SEMICONDUCTOR TECHNICAL DATA # ! ! " The MC12083 is a ÷2 prescaler for low power frequency division of a 1.1GHz high frequency input signal. On–chip output termination provides output current to drive a 2pF (typical) high impedance load. If additional drive is required for the prescaler output, an external resistor can be added parallel from the OUT Pin to GND to increase the output power. Care must be taken not to exceed the maximum allowable current through the output. Stand–By mode is featured to reduce current drain to 250µA typical when the stand–by pin SB is switched LOW disabling the prescaler. • • • • • MECL PLL COMPONENTS ÷2 PRESCALER WITH STAND–BY MODE 1.1GHz Toggle Frequency Supply Voltage 2.7V to 5.5V Low Power 4.5mA Typical at VCC = 2.7V Operating Temperature –40 to +85°C On–Chip Termination P SUFFIX 8–LEAD PLASTIC PACKAGE CASE 626–05 Pinout: 8–Lead Plastic (Top View) IN SB NC GND 8 7 6 5 1 2 3 4 D SUFFIX 8–LEAD PLASTIC SOIC PACKAGE CASE 751–05 IN VCC NC OUT A LOW on the Stand–By Pin 7 disables the device. MAXIMUM RATINGS Symbol Parameter Value Unit VCC Power Supply Voltage, Pin 2 –0.5 to +7.0 VDC TA Operating Temperature Range –40 to +85 °C Tstg Storage Temperature Range –65 to +150 °C IO Maximum Output Current, Pin 4 10.0 mA 1/97 Motorola, Inc. 1997 1 REV 2 MC12083 ELECTRICAL CHARACTERISTICS (VCC = 2.7 to 5.5V; TA = –40 to +85°C) Symbol Parameter Min Typ Max Unit 0.1 1.4 1.1 GHz ft Toggle Frequency (Sine Wave) ICC Supply Current Output (Pin 2) VCC = 3.0V VCC = 5.5V 4.4 4.8 6.5 6.5 mA ISB Standby Current VCC = 3.0V VCC = 5.5V 250 500 350 600 µA VIH Standby Input HIGH (SB) 2.0 VCC V VIL Standby Input LOW (SB) GND 0.8 V VOUT Output Voltage Swing (Note 1.) VIN Input Voltage Sensitivity 2pF Load @ 500MHz Input 2pF Load @ 750MHz Input 2pF Load @ 1100MHz Input 700 600 400 100–250MHz 250–400MHz 400–1100MHz 400 200 100 800 700 450 mVPP 1000 1000 1000 mVPP 1. Assume 2pF load, VCC = 2.7V, VIN =minimum specification for each frequency band, TA = 85°C VCC = 2.7 to 5.5V C3 Sine Wave Generator C1 VCC IN SB 50Ω OUT C2 2pF IN GND EXTERNAL COMPONENTS C1 = C2 = 1000pF C3 = 0.1µF Figure 1. AC Test Circuit MOTOROLA 2 HIPERCOMM BR1334 — Rev 4 MC12083 +15.0 +1257.40 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ +5.0 0 +397.64 +223.61 OPERATING WINDOW –5.0 AMPLITUDE (dBm) +707.11 –10.0 –15.0 –20.0 +125.74 +70.71 +39.76 +22.36 –25.0 +12.57 –30.0 +7.07 –35.0 +3.98 –40.0 +2.24 –45.0 +1.26 –50.0 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 MILLIVOLTS (rms) +10.0 +0.71 1500 FREQUENCY (MHz) Figure 2. Input Signal Amplitude versus Input Frequency Divide Ratio = 2; VCC = 2.7V; TA = 25°C; Output Loaded With 2pF 1400 1300 2.7V P-P –40 5.0V P-P –40 1200 2.7V P-P +25 OUTPUT VOLTAGE P-P, (mV) 1100 5.0V P-P +25 2.7V P-P +85 1000 5.0V P-P +85 900 800 700 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ VOUT WINDOW 600 500 400 300 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 INPUT FREQUENCY, (MHz) Figure 3. 12083 Output Peak–to–Peak at 2pF Load HIPERCOMM BR1334 — Rev 4 3 MOTOROLA MC12083 OUTLINE DIMENSIONS 8 P SUFFIX PLASTIC PACKAGE CASE 626–05 ISSUE K 5 –B– 1 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4 F –A– NOTE 2 L DIM A B C D F G H J K L M N C J –T– N SEATING PLANE D M K G H 0.13 (0.005) M T A M 8 C 5 0.25 H E M B M 1 4 B e h A C X 45 _ q SEATING PLANE 0.10 A1 B 0.25 M L C B S A INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040 M D SUFFIX PLASTIC SOIC PACKAGE CASE 751–05 ISSUE R D A B MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01 S NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. 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How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405; Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 4 MC12083/D HIPERCOMM BR1334 — Rev 4