q67100 Q1398
3.7-A Q67100 Q1399
5-A Q67100 Q1739
HYS64T256020GU-
3Q04
3.7-A Q67100 Q1370
2Q04
3Q04
3.7-A Q67100 Q1740
5-A Q67100 Q1741
3.7-A Q67100 Q1742
3Q04
Registered DDR2 DIMM – 240-pin
Module
Density
256 MB
Organization
Genera- Compo.
tion Organization
Compo.
Package
# of Ranks Module
on Module Height
Specialty DRAMs
32 M x 72 256 M 32 M x 8 PTFBGA60
1
30 mm
64 M x 4 PTFBGA60
1
30 mm
512 MB
256 M
64 M x 72
32 M x 8 PTFBGA60
512 M
64 M x 8 PTFBGA60
2
1
30 mm
30 mm
Module
Speed
PC2-3200 3-3-3
PC2-4300 4-4-4
PC2-3200 3-3-3
Sales
Description
HYS72T32000GR-
HYS72T64001GR-
1
30 mm
128 M x 72 512 M
2 GB
64 M x 8 PTFBGA60
2
30 mm
512 M 128 M x 4 PTFBGA60
2
30 mm
256 M x 72
Flash
4 GB
16
512 M x 72
1G
256 M x 4 PTFBGA68
1
30 mm
1G
512 M x 4
2
30 mm
SDFBGA
5-A Q67100 Q1326
3.7-A Q67100 Q1330
PC2-3200 3-3-3
5-A Q67100 Q1367
HYS72T64020GR-
PC2-4300 4-4-4
PC2-3200 3-3-3
3Q04
3Q04
3.7-A Q67100 Q1366
HYS72T64000GR-
5-A Q67100 Q1378
3.7-A Q67100 Q1379
HYS72T128000GR-
3.7-A Q67100 Q1381
PC2-3200 3-3-3
5-A Q67100 Q1382
HYS72T128020GR-
2Q04
5-A Q67100 Q1380
PC2-4300 4-4-4
PC2-4300 4-4-4
Prod. Green
5-A Q67100 Q1715
3.7-A Q67100 Q1716
PC2-3200 3-3-3
128 M x 4 PTFBGA60
Ordering
Code
PC2-4300 4-4-4
PC2-4300 4-4-4
1 GB
Speed
No.
2Q04
3.7-A Q67100 Q1383
PC2-3200 3-3-3 HYS72T256220GR- 5-A Q67100 Q1891
PC2-4300 4-4-4 HYS72T256020GR- 3.7-A Q67100 Q1918
PC2-3200 3-3-3
HYS72T256000GR-
PC2-4300 4-4-4
PC2-3200 3-3-3
PC2-4300 4-4-4
5-A Q67100 Q1735
3Q04
3.7-A Q67100 Q1736
HYS72T512022GR-
5-A Q67100 Q1737
3.7-A Q67100 Q1738
1Q05
Compo.
Package
32 M x 64 512 M 32 M x 16 PTFBGA84
# of Ranks Module
on Module Height
1
30 mm
Module
Speed
PC2-3200 3-3-3
PC2-4300 4-4-4
512 MB
64 M x 64 512 M 32 M x 16 PTFBGA84
2
30 mm
PC2-3200 3-3-3
512 M 128 M x 8
SDFBGA
2
30 mm
128 M x 64
1G
64 M x 16 PTFBGA92
2
30 mm
1G
256 M x 8 SDFBGA
2
30 mm
2 GB
Ordering
Code
5-A Q67100 Q1404
HYS64T64020GDL-
HYS64T128022GDL-
5-A Q67100 Q1743
PC2-4300 4-4-4
3Q04
5-A Q67100 Q1692
3.7-A Q67100 Q1691
HYS64T128020GDL-
3Q04
3.7-A Q67100 Q1405
PC2-3200 3-3-3
PC2-4300 4-4-4
Prod. Green
3.7-A Q67100 Q1402
PC2-4300 4-4-4
PC2-3200 3-3-3
256 M x 64
Speed
No.
