DATA SHEET MOS Integrated Circuit μ PD65881GB-P01 Product with functions equivalent to those of the μPD71054 (programmable timer/counter), using the gate array method The μ PD65881GB-P01 has an IP macro (product name: NA54A macro) included in CMOS gate array CMOS-N5, and is a product with functions equivalent to those achieved by the μ PD71054 (programmable timer/counter, discontinued product). The internal block functions and commands are the same as those of the μ PD71054, so the μ PD65881GB-P01 can be used as a substitute for the μ PD71054. This product is designed using the gate array method and has therefore some differences and cautions dependent on the gate array. Before adopting this product, note the disclaimer below and 3. CAUTIONS WHEN CONSIDERING ADOPTION OF THIS PRODUCT. Disclaimer (Be sure to read) • This product does not have functions equivalent to any similar non-NEC Electronics product. NEC Electronics shall assume no responsibility for any loss or damage incurred by our customers or by third parties resulting from the replacement of products similar to, but other than the μ PD71054GB-10-3B4. • NEC Electronics shall assume no responsibility for any loss or damage incurred by our customers or by third parties resulting from the use of this product outside the conditions described in the absolute maximum ratings, recommended operation range, and quality grades. DIFFERENCES WITH THE μ PD71054 Item Part number (mark) Package type Package shape (comparison of 44-pin QFP) Function of pin 39 Lead-free support Recommended soldering conditions Absolute maximum ratings Power supply voltage Input voltage Output voltage Recommended operation range DC characteristics AC characteristics This Product μ PD65881GB-P01-3BS-A μ PD71054 μ PD71054GB-10-3B4 Reference − (658N54) (standard NEC mark) Only 44-pin QFP QFP, DIP, QFJ The body size and package width are the same, but the pin lengths and pin bending method are different. IC (connection with external pin NC prohibited) Yes No IR60-207-3, partial heating IR35-00-3, VP15-00-3, WS60-00-1, partial heating −0.5 to +6.0 (V) −0.5 to +7.0 (V) −0.5 to +6.0 (V) −0.5 to VDD+0.3 (V) −0.5 to +6.0 (V) −0.5 to VDD+0.3 (V) TA = −40 to +85°C, VDD = 5 V±10% This product does not guarantee operation at less than 4.5 V. Partially different This product has the following restrictions on load capacitance. D7 to D0: 150 pF or less OUT0 to OUT2: 40 pF or less − 4. PACKAGE DRAWING 1. PIN LAYOUT ORDERING INFORMATION 5. RECOMMENDED SOLDERING CONDITIONS 2. ELECTRICAL SPECIFICATIONS The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. A18500EJ1V0DS00 (1st edition) Date Published August 2007 NS Printed in Japan © NEC Electronics Corporation 2007 μ PD65881GB-P01 ORDERING INFORMATION Part Number Package μ PD65881GB-P01-3BS-A Remark 44-pin plastic QFP (10x10) Products with -A at the end of the part number are lead-free products. QUALITY GRADES "Standard" This product is intended to be used for applications such as computers, office equipment, communications equipment, test and measurement equipment, and home electronic appliances. It therefore cannot be used for the following applications. Applications requiring special or specific grades, such as transportation equipment (automobiles, trains, ships, etc.), traffic control systems, medical equipment, aircraft equipment, and aerospace equipment. Remark For details of quality grades, refer to Quality Grades on NEC Semiconductor Devices (C11531E). 1. PIN LAYOUT For the pin functions, refer to the μ PD71054 Data Sheet (IC-1920). Pin No. I/O Pin Name Name of Pin on Pin No. I/O Pin Name Name of Pin on μ PD71054 μ PD71054 1 − NC ← 23 − NC ← 2 − NC ← 24 I CLK1 ← 3 − NC ← 25 I GATE2 ← 4 I/O D3 ← 26 O OUT2 ← 5 I/O D2 ← 27 I CLK2 ← 6 − NC ← 28 − NC ← 7 I/O D1 ← 29 I A0 ← 8 I/O D0 ← 30 I A1 ← 9 I CLK0 ← 31 I CSB CS 10 O OUT0 ← 32 I RDB RD 11 − NC ← 33 − NC ← 12 − NC ← 34 − NC ← 13 − NC ← 35 − NC ← 14 − NC ← 36 − NC ← 15 I GATE0 ← 37 I WRB WR 16 − GND VDD 17 − IC (GND) 18 O OUT1 19 I 20 − 21 22 Note ← 38 − IC 39 − IC (VDD) ← 40 I/O D7 GATE1 ← 41 I/O D6 ← NC ← 42 I/O D5 ← − NC ← 43 I/O D4 ← − NC ← 44 − NC ← Note ← Note NC ← This pin is connected to GND or VDD in the chip. To enhance the power supply in order to handle noise, it can be connected to the power supply pin of the board to improve the noise resistance performance. 2 Data Sheet A18500EJ1V0DS μ PD65881GB-P01 2. ELECTRICAL SPECIFICATIONS This chapter describes only the differences with the μ PD71054. For electrical specifications other than those below, refer to the μ PD71054 Data Sheet (IC-1920). Absolute Maximum Ratings Parameter Symbol Conditions Ratings Unit −0.5 to +6.0 V Power supply voltage VDD Input voltage VI −0.5 to +6.0 V Output voltage VO −0.5 to +6.0 V Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Recommended Operating Range This is the same as the μ PD71054. This product does not guarantee operation at less than 4.5 V. DC Characteristics (VDD = 5 V±10%, TA = −40 to +85°C) Parameter Symbol μ PD71054 This Product Condition MIN. TYP. MAX. Condition MIN. TYP. Unit MAX. Input voltage, high VIH 2.29 VDD 2.2 VDD+0.3 V Input voltage, low VIL 0.00 0.77 −0.5 0.8 V Output voltage, high VOH IOH = VDD−0.1 IOH = V −400 μ A 0 mA IOH = 0.7×VDD VDD−0.4 3.0 mA Output voltage, low VOL IOL = 0.4 3 