LX5551 ® TM 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier & SPDT for 11b/g/n P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION The Rx path of LX5551 includes a low-cost SPDT switch with excellent insertion loss and isolation. It features a very low Tx-to-Rx port leakage in receive mode. LX5551 is available in a 16-pin, 3x3mm micro-lead package (MLPQ16L). With its best-class performance and compact footprint, LX5551 offers an ideal front-end solution for the ever demanding design requirements of today’s WLAN systems, including 802.11b/g and the latest 11n MIMO implementation. 2.4-2.5GHz 11b/g/n Front-End Solution in a Single 3x3mm MLP Package All RF Ports Matched to 50 Ω Single-Polarity 3.3V Supply Tx Path Power Gain ~ 27dB Rx Path Loss ~ 0.6dB Pout ~ +18dBm at Antenna* for EVM = 3% Total Current ~140mA for +18dBm with 90% Duty Cycle Pout > +22dBm for 11b 1Mbps DSSS Mask Compliance 2 Small Footprint: 3x3mm Low Profile: 0.9mm RoHS Compliant & Pb-Free WWW . Microsemi .C OM LX5551 is a high-performance WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5551 integrates an advanced InGaP/GaAs Heterojunction Bipolar Transistor (HBT) power amplifier with both input/output impedance matching, and an InGaAs pseudomorphic HEMT (pHEMT) switch, into a single 3x3mm package. The Tx path of LX5551 features a two-stage monolithic microwave integrated circuit (MMIC) power amplifier with active bias circuitry, and 50 Ω input/output matching inside the package. With 3.3V supply voltage and 90mA nominal bias current, the Tx path provides 27dB gain and +18dBm linear output power, with extremely low total EVM (<3%) for 64QAM/54Mbps OFDM. Both gain and power are readily measured at antenna port, with switch insertion loss included. * Including SPDT switch loss APPLICATIONS IEEE 802.11b/g IEEE 802.11n MIMO IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com BLOCK DIAGRAM Vref Vc TxIn Ctl1 Ctl2 Internal OMN* Det Antenna RxOut Copyright © 2008 Rev. 1.0, 2008-12-17 LX5551 *OMN: Output Matching Network Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX5551 ® TM 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier & SPDT for 11b/g/n P RODUCTION D ATA S HEET WWW . Microsemi .C OM PRODUCT HIGHLIGHT MSC 5551 720A PACKAGE ORDER INFO LQ Plastic MLPQ 16 pin 3x3mm RoHS Compliant /Pb-Free LX5551LQ Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX5551LQ-TR) ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT DC Supply Voltage, RF off (PA).......................................................................5V (Switch) ................................................................5V Collector Current (PA)................................................................................500mA Total Power Dissipation....................................................................................2W RF Input Power............................................................................................10dbm Maximum Junction Temperature (Tj max) ................................................ +150°C Operation Ambient Temperature ...................................................-40°C to +85°C Storage Temperature....................................................................-65°C to +150°C RoHs/Pb Free Peak Package Solder Reflow Temperature (40 seconds maximum exposure)…………………………………………………….…..260°C(+0, -5) 16 15 Vc1 Open 14 13 TxIn 1 12 Vc2 Vref 2 11 Open Det 3 10 PAOut RxOut 4 9 5 6 Ctl1 Ant 7 SwIn 8 Ctl2 Optional LQ PACKAGE (“See-Through” View from Top) THERMAL DATA RoHS/Pb-free 100% Matte Tin Lead finish LQ Plastic MLPQ 16-Pin THERMAL RESISTANCE-JUNCTION TO CASE, θJC THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA 17°C/W 55.2°C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. Copyright © 2008 Rev. 1.0, 2008-12-17 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 PACKAGE DATA Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. Vcc Open TM ® Thank you for your interest in Microsemi® Analog Mixed Signal products. The full data sheet for this device contains proprietary information. To obtain a copy, please contact your local Microsemi sales representative. The name of your local representative can be obtained at the following link http://www.microsemi.com/contact/contactfind.asp or Contact us directly by sending an email to: [email protected] Be sure to specify the data sheet you are requesting and include your company name and contact information and or vcard. We look forward to hearing from you. Copyright Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 WWW . Microsemi .C OM INFORMATION