5-A Q67100 Q1401
HYS64T32000GDL-
PC2-3200 3-3-3
PC2-4300 4-4-4
1 GB
Sales
Description
3Q04
3.7-A Q67100 Q1744
HYS64T256022GDL-
5-A Q67100 Q1745
3.7-A Q67100 Q1746
4Q04
DRAM Modules
Genera- Compo.
tion Organization
Specialty DRAMs
256 MB
Organization
Flash
Module
Density
DRAM Components
SO-DIMM DDR2 – 200-pin
17
DRAM Components
SDR Modules
Nomenclature SDR Modules
DRAM Modules
Specialty DRAMs
Flash
18
Unbuffered DIMM, Registered DIMM (168-pin) and SO-DIMM (144-pin)
HYS
64
V
32
2
2
0
GU
L
-6
-A
(Example)
Part Number
Extension
Component Die Revision Indicator
Speed
6
7
7.5
8
=
=
=
=
Power
L
none
= Low-Power Product
= Standard-Power Product
Module Family
GU
GR
GBR
GD
GBD
=
=
=
=
=
Designator
Product Variations
Number of
Memory Ranks
0
2
Designator
Data Sheet Defined
Memory Density
per DQ
8
16
32
64
128
256
=
=
=
=
=
=
Power Supply
V
= 3.3 V (SDR Modules)
Data Width
64
72
= x 64 (Non-ECC)
= x 72 (ECC)
Prefix
HYS
= Standard Prefix for SDRAM-based Memory Modules
166 MHz
133 MHz
133 MHz
100 MHz
(PC166
(PC133
(PC133
(PC100
3-3-3)
2-2-2)
3-3-3)
2-2-2)
Unbuffered 168-pin DIMM
Registered 168-pin DIMM
Registered 168-pin DIMM (FBGA-based)
144-pin Small Outline DIMM (SO-DIMM)
144-pin SO-DIMM (FBGA-based)
= One Memory Module Rank
= Two Memory Module Ranks
8 Mb
16 Mb
32 Mb
64 Mb
128 Mb
256 Mb
DRAM Components
Organization
128 MB
Compo.
GeneraCompo.
tion Organization Package
128 M
16 M x 8
TSOP
# of Ranks Module
on Module Height
1
1.25"
Module
Speed
PC133 3-3-3
PC133 2-2-2
16 M x 64
Sales
Description
128 MB ECC
TSOP
1
1.15"
128 M
16 M x 8
TSOP
1
1.25"
128 M
16 M x 8
TSOP
2
1.25"
PC133 2-2-2
256 MB ECC
PC133 2-2-2
PC133 3-3-3
256 M
32 M x 8
TSOP
1
1.25"
128 M
16 M x 8
TSOP
2
1.25"
32 M x 72
256 M
32 M x 8
TSOP
1
1.25"
64 M x 64 256 M
32 M x 8
TSOP
2
1.25"
PC133 3-3-3
64 M x 72 256 M
32 M x 8
TSOP
2
1.25"
7-D Q67100 Q4442
7-C2 Q67100 Q4086
HYS64V32300GU-
7-C2 Q67100 Q4083
7.5-D Q67100 Q4359
HYS72V32220GU-
7.5-C2 Q67100 Q4088
7-C2 Q67100 Q4089
7.5-D Q67100 Q4362
HYS72V32300GU-
PC133 3-3-3
PC133 2-2-2
EOL
7-D Q67100 Q4361
PC133 3-3-3
PC133 3-3-3
EOL
7.5-C2 Q67100 Q4082
HYS64V32220GU-
PC133 2-2-2
PC133 2-2-2
EOL
7.5-C2 Q67100 Q4085
HYS72V16300GU-
PC133 2-2-2
PC133 2-2-2
512 MB ECC
HYS64V16302GU-
PC133 3-3-3
32 M x 64
Prod. Green
7-C2 Q67100 Q4080
7.5-D Q67100 Q4466
PC133 3-3-3
16 M x 72
256 MB
512 MB
PC133 2-2-2
Ordering
Code
7.5-C2 Q67100 Q4079
HYS64V16300GU-
PC133 3-3-3
256 M 16 M x 16
Speed
No.
