MIMIX XM1003-BD-EV1

32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
M1003-BD
February 2008 - Rev 06-Feb-08
Features
Sub-harmonic Image Reject Mixer
GaAs HBT Technology
9.0 dB Conversion Loss
18.0 dB Image Rejection
100% On-Wafer RF Testing
100% Visual Inspection to MIL-STD-883
Method 2010
Chip Device Layout
XM1003-BD
General Description
Mimix Broadband’s 32.0-42.0 GHz GaAs MMIC
sub-harmonic image reject mixer can be used as an upor down-converter. The device has a conversion loss of
9.0 dB with 18.0 dB image rejection across the band. I and
Q mixer outputs are provided and an external 90 degree
hybrid is required to select the desired sideband. This
MMIC uses Mimix Broadband’s 2 µm GaAs HBT device
model technology, and is based upon electron beam
lithography to ensure high repeatability and uniformity.
The chip has surface passivation to protect and provide a
rugged part with backside via holes and gold
metallization to allow either a conductive epoxy or
eutectic solder die attach process. This device is well
suited for Millimeter-wave Point-to-Point Radio, LMDS,
SATCOM and VSAT applications.
Absolute Maximum Ratings
Input Power (RF Pin)
Input Power (IF Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
+20 dBm
+20 dBm
-65 to +165 OC
-55 to +125 OC
Electrical Characteristics (Ambient Temperature T = 25o C)
Parameter
Frequency Range (RF) Upper Side Band
Frequency Range (RF) Lower Side Band
Frequency Range (LO)
Frequency Range (IF)
RF Return Loss (S11)
IF1/IF2 Return Loss (S22)
LO Return Loss (S33)
Conversion Loss (S21)
LO Input Drive (PLO)
Image Rejection
Isolation LO/RF
Isolation LO/IF
Isolation RF/IF
Input Third Order Intercept (IIP3)
Units
GHz
GHz
GHz
GHz
dB
dB
dB
dB
dBm
dBc
dBc
dB
dB
dBm
Min.
34.0
32.0
15.0
DC
-
Typ.
10.0
TBD
TBD
9.0
+12.0
18.0
-40.0
TBD
TBD
+14.0
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Max.
42.0
42.0
23.0
4.0
Page 1 of 7
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
M1003-BD
February 2008 - Rev 06-Feb-08
Mixer Measurements Down Conversion
XM1003-BD (USB, down conversion, IF=2GHz, PRF=-20dBm, PLO=+12,15 &
18dBm): USB Conversion Loss (dB) vs. RF freq (GHz)
XM1003-BD (LSB, down conversion, IF=2GHz, PRF=-20dBm, PLO=+12,15 &
18dBm): LSB Conversion Loss (dB) vs. RF freq (GHz)
LO freq (GHz)
12
14
16
LO freq (GHz)
18
20
22
24
14
16
18
20
22
24
26
0
-5
-5
-10
-10
-15
Conv Loss, LO Power (dBm)=12, DeviceCoord=R11C5
Conv Loss, LO Power (dBm)=12, DeviceCoord=R12C6
-20
Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C5
Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C7
-25
Conv Loss, LO Power (dBm)=15, DeviceCoord=R11C5
Conv Loss, LO Power (dBm)=15, DeviceCoord=R12C6
Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C5
-30
Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C7
Conv Loss, LO Power (dBm)=18, DeviceCoord=R11C5
-35
Conv Loss, LO Power (dBm)=18, DeviceCoord=R12C6
LSB Conversion Loss (dB)
USB Conversion Loss (dB)
0
-15
Conv Loss, LO Power (dBm)=12, DeviceCoord=R11C5
Conv Loss, LO Power (dBm)=12, DeviceCoord=R12C6
-20
Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C5
Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C7
-25
Conv Loss, LO Power (dBm)=15, DeviceCoord=R11C5
Conv Loss, LO Power (dBm)=15, DeviceCoord=R12C6
-30
Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C5
Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C7
Conv Loss, LO Power (dBm)=18, DeviceCoord=R11C5
-35
Conv Loss, LO Power (dBm)=18, DeviceCoord=R12C6
Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C5
-40
Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C7
Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C5
-40
Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C7
-45
-45
-50
26
30
34
