ML12079 2.8 GHz Prescaler MECL PLL Components ÷64/128/256 Prescaler Legacy Device: Motorola MC12079 The ML12079 is a single modulus divide by 64, 128, 256 prescaler for low power frequency division of a 2.8 GHz (typical) high frequency input signal. Divide ratio control inputs SW1 and SW2 select the required divide ratio of ÷64, ÷128, or ÷256. An external load resistor is required to terminate the output. A 1.2 kΩ resistor is recommended to achieve a 1.6 Vpp output swing, when dividing a 1.1 GHz input signal by the minimum divide ratio of 64, assuming a 12 pF load. Output current can be minimized dependent on conditions such as output frequency, capacitive load being driven, and output voltage swing required. Typical values for load resistors are included in the Vout specification for various divide ratios at 2.8 GHz input frequency. • • • • 2.8 GHz Toggle Frequency Supply Voltage 4.5 to 5.5 V Low Supply Current 9mA Typical at VCC = 5.0 V Operating Temperature Range of TA = –40 to 85°C NOTE: SW2 Divide Ratio H H 64 H L 128 L H 128 L L 256 1 SO 8 = -5P PLASTIC PACKAGE CASE 751 8 1 P DIP 8 = PP PLASTIC PACKAGE CASE 626 FUNCTIONAL TABLE SW1 8 CROSS REFERENCE/ORDERING INFORMATION MOTOROLA PACKAGE LANSDALE P DIP 8 MC12079P ML12079PP SO 8 MC12079D ML12079-5P Note: Lansdale lead free (Pb) product, as it becomes available, will be identified by a part number prefix change from ML to MLE. SW1 & SW2: H = VCC, L = Open. MAXIMUM RATINGS Characteristic Power Supply Voltage, Pin 2 Operating Temperature Range Storage Temperature Range Maximum Output Current, Pin 4 Symbol Range Unit VCC –0.5 to 7.0 Vdc TA –40 to 85 °C Tstg –65 to 150 °C IO 4.0 mA PIN CONNECTIONS IN VCC SW1 OUT 1 8 2 7 3 6 4 5 IN NC SW2 Gnd (Top View) Page 1 of 4 www.lansdale.com Issue A ML12079 LANSDALE Semiconductor, Inc. ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V; TA = –40 to 85°C, unless otherwise noted.) Parameter Symbol Min Typ Max Unit ft 0.25 3.4 2.8 GHz ICC – 9.0 11.5 mA Vin 400 100 – – 1000 1000 mVpp Divide Ratio Control Input High (SW) VIH VCC VCC VCC V Divide Ratio Control Input Low (SW) VIL Open Open Open – Output Voltage Swing Vout 1.0 1.6 – Vpp Toggle Frequency (Sine Wave) Supply Current Output (Pin 2) Input Voltage Sensitivity 250–500 MHz 500–2800 MHz (CL = 12 pF; RL = 1.2 kΩ; IO = 2.7 mA)1 (CL = 12 pF; RL = 2.2 kΩ; IO = 1.5 mA)2 (CL = 12 pF; RL = 3.9 kΩ; IO = 0.85 mA)3 NOTES: 1. Divide ratio of ÷64 at 2.8 GHz. 2. Divide ratio of ÷128 at 2.8 GHz. 3. Divide ratio of ÷256 at 2.8 GHz. Figure 1. Logic Diagram (ML12079) In In D QB D Q D QB C Q C QB C Q D QB D QB D QB C Q C Q C Q D Q D QB C QB C Q Out SW2 SW1 Figure 2. AC Test Circuit VCC = 4.5 to 5.5 V C3 SINE WAVE GENERATOR C1 VCC IN SW1 50 Ω SW2 C2 IN OUT GND Page 2 of 4 CL www.lansdale.com RL EXTERNAL COMPONENTS C1 = C2 = 1000 pF C3 = 0.1 µF CL = 12 pF (Including Scope and Jig Capacitance) RL = 1.2 kΩ (for ÷64 at 2.8 GHz) Issue A ML12079 LANSDALE Semiconductor, Inc. Figure 3. Input Signal Amplitude versus Input Frequency +15.0 +1257.40 +10.0 +707.11 +5.0 +397.64 0 +223.61 OPERATING WINDOW +125.74 –10.0 +70.71 –15.0 +39.76 –20.0 +22.36 –25.0 +12.57 –30.0 +7.07 –35.0 +3.98 –40.0 +2.24 –45.0 +1.26 –50.0 0 400 800 1200 1600 2000 2400 2800 3200 mVrms AMPLITUDE (dBm) –5.0 +0.71 3600 FREQUENCY (MHz) Divide Ratio = 64; VCC = 5.0 V; TA = 25°C Figure 4. Output Amplitude versus Input Frequency 2000 1200 800 mVpp 1600 400 0 400 800 1200 1600 2000 2400 2800 3200 0 3600 FREQUENCY (MHz) Page 3 of 4 www.lansdale.com Issue A ML12079 LANSDALE Semiconductor, Inc. OUTLINE DIMENSIONS 8 P DIP 8 = PP PLASTIC PACKAGE (ML12079PP) CASE 626–05 ISSUE K 5 –B– 1 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4 F –A– NOTE 2 L DIM A B C D F G H J K L M N C J –T– N SEATING PLANE D M K G H 0.13 (0.005) T A M B M 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 5 0.25 H E M B M 1 4 h B X 45 e A C SEATING PLANE L 0.10 A1 B 0.25 M C B S A INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10 0.030 0.040 M SO 8 = -5P PLASTIC PACKAGE (ML12079-5P) CASE 751–06 ISSUE T D A MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10 0.76 1.01 S DIM A A1 B C D E e H h L MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0 7 Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc. Page 4 of 4 www.lansdale.com Issue A