EOL
7-D Q67100 Q4360
7.5-D Q67100 Q4390
HYS64V64220GU-
HYS72V64220GU-
7-D Q67100 Q4389
Specialty DRAMs
Module
Density
DRAM Modules
Unbuffered SDR DIMM – 168-pin
EOL
7.5-D Q67100 Q4387
7-D Q67100 Q4388
EOL
Flash
EOL = End of Life
19
DRAM Components
Registered SDR DIMM – 168-pin
Module
Density
DRAM Modules
128 MB
Organization
16 M x 72
Compo.
Generation Organization
128 M
16 M x 8
Compo.
Package
TSOP
# of Ranks Module
on Module Height
1
1.5"
Module
Speed
PC133 3-3-3
Sales
Description
HYS72V16301GR-
PC133 2-2-2
256 MB
32 M x 72
Ordering
Code
7.5-C2 Q67100 Q4091
128 M
32 M x 4
TSOP
1
1.5" PC133 3-3-3 HYS72V32301GR- 7.5-C2 Q67100 Q4094
256 M
32 M x 8
TSOP
1
1.5"
PC133 3-3-3
64 M x 72 256 M
64 M x 4
TSOP
1
1.5"
PC133 3-3-3
HYS72V32300GR-
PC133 3-3-3
128 M x 72 256 M 128 M x 4
TSOP
stack
2
1.5"
EOL
7.5-D Q67100 Q4479 EOL
7-D Q67100 Q4440
HYS72V64300GR-
PC133 2-2-2
1 GB
Prod. Green
7-C2 Q67100 Q4092
PC133 2-2-2
512 MB
Speed
No.
7.5-D Q67100 Q4474
EOL
7-D Q67100 Q4441
HYS72V128321GR-
7.5-D Q67100 Q4725
PC133 2-2-2
7-D Q67100 Q4726
PC133 3-3-3
7.5-D Q67100 Q4475
HYS72V128320GR-
Specialty DRAMs
PC133 2-2-2
EOL
7-D Q67100 Q4439
EOL = End of Life
SO-DIMM SDR – 144-pin
Module
Density
Organization
128 MB
16 M x 64
Compo.
Generation Organization
Compo.
Package
# of Ranks Module
on Module Height
Module
Speed
Sales
Description
8 M x 16
TSOP
2
1.00" PC133 3-3-3 HYS64V16220GDL- 7.5-C2 Q67100 Q4342
256 M
16 M x 16
TSOP
1
1.00"
PC133 3-3-3
HYS64V16200GDL-
32 M x 64 256 M
16 M x 16
TSOP
2
1.00"
PC133 3-3-3
Flash
64 M x 64 256 M
32 M x 8
FBGA
2
1.15"
PC133 3-3-3
PC133 2-2-2
EOL = End of Life
20
Prod. Green
7.5-D Q67100 Q4478 EOL
7-D Q67100 Q4363
HYS64V32220GDL-
PC133 2-2-2
512 MB
Ordering
Code
128 M
PC133 2-2-2
256 MB
Speed
No.
7.5-D Q67100 Q4472
EOL
7-D Q67100 Q4444
HYS64V64220GBDL-
7.5-D Q67100 Q4499
7-D Q67100 Q4501
EOL
DRAM Components
Specialty DRAMs
Nomenclature Reduced Latency DRAM (RLDRAM™ )
RL
256
32
A
C
-4
(Example)
DRAM Modules
18
Speed
4
5
=
=
250 MHz
200 MHz
Package
C
=
FBGA
Product Revision
Die Revision
Organization
32
16
=
=
x 32
x 16
Memory Density
256
=
256 Mb
Memory Type
RL
=
Reduced Latency DRAM (RLDRAM)
I/O Voltage
18
=
1.8 V (VDDQ)
Prefix
HYB
=
Standard Prefix for Memory Components
Specialty DRAMs
HYB
Reduced Latency DRAM (RLDRAM™)
256 Mb
Organization
Power Supply
250 MHz
8 M x 32
2.5 V / 1.8 V VDDQ
16 M x 16
Speed
Sales Description
Speed No.