38
42
46
-50
50
26
30
34
RF freq (GHz)
38
16
18
20
22
14
24
0
-5
-5
-10
-10
18
20
22
24
26
-15
Im Rej, LO Power (dBm)=12, DeviceCoord=R11C5
-15
Im Rej, LO Power (dBm)=12, DeviceCoord=R12C6
Im Rej, LO Power (dBm)=12, DeviceCoord=R9C5
-20
Im Rej, LO Power (dBm)=12, DeviceCoord=R9C7
Im Rej, LO Power (dBm)=15, DeviceCoord=R11C5
Im Rej, LO Power (dBm)=15, DeviceCoord=R12C6
-25
Im Rej, LO Power (dBm)=15, DeviceCoord=R9C5
Im Rej, LO Power (dBm)=15, DeviceCoord=R9C7
-30
Im Rej, LO Power (dBm)=18, DeviceCoord=R11C5
Image Rejection (dBc)
Image Rejection (dBc)
16
0
5
-35
Conv Loss, LO Power (dBm)=12, DeviceCoord=R11C5
Conv Loss, LO Power (dBm)=12, DeviceCoord=R12C6
Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C5
-20
Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C7
Conv Loss, LO Power (dBm)=15, DeviceCoord=R11C5
Conv Loss, LO Power (dBm)=15, DeviceCoord=R12C6
-25
Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C5
Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C7
Conv Loss, LO Power (dBm)=18, DeviceCoord=R11C5
-30
Conv Loss, LO Power (dBm)=18, DeviceCoord=R12C6
Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C5
Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C7
-35
Im Rej, LO Power (dBm)=18, DeviceCoord=R12C6
Im Rej, LO Power (dBm)=18, DeviceCoord=R9C5
Im Rej, LO Power (dBm)=18, DeviceCoord=R9C7
-40
-40
-45
-45
-50
-50
26
30
34
38
42
46
26
50
30
34
38
RF freq (GHz)
30
31
32
33
34
35
36
46
50
XM1003-BD (LSB, Down Conversion, IF=2GHz, IF1-IF2=100MHz, PRF=-15dBm,
LO=12, 15 & 18 dBm): OIP3 avg (dBm) vs. LO freq (GHz), IIP3 avg (dBm) vs. RF freq (GHz)
RF freq (GHz)
29
42
RF freq (GHz)
XM1003-BD (USB, Down Conversion, IF=2GHz, IF1-IF2=100MHz, PRF=-15dBm,
LO=12, 15 & 18 dBm): OIP3 avg (dBm) vs. LO freq (GHz), IIP3 avg (dBm) vs. RF freq (GHz)
RF freq (GHz)
37
38
39
40
41
29
20
31
33
35
37
39
41
25
20
15
OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R12C6
10
OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C5
OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C7
OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R12C6
OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C5
5
OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C7
OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R12C6
OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C5
OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C7
0
IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R12C6
IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C5
IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C7
IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R12C6
-5
IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C5
IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C7
IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R12C6
-10
IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C5
IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C7
15
OIP3 avg (dBm) / IIP3 avg (dBm)
OIP3 avg (dBm) / IIP3 avg (dBm)
50
LO freq (GHz)
LO freq (GHz)
14
46
XM1003-BD(LSB, down conversion, IF=2GHz, PRF=-20dBm, PLO=+12,15 &
18dBm): Image Rejection (dBc) vs. RF freq (GHz)
XM1003-BD (USB, down conversion, IF=2GHz, PRF=-20dBm, PLO=+12,15 &
18dBm): Image Rejection (dBc) vs. RF freq (GHz)
12
42
RF freq (GHz)
OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R12C6
OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C5
OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C7
10
OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R12C6
OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C5
OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C7
5
OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R12C6
OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C5
OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C7
0
IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R12C6
IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C5
IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C7
-5
IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R12C6
IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C5
-10
IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C7
IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R12C6
IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C5
-15
-15
-20
13.5
-20
15.5
14
14.5
15
15.5
16
16.5
17
LO freq (GHz)
17.5
18
18.5
19
19.5
IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C7
16
16.5
17
17.5
18
18.5
19
19.5
20
20.5
21
21.5
LO freq (GHz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 7
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
M1003-BD
February 2008 - Rev 06-Feb-08
Mixer Measurements Up Conversion
XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, USB, PLO=+9dBm):
USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz)
XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, LSB, PLO=+9dBm):
USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz)
LO freq (GHz)
LO freq (GHz)
16
16.5
17
17.5
18
18.5
19
16
16.5
17
17.5
18
30
31
32
33
34
-5
-10
-15
-20
-25
-30
-35
19
19.5
20
20.5
21
35
36
37
38
39
40
-5
-10
-15
-20
-25
-30
-35
-40
-40
33
34
35
36
37
38
39
40
RF freq (GHz)
RF freq (GHz)
XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, USB, PLO=+12dBm):
USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz)
XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, LSB, PLO=+12dBm):
USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz)
LO freq (GHz)
15.5
0
16
16.5
17
17.5
LO freq (GHz)
18
18.5
19
16
16.5
17
17.5
18
30
31
32
33
34
18.5
19
19.5
20
20.5
21
35
36
37
38
39
40
0
-5
LSB Conversion gain (dB) / Image Rejection (dBc)
USB Conversion gain (dB) / Image Rejection (dBc)
18.5
0
LSB Conversion gain (dB) / Image Rejection (dBc)
USB Conversion gain (dB) / Image Rejection (dBc)
15.5
0
-10
-15
-20
-25
-30
-35
-5
-10
-15
-20
-25
-30
-35
-40
-40
33
34
35
36
37
38
39
40
RF freq (GHz)
RF freq (GHz)
XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, USB, PLO=+15dBm):
USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz)
LO freq (GHz)
USB Conversion gain (dB) / Image Rejection (dBc)
15.5
0
16
16.5
17
17.5
18
18.5
19
34
35
36
37
38
39
40
-5
-10
-15
-20
-25
-30
-35
-40
33
RF freq (GHz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 7
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
M1003-BD
February 2008 - Rev 06-Feb-08
Mixer Measurements Up Conversion (cont.)
XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, USB,
PLO=+9,+12 and +15dBm): LOxharm to RF gain (dB) vs. RF freq (GHz)
XM1003-BD (LSB,Up conversion, PIF=-15dBm, IF=2GHz, LSB,
PLO=+9,+12 and 15dBm): LOxharm to RF gain (dB) vs. LO freq (GHz)
0
0
-5
-5
-10
-10
-15
-15
-20
LOxharm to RF gain (dB)
LOxharm to RF gain (dB)
-20
-25
-30
-35
-40
-45
-25
-30
-35
-40
-45
-50
-50
-55
-55
-60
-60
-65
-65
-70
-70
30
31
32
33
34
35
RF freq (GHz)
36
37
38
39
16
40
17
18
19
20
21
LO freq (GHz)
OIP3 avg (dBm), LO Power (dBm)=12, Device=R10C7
OIP3 avg (dBm), LO Power (dBm)=12, Device=R10C7
OIP3 avg (dBm), LO Power (dBm)=12, Device=R11C7
OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C5
OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C8
OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C8_2
OIP3 avg (dBm), LO Power (dBm)=12, Device=R14C6
OIP3 avg (dBm), LO Power (dBm)=13, Device=R10C7
OIP3 avg (dBm), LO Power (dBm)=13, Device=R11C7
OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C5
OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C8
OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C8_2
OIP3 avg (dBm), LO Power (dBm)=13, Device=R14C6
OIP3 avg (dBm), LO Power (dBm)=14, Device=R10C7
OIP3 avg (dBm), LO Power (dBm)=14, Device=R11C7
OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C5
OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C8
OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C8_2
OIP3 avg (dBm), LO Power (dBm)=14, Device=R14C6
OIP3 avg (dBm), LO Power (dBm)=15, Device=R10C7
OIP3 avg (dBm), LO Power (dBm)=15, Device=R11C7
OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C5
OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C8
OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C8_2
OIP3 avg (dBm), LO Power (dBm)=15, Device=R14C6
IIP3 (dBm), LO Power (dBm)=12, Device=R10C7
IIP3 (dBm), LO Power (dBm)=12, Device=R11C7
IIP3 (dBm), LO Power (dBm)=12, Device=R12C5
IIP3 (dBm), LO Power (dBm)=12, Device=R12C8
IIP3 (dBm), LO Power (dBm)=12, Device=R12C8_2
IIP3 (dBm), LO Power (dBm)=12, Device=R14C6
IIP3 (dBm), LO Power (dBm)=13, Device=R10C7
IIP3 (dBm), LO Power (dBm)=13, Device=R11C7
IIP3 (dBm), LO Power (dBm)=13, Device=R12C5
IIP3 (dBm), LO Power (dBm)=13, Device=R12C8
IIP3 (dBm), LO Power (dBm)=13, Device=R12C8_2
IIP3 (dBm), LO Power (dBm)=13, Device=R14C6
IIP3 (dBm), LO Power (dBm)=14, Device=R10C7
IIP3 (dBm), LO Power (dBm)=14, Device=R11C7
IIP3 (dBm), LO Power (dBm)=14, Device=R12C5
IIP3 (dBm), LO Power (dBm)=14, Device=R12C8
IIP3 (dBm), LO Power (dBm)=14, Device=R12C8_2
IIP3 (dBm), LO Power (dBm)=14, Device=R14C6
IIP3 (dBm), LO Power (dBm)=15, Device=R10C7
IIP3 (dBm), LO Power (dBm)=15, Device=R11C7
IIP3 (dBm), LO Power (dBm)=15, Device=R12C5
IIP3 (dBm), LO Power (dBm)=15, Device=R12C8
IIP3 (dBm), LO Power (dBm)=15, Device=R12C8_2
IIP3 (dBm), LO Power (dBm)=15, Device=R14C6
RF freq (GHz)
32
34
36
38
40
42
44
46
15
OIP3 avg (dBm) / IIP3 (dBm)
10
5
0
-5
-10
15
16
17
18
19
20
21
22
LO Freq (GHz)
OIP3 avg (dBm), LO Power (dBm)=12, Device=R11C7
XM1003-BD (Up Conv, IF=2GHz, IF1-IF2=0.1GHz, LSB, Pout=-23dBm):
OIP3 avg (dBm) vs. LO freq (GHz) & IIP3 avg (dBm) vs RF freq
OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C5
OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C8
OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C8_2
OIP3 avg (dBm), LO Power (dBm)=12, Device=R14C6
OIP3 avg (dBm), LO Power (dBm)=13, Device=R10C7
RF freq (GHz)
OIP3 avg (dBm), LO Power (dBm)=13, Device=R11C7
OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C5
32
34
36
38
40
42
44
46
OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C8
OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C8_2
15
OIP3 avg (dBm), LO Power (dBm)=13, Device=R14C6
OIP3 avg (dBm), LO Power (dBm)=14, Device=R10C7
OIP3 avg (dBm), LO Power (dBm)=14, Device=R11C7
OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C5
OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C8
OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C8_2
10
OIP3 avg (dBm) / IIP3 (dBm)
XM1003-BD (Up Conv, IF=2GHz, IF1-IF2=0.1GHz, USB, Pout=-23dBm):
OIP3 avg (dBm) vs. LO freq (GHz) & IIP3 (dBm) vs RF freq (GHz)
OIP3 avg (dBm), LO Power (dBm)=14, Device=R14C6
OIP3 avg (dBm), LO Power (dBm)=15, Device=R10C7
OIP3 avg (dBm), LO Power (dBm)=15, Device=R11C7
OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C5
OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C8_2
OIP3 avg (dBm), LO Power (dBm)=15, Device=R14C6
5
OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C8
IIP3 (dBm) , LO Power (dBm)=12, Device=R10C7
IIP3 (dBm) , LO Power (dBm)=12, Device=R11C7
IIP3 (dBm) , LO Power (dBm)=12, Device=R12C5
IIP3 (dBm) , LO Power (dBm)=12, Device=R12C8
IIP3 (dBm) , LO Power (dBm)=12, Device=R12C8_2
IIP3 (dBm) , LO Power (dBm)=12, Device=R14C6
