MIMIX CMM0014

2.0-22.0 GHz GaAs MMIC
Power Amplifier
CMM0014-BD
August 2006 - Rev 02-Aug-06
2.0 to 22.0 GHz
GaAs MMIC
Power Amplifier
Chip Diagram
Advanced Product Information
August 2004
(1 of 3)
Features
Small Size: 45 x 92 mils
High Gain: 11.5 dB, Nom
Medium Power: +25 dBm, Typ P1dB @14 GHz
Directly Cascadable – Fully Matched
Unconditionally Stable
Single Bias Operation
Bias Control
pHEMT Technology
Silicon Nitride Passivation
Specifications (TA = 25°C, Vdd = 8V)1
Parameters
Frequency Range
Small Signal Gain
Gain Flatness
Gain Variation (-40°C to +85°C)
Input Return Loss
Output Return Loss
Power Output (@1 dB Gain Compression) 1
P1dB Variation (over operating frequency)
P1dB Variation (-40°C to +85°C)
Saturated Output Power
Second Order Intercept Point @ 10 GHz
Third Order Intercept Point @ 10 GHz
Noise Figure
Current
Thermal Resistance
Stability 2
Units
Min
GHz
dB
±dB
±dB
dB
dB
dBm
dBm
±dBm
dBm
dBm
dBm
dB
mA
°C/W
2.0
10.0
Typ
Max
22.0
13.5
0.8
0.35
-10.0
-9.0
22.5
4.5
0.25
29.0
24.0
48.0
37.5
250
295
7.5
340
33.0
Unconditionally Stable
Notes: 1. Tested on Celeritek Connectorized evaluation board (standard assembly condition detailed on page 3).
2. Stability factor measured on-wafer.
Die Attach and Bonding Procedures
Absolute Maximum Ratings
Parameter
Rating
Drain Voltage
Drain Current
Continuous Power Dissipation
Input Power
Storage Temperature
Channel Temperature
Operating Backside Temperature
7V (min.) / 9V (max.)
350 mA
2.8 W
+20 dBm
-50°C to +150°C
+175°C
-40 to (see note 2)°C
Notes: 1. Operation outside these limits can cause permanent damage.
2. Calculation maximum operating temperature:
Tmax = 175–(Pdis [W] x 33.0) [°C].
Die Attach: Eutectic die attach is recommended. For eutectic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (prestressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 3
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-22.0 GHz GaAs MMIC
Power Amplifier
CMM0014-BD
August 2006 - Rev 02-Aug-06
Typical Performance (Vdd = 8V, 300 mA)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 3
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-22.0 GHz GaAs MMIC
Power Amplifier
CMM0014-BD
August 2006 - Rev 02-Aug-06
Assembly Example
Note:
1. Eutectic attach on at least 30mil thick CuW or CuMo carrier is recommend.
2. For evaluation, a 1.4mil wire diameter lithium gold air coil has been used .
Ordering Information
The CMM-0014-BD is available in bare die and is shipped in Gel Pak.
Package
Part Number for Ordering
CMM0014-BD
Bare Die
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 3
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.