Ordering Code
4
Q67100 Q4355
200 MHz
5
Q67100 Q4357
250 MHz
4
Q67100 Q4356
5
Q67100 Q4358
200 MHz
HYB18RL25632AC-
HYB18RL25616AC-
Package
Prod.
T-FBGA-144
Now
Green
Flash
Density
21
DRAM Components
Nomenclature Graphics RAM and Mobile-RAM
HYB
DRAM Modules
Specialty DRAMs
Flash
22
25
D
128
32
3
A
C
L
- 3.3
(Example)
Speed
2.2
2.5
2.8
3.0
3.3
3.6
4.5
5
7.5
8
=
=
=
=
=
=
=
=
=
=
Power Down Current
Low-Power Down Current
Package
C
T
E
F
Product Revision
Die Revision
Interface
0
3
5
=
=
=
LV-TTL Interface
Matched Impedance 2.5 V VDDQ
Matched Impedance 1.8 V VDDQ
Organization
80
16
32
=
=
=
x8
x 16
x 32
Memory Density
128
256
512
=
=
=
128 Mb
256 Mb
512 Mb
Memory Type
D
L
=
=
DDR SDRAM or Graphics RAM
Low-Power SDRAM (Mobile-RAM)
Supply Voltage
18
25
39
=
=
=
1.8 VVDD
2.5 VDD / 1.8 VVDD or 2.5 VDDQ
3.3 VDD / 3.3 VDDQ
Prefix
HYB
HYE
=
=
Standard Prefix for Memory Components
Prefix for Extended Temperature Version
(- 25 °C – + 85 °C)
=
=
=
=
450 MHz
400 MHz
350 MHz
333 MHz
300 MHz
275 MHz
222 MHz
200 MHz
133 MHz
125 MHz
FBGA
TSOP
TSOP Lead and Halogen-Free
FBGA Lead and Halogen-Free
DRAM Components
Graphics RAM
Sales Description
333 MHz
300 MHz
4 M x 32
2.5 V
2.5 V
8 M x 32
1.8 V
Q67100 Q4866
3.3
Q67100
Q67100 Q4348
Q67100 Q4930
HYB25D128323C-
4.5
Q67100
HYB25D128323CL-
4.5
Q67100 Q4786
6.0
Q67100 Q4592
200 MHz
5.0
Q67100 Q4277
200 MHz
5.0
Q67100
Q1408
250 MHz
4.0
Q67100
Q1409
500 MHz
20
Q67100 Q4868
22
Q67100 Q4869
25
Q67100 Q4870
HYB25D256160BT-
HYB25D256161CE-
450 MHz
HYB18T256321F-
X = Lead-Free
Package
Prod.
FBGA-144
EOL
Green
Q4121
3.6
400 MHz
XX = Lead and Halogen-Free
3.0
3.6
166 MHz
16 M x 16
Ordering Code
HYB25D128323CL-
275 MHz
222 MHz
256 Mb
HYB25D128323C-
Speed No.
DRAM Modules
128 Mb
Speed
Q4123
Now
TSOP-66
FBGA-144
Now
XX
3Q04
X
EOL = End of Life
Mobile-RAM
Density
Organization Power Supply
Core
Power Supply Speed
I/O
Latency
128 Mb
2.5 V
8 M x 16
256 Mb
3.3 V
2.5 V / 1.8 V
3.3 V
1.8 V
1.8 V
2.5 V
2.5 V / 1.8 V
Sales Description
Speed No.