0
IIP3 (dBm) , LO Power (dBm)=13, Device=R10C7
IIP3 (dBm) , LO Power (dBm)=13, Device=R11C7
IIP3 (dBm) , LO Power (dBm)=13, Device=R12C5
IIP3 (dBm) , LO Power (dBm)=13, Device=R12C8
IIP3 (dBm) , LO Power (dBm)=13, Device=R12C8_2
IIP3 (dBm) , LO Power (dBm)=13, Device=R14C6
-5
IIP3 (dBm) , LO Power (dBm)=14, Device=R10C7
IIP3 (dBm) , LO Power (dBm)=14, Device=R11C7
IIP3 (dBm) , LO Power (dBm)=14, Device=R12C5
IIP3 (dBm) , LO Power (dBm)=14, Device=R12C8
IIP3 (dBm) , LO Power (dBm)=14, Device=R12C8_2
IIP3 (dBm) , LO Power (dBm)=14, Device=R14C6
IIP3 (dBm) , LO Power (dBm)=15, Device=R10C7
-10
IIP3 (dBm) , LO Power (dBm)=15, Device=R11C7
17
18
19
20
21
22
23
24
IIP3 (dBm) , LO Power (dBm)=15, Device=R12C5
IIP3 (dBm) , LO Power (dBm)=15, Device=R12C8
LO Freq (GHz)
IIP3 (dBm) , LO Power (dBm)=15, Device=R12C8_2
IIP3 (dBm) , LO Power (dBm)=15, Device=R14C6
XM1003-BD (Up Conv, IF=2GHz, IF1-IF2=0.1GHz, USB, Pout=-23dBm):
im3 avg (dBm) vs. LO freq (GHz) & RF level (dbm) vs RF Freq (GHz)
XM1003-BD (Up Conv, IF=2GHz, IF1-IF2=0.1GHz, LSB, Pout=-23dBm):
im3 avg (dBm) vs. LO freq (GHz) & RF level (dbm) vs RF Freq (GHz)
RF freq (GHz)
RF freq (GHz)
32
34
36
38
40
42
44
32
46
im3 avg (dBm), LO Power (dBm)=12, Device=R10C7
0
34
36
38
40
42
44
46
im3 avg (dBm), LO Power (dBm)=12, Device=R10C7
0
im3 avg (dBm), LO Power (dBm)=12, Device=R11C7
im3 avg (dBm), LO Power (dBm)=12, Device=R11C7
im3 avg (dBm), LO Power (dBm)=12, Device=R12C5
im3 avg (dBm), LO Power (dBm)=12, Device=R12C5
im3 avg (dBm), LO Power (dBm)=12, Device=R12C8
-10
im3 avg (dBm), LO Power (dBm)=12, Device=R12C8
-10
im3 avg (dBm), LO Power (dBm)=12, Device=R12C8_2
im3 avg (dBm), LO Power (dBm)=12, Device=R12C8_2
im3 avg (dBm), LO Power (dBm)=12, Device=R14C6
im3 avg (dBm), LO Power (dBm)=12, Device=R14C6
im3 avg (dBm), LO Power (dBm)=12, Device=R14C8
-20
-20
im3 avg (dBm), LO Power (dBm)=13, Device=R10C7
im3 avg (dBm), LO Power (dBm)=13, Device=R10C7
im3 avg (dBm), LO Power (dBm)=13, Device=R11C7
im3 avg (dBm), LO Power (dBm)=13, Device=R11C7
im3 avg (dBm), LO Power (dBm)=13, Device=R12C5
im3 avg (dBm), LO Power (dBm)=13, Device=R12C5
-30
-30
im3 avg (dBm), LO Power (dBm)=13, Device=R12C8
im3 avg (dBm), LO Power (dBm)=13, Device=R12C8_2
im3 avg (dBm), LO Power (dBm)=13, Device=R14C6
im3 avg (dBm), LO Power (dBm)=13, Device=R14C8
-40
im3 avg (dBm), LO Power (dBm)=14, Device=R10C7
im3 avg (dBm), LO Power (dBm)=14, Device=R11C7
im3 avg (dBm), LO Power (dBm)=14, Device=R12C5
-50
im3 avg (dBm)
im3 avg (dBm) / Tone1 Level (dBm)
im3 avg (dBm), LO Power (dBm)=12, Device=R14C8
im3 avg (dBm), LO Power (dBm)=13, Device=R12C8
im3 avg (dBm), LO Power (dBm)=13, Device=R12C8_2
im3 avg (dBm), LO Power (dBm)=13, Device=R14C6
im3 avg (dBm), LO Power (dBm)=13, Device=R14C8
-40
im3 avg (dBm), LO Power (dBm)=14, Device=R10C7
im3 avg (dBm), LO Power (dBm)=14, Device=R11C7
im3 avg (dBm), LO Power (dBm)=14, Device=R12C5
-50
im3 avg (dBm), LO Power (dBm)=14, Device=R12C8
im3 avg (dBm), LO Power (dBm)=14, Device=R12C8
im3 avg (dBm), LO Power (dBm)=14, Device=R12C8_2
im3 avg (dBm), LO Power (dBm)=14, Device=R12C8_2
im3 avg (dBm), LO Power (dBm)=14, Device=R14C6
im3 avg (dBm), LO Power (dBm)=14, Device=R14C6
-60
im3 avg (dBm), LO Power (dBm)=14, Device=R14C8
-60
im3 avg (dBm), LO Power (dBm)=14, Device=R14C8
im3 avg (dBm), LO Power (dBm)=15, Device=R10C7
im3 avg (dBm), LO Power (dBm)=15, Device=R10C7
im3 avg (dBm), LO Power (dBm)=15, Device=R11C7
im3 avg (dBm), LO Power (dBm)=15, Device=R11C7
-70
im3 avg (dBm), LO Power (dBm)=15, Device=R12C5
-70
im3 avg (dBm), LO Power (dBm)=15, Device=R12C5
im3 avg (dBm), LO Power (dBm)=15, Device=R12C8
im3 avg (dBm), LO Power (dBm)=15, Device=R12C8
im3 avg (dBm), LO Power (dBm)=15, Device=R12C8_2