mA Output current, low IOL IOL = 0.4 V 2.5 mA 3.0 2.5 mA AC Characteristics These are similar to the μ PD71054 characteristics, except for the following restrictions on load capacitance. Operation outside the range of these restrictions is not guaranteed. D7 to D0: 150 pF or less OUT0 to OUT2: 40 pF or less Data Sheet A18500EJ1V0DS 3 μ PD65881GB-P01 3. CAUTIONS WHEN CONSIDERING ADOPTION OF THIS PRODUCT When considering the adoption of this product, note the following points. (1) Function check using product samples Before adopting this product, make sure to request product samples from NEC Electronics to check the functions. Product samples are available free of charge. When mounting this product onto different multiple printed circuit boards, extensively check the functions by changing the supply voltage to be supplied to the printed circuit boards as well as the temperature conditions for all printed circuit boards. The standard number of product samples is five. When requesting product samples, communicate the following items to an NEC Electronics sales representative. Your company name, your name, product application, the period of starting adoption, the number of products to be adopted (2) Submitting the Approval Sheet When normal operation has been confirmed and the adoption has been decided, complete a copy of the Approval Sheet (Appendix of this document) and submit it to NEC Electronics. (3) Shipment inspection Shipment inspection is performed for this product by using the μ PD71054GB-10-3B4 shipment test pattern. The DC characteristics satisfy the gate array shipment inspection. (4) Order amount Orders from a minimum of 100 units, and in units of 100 are accepted. (5) Package, packing form The dimensions are partially different from the μ PD71054GB-10-3B4. Refer to the package drawing and confirm that the product can actually be mounted. Dry pack tray packing is used for packing. (6) Price This product has a standard price. Please ask the NEC Electronics Sales Department for details. (7) Obtaining the μ PD71054 Data Sheet The μ PD71054 (original product) Data Sheet is available from the NEC Electronics Web site (http://www.necel.com/). The URL is as follows. http://www.necel.com/nesdis/image/IC-1920B.pdf 4 Data Sheet A18500EJ1V0DS μ PD65881GB-P01 4. PACKAGE DRAWING 44-PIN PLASTIC QFP (10x10) A B 23 22 33 34 detail of lead end S C D R Q 12 11 44 1 F J G I H M P K M N S L S NOTE ITEM Each lead centerline is located within 0.16 mm of its true position (T.P.) at maximum material condition. MILLIMETERS A 13.2±0.2 B 10.0±0.2 C 10.0±0.2 D 13.2±0.2 F 1.0 G 1.0 H 0.37 +0.08 −0.07 I J 0.16 0.8 (T.P.) K 1.6±0.2 L 0.8±0.2 M 0.17 +0.06 −0.05 N 0.10 P 2.7±0.1 Q 0.125±0.075 R 3° +7° −3° S 3.0 MAX. S44GB-80-3BS-2 5. RECOMMENDED SOLDERING CONDITIONS These products should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, please contact an NEC Electronicssales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Soldering Method Soldering Conditons Recommended Condition Symbol Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or Note (after that, prebake higher), Count: 3 times or less, Exposure limit: 7 days IR60-207-3 at 125°C for 20 to 72 hours) Partial heating Note Pin temperature: 350°C max., Time: 3 seconds max. (per pin row) − After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). Data Sheet A18500EJ1V0DS 5 μ PD65881GB-P01 APPENDIX APPROVAL SHEET Copy this page, and complete and confirm the required items. If you accept the conditions, sign and submit this sheet to NEC Electronics. Approval Sheet TO: NEC Electronics ( ) We have confirmed through sample evaluations that the device functions as stated in the specifications and agree to use the device in accordance with the boxes checked below in Confirmed Items. Company : Date (yy/mm/dd): Name: Department: Signature: Title: Applications (Set) Check the boxes below, to indicate confirmation of related matters. Device μ PD65881GB-P01-3BS-A (μ PD71054 function compatible) (Part-Number) μ PD65881GB-P02-3BS-A (μ PD71051 function compatible) μ PD65881GB-P03-3BS-A (μ PD71055 function compatible) NEC Electronics Office Counterpart Name Confirmed Items Confirm the contents below and check the confirmed items. All items must be confirmed and checked. 1. Differences from the original product (μ PD71051/71054/71055) and notes for use of the function-compatible device(s) in the Data Sheet 2. Proper operation in the actual application environment, using samples 3. Necessity of re-evaluation before using in a new or different board or application set 4. Necessity of using the board with at least 4 layers and a stable power supply. Conventionally ignored noise entering chips may be interpreted as being normal signals when the function-equivalent product is employed in a more advanced design process. Additional Information required: Demand/Forecast M/P starting time (yy/mm/dd) Monthly Run-Rate (units) Comment 6 Data Sheet A18500EJ1V0DS μ PD65881GB-P01 NOTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. 5 POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. 6 INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. Data Sheet A18500EJ1V0DS 7 μ PD65881GB-P01 • The information in this document is current as of August, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1