HYB25L128160AC-
7.5
Ordering Code
Package
3.3 V
1.8 V
512 Mb
3.3 V
133 MHz 3-3-3
1.8 V
7.5
Q67100 Q4624 TSOP-54
HYB39L128160AC-
7.5
Q67100 Q4546 FBGA-54
HYB18L128160BF-
7.5
Q67100 Q1581
HYB18L128160BC-
7.5
Q67100 Q1588 FBGA-54 2Q04
HYB25L256160AC-
7.5
Q67100 Q5145 FBGA-54
FBGA-54 2Q04
XX = Lead and Halogen-Free
7.5
Q67100 Q5144 FBGA-54
HYB39L256160AT-
7.5
Q67100 Q4627 TSOP-54
HYB18L256160BF-
7.5
Q67100 Q1295 FBGA-54 2Q04
HYB18L256160BC-
7.5
Q67100 Q1577 FBGA-54 2Q04
ETR = Extended Temperature
XX
Now
HYB39L256160AC-
HYB25L512160AC7.5
Q67100 Q4921 FBGA-54
Dual
3.3 V or
133 MHz 3-3-3
3.3
V
or
2.5
V
16 M x 16
2.5 V / 1.8 V
HYE25L512160AC- 7.5 ETR Q67100 Q4923 FBGA-54
= Halogen-Free
Now
HYB39L128160AT-
HYE25L256160AC- 7.5 ETR Q67100 Q5148 FBGA-54
16 M x 16
Green
Q67100 Q4542 FBGA-54
HYE25L128160AC- 7.5 ETR Q67100 Q4544 FBGA-54
133 MHz 3-3-3
Prod.
Specialty DRAMs
Organization Power Supply
XX
Flash
Density
Now
23
DRAM Components
Nomenclature CellularRAM™
HYE
18
P
16
16
1
A
C
- 60
(Example)
DRAM Modules
Speed
Specialty DRAMs
Package
C
W
=
=
Chip-size Package
Wafer / Known Good Die
Product Revision
Die Revision
Interface
0
1
=
=
Sync / Async / Page
Async / Page only
Organization
16
=
x 16
Memory Density
16
32
=
=
16 Mb
32 Mb
Memory Type
P
=
CellularRAM (PSRAM)
Supply Voltage
18
=
1.8 V VDD / 1.8 – 3.0 V VDDQ
Prefix
HYE
=
Extended Temperature
CellularRAM™
Density
Organization
Interface
16 Mb
Async
Speed
Speed No.
Ordering Code
Package
85
Q67100 Q5098
VFBGA-48
70
Q67100 Q5099
VFBGA-48
70
Q67100 Q5101
Wafer / KGD
85
Q67100 Q5103
VFBGA-48
70
Q67100 Q5104
VFBGA-48
70
Q67100 Q5106
Wafer / KGD
12.5
Q67100 Q1802
VFBGA-54
66 MHz / 85 ns
15
Q67100 Q5108
VFBGA-54
66 MHz / 85 ns HYE18P32160AW-
15
Q67100 Q5110
Wafer / KGD
85 ns
1 M x 16
SRAM
Async
85 ns
2 M x 16
SRAM
Flash
Sync
X = Lead-Free
24
80 MHz / 70 ns
2 M x 16
SRAM
/ Flash
HYE18P16161AW-
HYE18P32161AC-
70 ns
70 ns
32 Mb
HYE18P16161AC-
70 ns
70 ns
32 Mb
Sales Description
HYE18P32161AWHYE18P32160AC-
Prod.