im3 avg (dBm), LO Power (dBm)=15, Device=R12C8_2
-80
im3 avg (dBm), LO Power (dBm)=15, Device=R14C6
15
16
17
18
19
LO freq (GHz)
20
21
22
im3 avg (dBm), LO Power (dBm)=15, Device=R14C8
T2 level (dBm) , LO Power (dBm)=12, Device=R10C7
im3 avg (dBm), LO Power (dBm)=15, Device=R14C6
-80
17
18
19
20
21
22
23
24
im3 avg (dBm), LO Power (dBm)=15, Device=R14C8
T2 level (dBm) , LO Power (dBm)=12, Device=R10C7
LO freq (GHz)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 7
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
M1003-BD
February 2008 - Rev 06-Feb-08
Mechanical Drawing
1.080
(0.043)
1.800
(0.071)
2
3
XM1003-BD
0.564
(0.022)
0.900
(0.035)
1
4
0.0
0.0
1.080
(0.043)
1.500
(0.059)
(Note: Engineering designator is 38IRM0363)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.674 mg.
Bond Pad #1 (RF)
Bond Pad #3 (LO)
Bond Pad #2 (IF1)
Bond Pad #4 (IF2)
RF Arrangement
IF1
2
3
LO
XM1003-BD
RF
1
4
IF2
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 7
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
M1003-BD
February 2008 - Rev 06-Feb-08
App Note [1] USB/LSB Selection -
LSB
USB
IF2
For Upper Side Band operation (USB):
With IF1 and IF2 connected to the
direct port (0º) and coupled port (90º)
respectively as shown in the diagram,
the USB signal will reside on the
isolated port. The input port must be
loaded with 50 ohms.
For Lower Side Band operation (LSB):
With IF1 and IF2 connected to the
direct port (0º) and coupled port (90º)
respectively as shown in the diagram,
the LSB signal will reside on the input
port. The isolated port must be loaded
with 50 ohms.
IF1
An alternate method of Selection of USB or LSB:
-90
USB
LSB
In Phase Combiner
In Phase Combiner
-90o
o
IF2
IF1
IF2
IF1
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 6 of 7
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
32.0-42.0 GHz GaAs MMIC
Image Reject Mixer
M1003-BD
February 2008 - Rev 06-Feb-08
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
• Do not ingest.
• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life
support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices need
careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable
grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be
clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in
a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die.
An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications
for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick,
placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing
action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic
(80% Au 20% Sn) has a melting point of approximately 280 ºC (Note: Gold Germanium should be avoided). The work station
temperature should be 310 ºC +/- 10 ºC. Exposure to these extreme temperatures should be kept to minimum. The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during
placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond
pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2%
elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias
connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may
be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds
should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
RoHS Compliant Parts - All Mimix products are RoHS compliant unless specifically ordered with Tin-Lead finish.
Ordering Information
Part Number for Ordering
XM1003-BD-000V
XM1003-BD-EV1
Description
“V” - vacuum release gel paks
XM1003-BD die evaluation module
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 7 of 7
Characteristic Data and Specifications are subject to change without notice. ©2008 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.