Green
2Q04
X
2Q04
X
2Q04
X
DRAM Components
Flash
Nomenclature TwinFlash™ Components
DS
512
80
0
A
T
C
(Example)
Temperature Range
C
=
Commercial (0 °C – + 70 °C)
Package
T
=
TSOP I 48-P-1220-0.5
Process Technology
A
B
=
=
170 nm Process Technology
170 nm Process Technology (Enhanced Write Speed)
Product Variation
0
2
=
=
Standard Product (Tape & Reel Packing)
Stacked Die (Tape & Reel Packing)
Organization
80
=
x8
Memory Density
512
1G
=
=
512 Mb
1024 Mb
Memory Type
DS
=
Data SLC: TwinFlash Single-Level Cell (2 bit / cell)
Supply and
I/O Voltage
33
31
=
=
3.3 V core and 3 V I/O
3.3 V core and 1.8 V I/O
Prefix
HYF
=
Flash Memory Components
DRAM Modules
33
Specialty DRAMs
HYF
Density
Organization
Page Size
Block Size
Core
Voltage
512 Mb
64 M x 8
512 + 16 Bytes
16 K + 512 Bytes
3V
1 Gb
128 M x 8
512 + 16 Bytes
16 K + 512 Bytes
3V
I/O
Voltage
Write
Speed
Sales
Description
3V
Normal
HYF33DS512800ATC
3V
Enhanced
HYF33DS512800BTC
1.8 V
Enhanced
HYF31DS512800BTC
3V
Normal
HYF33DS1G802ATC
3V
Enhanced
HYF33DS1G802BTC
1.8 V
Enhanced
HYF31DS1G802BTC
Ordering Code
Package
On request
P-TSOPI-48
On request
P-TSOPI-48
Flash
TwinFlash™ Components
25
DRAM Components
Nomenclature TwinFlash™ Cards
HYC
3
N
256
0
NO
5
0
AA
1
A
A
(Example)
DRAM Modules
Specialty DRAMs
Package
A
B
C
D
=
=
=
=
SD (commercial)
MMC (commercial)
miniSD (commercial)
mini MMC (commercial)
Memory Revision
A
B
=
=
170 nm Process Technology
110 nm Process Technology
Controller Generation
1
2
=
=
1st generation
2nd generation
Firmware
AA
AB
=
=
1st firmware
2nd firmware
Content
0
1
=
=
No content
Content 1 rev. label
Label Size
0
1
2
3
4
5
6
7
=
=
=
=
=
=
=
=
No label
16 MB
32 MB
64 MB
128 MB
256 MB
512 MB
1 GB
Label Shortcut
NO
IF
=
=
No label
IFX label
Speed
0
1
=
=
Standard
Future use
Memory Capacity
64
128
256
512
01G
=
=
=
=
=
64 MB
128 MB
256 MB
512 MB
1024 MB
Technology
N
=
TWIN-NAND
Supply Voltage
3
1
=
=
3.3 V Core
1.8 V Core (Dual-Voltage)
Type
C
=
Flash Card
TwinFlash™ Cards
Card
Multi
Media
Cards
Density
Operating Voltage
64 MB
128 MB
Flash
256 MB
26
HYC3N1280NO00AA1AB
On request
HYC3N2560NO00AA1AB
64 MB
128 MB
Ordering Code
HYC3N0640NO00AA1AB
2.7 V – 3.6 V
256 MB
SD
Cards
Sales Description
HYC3N0640NO00AA1AA
2.7 V – 3.6 V
HYC3N1280NO00AA1AA
HYC3N2560NO00AA1AA
On request
More detailed Information on
Memory Products is available:
On our Internet websites:
www.infineon.com/memory and www.infineon.com/memory/flash
C Datasheets
C Simulation models
C Memory Spectrum (PDF version)
C Brochures (PDF version)
Edition 2004 April
Published by
Infineon Technologies AG,
St.-Martin-Straße 53,
D-81669 München
© Infineon Technologies AG 2004.
All Rights Reserved.
Please note
The information in this document is subject to change
without notice. The information herein describes certain
components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but
not limited to warranties of non-infringement regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and
conditions and prices, please contact your nearest
Infineon Technologies office in Germany or our Infineon
Technologies representatives worldwide.
(www.infineon.com).
Warnings
Due to technical requirements, components may contain
dangerous substances. For information on the types
in question, please contact your nearest Infineon
Technologies office.
Infineon Technologies components may only be used in
life-support devices or systems with the express written
approval of Infineon Technologies if a failure of such
components can reasonably be expected to cause the
failure of that life-support device or system, or to affect
the safety or effectiveness of that device or system.
Life-support devices or systems are intended to be
implanted in the human body, or to support and/or
maintain and sustain and/or protect human life. If they
fail, it is reasonable to assume that the health of the
user or other persons may be endangered.
27
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Ordering No. B166-H8399-X-X-7600
Printed in Germany
WS 04045.
Z&P 2003091
* and representative offices